Optical device

Abstract

The utility model provides an optical device, and relates to the technical field of optics. The optical device comprises a first substrate and a second substrate which are bonded into an integrated structure, and the bonding surface of the first substrate is plated with a pattern film layer; a flat layer is plated on the face, away from the first substrate, of the pattern film layer, and the face, provided with the pattern film layer, of the first substrate is bonded with the plate face of the second substrate. According to the optical device obtained through the design, the graphic film layer is plated, the optical function is enriched, meanwhile, due to the arrangement of the flat layer, the requirement for the flatness of the substrate is lowered, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optics, in particular to an optical device. Background Art

[0002] The bonding process refers to the method of tightly combining silicon wafers with glass, glass with glass or other materials through chemical and physical effects. Today, the bonding process has been widely used in the optical, semiconductor and other market fields.

[0003] The optical devices obtained by the existing bonding process are usually made of pure glass material, and the surface of the glass needs to be very flat, so that the functions of the prepared optical devices are relatively simple. In addition, the bonding process has high requirements for the flatness of the glass, resulting in low production efficiency. Utility Model Content

[0004] The utility model aims to provide an optical device, which is plated with a graphic film layer to enrich the optical function, and at the same time the provision of a flat layer reduces the requirement for the flatness of a substrate and improves production efficiency.

[0005] The embodiment of the utility model is achieved as follows:

[0006] One aspect of the utility model provides an optical device, comprising a first substrate and a second substrate bonded into an integral structure, wherein the bonding surface of the first substrate is coated with a graphic film layer; a surface of the graphic film layer facing away from the first substrate is coated with a flat layer, and the surface of the first substrate provided with the graphic film layer is bonded to the surface of the second substrate.

[0007] Optionally, a groove is formed on a surface of the first substrate close to the second substrate, and the patterned film layer is plated on a bottom surface of the groove.

[0008] Optionally, the flat layer is plated on a side of the graphic film layer facing away from the first substrate to fill the groove.

[0009] Optionally, the coating area of ​​the graphic film layer is smaller than the plate area of ​​the first substrate.

[0010] Optionally, the flat layer is disposed on a side of the graphic film layer facing away from the first substrate, and covers the surface of the first substrate.

[0011] Optionally, both the first substrate and the second substrate are glass substrates.

[0012] Optionally, the first substrate is a glass substrate, and the second substrate is a silicon wafer substrate.

[0013] Optionally, the planar layer is a silicon dioxide layer, a silicon oxynitride layer or a niobium silicon oxide layer.

[0014] The beneficial effects of the utility model include:

[0015] The present application provides an optical device, comprising a first substrate and a second substrate bonded into an integral structure, wherein the bonding surface of the first substrate is coated with a graphic film layer; the side of the graphic film layer facing away from the first substrate is coated with a flat layer, and the side of the first substrate provided with the graphic film layer is bonded to the plate surface of the second substrate. The optical device obtained by the above design is coated with a graphic film layer, which enriches the optical function, and the provision of the flat layer reduces the requirement for the flatness of the substrate, thereby improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 One of the structural schematic diagrams of the optical device provided by the embodiment of the utility model;

[0018] Figure 2 A second structural schematic diagram of an optical device provided in an embodiment of the utility model;

[0019] Figure 3 One of the structural schematic diagrams of the first substrate of the optical device provided by the embodiment of the utility model coated with a graphic film layer and a flat layer;

[0020] Figure 4 One of the structural schematic diagrams of the polished flat layer of the first substrate of the optical device provided in the embodiment of the utility model;

[0021] Figure 5 A second structural schematic diagram of a first substrate of an optical device provided by an embodiment of the utility model coated with a graphic film layer and a flat layer;

[0022] Figure 6 The second structural schematic diagram of the polished flat layer of the first substrate of the optical device provided in the embodiment of the utility model.

[0023] Icon: 100 - optical device; 110 - first substrate; 120 - second substrate; 130 - graphic film layer; 140 - flat layer. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0027] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0028] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0029] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Please refer to Figure 1 and Figure 2 This embodiment provides an optical device 100, including a first substrate 110 and a second substrate 120 bonded into an integral structure, the bonding surface of the first substrate 110 is coated with a graphic film layer 130; the side of the graphic film layer 130 facing away from the first substrate 110 is coated with a flat layer 140, and the side of the first substrate 110 provided with the graphic film layer 130 is bonded to the plate surface of the second substrate 120.

[0031] Specifically, Figure 1 and Figure 2 As shown, the optical device 100 is formed by bonding a first substrate 110 and a second substrate 120. The side of the first substrate 110 close to the second substrate 120 is a bonding surface, and a pattern film layer 130 can be plated on the surface of the first substrate 110 by coating, lift-off process or coating, dry etching process. Since the substrate of the optical device obtained by the existing bonding process is usually pure glass material, the function of the prepared optical device is relatively single, and the present application can make the optical function of the optical device 100 more abundant by setting the pattern film layer 130.

[0032] It should be noted that, in addition to being able to coat a layer of graphic film layer 130 on the surface of the first substrate 110, the graphic film layer 130 can also be coated on the surface of the second substrate 120, as long as it can be ensured that the optical device 100 has a graphic base and the first substrate 110 and the second substrate 120 can be stably bonded.

[0033] A flat layer 140 is plated on the side of the graphic film layer 130 away from the first substrate 110 by a coating machine. The flat layer 140 has a certain thickness to meet the subsequent polishing and thinning process. The optical performance of the flat layer 140 is consistent with the optical performance of the second substrate 120 to be bonded later. The setting of the flat layer 140 can flatten the surface of the graphic film layer 130; the existing bonding process has high requirements for the flatness of the glass during bonding processing, resulting in low production efficiency; and the present application can bond the first substrate 110 and the second substrate 120 provided with the graphic film layer 130 together through the setting of the flat layer 140, thereby ensuring the bonding force of the optical device 100 and improving production efficiency.

[0034] After the pattern film layer 130 and the flat layer 140 are sequentially plated on the first substrate 110, the first substrate 110 with the pattern film layer 130 and the second substrate 120 to be bonded are cleaned by a cleaning device, and the first substrate 110 and the second substrate 120 are directly bonded together by adjusting the current intensity, frequency, pulse and other parameters by a low-temperature discharge bonding device, thereby completing the manufacture of the optical device 100. Alternatively, the first substrate 110 and the second substrate 120 can be bonded together by pre-bonding and annealing, thereby completing the manufacture of the optical device 100.

[0035] It should be noted that for the low-temperature discharge bonding process, the surface roughness of the flat layer can be set to be less than 20 nm; for the pre-bonding and annealing process, the surface roughness of the flat layer can be set to be less than 1 nm, thereby maximizing the reliability and stability of the bonding process between the first substrate 110 and the second substrate 120 and increasing the bonding force of the optical device 100.

[0036] The present application provides an optical device 100, comprising a first substrate 110 and a second substrate 120 bonded into an integral structure, the bonding surface of the first substrate 110 is coated with a graphic film layer 130; the side of the graphic film layer 130 facing away from the first substrate 110 is coated with a flat layer 140, and the side of the first substrate 110 provided with the graphic film layer 130 is bonded to the plate surface of the second substrate 120. The optical device 100 obtained by the above design is coated with the graphic film layer 130, which enriches the optical function, and the provision of the flat layer 140 reduces the requirement for the flatness of the substrate, thereby improving the production efficiency.

[0037] In one possible implementation of the present application, Figure 3 As shown, a groove is formed on the surface of the first substrate 110 close to the second substrate 120 , and the pattern film layer 130 is plated on the bottom surface of the groove.

[0038] Specifically, a groove corresponding to the size and position of the required pattern can be set on the surface of the first substrate 110 by a wet etching machine, and the groove has a certain depth to accommodate the pattern film layer 130 and the flat layer 140 .

[0039] like Figure 3 As shown, the graphic film layer 130 is coated on the entire surface of the first substrate 110 by a coating machine so that the graphic film layer 130 is coated on the ground of the groove. At this time, the graphic film layer 130 is not only coated on the bottom surface of the groove, but also coated on the surface of the first substrate 110 where no groove is set.

[0040] Furthermore, the planarization layer 140 is plated on a side of the pattern film layer 130 facing away from the first substrate 110 to fill the groove.

[0041] For details, please refer to Figure 3 and Figure 4 The flat layer 140 is plated on the side of the graphic film layer 130 facing away from the first substrate 110 and can fill the groove. The flat layer 140 has a sufficient thickness and can be polished flat by thinning and polishing equipment using appropriate process parameters to expose the portion of the first substrate 110 where the groove is not set. At this time, the graphic film layer 130 and the flat layer 140 are both set in the groove to ensure that the side of the first substrate 110 where the graphic film layer 130 and the flat layer 140 are set is a flat plane, and ensure that all parts of the surface can be flat.

[0042] In another possible implementation of the present application, Figure 5 and Figure 6 As shown, no groove is set on the surface of the first substrate 110 close to the second substrate 120, and the graphic film layer 130 is plated on the surface of the first substrate 110 close to the second substrate 120 by coating, lift-off process or coating, dry etching process.

[0043] A flat layer 140 is plated on the graphic film layer 130 by a coating machine. The coverage area of ​​the flat layer 140 can be the same as the board area of ​​the first substrate 110, so as to cover the graphic film layer 130 and the position on the first substrate 110 where the graphic film layer 130 is not set, so as to ensure that the board surface of the first substrate 110 is flat everywhere.

[0044] like Figure 6 As shown, the planar layer 140 is polished flat by using a thinning and polishing device and appropriate process parameters to minimize the thickness of the planar layer 140 while ensuring that the surface roughness of the planar layer 140 is small.

[0045] In one possible implementation of the present application, the coating area of ​​the graphic film layer 130 is smaller than the surface area of ​​the first substrate 110 .

[0046] Specifically, Figure 5 As shown, the coating area of ​​the graphic film layer 130 is smaller than the surface area of ​​the first substrate 110, so as to ensure that the flat layer 140 can be coated on the surface of the graphic film layer 130, so as to ensure that the bonding surface of the first substrate 110 is flat and smooth. The specific coating area of ​​the graphic film layer 130 can be adjusted according to the actual required pattern. When the graphic film layer 130 is coated on the bottom surface of the groove of the first substrate 110, the size of the groove can also be adjusted according to the coating area of ​​the graphic film layer 130. This ensures the integrity of the graphic film layer 130 coated on the ground of the groove.

[0047] In one possible implementation of the present application, the first substrate 110 and the second substrate 120 may both be glass substrates, and the two glass substrates are bonded to each other to obtain a double-layer glass optical device 100 .

[0048] In another possible implementation of the present application, the first substrate 110 is a glass substrate, and the second substrate 120 is a silicon wafer substrate. Of course, the first substrate 110 can also be a glass substrate, and the second substrate 120 can be a silicon wafer substrate.

[0049] For example, the flat layer 140 is a silicon dioxide layer, or the flat layer 140 is a silicon oxynitride layer, or the flat layer 140 can also be a niobium silicon oxide layer, a silicon nitride layer, etc. Among them, the silicon dioxide layer is a transparent material with high transmittance in the visible light and near-infrared light range; silicon dioxide can be used to make anti-reflection coatings, which can reduce the reflection on the surface of optical components and improve the transmittance and transmission efficiency of optical systems; the properties of silicon oxynitride film mainly include luminescence characteristics and adjustable refractive index, and its refractive index can be controlled to change continuously along the normal direction of the film surface; silicon nitride film has a high refractive index and excellent light transmittance, especially in the infrared and ultraviolet spectral regions. This enables silicon nitride film to effectively manage and manipulate light in optoelectronic devices such as LEDs, lasers and solar cells. It should be noted that the specific structural material of the flat layer 140 can be selected accordingly according to the optical performance requirements of the optical device 100 to match the refractive index of the first substrate 110 and the second substrate 120, thereby further enriching the optical function of the optical device 100.

[0050] When the flat layer 140 is plated, it should have a certain thickness to ensure that it can be polished; after the flat layer 140 is plated, the flat layer 140 can be polished flat by thinning and polishing equipment using appropriate process parameters. The polishing process can reduce the roughness of the flat layer 140 to further improve the bonding stability of the first substrate 110 and the second substrate 120.

[0051] The preparation method of the optical device 100 of the present application is as follows:

[0052] Method 1:

[0053] First, a groove is formed on the bonding surface of the first substrate 110 by a wet etching machine. The position and size of the groove are adapted to the required pattern. The groove has a sufficient depth to ensure that the pattern film layer 130 and the flat layer 140 can be plated in sequence in the groove.

[0054] Then, the pattern film layer 130 is plated on the entire surface of the bonding surface of the first substrate 110 by a coating machine, so that the pattern film layer 130 covers the bottom surface of the groove and other areas of the surface of the first substrate 110 where no groove is set, such as Figure 3 As shown;

[0055] Then, a flat layer 140 is plated on the pattern film layer 130 by using a coating machine. The flat layer 140 can be a silicon dioxide layer, a silicon oxynitride layer or other film layer. The specific film material of the flat layer 140 needs to be determined in combination with the optical requirements of the optical device 100. The thickness of the flat layer 140 needs to be able to fill the groove to ensure that the subsequent flat layer 140 has sufficient thickness for polishing. Figure 4 shown.

[0056] Afterwards, the flat layer 140 is polished by thinning and polishing equipment with preset process parameters to expose the surface of the first substrate 110 in the area where the groove is not set. At this time, the groove is filled with the flat layer 140, and the thickness of the bonding surface of the first substrate 110 is consistent at all locations to facilitate subsequent bonding.

[0057] Finally, the first substrate 110 and the second substrate 120 are cleaned by a cleaning device, and the first substrate 110 and the second substrate 120 are directly bonded together by adjusting the current intensity, frequency, pulse and other parameters through a low-temperature discharge bonding device, thereby completing the manufacture of the optical device 100; or, the first substrate 110 and the second substrate 120 can be bonded together by pre-bonding and annealing, thereby completing the manufacture of the optical device 100, such as Figure 2 shown.

[0058] Option 2:

[0059] First, a pattern film layer 130 is deposited on the surface of the first substrate 110 by coating, lift-off process or coating, dry etching process. The coating area and position of the pattern film layer 130 are adapted to the required pattern, such as Figure 5 .

[0060] Then, a flat layer 140 is plated on the surface of the graphic film layer 130 by a coating machine. The flat layer 140 can be a silicon dioxide layer or a silicon nitride layer or other film layer. The specific film material of the flat layer 140 needs to be determined in combination with the optical requirements of the optical device 100. The flat layer 140 should be of sufficient thickness to ensure that the subsequent flat layer 140 has sufficient thickness for polishing. Figure 5 and Figure 6 .

[0061] Afterwards, the flat layer 140 is polished by thinning and polishing equipment in accordance with preset process parameters, so that the thickness of each part of the flat layer 140 is consistent, so as to facilitate subsequent bonding.

[0062] Finally, the first substrate 110 and the second substrate 120 are cleaned by a cleaning device, and the first substrate 110 and the second substrate 120 are directly bonded together by adjusting the current intensity, frequency, pulse and other parameters through a low-temperature discharge bonding device, thereby completing the manufacture of the optical device 100; or, the first substrate 110 and the second substrate 120 can be bonded together by pre-bonding and annealing, thereby completing the manufacture of the optical device 100, such as Figure 1 .

[0063] The optical device 100 obtained by the above design is coated with a pattern film layer 130, which enriches the optical function. At the same time, the provision of the flat layer 140 reduces the requirement for the flatness of the substrate and improves the production efficiency.

[0064] The above description is only an optional embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

[0065] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present utility model will not further describe various possible combinations.

Claims

1. An optical device, characterized in that: The invention comprises a first substrate (110) and a second substrate (120) which are bonded into an integral structure, wherein the bonding surface of the first substrate (110) is coated with a graphic film layer (130); the surface of the graphic film layer (130) facing away from the first substrate (110) is coated with a flat layer (140), and the surface of the first substrate (110) on which the graphic film layer (130) is provided is bonded to the surface of the second substrate (120).

2. The optical device according to claim 1, characterized in that A groove is provided on the surface of the first substrate (110) close to the second substrate (120), and the patterned film layer (130) is plated on the bottom surface of the groove.

3. The optical device according to claim 2, characterized in that: The flat layer (140) is plated on a side of the graphic film layer (130) facing away from the first substrate (110) to fill the groove.

4. The optical device according to any one of claims 1 to 3, characterized in that: The coating area of ​​the graphic film layer (130) is smaller than the surface area of ​​the first substrate (110).

5. The optical device according to claim 4, characterized in that: The flat layer (140) is arranged on a side of the graphic film layer (130) that is away from the first substrate (110), and covers the surface of the first substrate (110).

6. The optical device according to claim 1, characterized in that: The first substrate (110) and the second substrate (120) are both glass substrates.

7. The optical device according to claim 1, characterized in that: The first substrate (110) is a glass substrate, and the second substrate (120) is a silicon wafer substrate.

8. The optical device according to claim 1, characterized in that: The flat layer (140) is a silicon dioxide layer, a silicon oxynitride layer or a niobium silicon oxide layer.

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