Ceramic copper-plated heat sink

Abstract

The utility model discloses a ceramic copper-plated heat sink, which comprises a substrate material and a copper-plated film, the surface of the substrate material is plated with the copper-plated film, the middle position of the substrate material is plated with a nickel-plated film along the height direction, one side of the bottom end of the edge of the substrate material is plated with a titanium-plated film, and the edge of the nickel-plated film is plated with a gold-plated film. The ceramic copper-plated heat sink is provided with the substrate material and has extremely high heat conductivity, so that the ceramic copper-plated heat sink can quickly and effectively conduct heat from a heat source, the heat dissipation efficiency is greatly improved, the adhesion force between the plating layer and the substrate is enhanced by the titanium plating film, the stability of the plating layer in a high-temperature working environment is ensured, and the service life of the plating layer is prolonged. The copper plating film further enhances the heat conduction performance of the heat sink, the nickel plating film and the gold plating film not only provide excellent corrosion resistance for the heat sink, but also keep the surface smoothness, avoid any additional heat resistance in the heat transfer process, and solve the problem that the performance of a traditional heat sink is reduced under high temperature and high heat load. And the stable operation of the electronic equipment is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of heat sinks, in particular to a ceramic copper-plated heat sink. Background Art

[0002] A heat sink is a heat dissipation component used in electronic devices. Its main function is to effectively transfer the heat generated by electronic components to the surrounding environment to maintain the operating temperature of the components within a safe range. An efficient heat sink is essential to extend the service life of electronic devices and maintain stable device performance. Heat sinks are usually made of materials with thermal conductivity, and their shape, size, and material properties are considered during design to maximize the effects of heat conduction and convection.

[0003] The heat sinks currently on the market face the problem of performance degradation under high temperature and high heat load. The main reasons include the limitations of the thermal conductivity of the material and the fact that the stability of the material structure is easily affected under extreme working conditions. Although traditional metal heat sinks have good thermal conductivity, they are prone to oxidation under continuous high temperature, which affects the thermal conductivity efficiency, and the mechanical stability of metal materials at high temperatures will also be reduced. In addition, these heat sinks are not corrosion-resistant enough under extreme conditions, and long-term use will lead to material performance degradation, affecting the stable operation and service life of electronic equipment.

[0004] Therefore, there is an urgent need for a ceramic copper-plated heat sink to solve the technical defects proposed in the above technology. Utility Model Content

[0005] The utility model aims to provide a ceramic copper-plated heat sink to solve the problem of performance degradation under high temperature and high heat load proposed in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a ceramic copper-plated heat sink, comprising a substrate material and a copper coating, wherein the surface of the substrate material is coated with a copper coating, the middle position of the substrate material is coated with a nickel coating along the height direction, one side of the bottom end of the edge of the substrate material is coated with a titanium coating, and the edge of the nickel coating is coated with a gold coating.

[0007] Preferably, the nickel plating film and the gold plating film have the same thickness.

[0008] Preferably, the flatness of the substrate material is less than 5um, and the parallelism is less than 3um.

[0009] Preferably, the copper plating film has a thickness of less than 0.5 mm.

[0010] Compared with the prior art, the utility model has the following beneficial effects: the ceramic copper-plated heat sink not only solves the problem of performance degradation of traditional heat sinks under high temperature and high heat load, and is suitable for applications requiring high current transmission, but also overcomes the problem of easy corrosion and unstable electrical performance of traditional heat sinks;

[0011] (1) The substrate material, copper coating, titanium coating, nickel coating and gold coating are provided. The substrate material is made of a composite material of ceramic and aluminum nitride and has extremely high thermal conductivity, which enables the ceramic copper-plated heat sink to quickly and effectively conduct heat from the heat source, greatly improving the heat dissipation efficiency. The titanium coating enhances the adhesion between the coating and the substrate, ensuring the stability of the coating under high-temperature working environment. The copper coating further enhances the thermal conductivity of the heat sink. The nickel coating and the gold coating not only provide the heat sink with excellent corrosion resistance, but also maintain the surface finish, avoiding any additional thermal resistance in the heat transfer process, solving the problem of performance degradation of traditional heat sinks under high temperature and high heat load, and ensuring the stable operation of electronic equipment.

[0012] (2) By providing a substrate material, a copper coating, a titanium coating, a nickel coating, and a gold coating, the substrate material not only provides high thermal conductivity, but also has good electrical insulation performance, so that the heat sink can provide efficient heat dissipation while ensuring the electrical safety of the electronic components. The high electrical conductivity of the copper coating further optimizes the electrical performance of the heat sink, and is suitable for applications requiring high current transmission;

[0013] (3) The heat sink is provided with a substrate material, a copper coating, a titanium coating, a nickel coating, and a gold coating. The heat sink uses aluminum nitride with high thermal conductivity as the substrate material. In addition, the multi-layer coating design of titanium, copper, nickel, and gold is adopted. The nickel coating provides a layer of protection for the heat sink to prevent the copper coating from oxidizing. The gold coating protects the heat sink from corrosion and environmental factors. The problems of easy corrosion and unstable electrical properties of traditional heat sinks are overcome, so that the heat sink can maintain stable performance even in harsh working environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a front view structural schematic diagram of the utility model;

[0015] Figure 2 It is a side view structural schematic diagram of the utility model;

[0016] Figure 3 It is a rear view structural schematic diagram of the utility model;

[0017] Figure 4 For the utility model Figure 1 Schematic diagram of the cross-section structure at point A in the middle;

[0018] Figure 5 For the utility model Figure 1 Schematic diagram of the cross-sectional structure at point B in the middle.

[0019] In the figure: 1. substrate material; 2. copper plating; 3. titanium plating; 4. nickel plating; 5. gold plating. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Example 1: Please refer to Figure 1-5 A ceramic copper-plated heat sink comprises a substrate material 1 and a copper coating 2, wherein the surface of the substrate material 1 is coated with the copper coating 2, the middle position of the substrate material 1 is coated with a nickel coating 4 along the height direction, the bottom side of the edge of the substrate material 1 is coated with a titanium coating 3, and the edge of the nickel coating 4 is coated with a gold coating 5, and the substrate material 1 is a component made of a ceramic and aluminum nitride composite material;

[0022] Specifically, Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the substrate material 1 is made of a composite material of ceramic and aluminum nitride AlN, which has extremely high thermal conductivity, so that the ceramic copper-plated heat sink can quickly and effectively conduct heat from the heat source, greatly improving the heat dissipation efficiency. The titanium coating 3 enhances the adhesion between the coating and the substrate, ensuring the stability of the coating in a high-temperature working environment. The copper coating 2 further enhances the thermal conductivity of the heat sink. The nickel coating 4 and the gold coating 5 not only provide the heat sink with excellent corrosion resistance, but also maintain the surface finish, avoiding any additional thermal resistance during the heat transfer process.

[0023] Embodiment 2: The cross section of the substrate material 1 is rectangular, and the thickness of the two corners at the bottom of the substrate material 1 is greater than the thickness of the two corners at the top;

[0024] Specifically, Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the substrate material 1 not only provides high thermal conductivity, but also has good electrical insulation properties, so that the heat sink can provide efficient heat dissipation while ensuring the electrical safety of electronic components. The high electrical conductivity of the copper plating 2 further optimizes the electrical performance of the heat sink, making it suitable for applications requiring high current transmission.

[0025] Embodiment 3: The nickel plating film 4 and the gold plating film 5 have the same plating thickness, the flatness of the substrate material 1 is less than 5um, the parallelism is less than 3um, and the thickness of the copper plating film 2 is less than 0.5mm;

[0026] Specifically, Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the heat sink uses aluminum nitride AlN with high thermal conductivity as the substrate material 1, and is designed with a multi-layer coating of titanium Ti, copper Cu, nickel Ni, and gold Au. The nickel coating 4 provides a layer of protection for the heat sink to prevent the copper coating 2 from oxidizing, and the gold coating 5 protects the heat sink from corrosion and environmental factors.

[0027] Working principle: The substrate material 1 is made of ceramic and aluminum nitride AlN composite material, which has extremely high thermal conductivity, which enables the ceramic copper-plated heat sink to quickly and effectively conduct heat from the heat source, greatly improving the heat dissipation efficiency. The titanium coating 3 enhances the adhesion between the coating and the substrate, ensuring the stability of the coating in a high-temperature working environment. The copper coating 2 further enhances the thermal conductivity of the heat sink. The nickel coating 4 and the gold coating 5 not only provide the heat sink with excellent corrosion resistance, but also maintain the surface finish, avoiding any additional thermal resistance in the heat transfer process, solving the problem of performance degradation of traditional heat sinks under high temperature and high heat load, and ensuring the stable operation of electronic equipment. The substrate material 1 not only provides high thermal conductivity, but also has good electrical insulation performance, so that the heat sink can provide efficient heat dissipation while ensuring the electrical safety of electronic components. The high electrical conductivity of the copper plating 2 further optimizes the electrical performance of the heat sink and is suitable for applications requiring high current transmission. The heat sink uses aluminum nitride AlN with high thermal conductivity as the substrate material 1, and is designed with a multi-layer plating of titanium Ti, copper Cu, nickel Ni, and gold Au. The nickel plating 4 provides a layer of protection for the heat sink to prevent the copper plating 2 from oxidizing, and the gold plating 5 protects the heat sink from corrosion and environmental factors, overcoming the problems of easy corrosion and unstable electrical performance of traditional heat sinks, so that the heat sink can maintain stable performance even in harsh working environments.

[0028] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A ceramic copper-plated heat sink, comprising a substrate material (1) and a copper-plated film (2), characterized in that: The surface of the substrate material (1) is plated with a copper film (2), the middle position of the substrate material (1) is plated with a nickel film (4) along the height direction, the bottom side of the edge of the substrate material (1) is plated with a titanium film (3), and the edge of the nickel film (4) is plated with a gold film (5).

2. The ceramic copper-plated heat sink according to claim 1, characterized in that: The cross section of the substrate material (1) is rectangular, and the thickness of the two corners at the bottom of the substrate material (1) is greater than that of the two corners at the top.

3. The ceramic copper-plated heat sink according to claim 1, characterized in that: The nickel plating film (4) and the gold plating film (5) have the same plating thickness.

4. The ceramic copper-plated heat sink according to claim 1, characterized in that: The flatness of the substrate material (1) is less than 5um, and the parallelism is less than 3um.

5. The ceramic copper-plated heat sink according to claim 1, characterized in that: The copper plating film (2) has a thickness of less than 0.5 mm.

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