Auxiliary device of semiconductor aluminum plating equipment

Abstract

The utility model provides an auxiliary device of semiconductor aluminum plating equipment, the semiconductor aluminum plating equipment comprises a cooling chamber, and the auxiliary device comprises an oxygen content detection unit and an exhaust unit; the oxygen content detection unit is communicated with the interior of the cooling chamber; the exhaust unit comprises an exhaust pipe and an exhaust pump; one end of the exhaust pipe is communicated with the interior of the cooling chamber, and the other end of the exhaust pipe is arranged outside the cooling chamber; and the exhaust pump is mounted on the exhaust pipe. When the detection result of the oxygen content detection unit or the air pressure detection unit is larger than the corresponding threshold value, oxygen in the cooling chamber is exhausted through the exhaust unit, and the unexpected effect is that the defect of annular metal protrusions on the wafer can be obviously improved or even eliminated, so that the first wafer effect of semiconductor aluminum plating equipment is obviously improved or even eliminated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor aluminum plating equipment, in particular to an auxiliary device of semiconductor aluminum plating equipment. Background Art

[0002] The semiconductor process includes an aluminum plating process, and the aluminum plating process requires the use of semiconductor aluminum plating equipment. The semiconductor aluminum plating equipment includes multiple chambers such as a high-temperature aluminum plating chamber and a cooling chamber (the cooling chamber can also be called chamber B). The wafer needs to enter these chambers in sequence according to a pre-established process flow. The process flow includes: the wafer is subjected to high-temperature aluminum plating in the high-temperature aluminum plating chamber, and then enters the cooling chamber for cooling. After cooling, it is removed from the semiconductor aluminum plating equipment or subjected to other treatments.

[0003] However, current semiconductor aluminum plating equipment has a first-piece effect, that is, when the equipment is just running or has been in standby for a long time, the first products produced have ring-shaped metal bump defects. Adjusting the process temperature or process parameters cannot improve or eliminate the ring-shaped metal bump defects. Utility Model Content

[0004] The utility model provides an auxiliary device for semiconductor aluminum plating equipment to solve the technical problem of first-piece effect in semiconductor aluminum plating equipment.

[0005] In order to solve the above technical problems, the utility model provides an auxiliary device for semiconductor aluminum plating equipment, the semiconductor aluminum plating equipment includes a cooling chamber, the auxiliary device includes an oxygen content detection unit and an exhaust unit; the oxygen content detection unit is connected to the interior of the cooling chamber; the exhaust unit includes an exhaust pipe and an exhaust pump; one end of the exhaust pipe is connected to the interior of the cooling chamber, and the other end is arranged outside the cooling chamber; the exhaust pump is installed on the exhaust pipe.

[0006] Optionally, a check valve is also included; the check valve is installed on the exhaust pipe.

[0007] Optionally, the check valve is arranged on the exhaust pipe between the cooling chamber and the exhaust pump.

[0008] Optionally, the exhaust pump is arranged on the exhaust pipe between the cooling chamber and the check valve.

[0009] Optionally, one end of the exhaust pipe is connected to the bottom of the cooling chamber.

[0010] Optionally, a sealing ring is provided between one end of the exhaust pipe and the cooling chamber.

[0011] Optionally, the other end of the exhaust pipe is connected to a preset exhaust gas treatment pipeline.

[0012] Optionally, the oxygen content detection unit includes a display screen, and the display screen is mounted on the housing of the semiconductor aluminum plating equipment.

[0013] The utility model also provides another auxiliary device for semiconductor aluminum plating equipment, the semiconductor aluminum plating equipment includes a cooling chamber, the auxiliary device includes an air pressure detection unit and an exhaust unit; the air pressure detection unit is connected to the interior of the cooling chamber; the exhaust unit includes an exhaust pipe and an exhaust pump; one end of the exhaust pipe is connected to the interior of the cooling chamber, and the other end is arranged outside the cooling chamber; the exhaust pump is installed on the exhaust pipe.

[0014] Optionally, the air pressure detection unit includes a display screen, and the display screen is mounted on the housing of the semiconductor aluminum plating equipment.

[0015] The utility model provides an auxiliary device for semiconductor aluminum plating equipment, which is equipped with an oxygen content detection unit or an air pressure detection unit, and an exhaust unit. When the detection result of the oxygen content detection unit or the air pressure detection unit is greater than the corresponding threshold value, the oxygen in the cooling chamber is discharged through the exhaust unit. The unexpected effect is that the annular metal protrusion defect on the wafer can be significantly improved or even eliminated, so that the first-piece effect of the semiconductor aluminum plating equipment is significantly improved or even eliminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of an auxiliary device of a semiconductor aluminum plating device provided by an embodiment of the utility model.

[0017] Figure 2 It is a structural schematic diagram of another auxiliary device of semiconductor aluminum plating equipment provided by one embodiment of the utility model.

[0018] [Description of reference numerals is as follows]:

[0019] Cooling chamber-1, oxygen content detection unit-2, exhaust unit-3, manual valve-4;

[0020] Exhaust pipe-31, exhaust pump-32, check valve-33. DETAILED DESCRIPTION

[0021] In order to make the purpose, advantages and features of the present invention clearer, the auxiliary device of the semiconductor aluminum plating equipment proposed by the present invention is further described in detail below in conjunction with the accompanying drawings. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0022] In the description of the present invention, the terms "first", "second", etc. are added for the convenience of description and reference, and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined by the terms "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0023] like Figure 1 As shown, this embodiment provides an auxiliary device for semiconductor aluminum plating equipment, the semiconductor aluminum plating equipment includes a cooling chamber 1, the auxiliary device includes an oxygen content detection unit 2 and an exhaust unit 3; the oxygen content detection unit 2 is connected to the interior of the cooling chamber 1; the exhaust unit 3 includes an exhaust pipe 31 and an exhaust pump 32; one end of the exhaust pipe 31 (one end of the exhaust pipe 31 refers to Figure 1 The left end of the exhaust pipe 31 can be defined as end A) is connected to the interior of the cooling chamber 1, and the other end (the other end of the exhaust pipe 31 refers to Figure 1 The right end of the cooling chamber 1 (which can be defined as the B end) is arranged outside the cooling chamber 1; the exhaust pump 32 is installed on the exhaust pipe 31. The exhaust pump 32 can be an electric exhaust pump, and when the detection result of the oxygen content detection unit 2 is greater than the threshold value, the oxygen in the cooling chamber 1 is automatically discharged through the electric exhaust pump.

[0024] After slicing and analyzing normal wafers and wafers with annular metal protrusion defects, the inventor found that the composition of the annular metal protrusion defect is Al2O3 (Al2O3, aluminum oxide), which means that air may enter the cooling chamber 1 during the equipment shutdown or standby process. When the wafer moves from the high-temperature aluminum-plated chamber to the cooling chamber 1, the high-temperature Al on the wafer reacts with the oxygen in the air entering the cooling chamber 1 to generate Al2O3. In order to verify this hypothesis, when the oxygen content detection unit 2 detects that the oxygen content in the cooling chamber is greater than the preset threshold, the oxygen in the cooling chamber 1 is discharged through the exhaust unit 3, and then the aluminum-plated wafer is moved to the cooling chamber 1. The wafer obtained in this way can significantly improve or even eliminate the annular metal protrusion defect on the wafer.

[0025] The present embodiment provides an auxiliary device for semiconductor aluminum plating equipment, which is equipped with an oxygen content detection unit 2 and an exhaust unit 3. When the detection result of the oxygen content detection unit 2 is greater than a threshold value, the oxygen in the cooling chamber 1 is discharged through the exhaust unit 3. The unexpected effect is that the annular metal protrusion defect on the wafer can be significantly improved or even eliminated, so that the first-piece effect of the semiconductor aluminum plating equipment can be significantly improved or even eliminated.

[0026] Optional, such as Figure 1As shown, the exhaust unit 3 further includes a check valve 33; the check valve 33 is installed on the exhaust pipe 31. The check valve 33 can prevent external air from entering the cooling chamber 1. The check valve 33 can be an electromagnetic check valve. In other embodiments, the exhaust pump 32 can use an exhaust pump with a check valve 33.

[0027] Optional, such as Figure 1 As shown, the check valve 33 is arranged on the exhaust pipe 31 between the cooling chamber 1 and the exhaust pump 32. When the exhaust pump 32 fails or is under maintenance, the check valve 33 can close the exhaust pipe 31 to avoid back pressure in the cooling chamber 1. When the auxiliary device is actually used, a manual valve 4 can also be arranged on the exhaust pipe 31 to manually control the opening and closing of the exhaust pipe 31.

[0028] Optional, such as Figure 2 As shown, the exhaust pump 32 is disposed on the exhaust pipe 31 between the cooling chamber 1 and the check valve 33. The exhaust pump 32 is close to the cooling chamber 1, so that the oxygen in the cooling chamber 1 can be discharged as quickly as possible, saving time and increasing production.

[0029] Optional, reference Figure 1 As shown, one end of the exhaust pipe 31 (i.e., end A of the exhaust pipe 31) is connected to the bottom of the cooling chamber 1. The density of oxygen is slightly greater than that of air, and the oxygen content at the bottom of the cooling chamber 1 is slightly higher than that at the top thereof. Connecting end A of the exhaust pipe 31 to the bottom of the cooling chamber 1 can discharge the oxygen in the cooling chamber 1 as quickly as possible, saving time and increasing production.

[0030] Optional, reference Figure 1 As shown, a sealing ring is provided between one end of the exhaust pipe 31 (i.e., end A of the exhaust pipe 31) and the cooling chamber 1. The sealing ring can improve the sealing performance between the cooling chamber 1 and end A of the exhaust pipe 31, and prevent external air from entering the cooling chamber 1.

[0031] Optional, reference Figure 1 As shown, the other end of the exhaust pipe 31 (i.e., end B of the exhaust pipe 31) is connected to a preset exhaust gas treatment pipeline. The preset exhaust gas treatment pipeline can be a factory exhaust gas treatment pipeline in a workshop, which can purify the exhaust gas before discharging it into the air to prevent air pollution.

[0032] Optional, reference Figure 1 As shown, the oxygen content detection unit 2 includes a display screen, which is mounted on the housing of the semiconductor aluminum plating equipment. The operator can check the oxygen content in the cooling chamber 1 through the display screen of the oxygen content detection unit 2 to prevent the excessive oxygen content in the cooling chamber 1 from causing annular metal protrusion defects on the wafer.

[0033] refer to Figure 1 As shown, based on the same technical concept as the auxiliary device of the above-mentioned semiconductor aluminum plating equipment, this embodiment provides another auxiliary device of semiconductor aluminum plating equipment, the semiconductor aluminum plating equipment includes a cooling chamber 1, and the auxiliary device includes an air pressure detection unit (equivalent to replacing the oxygen content detection unit 2 with the air pressure detection unit) and an exhaust unit 3; the air pressure detection unit is connected to the interior of the cooling chamber 1; the exhaust unit 3 includes an exhaust pipe 31 and an exhaust pump 32; one end of the exhaust pipe 31 is connected to the interior of the cooling chamber 1, and the other end is arranged outside the cooling chamber 1; the exhaust pump 32 is installed on the exhaust pipe 31.

[0034] The interior of the cooling chamber 1 is usually a negative pressure environment. When the equipment is shut down or in standby mode, the equipment is back-pressurized due to the pressure difference, causing air to enter the cooling chamber 1, which in turn increases the oxygen content in the cooling chamber 1. When the air pressure in the cooling chamber 1 is too high, the air in the cooling chamber 1 is exhausted through the exhaust unit 3, which can also significantly improve or even eliminate the annular metal protrusion defect on the wafer, but this solution is indirect because when the air in the cooling chamber 1 is exhausted, the oxygen content in the cooling chamber 1 cannot be directly determined. The optimal solution is that the auxiliary device of the semiconductor aluminum plating equipment includes an oxygen content detection unit 2 but does not include an air pressure detection unit.

[0035] The present embodiment provides an auxiliary device for semiconductor aluminum plating equipment, which is equipped with an air pressure detection unit and an exhaust unit 3. When the detection result of the air pressure detection unit is greater than a threshold value, the oxygen in the cooling chamber 1 is discharged through the exhaust unit 3. The unexpected effect is that the annular metal protrusion defects on the wafer can be significantly improved or even eliminated, thereby improving or even eliminating the first-piece effect of the semiconductor aluminum plating equipment.

[0036] Optional, reference Figure 1 As shown, the air pressure detection unit includes a display screen, which is installed on the housing of the semiconductor aluminum plating equipment. The operator can check the air pressure in the cooling chamber 1 through the display screen of the air pressure detection unit. When the air pressure is high, it means that the air content is high, and the high air content means that the oxygen content is high. At this time, the air in the cooling chamber 1 should be removed in time.

[0037] To sum up, the utility model provides an auxiliary device for semiconductor aluminum plating equipment, which is equipped with an oxygen content detection unit 2 or an air pressure detection unit, and an exhaust unit 3. When the detection result of the oxygen content detection unit 2 or the air pressure detection unit is greater than the corresponding threshold value, the oxygen in the cooling chamber 1 is discharged through the exhaust unit 3. The unexpected effect is that the annular metal protrusion defects on the wafer can be significantly improved or even eliminated, so that the first-piece effect of the semiconductor aluminum plating equipment can be significantly improved or even eliminated.

[0038] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation to the scope of the utility model. Any changes and modifications made by ordinary technicians in this field based on the above disclosure are within the protection scope of the utility model.

Claims

1. An auxiliary device for semiconductor aluminum plating equipment, the semiconductor aluminum plating equipment comprising a cooling chamber, characterized in that: The auxiliary device includes an oxygen content detection unit and an exhaust unit; the oxygen content detection unit is connected to the interior of the cooling chamber; the exhaust unit includes an exhaust pipe and an exhaust pump; one end of the exhaust pipe is connected to the interior of the cooling chamber, and the other end is arranged outside the cooling chamber; the exhaust pump is installed on the exhaust pipe.

2. The auxiliary device of semiconductor aluminum plating equipment as claimed in claim 1, characterized in that: The exhaust unit further comprises a check valve; the check valve is installed on the exhaust pipe.

3. The auxiliary device of semiconductor aluminum plating equipment as claimed in claim 2, characterized in that: The check valve is disposed on the exhaust pipe between the cooling chamber and the exhaust pump.

4. The auxiliary device of semiconductor aluminum plating equipment as claimed in claim 2, characterized in that: The exhaust pump is disposed on the exhaust pipe between the cooling chamber and the check valve.

5. The auxiliary device of semiconductor aluminum plating equipment as claimed in claim 1, characterized in that: One end of the exhaust pipe is communicated with the bottom of the cooling chamber.

6. The auxiliary device of semiconductor aluminum plating equipment as claimed in claim 1, characterized in that: A sealing ring is arranged between one end of the exhaust pipe and the cooling chamber.

7. The auxiliary device of semiconductor aluminum plating equipment as claimed in claim 1, characterized in that: The other end of the exhaust pipe is communicated with a preset exhaust gas treatment pipeline.

8. The auxiliary device of semiconductor aluminum plating equipment as claimed in claim 1, characterized in that: The oxygen content detection unit comprises a display screen, which is mounted on a housing of the semiconductor aluminum plating equipment.

9. An auxiliary device for semiconductor aluminum plating equipment, the semiconductor aluminum plating equipment comprising a cooling chamber, characterized in that: The auxiliary device includes an air pressure detection unit and an exhaust unit; the air pressure detection unit is connected to the interior of the cooling chamber; the exhaust unit includes an exhaust pipe and an exhaust pump; one end of the exhaust pipe is connected to the interior of the cooling chamber, and the other end is arranged outside the cooling chamber; the exhaust pump is installed on the exhaust pipe.

10. An auxiliary device for semiconductor aluminum plating equipment as claimed in claim 9, characterized in that: The air pressure detection unit includes a display screen, which is mounted on the housing of the semiconductor aluminum plating equipment.

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