Heat dissipation assembly for air conditioner and air conditioner

Abstract

The utility model relates to the technical field of household appliances, and discloses a heat dissipation assembly for an air conditioner, the air conditioner comprises an element to be subjected to heat dissipation, and the heat dissipation assembly comprises a mounting bracket, a shell and a vibration assembly. The installation support is installed at the position, corresponding to a to-be-cooled element, of the air conditioner, and the installation support is provided with a clamping part. The shell can be clamped to the clamping part of the mounting bracket, the shell is provided with a mounting cavity and a jet orifice, and the jet orifice is formed in the position, corresponding to a to-be-cooled element, of the shell; the vibration assembly is mounted in the mounting cavity in a position corresponding to the jet orifice; wherein under the condition that the temperature of the element to be cooled is higher than or equal to a temperature threshold value, the vibration assembly can vibrate so as to push surrounding air to the jet flow opening. Through the arrangement, air disturbance around the to-be-cooled element can be increased, and therefore the heat dissipation effect on the to-be-cooled element is better. Meanwhile, the utility model further discloses the air conditioner.

Description

Technical Field

[0001] The present application relates to the technical field of household appliances, for example, to a heat dissipation component for an air conditioner and an air conditioner. Background Art

[0002] At present, air conditioners have been widely used in people's daily life. People can use air conditioners to cool or heat the room to adjust the indoor temperature. However, with the development of society and the improvement of living standards, people's requirements for the quality of life are getting higher and higher. For example, people now also set IPM (intelligent power module) in the air conditioner to integrate multiple functions into one module, thereby achieving more precise and efficient control of the motor, which is crucial for variable frequency air conditioners. However, during use, IPM will generate heat and keep itself in a high temperature state. If it is in a high temperature state for a long time, its life will be reduced.

[0003] In the related art, fins are generally installed at positions corresponding to the IPM of the air conditioner, and the fins are arranged to fit the IPM. In this way, when the IPM is running, the fins will exchange heat with the IPM, thereby achieving the effect of cooling the IPM.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] In the related art, in the existing air conditioner provided with fins, since the fins are installed in the casing of the air conditioner, the air around the fins is generally in a static state, which results in poor heat dissipation effect of the fins on the IPM.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The embodiments of the present disclosure provide a heat dissipation assembly for an air conditioner and an air conditioner. When the temperature of a component to be cooled of the air conditioner is high, air disturbance around the component to be cooled can be increased, thereby achieving a better heat dissipation effect on the component to be cooled.

[0009] The embodiment of the present disclosure provides a heat dissipation assembly for an air conditioner, the air conditioner includes a heat dissipation element, and the heat dissipation assembly includes: a mounting bracket, a shell, and a vibration assembly. The mounting bracket is mounted at a position of the air conditioner corresponding to the heat dissipation element, and the mounting bracket is provided with a clamping portion; the shell can be clamped to the clamping portion of the mounting bracket, and the shell is provided with a mounting cavity and a jet port, and the jet port is provided at a position of the shell corresponding to the heat dissipation element; the vibration assembly is mounted at a position in the mounting cavity corresponding to the jet port; wherein, when the temperature of the heat dissipation element is higher than or equal to a temperature threshold, the vibration assembly can vibrate to push the surrounding air toward the jet port.

[0010] In some embodiments, the air conditioner further includes a power supply device; the vibration component includes: a piezoelectric ceramic sheet and an elastic diaphragm. The piezoelectric ceramic sheet is mounted on the housing, and the piezoelectric ceramic sheet is electrically connected to the power supply device; the elastic diaphragm is bonded to the piezoelectric ceramic sheet; wherein the elastic diaphragm and the wall surface of the housing where the jet port is disposed are parallel to each other.

[0011] In some embodiments, the distance between the elastic diaphragm and the jet port is greater than or equal to the first distance, and less than or equal to the second distance.

[0012] In some embodiments, the shape of the jet port is defined as a rectangle, and the width of the jet port is less than or equal to a preset width.

[0013] In some embodiments, the heat dissipation assembly further comprises: a fin assembly, which is mounted on the mounting bracket and is arranged to fit the element to be dissipated; wherein the jet port of the housing is arranged toward the fin assembly.

[0014] In some embodiments, the fin assembly includes: a fin body and a heat pipe. The fin body is mounted on a mounting bracket; the heat pipe is mounted on a side wall of the fin body facing the element to be cooled; wherein the jet port of the housing is arranged toward the fin body.

[0015] In some embodiments, when the jet port is rectangular, the length of the jet port is greater than or equal to the length of the fin assembly.

[0016] In some embodiments, a snap-on opening is provided at a position corresponding to the mounting bracket and the shell to form a snap-on portion; a snap hook is provided at a position corresponding to the shell and the snap-on opening; wherein the snap hook can be inserted into the snap-on opening and snap-on to the snap-on opening so that the shell is snap-on to the mounting bracket.

[0017] In some embodiments, the mounting bracket and the housing are correspondingly provided with a plurality of snap-fit ​​openings and a plurality of snap hooks.

[0018] The embodiment of the present disclosure also provides an air conditioner comprising: an air conditioner body and the above-mentioned heat dissipation assembly for the air conditioner. The air conditioner body comprises a heat dissipation element to be dissipated; wherein the heat dissipation assembly is installed at a position of the air conditioner body corresponding to the heat dissipation element to be dissipated.

[0019] The heat dissipation assembly for an air conditioner and the air conditioner provided in the embodiments of the present disclosure can achieve the following technical effects:

[0020] The embodiment of the present disclosure provides a heat dissipation assembly for an air conditioner, the air conditioner includes an element to be dissipated, and the heat dissipation assembly includes: a mounting bracket, a housing, and a vibration assembly. The mounting bracket is mounted at a position of the air conditioner corresponding to the element to be dissipated, and the mounting bracket is provided with a clamping portion; the housing can be clamped to the clamping portion of the mounting bracket, and the housing is provided with a mounting cavity and a jet port, and the jet port is provided at a position corresponding to the element to be dissipated in the housing; the vibration assembly is mounted at a position corresponding to the jet port in the mounting cavity; wherein, when the temperature of the element to be dissipated is higher than or equal to the temperature threshold, the vibration assembly can vibrate to push the surrounding air toward the jet port. In this way, when the temperature of the element to be dissipated is high, the vibration assembly can vibrate periodically and push the air located on the side of the vibration assembly close to the jet port toward the jet port. The air forms an airflow under the push of the vibration assembly, and flows from the jet port to the surrounding side of the element to be dissipated, so that the air around the element to be dissipated is disturbed. In this way, the air disturbance around the element to be dissipated can be increased, so that the heat dissipation effect of the element to be dissipated is better.

[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0023] Figure 1 is a structural schematic diagram of a heat dissipation assembly for an air conditioner provided by an embodiment of the present disclosure;

[0024] Figure 2 is a schematic structural diagram of a mounting bracket provided in an embodiment of the present disclosure;

[0025] Figure 3 is a structural schematic diagram of a vibration component provided by an embodiment of the present disclosure;

[0026] Figure 4 is a cross-sectional view of a vibration assembly provided by an embodiment of the present disclosure;

[0027] Figure 5It is a structural schematic diagram of a fin assembly provided in an embodiment of the present disclosure.

[0028] Reference numerals:

[0029] 01: Components to be cooled;

[0030] 10: Mounting bracket; 11: Snap-on opening;

[0031] 20: vibration component; 21: housing; 22: mounting cavity; 23: jet port; 24: hook; 25: piezoelectric ceramic sheet; 26: elastic diaphragm;

[0032] 30: fin assembly; 31: fin body; 32: heat pipe. DETAILED DESCRIPTION

[0033] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0034] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0035] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0036] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0037] Unless otherwise stated, the term "plurality" means two or more.

[0038] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.

[0039] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0040] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0041] The disclosed embodiment provides a heat dissipation component for an air conditioner and an air conditioner. When the temperature of the heat dissipation element of the air conditioner is high, the air disturbance around the heat dissipation element 01 can be increased, thereby achieving a better heat dissipation effect on the heat dissipation element 01.

[0042] The embodiment of the present disclosure provides a heat dissipation assembly for an air conditioner, the air conditioner includes a heat dissipation element 01, and the heat dissipation assembly includes: a mounting bracket 10, a shell 21, and a vibration assembly 20. The mounting bracket 10 is mounted at a position of the air conditioner corresponding to the heat dissipation element 01, and the mounting bracket 10 is provided with a clamping portion; the shell 21 can be clamped to the clamping portion of the mounting bracket 10, and the shell 21 is provided with a mounting cavity and a jet port 23, and the jet port 23 is provided at a position of the shell 21 corresponding to the heat dissipation element; the vibration assembly 20 is mounted in the mounting cavity at a position corresponding to the jet port 23; wherein, when the temperature of the heat dissipation element 01 is higher than or equal to the temperature threshold, the vibration assembly 20 can vibrate to push the surrounding air toward the jet port 23.

[0043] Specifically, the air conditioner further comprises a casing, and the mounting bracket 10 can be fixedly mounted on the casing and the position corresponding to the heat dissipation element 01 by fasteners or clamps. The housing 21 is fixedly mounted on the mounting bracket 10, and a jet port 23 is provided on the wall of the housing 21 facing the heat dissipation element 01.

[0044] When the temperature of the element 01 to be cooled is higher than or equal to the temperature threshold, the vibration component 20 may vibrate periodically and push the air on the side of the vibration component 20 close to the jet port 23 toward the jet port 23. The air forms an airflow under the push of the vibration component 20 and flows from the jet port 23 to the side around the element 01 to be cooled, so that the air around the element 01 to be cooled is disturbed. After the temperature of the element 01 to be cooled drops below the temperature threshold, the vibration component 20 stops vibrating.

[0045] In the above embodiment, the position of the jet port 23 can be flush with the element to be cooled 01, or can be offset from the element to be cooled 01. For example, the housing 21 can be arranged on one side of the element to be cooled 01, and the jet port 23 is arranged directly facing the element to be cooled 01, so that the airflow blown out from the jet port 23 can directly blow the element to be cooled 01; the housing 21 can also be arranged below or above the side of the element to be cooled 01, and the jet port 23 is arranged directly below or above the element to be cooled 01, so that the airflow blown out from the jet port 23 can disturb the airflow below or above the element to be cooled 01.

[0046] In some embodiments, the air conditioner further includes a power supply device; the vibration assembly 20 includes: a piezoelectric ceramic sheet 25 and an elastic diaphragm 26. The piezoelectric ceramic sheet 25 is mounted on the housing 21, and the piezoelectric ceramic sheet 25 is electrically connected to the power supply device; the elastic diaphragm 26 is bonded to the piezoelectric ceramic sheet 25; wherein the elastic diaphragm 26 and the wall surface of the housing 21 where the jet port 23 is disposed are parallel to each other.

[0047] Specifically, the air conditioner is also provided with a control unit and a temperature sensor. The temperature sensor is arranged corresponding to the heat dissipation element 01, and is used to obtain the temperature of the heat dissipation element 01, and the temperature sensor is electrically connected to the control unit to send a high temperature signal or a low temperature signal to the control unit. The control unit is electrically connected to the power supply device, and the control unit can control the power supply device to supply power to the piezoelectric ceramic sheet 25, so that the piezoelectric ceramic sheet 25 and the elastic diaphragm 26 vibrate. The piezoelectric ceramic sheet 25 and the elastic diaphragm 26 are parallel to the wall surface where the jet port 23 is located, so that when the piezoelectric ceramic sheet 25 and the elastic diaphragm 26 vibrate, the air can be pushed toward the jet port 23.

[0048] When the temperature sensor detects that the temperature of the heat dissipation element 01 is higher than or equal to the temperature threshold, the temperature sensor sends a high temperature signal to the control unit. After receiving the high temperature signal, the control unit controls the power supply device to supply power to the piezoelectric ceramic sheet 25, so that the piezoelectric ceramic sheet 25 and the elastic diaphragm 26 vibrate.

[0049] When the temperature sensor detects that the temperature of the heat dissipation element 01 is lower than the temperature threshold, the temperature sensor sends a low temperature signal to the control unit. After receiving the low temperature signal, the control unit controls the power supply device to stop supplying power to the piezoelectric ceramic sheet 25.

[0050] Optionally, the elastic diaphragm 26 is a brass diaphragm.

[0051] It is understandable that when the power supply device applies a certain AC voltage to the piezoelectric ceramic, the piezoelectric ceramic will deform under the inverse piezoelectric effect. Since the piezoelectric ceramic sheet 25 is fixed on all sides, the piezoelectric ceramic sheet 25 and the elastic diaphragm 26 will bend and deform up and down. At this time, the piezoelectric ceramic sheet 25 and the elastic diaphragm 26 vibrate up and down with the voltage change, repeatedly compressing and expanding the air in the installation cavity 22 (i.e., the blowing and sucking process), thereby forming an air jet at the ejector outlet. The air jet effectively enhances the air disturbance around the heat dissipation element 01, thereby enhancing heat dissipation.

[0052] Optionally, the heat dissipation component is provided with an independent power supply, which is electrically connected to the piezoelectric ceramic sheet 25 and the control unit, respectively. When the control unit receives a high temperature signal and the power supply device of the air conditioner cannot supply power to the piezoelectric ceramic sheet 25, the control unit can control the independent power supply to supply power to the piezoelectric ceramic sheet 25 to ensure the normal operation of the heat dissipation component.

[0053] In some embodiments, the distance between the elastic membrane 26 and the jet port 23 is greater than or equal to the first distance, and less than or equal to the second distance.

[0054] Specifically, the distance between the elastic membrane 26 and the jet port 23 is greater than or equal to 1 cm and less than or equal to 10 cm. For example, the distance between the elastic membrane 26 and the jet port 23 may be 1 cm, 3 cm, 5 cm, 7 cm or 10 cm.

[0055] It is understandable that if the distance between the elastic diaphragm 26 and the jet port 23 is less than 1 cm, the elastic diaphragm 26 may hit the housing 21 when vibrating, resulting in a reduction in its service life. In addition, if the distance between the elastic diaphragm 26 and the jet port 23 is too small, the air flow rate pushed by the elastic diaphragm 26 to the jet port 23 will be reduced. If the distance between the elastic diaphragm 26 and the jet port 23 is greater than 10 cm, the air flow velocity pushed by the elastic diaphragm 26 to the jet port 23 may be low, thereby affecting the heat dissipation effect of the heat dissipation element 01.

[0056] In some embodiments, the shape of the jet port 23 is defined as a rectangle, and the width of the jet port 23 is less than or equal to a preset width.

[0057] Specifically, the width of the jet port 23 is less than or equal to 10 mm. For example, the width of the jet port 23 may be 10 mm, 8 mm or 6 mm. In this way, the speed of the airflow flowing out of the jet port 23 may be increased.

[0058] In some embodiments, the heat dissipation assembly further includes: a fin assembly 30 . The fin assembly 30 is mounted on the mounting bracket 10 and is arranged in close contact with the heat dissipation element 01 ; wherein the jet port 23 of the housing 21 is arranged toward the fin assembly 30 .

[0059] Specifically, the fin assembly 30 is arranged to be attached to the heat dissipation element 01, so that the fin assembly 30 and the heat dissipation element 01 can exchange heat. The jet port 23 of the housing 21 is arranged toward the fin assembly 30, so that the airflow flowing out of the jet port 23 can directly flow to the fin assembly 30 to dissipate heat from the fin assembly 30.

[0060] In some embodiments, the fin assembly 30 includes: a fin body 31 and a heat pipe 32. The fin body 31 is mounted on the mounting bracket 10; the heat pipe 32 is mounted on the side wall of the fin body 31 facing the heat dissipation element 01; wherein the jet port 23 of the housing 21 is arranged toward the fin body 31.

[0061] Specifically, the fin body 31 is fixedly mounted on the mounting bracket 10. The heat pipe 32 is mounted on the fin body 31, and the two sides of the heat pipe 32 are respectively attached to the fin body 31 and the heat dissipation element 01. In this way, the heat dissipation element 01 can be cooled by the fin body 31 and the heat pipe 32, further improving the cooling efficiency.

[0062] Optionally, the side wall of the fin body 31 facing the mounting bracket 10 is provided with a mounting groove, and the heat pipe 32 can be installed in the mounting groove. The depth of the mounting groove is the same as the thickness of the heat pipe 32, so that the fin body 31 and the heat pipe 32 can be simultaneously attached to the heat dissipation element 01.

[0063] Optionally, the heat pipe 32 is a bent structure. For example, the heat pipe 32 may be an S-shaped structure.

[0064] In some embodiments, when the jet port 23 is rectangular, the length of the jet port 23 is greater than or equal to the length of the fin assembly 30 .

[0065] Specifically, the length of the jet port 23 is greater than or equal to the length of the fin assembly 30 , so that the airflow flowing out of the jet port 23 can flow through the entire fin assembly 30 , further improving the heat dissipation efficiency of the fin assembly 30 .

[0066] In some embodiments, a snap-on opening 11 is provided at a position corresponding to the mounting bracket 10 and the shell 21 to form a snap-on portion; a snap-on hook 24 is provided at a position corresponding to the shell 21 and the snap-on opening 11; wherein the snap-on hook 24 can be inserted into the snap-on opening 11 and snap-on to the snap-on opening 11, so that the shell 21 is snap-on to the mounting bracket 10.

[0067] Specifically, the hook 24 can be aligned with the snap-fit ​​opening 11 first, and then the hook 24 can be passed through the snap-fit ​​opening 11. At this time, the hook 24 can abut against the other side of the snap-fit ​​opening 11, so that the housing 21 is snap-fitted to the housing 21. This arrangement makes it more convenient for the user to install or remove the housing 21 from the mounting bracket 10.

[0068] In some embodiments, the mounting bracket 10 and the housing 21 are correspondingly provided with a plurality of snap-fit ​​openings 11 and a plurality of snap hooks 24 .

[0069] Specifically, the plurality of hooks 24 can be respectively engaged with the plurality of engaging openings 11 . With such an arrangement, the housing 21 can be engaged more firmly to prevent the housing 21 from falling off the mounting bracket 10 .

[0070] In practical applications, the number of the hooks 24 and the engaging openings 11 can be set according to actual needs. For example, two hooks 24 and two engaging openings 11 can be set correspondingly, and the two hooks 24 can be engaged with the two engaging openings 11 respectively.

[0071] The embodiment of the present disclosure also provides an air conditioner comprising: an air conditioner body and the above heat dissipation assembly for the air conditioner. The air conditioner body comprises a heat dissipation element 01; wherein the heat dissipation assembly is installed at a position corresponding to the air conditioner body and the heat dissipation element 01.

[0072] Specifically, the air conditioner body is provided with a casing, and the mounting bracket 10 can be fixedly mounted on the casing by fasteners or clamps.

[0073] An air conditioner using the heat dissipation assembly for air conditioners provided in the present application can increase air disturbance around the heat dissipation element 01 when the temperature of the heat dissipation element of the air conditioner is high, thereby achieving a better heat dissipation effect on the heat dissipation element 01.

[0074] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A heat dissipation assembly for an air conditioner, the air conditioner comprising a heat dissipation element, characterized in that: The heat dissipation components include: A mounting bracket is mounted at a position of the air conditioner corresponding to the element to be cooled, and the mounting bracket is provided with a clamping portion; A housing, which can be snapped onto the snap-on portion of the mounting bracket, wherein the housing is provided with a mounting cavity and a jet port, wherein the jet port is provided at a position of the housing corresponding to the element to be radiated; and, A vibration component is installed in the installation cavity at a position corresponding to the jet port; Wherein, when the temperature of the element to be cooled is higher than or equal to the temperature threshold, the vibration component may vibrate to push the surrounding air toward the jet port.

2. The heat dissipation assembly according to claim 1, characterized in that: The air conditioner also includes a power supply device; the vibration component includes: A piezoelectric ceramic sheet is mounted on the housing, and the piezoelectric ceramic sheet is electrically connected to the power supply device; and, The elastic diaphragm is bonded to the piezoelectric ceramic sheet; The elastic diaphragm and the wall surface of the shell on which the jet orifice is arranged are parallel to each other.

3. The heat dissipation assembly according to claim 2, characterized in that: The distance between the elastic diaphragm and the jet port is greater than or equal to the first distance, and less than or equal to the second distance.

4. The heat dissipation assembly according to claim 1, characterized in that: The shape of the jet port is limited to a rectangle, and the width of the jet port is less than or equal to a preset width.

5. The heat dissipation assembly according to claim 1, characterized in that: Also includes: The fin assembly is mounted on the mounting bracket and is arranged in close contact with the element to be cooled; Wherein, the jet port of the shell is arranged toward the fin assembly.

6. The heat dissipation assembly according to claim 5, characterized in that: The fin assembly includes: a fin body mounted on a mounting bracket; and, The heat pipe is installed on the side wall of the fin body facing the element to be cooled; Wherein, the jet port of the shell is arranged toward the fin body.

7. The heat dissipation assembly according to claim 5, characterized in that: When the jet port is rectangular, the length of the jet port is greater than or equal to the length of the fin assembly.

8. The heat dissipation assembly according to any one of claims 1 to 7, characterized in that: A snap-fit ​​opening is provided at a position corresponding to the mounting bracket and the housing to form a snap-fit ​​portion; and, A hook is provided at a position of the housing corresponding to the snap-in opening; The hook can be inserted into the clamping opening and clamped in the clamping opening, so that the housing is clamped in the mounting bracket.

9. The heat dissipation assembly according to claim 8, characterized in that: The mounting bracket and the shell are correspondingly provided with a plurality of clamping openings and a plurality of clamping hooks.

10. An air conditioner, characterized in that: include: The air conditioner body includes a heat dissipation element; and A heat dissipation assembly for an air conditioner as claimed in any one of claims 1 to 9; Wherein, the heat dissipation component is installed at a position corresponding to the air conditioner body and the element to be cooled.

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