Adjustable positioning device for semiconductor detection

Abstract

The utility model provides an adjustable positioning device for semiconductor detection, which relates to the technical field of adjustable positioning devices for semiconductor detection, and comprises a base, a pair of supporting rods are arranged on the base, a first electric lead screw is arranged between the supporting rods, a supporting plate is arranged on the first electric lead screw, and the supporting plate is arranged on the base. An angle adjusting mechanism is fixedly arranged on the supporting plate, a clamping assembly is fixedly arranged on the angle adjusting mechanism, and a detection assembly is arranged above the clamping assembly. According to the device, different positions and detection angles can be adjusted in combination with the detection probe, manual auxiliary operation needed during detection is avoided, labor force is saved, and then the operation efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of an adjustable semiconductor detection positioning device, and more specifically, particularly relates to an adjustable semiconductor detection positioning device. Background Art

[0002] A semiconductor is a material with an electrical conductivity between that of an insulator and that of a conductor at room temperature. Its electrical conductivity is easily controlled and can be used as a component material for information processing. It has unique electrical properties and its electrical conductivity is weaker than that of a conductor, but easier than that of an insulator. Semiconductor materials are widely used in electronics and optoelectronics. Common semiconductor materials include silicon and germanium. These materials have four valence electrons in their crystal structure and can form covalent bonds. By doping semiconductor materials with other elements, the number of free electrons or holes can be increased, thereby changing their electrical conductivity. Semiconductor materials play a key role in the manufacture of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion and other fields. These tests include geometric dimension and surface morphology detection, component structure analysis, electrical performance testing, temperature testing, optical testing, parameter testing (such as DC parameter testing and AC parameter testing) and functional testing. The purpose of semiconductor testing is to identify and eliminate unqualified products during the production process and improve the product yield and reliability. It is an indispensable part of the semiconductor manufacturing process and is of great significance to improving product performance, yield and production efficiency. The semiconductor positioning device in semiconductor testing occupies an important part of it.

[0003] Based on the above, the inventors found that there are the following problems:

[0004] Current semiconductor detection positioning devices are generally fixed in position and cannot be combined with detection probes to adjust the position. In addition, existing positioning devices cannot be adjusted according to different detection angles and require manual assistance during use, which is very inconvenient and reduces the detection efficiency.

[0005] Therefore, in view of this, the existing structure and defects are studied and improved, and an adjustable semiconductor detection positioning device is provided to achieve a more practical purpose. Utility Model Content

[0006] In order to solve the above technical problems, the utility model provides an adjustable semiconductor detection positioning device to solve the problems that the current detection probe cannot be combined to adjust the position and the existing positioning device cannot be adjusted according to different detection angles.

[0007] The purpose and effect of the adjustable semiconductor detection positioning device of the utility model are achieved by the following specific technical means:

[0008] An adjustable semiconductor detection positioning device comprises a base, a pair of support rods are arranged on the base, an electric screw rod is arranged in the middle of the support rods, a support plate is arranged on the electric screw rod, an angle adjustment mechanism is fixedly arranged on the support plate, a clamping assembly is fixedly arranged on the angle adjustment mechanism, and a detection assembly is arranged above the clamping assembly.

[0009] Furthermore, the angle adjustment mechanism includes a column, a universal joint, a rotating column one, a rotating column two and an electric hydraulic telescopic rod, the lower end of the column is fixedly connected to the upper end of the support plate, the upper end of the column is fixedly connected to the universal joint, the upper end of the universal joint is fixedly connected to the middle position of the rotating column one, the two ends of the rotating column one are movably connected to a movable frame, the rotating column two penetrates the rotating column one and is movably connected to the other two ends of the movable frame, the upper end of the movable frame is fixedly provided with a connecting column, the two adjacent sides of the bottom end of the movable frame are provided with a connecting frame, and the two ends of the electric hydraulic telescopic rod are respectively fixedly welded with circular heads, the connecting frame is connected to the electric hydraulic telescopic rod through the circular head, the other end of the electric hydraulic telescopic rod is connected with a semicircular groove, and the lower end of the semicircular groove is fixedly connected to the support plate.

[0010] Furthermore, the clamping assembly includes a clamping block and a clamping base, the bottom end of the clamping base is fixedly connected to the connecting column, three groups of rectangular grooves are opened on the upper end surface of the clamping base, two electric screws are arranged inside the rectangular grooves, the bottom of the clamping block is connected to the two electric screws, and a sponge is arranged on the clamping block.

[0011] Furthermore, the detection component includes a support plate, an electric screw rod three is arranged in the support plate, an electric telescopic rod is installed on the electric screw rod three, and a detection probe is installed at the bottom of the electric telescopic rod.

[0012] Furthermore, the internal cross-sectional diameters of the upper and lower ends of the portion where the connection frame connects with the circular head are smaller than the diameter of the circular head, and the internal cross-sectional diameter of the upper end of the semicircular groove is smaller than the diameter of the circular head.

[0013] Furthermore, a pair of cylindrical pipes are fixedly provided on the lower end surface of the support plate, the cylindrical pipes are movably connected to the support rods, threaded pipes are provided between the cylindrical pipes, threaded grooves are provided inside the threaded pipes, the threaded grooves in the threaded pipes are engaged with the threads on a surface of the electric screw, and the threaded pipes are fixedly connected to the support plate.

[0014] Furthermore, the second rotating column and the first rotating column are movably connected, and the first rotating column and the movable frame are movably connected.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] The relative positions of the detection probe and the semiconductor clamping assembly can be flexibly adjusted through the electric screw rod 1, the electric screw rod 2, the electric screw rod 3 and the electric telescopic rod; the clamping block can be moved horizontally in the rectangular groove through the cooperation of the electric screw rod 2, so that semiconductor materials of different sizes can be clamped; the sponge can avoid scratches on the surface of the semiconductor being detected; the flexible extension and retraction of the electric hydraulic telescopic rod can drive the two sides of the bottom end of the movable frame to move up and down flexibly, and the universal joint can make the movable frame move in multiple directions around the center without restriction, thereby realizing the detection of semiconductor materials being detected at different angles. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The utility model is a three-dimensional schematic diagram of an adjustable semiconductor detection positioning device.

[0018] Figure 2 The utility model is a three-dimensional schematic diagram of an adjusting mechanism of an adjustable semiconductor detection positioning device.

[0019] Figure 3 The utility model is a three-dimensional schematic diagram of an electric hydraulic telescopic rod of an adjustable semiconductor detection positioning device.

[0020] Figure 4 The utility model is a three-dimensional schematic diagram of a clamping assembly of an adjustable semiconductor detection positioning device.

[0021] Figure 5 The utility model is a schematic diagram of two cross sections of a clamping block and an electric lead screw of a clamping assembly of an adjustable semiconductor detection positioning device.

[0022] In the figure, the corresponding relationship between the component names and the figure numbers is as follows:

[0023] 1. Base; 3. Support rod; 4. Electric screw rod 1; 5. Support plate; 501. Cylindrical pipe; 502. Threaded pipe; 6. Adjustment mechanism; 601. Cylinder; 602. Universal joint; 603. Rotating column 1; 604. Rotating column 2; 605. Electric hydraulic telescopic rod; 606. Movable frame; 607. Connecting column; 608. Connecting frame; 609. Round head; 610. Semicircular groove; 7. Clamping assembly; 701. Clamping block; 702. Rectangular groove; 703. Electric screw rod 2; 704. Sponge; 705. Clamping base; 8. Detection assembly; 801. Support plate; 802. Electric screw rod 3; 803. Electric telescopic rod; 804. Detection probe. DETAILED DESCRIPTION

[0024] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0025] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Example:

[0028] As attached Figure 1 To Attachment Figure 5 As shown:

[0029] The utility model provides an adjustable semiconductor detection positioning device, comprising a base 1, a pair of support rods 3 are arranged on the base 1, an electric screw rod 4 is arranged in the middle of the support rods 3, a support plate 5 is arranged on the electric screw rod 4, an angle adjustment mechanism 6 is fixedly arranged on the support plate 5, a clamping assembly 7 is fixedly arranged on the angle adjustment mechanism 6, and a detection assembly 8 is arranged above the clamping assembly 7.

[0030] The angle adjustment mechanism 6 includes a column 601, a universal joint 602, a rotating column 1 603, a rotating column 2 604 and an electric hydraulic telescopic rod 605. The lower end of the column 601 is fixedly connected to the upper end of the support plate 5. The upper end of the column 601 is fixedly connected to the universal joint 602. The upper end of the universal joint 602 is fixedly connected to the middle position of the rotating column 1 603. The two ends of the rotating column 1 603 are movably connected to a movable frame 606. The rotating column 2 604 penetrates the rotating column 1 603 and is movably connected to the other two ends of the movable frame 606. The upper end of the movable frame 606 is fixedly provided with a connecting column 607. The bottom of the movable frame 606 is provided with a connecting frame 607 on two adjacent sides. 8, and circular heads 609 are respectively fixedly welded at both ends of the electric hydraulic telescopic rod 605, the connecting frame 608 is connected to the electric hydraulic telescopic rod 605 through the circular head 609, the other end of the electric hydraulic telescopic rod 605 is connected with a semicircular groove 610, and the lower end of the semicircular groove 610 is fixedly connected to the support plate 5, the extension and contraction of the electric hydraulic telescopic rod 605 drives the circular head 609 to move up and down, thereby driving the movement of the connecting frame 608, and then driving the movement of both ends of the movable frame 606 with the upper end of the universal joint 602 as the center, and the design of the universal joint 602 allows the movable frame 606 to be supported and can flexibly move with the extension and contraction of a pair of electric hydraulic telescopic rods 605.

[0031] Among them, the clamping assembly 7 includes a clamping block 701 and a clamping base 705, the bottom end of the clamping base 705 is fixedly connected to the connecting column 607, and three groups of rectangular grooves 702 are opened on the upper end surface of the clamping base 705. An electric screw rod 2 703 is arranged inside the rectangular groove 702. The bottom of the clamping block 701 is connected to the electric screw rod 2 703, and a sponge 704 is arranged on the clamping block 701. Through the action of the electric screw rod 2 703, the clamping block 701 can be flexibly moved on the rectangular groove 702 to clamp semiconductor materials of different sizes, and the design of the sponge 704 can avoid scratching the semiconductor material being detected.

[0032] Among them, the detection component 8 includes a support plate 801, an electric screw rod 3 802 is arranged in the support plate 801, an electric telescopic rod 803 is installed on the electric screw rod 3 802, and a detection probe 804 is installed at the bottom of the electric telescopic rod 803. The electric telescopic rod 803 can drive the detection probe 804 to adjust the detection distance up and down, and the electric screw rod 3 802 can adjust the horizontal distance between the detection probe 804 and the base 1.

[0033] Among them, the internal cross-sectional diameters of the upper and lower ends of the connecting frame 608 and the circular head 609 are smaller than the diameter of the circular head 609, and the internal cross-sectional diameter of the upper end of the semicircular groove 610 is smaller than the diameter of the circular head 609. By limiting the diameters of the connecting frame 608, the circular head 609 and the semicircular groove 610, it is ensured that the circular head 609 can move flexibly in the connecting frame 608 and the semicircular groove 610 and will not separate from the connecting frame 608 and the semicircular groove 610.

[0034] Among them, a pair of cylindrical pipes 501 are fixedly provided on the lower end surface of the support plate 5, and the cylindrical pipes 501 are movably connected to the support rod 3. A threaded pipe 502 is provided between the cylindrical pipes 501, and a threaded groove is provided inside the threaded pipe 502. The threaded groove in the threaded pipe 502 is engaged with the thread on the surface of the electric screw 4. The threaded pipe 502 is fixedly connected to the support plate 5, and the movement of the electric screw 4 can drive the support plate 5 to flexibly move in the horizontal position on the base 1, so as to facilitate the combination with the detection probe 804 to align the detected semiconductor.

[0035] The second rotating column 604 and the first rotating column 603 are movably connected, and the first rotating column 603 and the movable frame 606 are movably connected.

[0036] The specific usage and function of this embodiment are as follows:

[0037] When using the device, first place the semiconductor to be tested on the clamping base 705, start the electric screw 2 703 to drive the clamping block 701 to move and clamp the semiconductor to be tested, then start the electric screw 1 4 and the electric screw 3 802 to drive the detection probe 804 and the support plate 5 and the clamping assembly 7 on the support plate 5 to move to the appropriate position, then start the electric telescopic rod 803 to adjust the distance between the detection probe 804 and the semiconductor to be tested, and the detection can be carried out when it reaches the appropriate detection position. When it is necessary to detect the side and different angles of the semiconductor during the detection process, start the electric hydraulic telescopic rod 605 to drive the movable frame 606 to adjust the angle with the upper end of the universal joint 602 as the center, thereby driving the support plate 5 and the semiconductor to be tested on the support plate 5 to adjust the angle, so as to achieve the effect of detecting semiconductors of different sizes and different angles.

[0038] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific purposes.

Claims

1. An adjustable semiconductor detection positioning device, comprising a base (1), characterized in that: The base (1) is provided with a pair of support rods (3), an electric screw rod (4) is provided in the middle of the support rods (3), a support plate (5) is provided on the electric screw rod (4), an angle adjustment mechanism (6) is fixedly provided on the support plate (5), a clamping assembly (7) is fixedly provided on the angle adjustment mechanism (6), and a detection assembly (8) is provided above the clamping assembly (7).

2. An adjustable semiconductor detection positioning device as claimed in claim 1, characterized in that: The angle adjustment mechanism (6) comprises a column (601), a universal joint (602), a rotating column (603), a rotating column (604) and an electric hydraulic telescopic rod (605); the lower end of the column (601) is fixedly connected to the upper end of the support plate (5); the upper end of the column (601) is fixedly connected to the universal joint (602); the upper end of the universal joint (602) is fixedly connected to the middle position of the rotating column (603); the two ends of the rotating column (603) are movably connected to movable frames (606); the rotating column (604) penetrates the rotating column (603) ) are movably connected to the other two ends of the movable frame (606); a connecting column (607) is fixedly provided at the upper end of the movable frame (606); connecting frames (608) are provided at two adjacent sides of the bottom end of the movable frame (606); and circular heads (609) are respectively fixedly welded at both ends of the electric hydraulic telescopic rod (605); the connecting frame (608) is connected to the electric hydraulic telescopic rod (605) through the circular head (609); the other end of the electric hydraulic telescopic rod (605) is connected to a semicircular groove (610); and the lower end of the semicircular groove (610) is fixedly connected to the support plate (5).

3. An adjustable semiconductor detection positioning device as claimed in claim 2, characterized in that: The clamping assembly (7) comprises a clamping block (701) and a clamping base (705), the bottom end of the clamping base (705) is fixedly connected to the connecting column (607), the upper end surface of the clamping base (705) is provided with three groups of rectangular grooves (702), the inside of the rectangular groove (702) is provided with a second electric screw rod (703), the bottom of the clamping block (701) is connected to the second electric screw rod (703), and the clamping block (701) is provided with a sponge (704).

4. The adjustable semiconductor detection positioning device as claimed in claim 1, characterized in that: The detection assembly (8) comprises a support plate (801), wherein an electric screw rod three (802) is arranged inside the support plate (801), an electric telescopic rod (803) is installed on the electric screw rod three (802), and a detection probe (804) is installed at the bottom of the electric telescopic rod (803).

5. The adjustable semiconductor detection positioning device as claimed in claim 2, characterized in that: The internal cross-sectional diameters of the upper and lower ends of the portion where the connecting frame (608) connects with the circular head (609) are smaller than the diameter of the circular head (609), and the internal cross-sectional diameter of the upper end of the semicircular groove (610) is smaller than the diameter of the circular head (609).

6. The adjustable semiconductor detection positioning device as claimed in claim 1, characterized in that: A pair of cylindrical pipes (501) are fixedly provided on the lower end surface of the support plate (5), the cylindrical pipes (501) are movably connected to the support rod (3), a threaded pipe (502) is provided between the cylindrical pipes (501), a threaded groove is provided inside the threaded pipe (502), the threaded groove inside the threaded pipe (502) is meshed with the thread on the surface of the electric screw rod (4), and the threaded pipe (502) is fixedly connected to the support plate (5).

7. An adjustable semiconductor detection positioning device as claimed in claim 2, characterized in that: The second rotating column (604) and the first rotating column (603) are movably connected, and the first rotating column (603) and the movable frame (606) are movably connected.

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