LED support convenient for improving chip mounting efficiency

Abstract

The utility model discloses an LED support convenient for improving chip mounting efficiency, comprising a metal substrate and a housing, the metal substrate passes through and is clamped on the housing, the middle upper part of the metal substrate is provided with a pad function area, the housing is provided with a colloid isolation insulation strip, the colloid isolation insulation strip isolates and insulates the pad function area, and the metal substrate is clamped on the housing. The bottom of the metal substrate extends to the bottom of the shell and is uniformly provided with a plurality of weld legs, and one of the weld legs is provided with a notch mark. Due to the design of the notch mark, when the chip and the support are mounted on the bulk LED, the bulk LED does not need to be woven into a belt, and a bulk high-speed chip mounter can identify the weld legs of the bulk LED, so that the chip mounting is smoothly completed, the chip mounting process is effectively simplified, and the chip mounting efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field related to LED brackets, and in particular to an LED bracket which is convenient for improving patch efficiency. Background Art

[0002] When bulk LED chips and brackets are being mounted, in order to avoid wrong mounting, they need to be compiled into tapes before being put into the bulk high-speed mounting machine for mounting, which results in many mounting steps and low mounting efficiency.

[0003] Therefore, it is necessary to provide an LED bracket that is convenient for improving patch efficiency to overcome the above-mentioned defects. Utility Model Content

[0004] The main purpose of the utility model is to overcome the shortcomings of the prior art and provide an LED bracket that is convenient for improving the patch efficiency. It is used to solve the problem in the prior art that when bulk LEDs are mounted on chips and brackets, they need to be compiled into tapes before they can be placed in a bulk high-speed patch machine for patching, resulting in many patch processes and low patch efficiency.

[0005] To achieve the above-mentioned purpose, the technical solution provided by the utility model is: an LED bracket that is convenient for improving the efficiency of patch, including a metal substrate and a shell, the metal substrate passes through and is clamped on the shell, a soldering pad functional area is provided in the middle upper part of the metal substrate, a colloid isolation insulating strip is provided on the shell, the colloid isolation insulating strip isolates and insulates the soldering pad functional area, the bottom of the metal substrate extends to the bottom of the shell and is evenly provided with a plurality of solder feet, one of which is provided with a notch mark.

[0006] As a further solution of the utility model, it is characterized in that: the welding foot is set as a bent foot.

[0007] As a further solution of the utility model, it is characterized in that: the number of the welding feet is set to 4.

[0008] As a further solution of the utility model, it is characterized in that: the welding feet are arranged at the four corners extending from the bottom of the metal substrate to the bottom of the shell.

[0009] As a further solution of the utility model, it is characterized in that: the notch mark is set as a triangular notch.

[0010] Compared with the prior art, the utility model has the following beneficial effects:

[0011] The present invention is an LED bracket that is convenient for improving patch efficiency, including a metal substrate and a shell, the metal substrate passes through and is clamped on the shell, a pad functional area is provided in the middle upper part of the metal substrate, a colloid isolation insulation strip is provided on the shell, and the colloid isolation insulation strip isolates and insulates the pad functional area, and the bottom of the metal substrate extends to the bottom of the shell and is evenly provided with a plurality of welding feet, one of which is provided with a notch mark. The notch mark design does not need to be compiled into a belt when the bulk LED is being patched with the chip and the bracket, and the bulk high-speed patch machine can identify its welding feet, thereby successfully completing the patch, achieving the beneficial effect of effectively simplifying the patch process and effectively improving the patch efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of a top view of an LED bracket that is convenient for improving patch efficiency according to the utility model;

[0013] Figure 2 This is a front view structural schematic diagram of an LED bracket that is convenient for improving patch efficiency according to the utility model;

[0014] Figure 3 This is a schematic diagram of the bottom-up structure of an LED bracket that is convenient for improving patch efficiency according to the utility model;

[0015] Description of components in the legend: 1-metal substrate; 2-shell; 3-pad functional area; 4-colloid isolation insulation strip; 5-weld foot; 51-notch mark. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] Please see Figure 1-3 In the embodiment of the utility model, an LED bracket that is convenient for improving patch efficiency includes a metal substrate 1 and a shell 2. The metal substrate 1 passes through and is clamped on the shell 2. A pad functional area 3 is provided in the middle upper part of the metal substrate 1. A colloid isolation insulating strip 4 is provided on the shell 2. The colloid isolation insulating strip 4 isolates and insulates the pad functional area 3. The bottom of the metal substrate 1 extends to the bottom of the shell 2 and is evenly provided with a plurality of solder feet 5, one of which is provided with a notch mark 51. The notch mark design does not need to be compiled into a belt when the bulk LED is being patched with the chip and the bracket. The bulk high-speed patch machine can identify its solder feet, thereby successfully completing the patch, effectively simplifying the patch process and effectively improving the patch efficiency.

[0018] Based on the above embodiment, in order to further facilitate patching, the soldering foot 5 is configured as a bent foot.

[0019] Based on the above embodiment, according to actual usage, the number of the welding feet 5 is set to 4.

[0020] Based on the above embodiment, in order to further facilitate identification and patching, the solder feet 5 are arranged at the four corners extending from the bottom of the metal substrate 1 to the bottom of the shell 2 .

[0021] Based on the above embodiment, in order to simplify the product and improve the recognition efficiency, the notch mark 51 is set as a triangular notch.

[0022] The above detailed description is a specific description of a feasible embodiment of the present invention, but the embodiment is not intended to limit the patent scope of the present invention. Any equivalent implementation or modification that does not deviate from the technical spirit of the present invention should be included in the patent scope of this case.

Claims

1. An LED bracket for improving patch efficiency, comprising a metal substrate (1) and a housing (2), wherein the metal substrate (1) passes through and is clamped on the housing (2), a pad functional area (3) is provided in the middle upper part of the metal substrate (1), and a colloid isolation insulating strip (4) is provided on the housing (2), wherein the colloid isolation insulating strip (4) isolates and insulates the pad functional area (3), and is characterized in that: The bottom of the metal substrate (1) extends to the bottom of the shell (2) and is evenly provided with a plurality of welding feet (5), one of which is provided with a notch mark (51).

2. The LED bracket for improving patch efficiency according to claim 1, characterized in that: The welding foot (5) is configured as a bent foot.

3. The LED bracket for improving patch efficiency according to claim 1, characterized in that: The number of the welding feet (5) is set to 4.

4. The LED bracket for improving patch efficiency according to claim 1, characterized in that: The welding feet (5) are arranged at the four corners extending from the bottom of the metal substrate (1) to the bottom of the shell (2).

5. The LED bracket for improving patch efficiency according to claim 1, characterized in that: The notch mark (51) is set as a triangular notch.

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