LED packaging structure

Abstract

The utility model provides a light-emitting diode (LED) packaging structure, which comprises a substrate, a light-emitting unit is arranged on the substrate, the light-emitting unit comprises more than one LED chip, the LED chips are arranged on the substrate, a light reflecting surface is arranged between every two adjacent LED chips, light uniformizing layers are arranged above the LED chips, a reflecting channel is formed between every two adjacent light uniformizing layers, and the reflecting channel is communicated with the light uniformizing layers. The reflecting channel is located right above the light reflecting surface, one part of light rays emitted by the LED chip are emitted through the light uniformizing layer, the other part of light rays emitted by the LED chip are reflected by the light uniformizing layer, and the other part of light rays emitted by the LED chip are emitted through the reflecting channel; according to the structure of the utility model, the light emitted by the LED chips can be mixed, the light-emitting areas of the LED chips are enlarged, and the light emission is more uniform, so that the light uniformization can be realized without adding more light uniformizing films, and the cost can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, and in particular to an LED packaging structure. Background Art

[0002] COB packaging technology is an integrated packaging technology that directly mounts LED chips on PCB boards, performs COB high-integration pixel panel-level packaging on one side of the PCB board, and arranges driver IC devices on the other side of the PCB board without any brackets, so that the backlight module can be made thinner and lighter. However, for COB, its light efficiency is low, there are many LEDs, many membranes, and complex processes, which are technically difficult and costly.

[0003] Conventional COB packaging products are to attach LEDs to a substrate, and then protect the product by sealing it with a layer of packaging glue. This packaging structure forms a simple light board whose light output depends on the light-emitting angle of the LED itself. To achieve a thinner effect in backlight products, it is usually necessary to reduce the spacing between LEDs, which indirectly increases the number of LEDs and increases costs. Usually, when the spacing between LEDs on the light board is increased, the uniform light effect is achieved by increasing the number of uniform light films in the backlight film material, but this also brings about problems such as increased thickness of the backlight product, increased costs, and brightness attenuation.

[0004] For example, Chinese patent application number CN202321596486.0, with an announcement date of November 28, 2023, discloses a high-contrast backlight structure, including a substrate, a packaging layer, a dam and more than two LED chips, wherein adjacent LED chips are arranged on the substrate at intervals, the dam is arranged on the substrate and is located between adjacent LED chips, the packaging layer is arranged on the substrate and covers the LED chips and the dam, the dam extends from one end of the substrate toward the packaging layer, and the top of the dam is flush with the top of the packaging layer; the light emitted by the LED chips will not interfere with each other in the light conversion layer, thereby reducing the generation of halo; a luminous area is formed above the LED chip, and a non-luminous area is formed above the dam, and the contrast between the non-luminous area and the luminous area is large, so that the display effect of the backlight structure is good.

[0005] However, the above structure only sets dams on both sides of the LED chip to form a non-luminous area above the dams. However, this structure will cause the light in some places on the entire backlight emission surface to be relatively dark and the light in some places to be relatively bright, resulting in uneven backlight display and a small luminous area of ​​a single LED chip. Utility Model Content

[0006] The utility model provides an LED packaging structure, which enables light emitted by an LED chip to be mixed, so that the light-emitting area of ​​the LED chip becomes larger and the light emission is more uniform, thereby eliminating the need to add more uniform light films to achieve uniform light, thereby reducing costs.

[0007] To achieve the above-mentioned purpose, the technical solution of the utility model is: an LED packaging structure, including a substrate, a light-emitting unit is provided on the substrate, the light-emitting unit includes more than one LED chip, the LED chip is arranged on the substrate, a reflective surface is provided between each adjacent LED chip, a uniform light layer is provided above the LED chip, a reflective channel is formed between each adjacent uniform light layer, the reflective channel is located directly above the reflective surface, a part of the light emitted by the LED chip is emitted through the uniform light layer, another part of the light emitted by the LED chip is reflected by the uniform light layer, and another part of the light emitted by the LED chip is emitted through the reflective channel.

[0008] The above structure sets a reflective surface between adjacent LED chips, so that the light emitted from the side of the LED chip will be reflected upward by the reflective surface, thereby making the light emitting brightness of the LED chip higher, and at the same time sets a uniform light layer above the LED chip, so that part of the light emitted upward by the LED chip is emitted through the uniform light layer, and part of the light is reflected back by the uniform light layer. When the reflected light is reflected upward by the reflective surface again, the reflected light is emitted through the reflection channel, and part of the light emitted by the LED chip is also emitted through the reflection channel, thereby making the LED chip on the substrate The gap between adjacent LED chips causes the light between them to be weaker. By setting a reflective surface between each adjacent LED chip, the light reflected by the light-evening layer continues to be reflected back by the reflective surface, so that light is also emitted from the gap between adjacent LED chips, so that the reflected light is mixed with the light directly emitted through the light-evening layer, so that light is also emitted at the position where the reflective surface is set, thereby making the light-emitting area of ​​the LED chip larger and the light emission more uniform. There is no need to add more light-evening films to achieve light evenness, thereby reducing the number of light-evening films and reducing costs.

[0009] Furthermore, a reflective layer is provided between each adjacent LED chip, and the reflective surface is provided on the reflective layer.

[0010] The above arrangement, by arranging a reflective layer between adjacent LED chips, enables the light emitted by the LED chip to enter the reflective channel after being reflected by the uniform light layer, thereby further ensuring the reflection effect.

[0011] Furthermore, a sealing layer is covered on the LED chip, and the light uniforming layer is arranged on the sealing layer.

[0012] In the above arrangement, by arranging a light-evening layer on the encapsulation glue layer, the light reflected by the light-evening layer and the light emitted by the LED chip can be better mixed on the encapsulation glue layer.

[0013] Furthermore, the reflective layer is a white glue layer, and the top of the white glue layer extends downward and outward in an arc shape to the bottom to form a reflective surface with a slope.

[0014] The above arrangement, by providing the white glue layer, enables the light emitted from the side of the LED chip and the light reflected by the light-uniforming layer to be reflected upward, further ensuring the reflection effect.

[0015] Furthermore, white solder resist is provided between each adjacent LED chip, and a white glue layer is provided on the white solder resist; the thickness of the white solder resist is 0.01-0.06 mm, and the reflectivity of the white solder resist is greater than 70%.

[0016] The above arrangement, by setting the solder resist white oil, can play the role of insulation protection, and can also further increase the reflectivity of the area not covered by the white glue layer, so that the brightness of the product is higher.

[0017] Furthermore, the light-homogenizing layer is a light-homogenizing adhesive layer, and a white material is arranged in the light-homogenizing adhesive layer; the thickness of the light-homogenizing layer is 0.02-0.2 mm, and the reflectivity of the light-homogenizing layer (5) is greater than 50%.

[0018] The above arrangement is to add a light-homogenizing glue made of white material into a transparent glue, so that part of the light can be emitted through the transparent glue, while part of the light is reflected by the white material, thereby enabling better light homogenization.

[0019] Furthermore, the height of the white glue layer is higher than or equal to half of the height of the LED chip, and the top height of the white glue layer is greater than or equal to 0.05 mm.

[0020] The above arrangement ensures that the white glue layer has a certain height to form an arc, and also enables the white glue layer to reflect the light emitted from the side of the LED chip.

[0021] Furthermore, the sealing glue layer is a transparent glue layer.

[0022] With this arrangement, the transparent glue is used to protect the LED chip without affecting the light emission of the LED chip.

[0023] Furthermore, the ratio of the maximum brightness of the light emitted from the reflection channel to the maximum brightness of the light emitted from the uniform light layer is within a preset range, and the preset range is 50%-150%.

[0024] The above settings ensure the uniformity of light output of the entire module by setting the transmittance of the light emitted by the uniform light layer.

[0025] Furthermore, the coverage area of ​​the light-homogenizing layer is greater than or equal to the cross-sectional area of ​​the LED chip.

[0026] The above arrangement, by setting the area of ​​the light-evening layer, enables the light-evening layer and the reflective surface to better achieve the effects of light evenness and reflection. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of an embodiment of the utility model.

[0028] Figure 2 It is a structural schematic diagram of another embodiment of the utility model.

[0029] Figure 3 This is a structural schematic diagram of another embodiment of the utility model.

[0030] Figure 4 This is a top view of a light-dodging layer according to another embodiment of the present invention. DETAILED DESCRIPTION

[0031] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0032] Example 1.

[0033] like Figure 1 As shown, an LED packaging structure includes a substrate 1, on which a light-emitting unit is provided, wherein the light-emitting unit includes more than one LED chip 2, the LED chip 2 is provided on the substrate 1, a reflective surface 31 is provided between each adjacent LED chip 2, a uniform light layer 5 is provided above the LED chip 2, a reflective channel 6 is formed between each adjacent uniform light layer 5, the reflective channel 6 is located directly above the reflective layer 3, a part of the light emitted by the LED chip 2 is emitted through the uniform light layer 5, another part of the light emitted by the LED chip 2 is reflected by the uniform light layer 5, and another part of the light emitted by the LED chip 2 is emitted through the reflective channel 6. In this embodiment, the transmittance of the uniform light layer 5 is 80%.

[0034] A reflective layer 3 is provided between each adjacent LED chip, and a reflective surface 31 is provided on the reflective layer 3. By providing the reflective layer 3 between adjacent LED chips 2, when the light emitted by the LED chip 2 is reflected by the reflective layer 3, it will enter the reflective channel 6, further ensuring the reflection effect.

[0035] The LED chip 2 is covered with a sealing layer 4, and a light-homogenizing layer 5 is arranged on the sealing layer 4. By arranging the light-homogenizing layer 5 on the sealing layer 4, the light reflected by the light-homogenizing layer 5 and the light emitted by the LED chip 2 can be better mixed on the sealing layer 4.

[0036] The reflective layer 3 is a white glue layer, and the top of the white glue layer extends downward and outward in an arc shape to the bottom to form a reflective surface 31 with a slope. By setting the white glue layer, the light emitted from the side of the LED chip 2 and the light reflected by the uniform light layer 5 can be reflected upward, further ensuring the reflection effect.

[0037] A solder resist white oil 32 is provided between each adjacent LED chip 2, and a white glue layer is provided on the solder resist white oil 32; the thickness of the solder resist white oil 32 is 0.01-0.06mm. By providing the solder resist white oil 32, it can play a role of insulation protection, and can also further increase the reflectivity of the area not covered by the white glue layer, so that the brightness of the product is higher.

[0038] The light-homogenizing layer 5 is a light-homogenizing adhesive layer, in which a white material is disposed; the white material is a reflective material such as titanium dioxide or barium white; the thickness of the light-homogenizing layer 5 is 0.02-0.2 mm, and the reflectivity of the light-homogenizing layer is greater than 50%. The light-homogenizing adhesive made by adding the white material to the transparent adhesive allows part of the light to be emitted through the transparent adhesive, while part of the light is reflected by the white material, thereby enabling better light homogenization. In this embodiment, the reflective material such as titanium dioxide or barium white is specifically an existing material, which will not be described here.

[0039] The height of the white glue layer is higher than or equal to half the height of the LED chip 2 , and the top height of the white glue layer is greater than or equal to 0.05 mm, thereby making it easier for the white glue layer to reflect light emitted from the side of the LED chip 2 .

[0040] The sealing glue layer 4 is a transparent glue layer, and thus, the transparent glue is used to protect the LED chip without affecting the light emission of the LED chip.

[0041] The ratio of the maximum brightness of the light emitted from the reflection channel 6 to the maximum brightness of the light emitted from the light-homogenizing layer 5 is within a preset range, which is 50%-150%. This ensures that the intensity of the light emitted from the light-homogenizing layer 5 and the reflection channel 6 is the same or similar, ensuring the uniformity of the light output of the entire module.

[0042] The coverage area of ​​the light-evening layer 5 is greater than or equal to the cross-sectional area of ​​the LED chip 2. By setting the area of ​​the light-evening layer 5, the light-evening layer 5 and the reflective surface 31 can better achieve the functions of light evenness and reflection.

[0043] The beneficial effects of the utility model are as follows: by arranging the reflective surface 31 between adjacent LED chips 2, the light emitted from the side of the LED chip 2 is reflected upward by the reflective surface 31, thereby making the light luminance of the LED chip 2 higher, and at the same time, a uniform light layer 5 is arranged above the LED chip 2, thereby making part of the light emitted upward by the LED chip 2 be emitted through the uniform light layer 5, and part of the light is reflected back by the uniform light layer 5 (such as Figure 1 As shown by the middle arrow), when the reflected light is reflected upward by the reflective surface 31, the reflected light is emitted through the reflective channel 6, and a part of the light emitted by the LED chip is emitted through the reflective channel, thereby causing the light between adjacent LED chips 2 to be weaker due to the gaps between the LED chips 2 on the substrate 1. By setting the reflective surface 31 between each adjacent LED chip 2, when the light reflected by the light-evening layer 5 continues to be reflected back by the reflective surface 31, light is also emitted in the gaps between adjacent LED chips 2, so that the reflected light is mixed with the light directly emitted through the light-evening layer 5, so that light is also emitted at the position where the reflective surface is set, thereby increasing the light-emitting area of ​​the LED chip 2 and making the light emission more uniform, without adding more light-evening films to achieve light evenness, thereby reducing the number of light-evening films and reducing costs.

[0044] Example 2.

[0045] like Figure 2 As shown, the difference between this embodiment and embodiment 1 is that in this embodiment, no white solder resist is provided below the reflective surface.

[0046] Example 3.

[0047] like Figure 3 and Figure 4 As shown, the difference between this embodiment and embodiment 1 is that: in this embodiment, the LED chip 2 is a wide-angle chip, specifically, the top light-emitting surface of the LED chip 2 has a reflective layer 21, and the reflective layer 21 is formed of a reflective material or a partially light-transmitting material, and the reflectivity of the reflective layer 21 is greater than 70%; it is specifically the prior art and will not be described again here; a light outlet channel 51 is provided in the uniform light layer 5 directly above the LED chip 2.

Claims

1. An LED packaging structure, comprising a substrate (1), on which a light-emitting unit is provided, characterized in that: The light-emitting unit comprises more than one LED chip (2), the LED chip (2) being arranged on a substrate (1), a reflective surface (31) being arranged between each adjacent LED chip (2), a light-homogenizing layer (5) being arranged above the LED chip (2), a reflective channel (6) being formed between each adjacent light-homogenizing layer (5), the reflective channel (6) being located directly above the reflective surface (31), a portion of the light emitted by the LED chip (2) being emitted through the light-homogenizing layer (5), another portion of the light emitted by the LED chip (2) being reflected by the light-homogenizing layer (5), and another portion of the light emitted by the LED chip (2) being emitted through the reflective channel (6).

2. The LED packaging structure according to claim 1, characterized in that: A reflective layer (3) is provided between each adjacent LED chip (2), and a reflective surface (31) is provided on the reflective layer (3).

3. The LED packaging structure according to claim 1, characterized in that: The LED chip (2) is covered with a sealing glue layer (4), and the light uniforming layer (5) is arranged on the sealing glue layer (4).

4. The LED packaging structure according to claim 2, characterized in that: The reflective layer (3) is a white glue layer, and the top of the white glue layer extends downward and outward in an arc shape to the bottom to form a reflective surface (31) with a slope.

5. The LED packaging structure according to claim 4, characterized in that: A solder resist white oil (32) is provided between each adjacent LED chip (2), and a white glue layer is provided on the solder resist white oil (32); the thickness of the solder resist white oil (32) is 0.01-0.06 mm, and the reflectivity of the solder resist white oil (32) is greater than 70%.

6. The LED packaging structure according to claim 1, characterized in that: The light-homogenizing layer (5) is a light-homogenizing adhesive layer, and a white material is arranged in the light-homogenizing adhesive layer; the thickness of the light-homogenizing layer (5) is 0.02-0.2 mm, and the reflectivity of the light-homogenizing layer (5) is greater than 50%.

7. The LED packaging structure according to claim 4, characterized in that: The height of the white glue layer is higher than or equal to half the height of the LED chip (2), and the top height of the white glue layer is greater than or equal to 0.05 mm.

8. The LED packaging structure according to claim 3, characterized in that: The sealing glue layer (4) is a transparent glue layer.

9. The LED packaging structure according to claim 1, characterized in that: The ratio of the maximum brightness of the light emitted from the reflection channel (6) to the maximum brightness of the light emitted from the light-uniform layer (5) is within a preset range, and the preset range is 50%-150%.

10. The LED packaging structure according to claim 1, characterized in that: The coverage area of ​​the light homogenizing layer (5) is greater than or equal to the cross-sectional area of ​​the LED chip (2).

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