Cooling equipment and server

Abstract

The utility model provides cooling equipment and a server. The liquid cooling equipment comprises a heat dissipation assembly and a soaking assembly, the heat dissipation assembly comprises a substrate with a circulation channel and a penetrating opening, and the penetrating opening penetrates through the substrate in the thickness direction of the substrate and communicates with the circulation channel; the circulation channel is configured to circulate a first cooling medium; the soaking assembly comprises a soaking plate and a cooling piece integrally formed with the soaking plate, the soaking plate is connected with the bottom face of the base plate, and the cooling piece is located in the penetrating opening; the vapor chamber comprises a containing cavity for containing a second cooling medium. The liquid cooling technology and the vacuum cavity vapor chamber heat dissipation technology are organically combined together, the second cooling medium located at the bottom of the containing cavity absorbs the heat of the to-be-cooled component, then evaporates and diffuses into the containing cavity, the heat is transmitted to the cooling piece, the heat exchanges heat with the first cooling medium in the heat dissipation assembly and is condensed into the liquid state, and the heat dissipation efficiency is improved. And therefore, the heat dissipation effect of the cooling equipment can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a cooling device and a server. Background Art

[0002] With the promotion and application of artificial intelligence technology, the demand for high-computing power scenarios has continued to increase, causing the average power consumption of chips inside the server to jump from 300W to more than 1000W, which in turn causes the temperature of the server to rise, affecting the normal use of the server.

[0003] In the related art, air cooling equipment or liquid cooling equipment is usually used to cool down the chips inside the server to dissipate heat from the server. However, air cooling technology or liquid cooling technology can no longer meet the heat dissipation requirements of the chips inside the server. Utility Model Content

[0004] Embodiments of the present application provide a cooling device and a server.

[0005] In a first aspect, an embodiment of the present application provides a liquid cooling device, comprising:

[0006] A heat dissipation component, the heat dissipation component comprising a substrate having a circulation channel and a through-hole, the through-hole penetrating the substrate along the thickness direction of the substrate and communicating with the circulation channel; the circulation channel is configured to flow a first cooling medium;

[0007] A heat spreader assembly, the heat spreader assembly comprising a heat spreader plate and a cooling member integrally formed with the heat spreader plate, the heat spreader plate is connected to the bottom surface of the substrate, and the cooling member is located in the through opening; the heat spreader plate comprises a receiving cavity for receiving a second cooling medium;

[0008] Wherein, in the accommodating cavity, the heated and vaporized second cooling medium moves toward the top of the accommodating cavity, exchanges heat with the first cooling medium to be condensed into liquid, and flows back to the bottom of the accommodating cavity.

[0009] The liquid cooling device provided in the embodiment of the present application includes a heat spreader assembly and a heat dissipation assembly, which organically combines liquid cooling technology and vacuum chamber heat spreader heat dissipation technology. After the second cooling medium located at the bottom of the accommodating cavity absorbs the heat of the component to be cooled (for example, a chip), it evaporates and diffuses into the accommodating cavity, and transfers the heat to the cooling element. This heat is exchanged with the first cooling medium in the heat dissipation assembly to condense into a liquid state, and then flows back to the bottom of the accommodating cavity. On the one hand, the accommodating cavity adopts a vacuum design, and the second cooling medium after being heated and vaporized can be conducted in a three-dimensional space, which simplifies the heat transfer path of the second cooling medium after being heated and vaporized. Compared with the metal heat conduction solution in the related art, it has a larger conduction system, which greatly improves the heat dissipation efficiency of the cooling device. On the other hand, the second cooling medium located in the accommodating cavity repeatedly absorbs heat, vaporizes and condenses, and needs to absorb a large amount of heat, so it can take away the heat generated by the component to be cooled more quickly.

[0010] In addition, the heat spreader and the cooling element are integrally formed, that is, the cooling element can be directly processed on the surface of the heat spreader facing the substrate, and the cooling element can be directly located in the through hole of the substrate and directly contact the first cooling medium. Compared with the technical solution in the related art in which the cooling element is arranged on the substrate, the conduction path of the second cooling medium after being heated and vaporized is shortened, so that the second cooling medium after being heated and vaporized can quickly exchange heat and condense with the first cooling medium, thereby improving the cooling effect of the cooling device.

[0011] In a possible implementation, the heat spreader partially overlaps with the bottom surface of the substrate; wherein the projection of the through-hole on the heat spreader covers part of the heat spreader and at least covers the projection of the cooling element on the heat spreader; and the flow channel is distributed on opposite sides of the through-hole.

[0012] In a possible implementation, the vapor chamber at least completely overlaps with the bottom surface of the substrate; the cooling element is located in the middle of the vapor chamber;

[0013] The through-opening is located in the middle of the substrate and is arranged opposite to the cooling member; the flow channels are distributed on two opposite sides of the through-opening.

[0014] In a possible implementation, the cooling member includes a plurality of cooling channels, and the plurality of cooling channels are arranged at intervals along a first direction; the opening of each cooling channel faces the circulation channel and is connected to the circulation channel; wherein the first direction is perpendicular to the circulation channel.

[0015] In a possible implementation, the cooling element includes a plurality of fins, and the plurality of fins are arranged at intervals along the first direction; the cooling channel is formed between adjacent fins, and / or the cooling channel is provided in each of the fins.

[0016] In a possible implementation, the circulation channel includes a first circulation channel and a second circulation channel, the first circulation channel and the second circulation channel are respectively located on both sides of the through-hole and are symmetrically arranged relative to a center line of the through-hole, wherein the center line of the through-hole is parallel to the first direction;

[0017] The first circulation channel includes a first channel and at least two second channels, the first channel extends along the first direction; the at least two second channels are arranged on a side of the first channel facing the through-hole and are communicated with the first channel.

[0018] In a possible implementation manner, a top surface of the cooling element located in the through-hole is lower than a bottom surface of the circulation channel.

[0019] In one possible implementation, the accommodating chamber is a vacuum chamber, and the accommodating chamber includes at least two relatively independently arranged sub-chambers, the bottom surfaces of at least two of the sub-chambers are in contact with the component to be cooled, and the top surfaces of at least two of the sub-chambers are in contact with the surface of the cooling member facing the substrate.

[0020] In a possible implementation, the heat dissipation assembly further includes a top plate, which is disposed on the base plate to cover the circulation channel and the through-hole;

[0021] A liquid inlet pipe and a liquid outlet pipe are arranged on the top plate, one end of the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the circulation channel and are located on both sides of the cooling element.

[0022] In a possible implementation, the cooling device further includes an annular mounting plate and a locking member, and the mounting plate is provided with a first mounting hole;

[0023] When the heat spreader at least completely overlaps with the bottom surface of the substrate, a second mounting hole is provided on the heat spreader, and the second mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the heat spreader and sleeved on the outer peripheral surface of the substrate; the locking member is fixedly connected to the circuit board after passing through the first mounting hole and the second mounting hole in sequence;

[0024] Alternatively, when the heat spreader and the bottom surface of the substrate partially overlap, the substrate includes a first substrate and a second substrate arranged on the first substrate, the area of ​​the second substrate is smaller than the area of ​​the first substrate; a third mounting hole is arranged on the first substrate, and the third mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the first substrate and is sleeved on the outer peripheral surface of the second substrate; the locking piece is fixedly connected to the circuit board after passing through the first mounting hole and the third mounting hole in sequence.

[0025] In a possible implementation, the locking member includes a locking rod and an adapter sleeved on the locking rod;

[0026] The adapter comprises an annular body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular body, and the plurality of elastic claws are arranged at intervals along the circumference of the annular body.

[0027] In a possible implementation, the locking member further includes an elastic member; the locking rod includes a first boss and a second boss that are spaced apart, and the second boss and the adapter are respectively located on two sides of the annular mounting plate;

[0028] The elastic member is sleeved on the locking rod and is located between the first boss and the second boss.

[0029] In a second aspect, an embodiment of the present application provides a server, comprising a circuit board, a chip, and a cooling device as described in any one of the first aspects; the chip is arranged on the circuit board; the cooling device is arranged on the circuit board, and the heat spreader of the cooling device is at least attached to the chip.

[0030] Since the server provided in the embodiment of the present application includes the cooling device of the first aspect, the server in the embodiment of the present application also has the effects of the cooling device of the first aspect, which will not be repeated here.

[0031] In addition to the technical problems solved by the embodiments of the present application described above, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions, other technical problems that can be solved by the cooling equipment and server provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 An exploded diagram of a cooling device provided in one embodiment of the present application;

[0034] Figure 2 for Figure 1 The main view;

[0035] Figure 3 for Figure 1 A top view of

[0036] Figure 4 A schematic diagram of a heat sink and a substrate provided in one embodiment of the present application;

[0037] Figure 5 A schematic diagram of a heat spreader assembly provided in one embodiment of the present application;

[0038] Figure 6 for Figure 5 A magnified schematic diagram of the middle A area;

[0039] Figure 7 A schematic diagram of a substrate provided in one embodiment of the present application;

[0040] Figure 8 A schematic diagram of a substrate and a cooling element provided in an embodiment of the present application;

[0041] Fig. 9 An exploded view of a cooling device provided in another embodiment of the present application;

[0042] Fig.10 A schematic diagram of a heat spreader assembly provided in another embodiment of the present application;

[0043] Fig.11 for Fig.10 A magnified schematic diagram of the middle B area;

[0044] Fig.12 A schematic diagram of a substrate provided in another embodiment of the present application;

[0045] Fig.13 A schematic diagram of a substrate and a cooling element provided in another embodiment of the present application;

[0046] Fig.14 A schematic diagram of a locking member provided in an embodiment of the present application;

[0047] Fig.15 A schematic diagram of an adapter provided in an embodiment of the present application;

[0048] Fig.16 A schematic diagram of a receiving cavity provided in an embodiment of the present application;

[0049] Fig.17 A schematic diagram of a server provided in accordance with an embodiment of the present application.

[0050] Reference numerals:

[0051] 100: heat dissipation component;

[0052] 110: substrate; 111: circulation channel; 1111: first circulation channel; 1111a: first channel; 1111b: second channel; 1112: second circulation channel; 112: through-hole; 113: first substrate; 1131: third mounting hole; 114: second substrate;

[0053] 120: top plate; 121: notch;

[0054] 130: liquid inlet pipe; 140: liquid outlet pipe;

[0055] 200: heat spreader assembly; 210: heat spreader plate; 211: second mounting hole; 220: cooling element; 221: cooling channel; 230: accommodating cavity; 240: partition;

[0056] 300: mounting plate;

[0057] 400: locking member; 410: locking rod; 411: first boss; 412: second boss; 420: adapter; 421: annular body; 422: elastic claw; 430: elastic member;

[0058] 500: Circuit board;

[0059] 600: Chip. DETAILED DESCRIPTION

[0060] As described in the background technology, the cooling effect of the cooling device is poor and cannot meet the heat dissipation requirements of the chip inside the server. The inventors have found that the reason for this problem is that the relevant technology usually uses liquid cooling to dissipate heat, that is, the radiator is set directly above the chip and the heat generated by the chip is absorbed by the radiator. However, the material of the radiator is usually metal, such as copper or aluminum, and the thermal conductivity of copper or aluminum is poor, which cannot meet the heat dissipation requirements of the chip.

[0061] In view of this, the embodiments of the present application provide a cooling device and a server, which organically combine liquid cooling technology and vacuum chamber heat sink heat dissipation technology. After the second cooling medium located at the bottom of the accommodating cavity absorbs the heat of the component to be cooled (for example, a chip), it evaporates and diffuses into the accommodating cavity, and transfers the heat to the cooling element. This heat is exchanged with the first cooling medium in the heat dissipation component, condensed into a liquid state, and refluxed to the bottom of the accommodating cavity. On the one hand, the accommodating cavity adopts a vacuum design, and the second cooling medium after being heated and vaporized can be conducted in a three-dimensional space, which simplifies the heat transfer path of the second cooling medium after being heated and vaporized. Compared with the metal heat conduction solution in the related art, it has a larger conduction system, which greatly improves the heat dissipation efficiency of the cooling device. On the other hand, the second cooling medium located in the accommodating cavity repeatedly absorbs heat, vaporizes and condenses, and needs to absorb a large amount of heat. Therefore, it can take away the heat generated by the component to be cooled more quickly.

[0062] In addition, the heat spreader and the cooling element are integrally formed, that is, the cooling element can be directly processed on the surface of the heat spreader facing the substrate, and the cooling element can be directly located in the through hole of the substrate and directly contact the first cooling medium. Compared with the technical solution in the related art in which the cooling element is arranged on the substrate, the conduction path of the second cooling medium after being heated and vaporized is shortened, so that the second cooling medium after being heated and vaporized can quickly exchange heat and condense with the first cooling medium, thereby improving the cooling effect of the cooling device.

[0063] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of this application.

[0064] Please refer to the attached Figure 1 To Attachment Fig.16 The embodiment of the present application provides a cooling device, which is used to dissipate heat from a part to be cooled to ensure the normal operation of the part to be cooled. Exemplarily, the cooling device is used to dissipate heat from a server chip. The cooling device has a strong heat dissipation performance and can quickly take away the heat generated by the server chip, ensuring the normal operation of the server chip.

[0065] The cooling device includes a heat dissipation component 100 and a heat spreader component 200, wherein the heat dissipation component 100 includes a substrate 110, the substrate 110 has a circulation channel 111 and a through hole 112, the circulation channel 111 is configured to circulate a first cooling medium, the circulation channel 111 and the through hole 112 are interconnected, so that the first cooling medium flows in the circulation channel 111 and the through hole. The through hole 112 penetrates the substrate 110 along the thickness direction of the substrate 110, so that the through hole 112 is a through hole connected from top to bottom, so as to accommodate the cooling member 220 of the heat spreader component 200.

[0066] The heat spreader assembly 200 includes a heat spreader plate 210 and a cooling member 220. The heat spreader plate 210 is connected to the bottom surface of the substrate 110, and the cooling member 220 is located in the through opening 112. The heat spreader plate 210 includes a receiving cavity 230 for receiving a second cooling medium (see the attached Fig.16 ), wherein the receiving cavity 230 of the heat spreader 210 is a vacuum cavity. It should be noted that, in a specific preparation process, the second cooling medium can be filled into the receiving cavity 230 and the receiving cavity 230 can be evacuated to form a vacuum in the receiving cavity 230.

[0067] In actual use, the cooling device is installed on the part to be cooled so that the heat spreader 210 fits the part to be cooled to dissipate the heat of the part to be cooled. In this embodiment, the liquid cooling technology and the vacuum chamber heat spreader heat dissipation technology are organically combined. After the second cooling medium at the bottom of the accommodating cavity absorbs the heat of the part to be cooled (for example, the chip), it evaporates and diffuses into the accommodating cavity, and transfers the heat to the cooling member 220. This heat is exchanged with the first cooling medium in the heat dissipation assembly 100 and condensed into liquid cooling, and refluxed to the bottom of the accommodating cavity. On the one hand, the accommodating cavity adopts a vacuum design, and the second cooling medium after being heated and vaporized can be conducted in three-dimensional space, which simplifies the heat transfer path of the second cooling medium after being heated and vaporized. Compared with the metal heat conduction scheme in the related art, it has a larger conduction system, which greatly improves the heat dissipation efficiency of the cooling device. On the other hand, the second cooling medium located in the accommodating cavity repeatedly absorbs heat, vaporizes and condenses, and needs to absorb a large amount of heat, so it can take away the heat generated by the part to be cooled more quickly.

[0068] The cooling member 220 is disposed on the vapor chamber 210 and is integrally formed with the vapor chamber 210. For example, a shovel or other processing tool may be used on the surface of the vapor chamber 210 facing the substrate 110 to form the cooling member 220 on the vapor chamber 210. In this embodiment, the cooling member may be located in the through hole 112 penetrating the substrate 110 and in direct contact with the first cooling medium.

[0069] The cooling element in the related art is directly arranged on the substrate. In this way, the heat carried by the second cooling medium after being heated and vaporized needs to be conducted to the lower surface of the substrate 110 first, and then conducted to the upper surface of the substrate 110 through the substrate 110 before it can exchange heat with the first cooling medium.

[0070] In this embodiment, the heat carried by the second cooling medium after being heated and vaporized is directly conducted to the cooling member 220, and the cooling member 220 is located in the through-hole 112 and in direct contact with the first cooling medium. This arrangement shortens the conduction path of the second cooling medium after being heated and vaporized, so that the second cooling medium after being heated and vaporized can quickly exchange heat and condense with the first cooling medium, thereby improving the cooling effect of the cooling device. In addition, the cooling member 220 and the heat spreader 210 are integrally formed, which can simplify the welding process of the cooling member 220 and the heat spreader 210, and simplify the preparation process of the heat spreader assembly 200.

[0071] The heat spreader 210 may partially overlap with the bottom surface of the substrate 110, or may at least completely overlap with the bottom surface of the substrate 110. Figures 4 to 8 The bottom surfaces of the heat spreader 210 and the substrate 110 partially overlap. In other words, the heat spreader 210 is a small-sized structural component, and the area of ​​the heat spreader 210 is smaller than that of the substrate 110 .

[0072] The cooling member 220 is formed on the surface of the vapor chamber 210, wherein the projection of the through opening 112 on the vapor chamber 210 covers the portion of the vapor chamber 210 and at least covers the projection of the cooling member 220 on the vapor chamber 210. In other words, the area of ​​the through opening 112 is smaller than the area of ​​the vapor chamber 210 and larger than the area of ​​the cooling member 220. This arrangement allows the vapor chamber 210 to cover the bottom of the through opening 112 and install the cooling member 220 in the through opening 112.

[0073] The circulation channel 111 is distributed on two opposite sides of the through-port 112, that is, the circulation channel 111 located on one side of the through-port 112 is used to circulate the first cooling medium with a lower temperature; the circulation channel 111 located on the other side of the through-port 112 is used to circulate the first cooling medium that absorbs heat, so that the first cooling medium forms a circulation flow between the circulation channel 111 and the through-port 112.

[0074] In this embodiment, the heat spreader 210 is a small-sized structural member, and the heat spreader 210 can be directly set on the surface of the main component to be cooled. For example, the heat spreader 210 can be directly set on the chip of the circuit board and fit with the chip. Such a setting can not only cool the main component to be cooled in a timely and effective manner, but also reduce the manufacturing cost of the heat spreader assembly 200, thereby reducing the manufacturing cost of the cooling device.

[0075] In another possible implementation, please refer to the attached Fig. 9 To Attachment Fig.13 , the vapor chamber 210 at least completely overlaps with the bottom surface of the substrate 110, so that the vapor chamber 210 can be used to provide support for the substrate 110. In one example, the vapor chamber 210 can completely overlap only with the bottom surface of the substrate 110, that is, the area of ​​the vapor chamber 210 is equal to the area of ​​the substrate 110. In another example, the area of ​​the vapor chamber 210 is greater than the area of ​​the substrate 110.

[0076] The cooling member 220 is located in the middle of the heat spreader 210, and the through hole 112 is located in the middle of the substrate 110 and is arranged opposite to the cooling member 220; the circulation channel 111 is distributed on opposite sides of the through hole 112, that is, the circulation channel 111 located on one side of the through hole 112 is used to circulate the first cooling medium with a lower temperature; the circulation channel 111 located on the other side of the through hole 112 is used to circulate the first cooling medium after absorbing heat, so that the first cooling medium forms a circulation between the circulation channel 111 and the through hole 112. It should be noted that the middle of the heat spreader 210 in this embodiment can refer to the central area of ​​the heat spreader 210, and can also refer to the area adjacent to the central area of ​​the heat spreader 210.

[0077] When the cooling device in this example is used to dissipate heat from the circuit board of the server, the chip is the main component to be cooled, but other components on the circuit board will also generate a certain amount of heat. The area of ​​the heat spreader 210 in this embodiment is large and can cover most areas of the circuit board. In this way, the heat can be dissipated quickly and effectively for the chip, and it is also beneficial to dissipate heat for other components on the circuit board, thereby improving the overall heat dissipation effect of the circuit board of the server.

[0078] It should be noted that when the heat spreader 210 partially overlaps with the bottom surface of the substrate 110 , or when the heat spreader 210 at least completely overlaps with the bottom surface of the substrate 110 , the structures of the substrate 110 corresponding to the two are different.

[0079] For an example, see the attached Figure 7 When the heat spreader 210 partially overlaps with the bottom surface of the substrate 110, the substrate 110 includes a first substrate 113 and a second substrate 114. The second substrate 114 is disposed on the first substrate 113, and the area of ​​the second substrate 114 is smaller than the area of ​​the first substrate 113, that is, the shape of the substrate 110 is a convex shape.

[0080] The through hole 112 is disposed at the center of the second substrate 114, and the through hole 112 penetrates the first substrate 113 and the second substrate 114 along the thickness direction of the substrate 110; the flow channel 111 is located on two opposite sides of the through hole 112 and is formed on the second substrate 114. Figure 7 In the X direction, the circulation channels 111 are located on both sides of the through opening 112 in the X direction, that is, part of the circulation channels 111 are located on the left side of the through opening 112 , and the remaining circulation channels 111 are located on the right side of the through opening 112 .

[0081] For another example, see the attached Fig.12 When the heat spreader 210 at least completely overlaps with the bottom surface of the substrate 110 , the shape of the substrate 110 is the same as the shape of the second substrate 114 in the above example. At this time, the through opening 112 and the flow channel 111 are both formed on the substrate 110 .

[0082] In this embodiment, the cooling element 220 may be a plate heat exchanger or a microchannel heat exchanger. Figure 5 and attached Figure 6 , and attached Fig.10 and attached Fig.11 The cooling member 220 includes a plurality of cooling channels 221, and the plurality of cooling channels 221 are arranged at intervals along the first direction. When the cooling member 220 is a square structure, the plurality of cooling channels 221 can be arranged at intervals along the width direction of the cooling member 220. That is, the first direction is perpendicular to the flow channel, that is, the first direction is adjacent to the flow channel. Figure 5 and attached Fig.10 Center Y direction.

[0083] The opening of each cooling channel 221 faces the circulation channel 111 and is connected with the circulation channel 111, so that the first cooling medium can flow in the cooling channel 221. It should be noted that when the circulation channel 111 includes the first circulation channel 1111 and the second circulation channel 1112, the first circulation channel 1111 and the second circulation channel 1112 are respectively located on both sides of the through-hole 112. At this time, each cooling channel 221 has two openings, one of which faces the first circulation channel 1111 and is connected with the first circulation channel 1111, and the other faces the second circulation channel 1112 and is connected with the second circulation channel 1112. In this way, one of the openings can be used as the entrance of the cooling channel 221, and the other opening can be used as the exit of the cooling channel 221, so that the first cooling medium can circulate in the circulation channel and the cooling channel 221.

[0084] In this embodiment, the cooling element 220 includes a plurality of cooling channels 221. The first cooling medium can flow in each cooling channel 221 and exchange heat with the heat transferred to the cooling element 220, so that the second cooling medium after being heated and vaporized can quickly exchange heat and condense with the first cooling medium, thereby improving the cooling effect of the cooling device.

[0085] Among them, the formation of multiple cooling channels 221 in the cooling member 220 can be in various forms. For example, the cooling member 220 can be a plate structure, and multiple cooling channels 221 can be formed in the cooling member 220, so that multiple microchannels are formed inside the cooling member 220. For another example, the cooling member 220 includes a plurality of fins, the plurality of fins are arranged at intervals along a first direction, each fin extends along a second direction, and the first direction and the second direction intersect. That is, the first direction and the second direction are two intersecting directions within the plane where the substrate 110 is located. Cooling channels 221 are formed between adjacent fins, and / or, a cooling channel 221 is provided in each fin. In other words, the cooling channel 221 can be simply composed of the area between adjacent fins; or, the cooling channel 221 can be simply formed in each fin; or, the cooling channel 221 is simultaneously composed of the area between adjacent fins; and the cooling channel 221 is provided in each fin.

[0086] In order to facilitate the description of the circulation channels 111 located on both sides of the through-opening 112, it is convenient to divide the circulation channels 111 so that the circulation channels 111 include a first circulation channel 1111 and a second circulation channel 1112, the first circulation channel 1111 and the second circulation channel 1112 are respectively located on both sides of the through-opening 112, and the first circulation channel 1111 and the second circulation channel 1112 are symmetrically arranged relative to the center line of the through-opening 112, wherein the center line of the through-opening 112 is parallel to the first direction, and the center line of the through-opening 112 can be attached Figure 7 The first circulation channel 1111 and the second circulation channel 1112 are symmetrically arranged. On the one hand, the preparation of the first circulation channel 1111 and the second circulation channel 1112 can be facilitated and the preparation process can be simplified; on the other hand, the flow rate of the first cooling medium in the first circulation channel 1111 and the second circulation channel 1112 can be balanced to improve the cooling effect of the cooling device.

[0087] In this example, the first circulation channel 1111 includes a first channel 1111a and at least two second channels 1111b. The first channel 1111a extends along the first direction; at least two second channels 1111b are arranged on the side of the first channel 1111a facing the first through-port 112, and are connected to the first channel 1111a. Among them, the at least two second channels 1111b can be arranged at intervals along the first direction, and the at least two second channels 1111b can be parallel to each other or can be arranged relatively inclined. Exemplarily, each second channel 1111b extends along the second direction so that the at least two second channels 1111b are parallel to each other.

[0088] At least two second channels 1111b divide the first cooling medium flowing through the first channel 1111a into at least two flow directions, which can reduce the impact force of the first cooling medium on the fins of the cooling member 220. It can not only reasonably adjust the flow rate and flow velocity of the first cooling medium in the cooling channel 221, but also reduce the damage to the fins of the cooling member 220, thereby increasing the service life of the fins of the cooling member 220.

[0089] In a possible implementation, the top surface of the cooling member 220 located in the through hole 112 is lower than the bottom surface of the circulation channel 111. In other words, there is a height difference between the top surface of the cooling member 220 and the bottom surface of the circulation channel 111.

[0090] In this embodiment, the second circulation channel may be used as the liquid inlet end of the first cooling medium, and the first circulation channel may be used as the liquid outlet end of the first cooling medium; when the first cooling medium flows to the through-port 112 through the second circulation channel, since the top surface of the cooling member 220 in the through-port 112 is lower than the bottom surface of the circulation channel 111, the flow speed of the first cooling medium in the through-port 112 can be slowed down, and the flow time of the first cooling medium at the through-port 112 can be increased, providing more sufficient heat exchange time for the first cooling medium and the vaporized second cooling medium, thereby improving the heat exchange effect of the cooling equipment.

[0091] In one possible implementation, please refer to the attached Fig.15 The accommodating chamber 230 is a vacuum chamber, and the accommodating chamber 230 includes at least two relatively independently arranged sub-chambers. For example, a partition 240 is arranged in the accommodating chamber 230, and the partition 240 divides the accommodating chamber 230 into at least two relatively independently arranged sub-chambers.

[0092] Among them, in a direction perpendicular to the bottom surface of the heat spreader 210, one end of the partition 240 is connected to the bottom surface of the heat spreader 210, and the other end of the partition is connected to the top surface of the heat spreader 210, so that the bottom surface of each sub-chamber formed is in contact with the component to be cooled, and the top surface is in contact with the surface of the cooling member 220 facing the substrate 110. In this way, the second cooling medium in each sub-chamber can absorb the heat of the component to be cooled and vaporize. The vaporized second cooling medium can move to the top of the sub-chamber, exchange heat with the first cooling medium and condense into liquid. The liquid second cooling medium flows back to the bottom of the sub-chamber under the action of its own gravity. When one of the sub-chambers fails, the other sub-chamber can still keep working and complete the cooling function of the heat spreader, so that the cooling equipment can perform its cooling function normally.

[0093] It should be noted that the partition 240 may be a straight plate, and the partition 240 may be perpendicular to the bottom surface of the vapor chamber 210, or may be arranged to be inclined relative to the direction perpendicular to the bottom surface of the vapor chamber 210, so that at least two sub-chambers are regular shapes. The partition 240 may also be an irregular shape, so that at least two sub-chambers are irregular shapes.

[0094] In one possible implementation, the heat dissipation assembly 100 also includes a top plate 120, which is disposed on the substrate 110 to cover the circulation channel 111 and the through-port 112; such a configuration can prevent the first cooling medium from overflowing the circulation channel 111, thereby ensuring the normal use of the heat dissipation assembly 100.

[0095] Among them, the top plate 120 is provided with a liquid inlet pipe 130 and a liquid outlet pipe 140, one end of the liquid inlet pipe 130 and the liquid outlet pipe 140 are respectively connected to the circulation channel 111 and are located on both sides of the cooling member 220. In other words, one end of the liquid inlet pipe 130 is connected to the second circulation channel 1112, and one end of the liquid outlet pipe 140 is connected to the first circulation channel 1111. In order to improve the circulation path of the first cooling medium in the circulation channel 111, the liquid inlet pipe 130 and the liquid outlet pipe 140 are located on a diagonal line of the top plate 120. It should be noted that the other ends of the liquid outlet pipe 140 and the liquid inlet pipe 130 can also be connected to a storage box respectively, and the storage box is used to store the first cooling medium to ensure the normal use of the cooling device.

[0096] At least two notches 121 are arranged at intervals on the top plate 120. The at least two notches 121 penetrate the top plate 120 along the thickness direction of the top plate 120 and are not connected to the circulation channel 111 and the through-hole 112. That is, the projection area of ​​the notches 121 on the base plate 110 is arranged in a misaligned manner with the circulation channel 111 and the through-hole 112, so as to prevent the first cooling medium in the circulation channel 111 and the through-hole 112 from overflowing, thereby improving the safety of the cooling device.

[0097] It should be noted that the cooling device disclosed in the embodiment of the present application needs to be installed on the component to be cooled, for example, it needs to be installed on a circuit board. Therefore, the cooling device disclosed in the embodiment of the present application also includes a mounting plate 300 and a locking member 400.

[0098] For example, please refer to the attached Figure 1 and attached Fig. 9 The mounting plate 300 is an annular member, and a first mounting hole (not shown in the figure) is set on the mounting plate 300. One end of the locking member 400 passes through the first mounting hole and other mounting holes set on the cooling device in sequence, and is fixedly connected to the component to be cooled.

[0099] It should be understood that when the heat spreader 210 and the substrate 110 have different structures, the locations of the other mounting holes are also different. Figure 1 and attached Figure 2 When the heat spreader 210 partially overlaps with the bottom surface of the substrate 110 , the substrate 110 includes a first substrate 113 and a second substrate 114 disposed on the first substrate 113 , and the area of ​​the second substrate 114 is smaller than that of the first substrate 113 .

[0100] At this time, a third mounting hole 1131 is disposed on the first substrate 113 , and the third mounting hole 1131 is disposed opposite to the first mounting hole.

[0101] The annular mounting plate 300 is disposed on the first substrate 113 and sleeved on the outer circumferential surface of the second substrate 114 ; the locking member 400 passes through the first mounting hole and the third mounting hole 1131 in sequence and is fixedly connected to the circuit board.

[0102] For another example, see the attached Fig. 9 When the heat spreader 210 at least completely overlaps with the bottom surface of the substrate 110, a second mounting hole 211 is provided on the heat spreader 210, and the second mounting hole 211 is arranged opposite to the first mounting hole; the annular mounting plate 300 is arranged on the heat spreader 210 and sleeved on the outer peripheral surface of the substrate 110; the locking member 400 passes through the first mounting hole and the second mounting hole 211 in sequence and is fixedly connected to the circuit board.

[0103] Please refer to the attached Fig.14 , wherein the locking member 400 includes a locking rod 410 and an adapter 420, and the adapter 420 is sleeved on the locking rod 410, wherein the adapter 420 is located below the mounting plate 300 and located in the second mounting hole 211 or the third mounting hole 1131, and is used to adapt to the second mounting hole 211 or the third mounting hole 1131.

[0104] Please refer to the attached Fig.15 The adapter 420 includes an annular body 421 and a plurality of elastic claws 422; the plurality of elastic claws 422 are connected to the inner surface of the annular body 421, and the plurality of elastic claws 422 are arranged at intervals along the circumference of the annular body 421. The end of each elastic claw 422 away from the annular body 421 extends toward the center of the annular body 421, so that the diameter of the area surrounded by the plurality of elastic claws 422 gradually decreases in the direction away from the annular body 421. In this way, the adapter 420 can be adapted to locking rods 410 of different sizes, and the connection strength between the heat spreader 210 or the substrate 110 and the locking member 400 can be improved.

[0105] The locking member 400 further includes an elastic member 430; the elastic member 430 may include a spring. The locking rod 410 includes a first boss 411 and a second boss 412 arranged at intervals, and the second boss 412 and the adapter 420 are respectively located on both sides of the annular mounting plate 300. Figure 1 Taking the above-mentioned orientation as an example, the second boss 412 is located above the mounting plate 300 , and the adapter 420 is located below the annular mounting plate 300 .

[0106] The elastic member 430 is sleeved on the locking rod 410 and is located between the first boss 411 and the second boss 412 , so as to buffer the installation force, reduce the damage to the circuit board, and increase the service life of the circuit board.

[0107] The present application also provides a server, please refer to the attached Fig.16 The server includes a circuit board 500, a chip 600 and a cooling device described in any of the above embodiments.

[0108] The chip 600 is disposed on the circuit board 500 ; the cooling device is disposed on the circuit board 500 , and the heat spreader 210 of the cooling device is at least attached to the chip.

[0109] Since the server provided in the embodiment of the present application includes the cooling device described in any of the above embodiments, the effects of the cooling device described in any of the above embodiments are also possessed by the server in the embodiment of the present application, which will not be described in detail here.

[0110] It should be noted that other components on the circuit board 500 can also dissipate heat through cooling equipment. For example, other components can contact the bottom surface of the heat spreader 210 with thermally conductive materials to conduct the heat generated by other components to the heat spreader 210.

[0111] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0112] In the embodiments of the present application, the devices or elements referred to or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

[0113] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "may include" and "have" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A cooling device, characterized in that: include: A heat dissipation component, the heat dissipation component comprising a substrate having a circulation channel and a through-hole, the through-hole penetrating the substrate along the thickness direction of the substrate and communicating with the circulation channel; the circulation channel is configured to flow a first cooling medium; A heat spreader assembly, the heat spreader assembly comprising a heat spreader plate and a cooling member integrally formed with the heat spreader plate, the heat spreader plate is connected to the bottom surface of the substrate, and the cooling member is located in the through opening; the heat spreader plate comprises a receiving cavity for receiving a second cooling medium; Wherein, in the accommodating cavity, the heated and vaporized second cooling medium moves toward the top of the accommodating cavity, exchanges heat with the first cooling medium to be condensed into liquid, and flows back to the bottom of the accommodating cavity.

2. The cooling device according to claim 1, characterized in that: The heat spreader partially overlaps with the bottom surface of the substrate; wherein the projection of the through-hole on the heat spreader covers part of the heat spreader and at least covers the projection of the cooling element on the heat spreader; the flow channel is distributed on opposite sides of the through-hole.

3. The cooling device according to claim 1, characterized in that: The heat spreader at least completely overlaps with the bottom surface of the substrate, and the cooling element is located in the middle of the heat spreader; The through-opening is located in the middle of the substrate and is arranged opposite to the cooling member; the flow channels are distributed on two opposite sides of the through-opening.

4. The cooling device according to any one of claims 1 to 3, characterized in that: The cooling member comprises a plurality of cooling channels, which are arranged at intervals along a first direction; the opening of each cooling channel faces the circulation channel and is connected to the circulation channel; wherein the first direction is perpendicular to the circulation channel.

5. The cooling device according to claim 4, characterized in that: The cooling element includes a plurality of fins, and the plurality of fins are arranged at intervals along the first direction; the cooling channel is formed between adjacent fins, and / or the cooling channel is provided in each fin.

6. The cooling device according to claim 5, characterized in that The circulation channel includes a first circulation channel and a second circulation channel, the first circulation channel and the second circulation channel are respectively located on both sides of the through-hole and are symmetrically arranged relative to the center line of the through-hole, wherein the center line of the through-hole is parallel to the first direction; The first circulation channel includes a first channel and at least two second channels, the first channel extends along the first direction; the at least two second channels are arranged on a side of the first channel facing the through-port and are communicated with the first channel.

7. The cooling device according to any one of claims 1 to 3, characterized in that: The top surface of the cooling element located in the through-hole is lower than the bottom surface of the flow channel.

8. The cooling device according to any one of claims 1 to 3, characterized in that: The accommodating chamber is a vacuum chamber, and the accommodating chamber includes at least two relatively independently arranged sub-chambers, the bottom surfaces of at least two of the sub-chambers are in contact with the component to be cooled, and the top surfaces of at least two of the sub-chambers are in contact with the surface of the cooling member facing the substrate.

9. The cooling device according to any one of claims 1 to 3, characterized in that: The heat dissipation assembly further includes a top plate, which is disposed on the base plate to cover the flow channel and the through-hole; A liquid inlet pipe and a liquid outlet pipe are arranged on the top plate, one end of the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the circulation channel and are located on both sides of the cooling element.

10. The cooling device according to claim 2 or 3, characterized in that: The cooling device further comprises an annular mounting plate and a locking member, wherein the mounting plate is provided with a first mounting hole; When the heat spreader at least completely overlaps with the bottom surface of the substrate, a second mounting hole is provided on the heat spreader, and the second mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the heat spreader and sleeved on the outer peripheral surface of the substrate; the locking member is fixedly connected to the circuit board after passing through the first mounting hole and the second mounting hole in sequence; Alternatively, when the heat spreader and the bottom surface of the substrate partially overlap, the substrate includes a first substrate and a second substrate arranged on the first substrate, the area of ​​the second substrate is smaller than the area of ​​the first substrate; a third mounting hole is arranged on the first substrate, and the third mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the first substrate and is sleeved on the outer peripheral surface of the second substrate; the locking piece is fixedly connected to the circuit board after passing through the first mounting hole and the third mounting hole in sequence.

11. The cooling device according to claim 10, characterized in that The locking member comprises a locking rod and an adapter sleeved on the locking rod; The adapter comprises an annular body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular body, and the plurality of elastic claws are arranged at intervals along the circumference of the annular body.

12. The cooling device according to claim 11, characterized in that The locking member further comprises an elastic member; the locking rod comprises a first boss and a second boss which are spaced apart, the second boss and the adapter being respectively located on two sides of the annular mounting plate; The elastic member is sleeved on the locking rod and is located between the first boss and the second boss.

13. A server, characterized in that: It comprises a circuit board, a chip and the cooling device according to any one of claims 1 to 12; the chip is arranged on the circuit board; The cooling device is arranged on the circuit board, and the heat spreader of the cooling device is at least attached to the chip.

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