Wafer corrosion frame and corrosion device
By designing a wafer corrosion frame with gradually reducing the placement gap, the color difference problem after wafer corrosion in the prior art is solved, and a higher quality wafer corrosion effect is achieved.
Patent Information
- Application Number
- CN202420365256.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-27
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-02-27
AI Technical Summary
In the prior art, the color difference after wafer corrosion is more serious, affecting the quality of the wafer.
A wafer corrosion frame is designed, and the inner wall of the frame body is provided with a gradually reduced placement gap. The width of the first placement gap and the second placement gap near the bottom of the frame body are both smaller than the thickness of the wafer, reducing the wafer and Contact area of corrosion frame.
By reducing the contact area between the wafer and the corrosion frame, the color difference problem after wafer corrosion is significantly improved and the quality of the wafer is improved.
Smart Images
Figure CN222530398U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of wafer etching technology, and in particular to a wafer etching frame and an etching device. Background Art
[0002] During the semiconductor wafer processing, in order to remove the damage on the wafer surface after thinning, the back side of the wafer needs to be etched. In order to better etch the back side of the wafer, a corresponding wafer etching frame is required.
[0003] See also Figure 1 The wafer etching frame in the related art includes a frame body 1 and limiting teeth 2 located on the inner walls of the frame body 1 on opposite sides. There is a placement gap 3 between two adjacent limiting teeth 2. After at least part of the wafer 4 is placed in the placement gap 3, the wafer 4 can be etched.
[0004] However, the two opposite sides of the limiting teeth 2 of the wafer etching frame in the related art are parallel to each other, and the width of the placement gap 3 is equal from the bottom to the top of the etching frame. In this way, after the wafer 4 is placed in the placement gap 3, the wafer 4 will swing in the placement gap 3, so that the contact area between the wafer 4 and the etching frame is relatively large, and the part where the wafer 4 contacts the etching frame is not easily corroded, resulting in a more serious color difference in the wafer after etching, which ultimately affects the quality of the wafer. Utility Model Content
[0005] The main purpose of the present application is to provide a wafer etching frame and an etching device, aiming to solve the technical problem of serious color difference in the wafer after etching in the prior art.
[0006] In order to solve the above technical problems, the present application provides a wafer etching frame, the etching frame comprising:
[0007] A frame, the frame comprising a first inner wall and a second inner wall arranged opposite to each other;
[0008] A plurality of first frame teeth, wherein the plurality of first frame teeth are arranged on a first inner wall of the frame body;
[0009] A plurality of second frame teeth, wherein the plurality of second frame teeth are arranged on the second inner wall of the frame body, the plurality of first frame teeth correspond to the plurality of second frame teeth one by one, a first placement gap is formed between two adjacent first frame teeth, and a second placement gap is formed between two adjacent second frame teeth;
[0010] The first placement gap and the second placement gap are used to place wafers. From the top of the frame to the bottom of the frame, the widths of the first placement gap and the second placement gap gradually decrease. The widths of the first placement gap and the second placement gap on one side close to the bottom of the frame are both smaller than the thickness of the wafer.
[0011] In some possible implementations, the first frame teeth form a side surface of the first placement gap and are arranged obliquely, and the second frame teeth form a side surface of the second placement gap and are arranged obliquely.
[0012] In some possible implementations, the inclination angle of the side surface of the first placement gap formed by the first frame teeth is 45°-75°, and the inclination angle of the side surface of the second placement gap formed by the second frame teeth is 45°-75°.
[0013] In some possible implementations, two side surfaces of the first frame teeth forming the first placement gap are both inclined, and two side surfaces of the second frame teeth forming the second placement gap are both inclined.
[0014] In some possible implementations, the inclination angles of two side surfaces formed by the first frame teeth for the first placement gap are equal, and the inclination angles of two side surfaces formed by the second frame teeth for the second placement gap are equal.
[0015] In some possible implementations, the inclination angles of the two side surfaces formed by the first frame teeth to form the first placement gap are both 55°-85°, and the inclination angles of the two side surfaces formed by the second frame teeth to form the second placement gap are both 55°-85°.
[0016] In some possible implementations, from the top of the frame to the bottom of the frame, the distance between the first frame teeth and the second frame teeth that are oppositely arranged gradually decreases.
[0017] In some possible implementations, a handle is further installed on the top surface of the frame, and the cross-section of the handle is arc-shaped.
[0018] In some possible implementations, a stabilizing foot is further installed at the bottom of the frame, and the stabilizing foot includes an integrally formed inclined section and a horizontal section, the inclined section is integrally formed with the bottom of the frame, and the horizontal section is located in a horizontal direction.
[0019] In some possible implementations, the present application also provides a wafer etching device, which includes the wafer etching frame described in the present application.
[0020] Compared with the related art, this application has at least the following beneficial effects:
[0021] A wafer etching frame and an etching device proposed in an embodiment of the present application can greatly reduce the contact area between the wafer and the etching frame by setting the widths of the first placement gap and the second placement gap to gradually decrease from the top of the frame to the bottom of the frame, and the widths of the first placement gap and the second placement gap on the side close to the bottom of the frame are both smaller than the thickness of the wafer, thereby greatly improving the color difference problem of the wafer after etching, and further improving the quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0023] Figure 1 A schematic diagram of a top view of a wafer etching frame in the related art provided in an embodiment of the present application;
[0024] Figure 2 A schematic diagram of a top view structure of a wafer etching frame provided in an embodiment of the present application;
[0025] Figure 3 Provided in the embodiments of this application Figure 2 One of the cross-sectional views at AA in the middle;
[0026] Figure 4 Provided in the embodiments of this application Figure 2 One of the cross-sectional views at the middle BB;
[0027] Figure 5 Provided in the embodiments of this application Figure 2 The second cross-sectional view at AA in the middle;
[0028] Figure 6 Provided in the embodiments of this application Figure 2 The second cross-sectional view of the middle BB;
[0029] Figure 7 Provided in the embodiments of this application Figure 2 Schematic cross-sectional view at CC in the middle.
[0030] Figure numerals: 1, frame; 11, first inner wall; 12, second inner wall; 2, limiting teeth; 3, placement gap; 4, wafer; 5, first frame teeth; 6, first placement gap; 7, second frame teeth; 8, second placement gap; 9, handle; 10, stabilizing foot; 101, tilting section; 102, horizontal section. DETAILED DESCRIPTION
[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0032] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0034] In the description of the present application, it should be noted that the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0035] See also Figure 2-Figure 4 The present application provides a wafer etching frame, which includes a frame body 1, a plurality of first frame teeth 5 and a plurality of second frame teeth 7.
[0036] The frame 1 includes a first inner wall 11 and a second inner wall 12 which are arranged opposite to each other. The frame 1 includes a containing space. The top view of the frame 1 may be square, wherein the two inner walls of the frame 1 which are arranged opposite to each other are the first inner wall 11 and the second inner wall 12 respectively.
[0037] A plurality of first frame teeth 5 are arranged on the first inner wall 11 of the frame body 1, and a plurality of second frame teeth 7 are arranged on the second inner wall 12 of the frame body 1. The plurality of first frame teeth 5 are evenly arranged on the first inner wall 11, and the plurality of second frame teeth 7 are evenly arranged on the second inner wall 12. The plurality of first frame teeth 5 correspond to the plurality of second frame teeth 7 one by one. A first placement gap 6 is formed between two adjacent first frame teeth 5, and a second placement gap 8 is formed between two adjacent second frame teeth 7. The first placement gap 6 and the second placement gap 8 are used to place the wafer 4. From the direction along the top of the frame body 1 to the bottom of the frame body 1, the widths of the first placement gap 6 and the second placement gap 8 are gradually reduced, and the widths of the first placement gap 6 and the second placement gap 8 close to the bottom of the frame body 1 are both less than the thickness of the wafer 4. The first frame teeth 5 and the second frame teeth 7 can be integrally formed with the frame body 1.
[0038] The number of the first frame teeth 5 and the second frame teeth 7 can be set according to actual needs. The more the first frame teeth 5 are, the more the first placement gaps 6 are formed. The more the second frame teeth 7 are, the more the second placement gaps 8 are formed. The more the first placement gaps 6 and the second placement gaps 8 are, the more wafers 4 are etched at one time.
[0039] The first placement gap 6 and the second placement gap 8 that are relatively set have the same width at the same height of the frame 1. Since the widths of the first placement gap 6 and the second placement gap 8 are gradually reduced from the top of the frame 1 to the bottom of the frame 1, and the widths of the first placement gap 6 and the second placement gap 8 near the bottom of the frame 1 are both smaller than the thickness of the wafer 4, when the same wafer 4 is placed in the first placement gap 6 and the second placement gap 8 that are relatively set, under the action of the weight of the wafer 4 itself, the edges of part of the wafer 4 will be stuck in the first placement gap 6 and the second placement gap 8, so that the wafer 4 can be stably placed in the first placement gap 6 and the second placement gap 8, and in the process of etching the wafer 4, the wafer 4 is not easy to swing and contact the etching frame. And only part of the edge of the wafer 4 is in contact with the etching frame, and the other surfaces of the wafer 4 are not easy to contact with the etching frame, for example, the wafer 4 is not easy to contact with the bottom of the first placement gap 6 and the second placement gap 8, and the wafer 4 is in a suspended state. In this way, the contact area between the wafer 4 and the etching frame can be greatly reduced, and the wafer 4 can be etched more evenly, thereby reducing the color difference of the etched wafer 4.
[0040] Based on the above design, in this embodiment, by setting the widths of the first placement gap 6 and the second placement gap 8 to gradually decrease from the top of the frame 1 to the bottom of the frame 1, and the widths of the first placement gap 6 and the second placement gap 8 close to the bottom of the frame 1 are smaller than the thickness of the wafer 4, the contact area between the wafer 4 and the etching frame can be greatly reduced, thereby greatly improving the color difference problem of the wafer 4 after etching, and further improving the quality of the wafer 4.
[0041] In some embodiments, please refer again to Figure 3 and Figure 4 The first frame tooth 5 forms a side surface of the first placement gap 6 and is inclined, and the second frame tooth 7 forms a side surface of the second placement gap 8 and is inclined.
[0042] The cross-sectional shape of the first frame tooth 5 is a right-angled trapezoid. By setting one side of the first frame tooth 5 forming the first placement gap 6 to be inclined, the width of the first placement gap 6 can be gradually reduced from the top of the frame body 1 to the bottom of the frame body 1.
[0043] The cross-sectional shape of the second frame tooth 7 is a right-angled trapezoid. By setting one side of the second frame tooth 7 forming the second placement gap 8 to be inclined, the width of the second placement gap 8 can be gradually reduced from the top of the frame body 1 to the bottom of the frame body 1.
[0044] In some embodiments, please refer again to Figure 3 The inclination angle β1 of the side of the first frame teeth 5 forming the first placement gap 6 is 45°-75°, for example, the inclination angle β1 can be 45°, 50°, 55°, 60°, 70° or 75°, etc. Reasonable setting of the inclination angle β1 can make the width of the first placement gap 6 more appropriately matched with the thickness of the wafer 4, thereby further reducing the contact area between the wafer 4 and the etching frame.
[0045] Please see again Figure 4 The inclination angle β2 of the side of the second frame teeth 7 forming the second placement gap 8 is 45°-75°, for example, the inclination angle β2 can be 45°, 50°, 55°, 60°, 70° or 75°, etc. Reasonable setting of the inclination angle β2 can make the width of the second placement gap 8 more appropriately matched with the thickness of the wafer 4, thereby further reducing the contact area between the wafer 4 and the etching frame.
[0046] In some embodiments, see Figure 5 and Figure 6 The two side surfaces of the first frame teeth 5 forming the first placement gap 6 are both inclined, and the two side surfaces of the second frame teeth 7 forming the second placement gap 8 are both inclined.
[0047] The cross-sectional shape of the first frame tooth 5 is an isosceles trapezoid. By setting the two side surfaces of the first frame tooth 5 forming the first placement gap 6 to be inclined, the width of the first placement gap 6 can be gradually reduced from the top of the frame body 1 to the bottom of the frame body 1. The inclination angles of the two side surfaces of the first frame tooth 5 forming the first placement gap 6 are equal, and the inclination angles of the two side surfaces of the second frame tooth 7 forming the second placement gap 8 are equal.
[0048] The cross-sectional shape of the second frame tooth 7 is an isosceles trapezoid. By setting the two side surfaces of the second frame tooth 7 forming the second placement gap 8 to be inclined, the width of the second placement gap 8 can be gradually reduced from the top of the frame body 1 to the bottom of the frame body 1.
[0049] In some embodiments, please refer again to Figure 5The inclination angles β3 of the two sides of the first frame teeth 5 forming the first placement gap 6 are both 55°-85°. For example, the inclination angle β3 can be 55°, 60°, 65°, 70°, 75°, 80° or 85°, etc. Reasonable setting of the inclination angle β3 can make the width of the first placement gap 6 more appropriately matched with the thickness of the wafer 4, thereby further reducing the contact area between the wafer 4 and the etching frame.
[0050] Please see again Figure 6 The inclination angles β4 of the two sides of the second frame teeth 7 forming the second placement gap 8 are both 55°-85°. For example, the inclination angle β4 can be 55°, 60°, 65°, 70°, 75°, 80° or 85°, etc. Reasonable setting of the inclination angle β4 can make the width of the second placement gap 8 more appropriately matched with the thickness of the wafer 4, thereby further reducing the contact area between the wafer 4 and the etching frame.
[0051] In some embodiments, see Figure 7 , from the top of the frame body 1 to the bottom of the frame body 1 , the distance D between the first frame teeth 5 and the second frame teeth 7 that are arranged opposite to each other gradually decreases.
[0052] Since the distance D between the relatively arranged first frame teeth 5 and the second frame teeth 7 is gradually reduced from the top of the frame 1 to the bottom of the frame 1, the distance between the relatively arranged first placement gap 6 and the second placement gap 8 is gradually reduced from the top of the frame 1 to the bottom of the frame 1. When the wafer 4 is placed between the set first placement gap 6 and the second placement gap 8, under the action of the self-gravity of the wafer 4, the edge of the wafer 4 can be more stably stuck in the lower part of the first placement gap 6 and the second placement gap 8, thereby further reducing the contact area between the wafer 4 and the etching frame.
[0053] In some embodiments, please refer again to Figure 2 and Figure 7 A handle 9 is also installed on the top surface of the frame 1, and the cross-section of the handle 9 is arc-shaped. The handle 9 can be used to more conveniently move the etching frame, thereby improving the overhead viewing efficiency of the wafer 4.
[0054] In some embodiments, please refer again to Figure 7 A stabilizing foot 10 is also installed at the bottom of the frame 1. The stabilizing foot 10 includes an integrally formed inclined section 101 and a horizontal section 102. The inclined section 101 is integrally formed with the bottom of the frame 1, and the horizontal section 102 is located in the horizontal direction.
[0055] When the frame 1 is placed on the etching table, the contact area between the etching frame and the etching table can be increased by the horizontal section 102 , so that the etching frame can be more stable, and finally the etching quality of the wafer 4 can be improved.
[0056] In some embodiments, the present application further provides a wafer etching device, the etching device includes the wafer etching frame of the present application. Since the wafer etching device includes the wafer etching frame of the present application, the wafer etching device has all the beneficial effects of the wafer etching frame of the present application, which will not be repeated here.
[0057] The above are only various implementations of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A wafer etching frame, characterized in that: The corrosion frame comprises: A frame (1), the frame (1) comprising a first inner wall (11) and a second inner wall (12) arranged opposite to each other; A plurality of first frame teeth (5), wherein the plurality of first frame teeth (5) are arranged on a first inner wall (11) of the frame body (1); a plurality of second frame teeth (7), the plurality of second frame teeth (7) being arranged on the second inner wall (12) of the frame body (1), the plurality of first frame teeth (5) corresponding to the plurality of second frame teeth (7) one by one, a first placement gap (6) being formed between two adjacent first frame teeth (5), and a second placement gap (8) being formed between two adjacent second frame teeth (7); The first placement gap (6) and the second placement gap (8) are used to place a wafer (4); the widths of the first placement gap (6) and the second placement gap (8) gradually decrease from the top of the frame (1) to the bottom of the frame (1); the widths of the first placement gap (6) and the second placement gap (8) on one side close to the bottom of the frame (1) are both smaller than the thickness of the wafer (4).
2. The wafer etching frame according to claim 1, characterized in that: The first frame teeth (5) are arranged to be inclined on a side surface forming the first placement gap (6), and the second frame teeth (7) are arranged to be inclined on a side surface forming the second placement gap (8).
3. The wafer etching frame according to claim 2, characterized in that: The inclination angle of the side surface of the first placement gap (6) formed by the first frame teeth (5) is 45°-75°, and the inclination angle of the side surface of the second placement gap (8) formed by the second frame teeth (7) is 45°-75°.
4. The wafer etching frame according to claim 1, characterized in that: The two side surfaces of the first frame teeth (5) forming the first placement gap (6) are both inclined, and the two side surfaces of the second frame teeth (7) forming the second placement gap (8) are both inclined.
5. The wafer etching frame according to claim 4, characterized in that: The inclination angles of the two side surfaces of the first placement gap (6) formed by the first frame teeth (5) are equal, and the inclination angles of the two side surfaces of the second placement gap (8) formed by the second frame teeth (7) are equal.
6. The wafer etching frame according to claim 5, characterized in that: The inclination angles of the two side surfaces of the first placement gap (6) formed by the first frame teeth (5) are both 55°-85°, and the inclination angles of the two side surfaces of the second placement gap (8) formed by the second frame teeth (7) are also 55°-85°.
7. The wafer etching frame according to any one of claims 2 to 6, characterized in that: From the direction along the top of the frame body (1) to the bottom of the frame body (1), the distance between the first frame teeth (5) and the second frame teeth (7) arranged opposite to each other gradually decreases.
8. The wafer etching frame according to any one of claims 2 to 6, characterized in that: A handle (9) is also installed on the top surface of the frame (1), and the cross-section of the handle (9) is arc-shaped.
9. The wafer etching frame according to any one of claims 2 to 6, characterized in that: A stabilizing foot (10) is also installed at the bottom of the frame (1), and the stabilizing foot (10) comprises an integrally formed inclined section (101) and a horizontal section (102), the inclined section (101) being integrally formed with the bottom of the frame (1), and the horizontal section (102) being located in a horizontal direction.
10. A wafer etching device, characterized in that: The etching device comprises a wafer etching frame as described in any one of claims 1-9.