Ink coating mechanism for edge covering of silicon wafer battery piece
By designing a silicon wafer cell edge-coating mechanism including a micrometer and a rotating tool holder, the problems of troublesome operation and difficult to control ink thickness in the prior art are solved, and efficient and accurate ink adjustment and uniformity are achieved.
Patent Information
- Application Number
- CN202421209711.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-05-30
AI Technical Summary
The existing silicon wafer battery edge-covered ink coating device is troublesome to operate, the scraper is easy to deflect, it is difficult to ensure the thickness and uniformity of the ink, and the flexibility of use is poor.
An ink coating mechanism including a base plate, a support, a rotating shaft, an ink roller, a micrometer, a knife seat and a scraper is designed. By rotating the micrometer, the position of the knife seat relative to the vertical plate is adjusted, and the spacing distance between the scraper and the ink roller is adjusted, thereby adjusting the ink thickness.
It achieves easy and fast operation, can effectively adjust and maintain the accuracy and uniformity of ink thickness, and improves the flexibility of use and production efficiency.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solar cells, in particular to an ink coating mechanism used for edge wrapping of silicon slice solar cells. Background Art
[0002] In the manufacturing process of silicon wafer solar cells, coating the edges of silicon wafer solar cells with ink is a necessary process before electroplating.
[0003] The ink coating on the edge of silicon wafer and cell is usually achieved by applying ink around the edge with a dispensing head. Not only is the speed slow, but the ink output and the final ink size formed on the edge are difficult to meet the precision requirements. The edge coating can also be achieved by linearly contacting the ink coating roller with the edge of the silicon wafer and cell, which greatly improves the efficiency compared to the dispensing method.
[0004] However, in the existing ink coating device, such as the existing public patent (application number: 2023204381261, application date: 2023.03.09, name: silicon wafer hemming device), the adjustment of the ink layer thickness is satisfied by the structural form of the ink coating roller combined with the scraper, wherein the two ends of the scraper are equipped with the tool holder through vertical long holes. When adjustment is required, the fasteners at both ends of the scraper are loosened, and force is applied to the scraper to move it relative to the tool holder along the vertical long holes, and combined with the synchronous adjustment of the micrometer above, and then the fasteners are tightened. This process is not only cumbersome to operate, but also very easy to cause the scraper to deviate, especially it is difficult to ensure the parallelism relative to the ink roller, making it difficult to ensure the ink thickness and poor uniformity. It is very inconvenient to operate in actual production and has poor flexibility in use. Utility Model Content
[0005] In order to solve the above problems, the present application provides a structurally rational ink coating mechanism for silicon wafer and cell edge wrapping, which is suitable for different ink thickness edge wrapping requirements on silicon wafer and cell. It is not only easy and fast to operate, but also can effectively adjust and maintain the ink thickness accuracy and uniformity, and has good practicality.
[0006] The technical solution adopted by the utility model is as follows:
[0007] An inking mechanism for wrapping the edge of a silicon wafer and a solar cell comprises a bottom plate, on which supports are installed at intervals, a rotating shaft is installed between the supports on both sides for common rotation, and an ink roller is mounted on the rotating shaft; a vertical plate with an inverted L-shaped structure is installed on each of the supports on one side, and a micrometer is installed on the vertical plate; a knife holder is arranged between the micrometer and the rotating shaft, and a scraper is installed on each of the knife holders on both sides, and the scraper is spaced above the ink roller; the knife holder on one side is installed in a floating manner with the vertical plate.
[0008] As a further improvement of the above technical solution:
[0009] The micrometer is mounted on the vertical plate via a threaded structure, and the downward end of the micrometer abuts against the top surface of the tool holder.
[0010] Elastic parts are installed between the two sides of the vertical plate and the two sides of the knife seat, forming a floating installation of the knife seat inside the vertical plate; a guide part is installed between the vertical plate and the knife seat, forming a guide for the knife seat to float relative to the vertical plate.
[0011] A scraper holder is installed between the knife seats on both sides, and a scraper facing the ink roller is installed on the scraper holder; a circular hole is opened on the knife seat, and a communicating through groove is opened from the circular hole to the end face of the knife seat, and a locking hole is opened perpendicular to the through groove; the end of the scraper holder is fitted into the circular hole and locked by the fastener in the locking hole.
[0012] The rotating shaft is driven by a rotating driving mechanism and rotates with the axial direction of the rotating shaft as the center of a circle.
[0013] The utility model also comprises an ink cartridge, which is located below the ink roller, and an opening is provided on the top surface of the ink cartridge. When the ink roller rotates, the ink is dipped into the ink cartridge through the opening.
[0014] The sides of the two side supports facing each other extend inwards to form limit blocks, a top block is floatingly installed on the bottom plate below the limit blocks, and two ends of the ink cartridge are floatingly mounted between the limit blocks and the top block.
[0015] The limiting blocks on the side surfaces of the support are in an inverted L-shaped structure arranged facing each other, and the top block is located at the lower side of the limiting blocks.
[0016] The bottom plate located on the outside of the support side extends upward to form a convex strip, and a spacing distance is set between the bottom end of the vertical arm of one of the limit blocks on the side of the support and the bottom plate, and the side of the support and the convex strip are combined at the spacing distance to form a sliding fitting channel; a pad is installed at the sliding fitting channel, and a plunger is inserted from top to bottom through the pad toward the bottom plate; the top block is floatingly installed on the pad.
[0017] A supporting block is installed on the cushion block located outside the plunger, a top block is arranged above the supporting block, and an elastic body and a guide column are installed between the supporting block and the top block.
[0018] Compared with the prior art, the utility model has the following beneficial effects:
[0019] In the utility model, the actual relative position between the knife seat and the vertical plate is adjusted by rotating the micrometer, and the spacing distance between the scraper on the knife seat and the ink roller is adjusted, and then the thickness of the ink layer on the ink roller is adjusted through the scraper to meet the different ink thickness hemming requirements on the silicon wafer battery sheet. It is not only convenient, fast and flexible to operate, but also can effectively adjust and maintain the ink thickness accuracy and uniformity, and has good practicality.
[0020] The utility model also has the following advantages:
[0021] The scraper holder and the knife seat are not only easy to assemble, but also the direction and angle of the scraper toward the ink roller can be easily adjusted by rotating the scraper holder relative to the knife seat, which is convenient for actual operation during adjustment and maintenance.
[0022] The two ends of the ink cartridge are floated and pressed between the limit block and the top block, which is not only convenient for the replacement and installation of the ink cartridge, but also effectively ensures the reliability of the installation of the ink cartridge. The floating structure can also avoid accidental hard contact and collision.
[0023] Through the setting of the sliding assembly channel, it is convenient to take out the cushion block and the top block floating on it, and clean them thoroughly and regularly with the ink cartridge. Combined with the plunger for quick limit fixation after installation, it is convenient for daily maintenance operations in production and helps to ensure smooth and smooth production. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 This is a diagram of the use state of the utility model when it is used for edge wrapping of silicon wafers and solar cells.
[0025] Figure 2 It is a schematic diagram of the structure of the utility model (the rotating shaft and the ink roller are omitted).
[0026] Figure 3 It is a schematic diagram of the floating assembly of the knife holder of the utility model relative to the vertical plate.
[0027] Figure 4 The figure is a schematic diagram of the floating assembly of the top block below the ink cartridge of the utility model.
[0028] Figure 5 for Figure 4 A partial enlarged view of point A in the middle.
[0029] Figure 6 This is another usage state diagram of the utility model for edge wrapping of silicon wafers and solar cells.
[0030] Among them: 1. bottom plate; 2. rotating shaft; 3. ink cartridge; 4. support; 5. knife seat; 6. elastic member; 7. vertical plate; 8. micrometer; 9. rotating drive mechanism; 10. scraper; 11. scraper holder; 12. silicon wafer battery cell; 13. spacer; 14. plunger;
[0031] 101. Convex strips;
[0032] 20. Ink roller;
[0033] 30. opening; 31. top block; 32. guide column; 33. elastic body; 34. support block;
[0034] 41. Limit block;
[0035] 51. round hole; 52. through slot; 53. locking hole;
[0036] 71. Guide member;
[0037] 91. Synchronous belt drive assembly; 92. Driven pulley. DETAILED DESCRIPTION
[0038] The specific implementation of the utility model is described below in conjunction with the accompanying drawings.
[0039] like Figure 1 and Figure 2 As shown, the inking mechanism for the edge wrapping of silicon wafer and solar cell of this embodiment comprises a bottom plate 1, on which supports 4 are installed at intervals, a rotating shaft 2 is installed between the supports 4 on both sides for common rotation, and an ink roller 20 is mounted on the rotating shaft 2; an inverted L-shaped vertical plate 7 is installed on each of the single-sided supports 4, and a micrometer 8 is installed on the vertical plate 7; a knife holder 5 is further arranged between the micrometer 8 and the rotating shaft 2, and a scraper 10 is installed jointly on the knife holders 5 on both sides, and the scraper 10 is located above the ink roller 20 at intervals; the single-sided knife holder 5 is installed in a floating manner with the vertical plate 7.
[0040] In this embodiment, the actual relative position of the knife holder 5 with respect to the vertical plate 7 can be adjusted by rotating the micrometer 8, and the spacing distance between the scraper 10 on the knife holder 5 and the ink roller 20 can be adjusted, and then the thickness of the ink layer on the ink roller 20 can be adjusted through the scraper 10 to adapt to the different ink thickness hemming requirements on the silicon wafer cell.
[0041] The micrometer 8 is mounted on the vertical plate 7 via a threaded structure, which is convenient for the rotation adjustment of the micrometer 8 relative to the vertical plate 7; the downward end of the micrometer 8 abuts against the top surface of the tool holder 5, which is convenient for adjusting the height of the floatingly installed tool holder 5 through the vertical adjustment of the micrometer 8.
[0042] In this embodiment, the abutting contact between the bottom end of the micrometer 8 and the top surface of the tool holder 5 can be ensured and maintained reliable by the elastic action of the elastic member 6.
[0043] like Figure 3 As shown, elastic members 6 are installed between the two sides of the vertical plate 7 and the two sides of the knife seat 5, forming a floating installation of the knife seat 5 on the inner side of the vertical plate 7; a guide member 71 is installed between the vertical plate 7 and the knife seat 5, forming a floating guide for the knife seat 5 relative to the vertical plate 7.
[0044] In this embodiment, axle pins can be vertically installed on both sides of the vertical plate 7, and corresponding axle pins can be vertically installed on both sides of the knife seat 5, and then the elastic member 6 can be hung via the upper and lower axle pins to form an elastic floating installation of the knife seat 5 under the vertical plate 7; the elastic member 6 in this embodiment can be a spring or other elastic structure.
[0045] In this embodiment, the guide member 71 can be a long bolt that passes through the vertical plate 7 from top to bottom and is locked on the knife seat 5. When the knife seat 5 floats up and down relative to the vertical plate 7, the long bolt moves up and down relative to the vertical plate 7 to play a guiding role; of course, in actual use, the guide member 71 can also be other structural forms, such as commonly used guiding structures such as guide columns, or a guide rail-slider structure can be installed between the vertical plate 7 and the knife seat 5, which can also play a guiding role.
[0046] In actual adjustment, the micrometer 8 is rotated and moved downward or upward relative to the vertical plate 7. The tool holder 5 abutting against the bottom end of the micrometer 8 is forced to move downward or move upward under the elastic action of the elastic member 6, so that the height adjustment of the tool holder 5 is triggered by the rotation of the micrometer 8, and the guide member 71 effectively ensures the accuracy and reliability of the up and down movement of the tool holder 5.
[0047] A scraper frame 11 is installed between the two side blade seats 5, and a scraper 10 facing the ink roller 20 is installed on the scraper frame 11; Figure 4 As shown, a circular hole 51 is provided on the knife holder 5, a through slot 52 is provided from the circular hole 51 to the end surface of the knife holder 5, and a locking hole 53 is provided perpendicular to the through slot 52; the end of the scraper holder 11 is fitted into the circular hole 51 and locked via the fastener in the locking hole 53.
[0048] In this embodiment, the scraper frame 11 and the knife seat 5 are not only easy to assemble, but also the direction and angle of the scraper 10 toward the ink roller 20 can be easily adjusted by rotating the scraper frame 11 relative to the knife seat 5, which is convenient for adjustment and maintenance operations.
[0049] The rotating shaft 2 is driven by the rotating driving mechanism 9 to rotate around the axial direction of the rotating shaft 2 itself, thereby realizing the rotation of the ink roller 20 on the rotating shaft 2.
[0050] In this embodiment, the rotation driving mechanism 9 can be a synchronous belt transmission assembly 91 driven by a motor. The driving wheel power in the synchronous belt transmission assembly 91 is connected to the output end of the motor, and the driven wheel 92 in the synchronous belt transmission assembly 91 is coaxially installed on the rotating shaft 2, so that under the driving power of the motor, the rotating shaft 2 is driven to rotate through the synchronous belt transmission assembly 91.
[0051] It also includes an ink cartridge 3, which is located below the ink roller 20. An opening 30 is provided on the top surface of the ink cartridge 3. When the ink roller 20 rotates, the ink is dipped into the ink through the opening 30 of the ink cartridge 3. By arranging the ink cartridge 3 below the ink roller 20 and combining it with the rotation of the ink roller 20, ink can be applied to the ink roller 20 in a timely and real-time manner through the ink cartridge 3.
[0052] The opposing sides of the two side supports 4 extend inwards to form limit blocks 41 , and a top block 31 is floatingly mounted on the bottom plate 1 below the limit blocks 41 . Both ends of the ink cartridge 3 are floatingly mounted between the limit blocks 41 and the top block 31 .
[0053] In this embodiment, both ends of the ink cartridge 3 are floated and pressed between the limit block 41 and the top block 31, which not only facilitates the replacement and installation of the ink cartridge 3, but also effectively ensures the reliability of the installation of the ink cartridge 3, and can avoid accidental hard contact and collision through the floating structure.
[0054] The limit blocks 41 on the side of the support 4 are inverted L-shaped structures arranged facing each other, and the top block 31 is located at the lower side of the limit block 41; therefore, on the one hand, the ink cartridge 3 can be easily and quickly installed between the top block 31 and the horizontal arm of the upper limit block 41, and on the other hand, the vertical arm of the limit block 41 can provide guidance and limitation for the up and down floating of the top block 31, thereby effectively ensuring the reliability of the installation of the ink cartridge 3.
[0055] The bottom plate 1 located on the outside of the support 4 extends upward to form a convex strip 101, and a spacing distance is set between the bottom end of the vertical arm of one of the limit blocks 41 on the side of the support 4 and the bottom plate 1, and the side of the support 4 and the convex strip 101 are combined at the spacing distance to form a sliding fitting channel; a pad 13 is installed at the sliding fitting channel, and a plunger 14 is inserted from top to bottom through the pad 13 toward the bottom plate 1, and through the insertion of the plunger 14, the pad 13 that is slidably fitted into place is fixed relative to the bottom plate 1; the top block 31 is floatingly installed on the pad 13.
[0056] In this embodiment, by setting up the sliding assembly channel, it is convenient to take out the cushion block 13 and the top block 31 floatingly assembled thereon together, and to carry out thorough and regular cleaning of the ink cartridge 3. Combined with the plunger 14, the rapid limiting fixation after installation facilitates daily maintenance operations in production and helps to ensure smooth and unimpeded production.
[0057] During operation, the pad 13 is slidably assembled into the sliding assembly channel or slides outward, and the supports 4 and convex strips 101 on both sides of the sliding assembly channel provide guidance for the sliding of the pad 13, effectively ensuring the smooth and smooth sliding of the pad 13 and the accuracy of the assembly of the pad 13.
[0058] like Figure 5 As shown, a support block 34 is installed on the cushion block 13 located outside the plunger 14 , a top block 31 is mounted above the support block 34 , and an elastic body 33 and a guide column 32 are installed between the support block 34 and the top block 31 .
[0059] In the present embodiment, the top block 31 forms an elastic floating structure relative to the support block 34 through the elastic body 33, and the guide column 32 effectively ensures that the top block 31 floats up and down relative to the support block 34 stably, smoothly and consistently; at the same time, through the elasticity of the elastic body 33, the ink cartridge 3 can be stably pressed between the top block 31 and the limit block 41 of the support 4; the elastic body 33 in the present embodiment can be a spring or other commonly used elastic structures.
[0060] The inking mechanism of the utility model is suitable for inking silicon wafer battery slices.
[0061] like Figure 1 and Figure 6 As shown, the two groups of inking mechanisms are arranged at intervals and can move toward or away from each other under the drive of an external driving mechanism. The two groups of inking mechanisms are fixedly supported by an external structure on the silicon wafer battery cell 12, and the ink roller 20 is in contact with the edge of the silicon wafer battery cell 12 to achieve hemming of the edge of the silicon wafer battery cell.
[0062] In actual use, the ink coating mechanism can be used to coat ink on the four circumferential sides and chamfers of the silicon wafer cell to ensure the reliability of ink coating. Figure 1 As shown in FIG. 1 , ink is applied to the chamfered position of the silicon wafer cell 12 via an ink roller 20 with a conical structure, and Figure 6 FIG. 3 shows that ink is applied to the straight edge of the silicon wafer cell 12 by an ink roller 20 having a cylindrical structure.
[0063] The utility model is simple to operate and is suitable for different ink thickness edge wrapping requirements on silicon wafer battery sheets. It is not only convenient, fast and flexible to operate, but also can effectively adjust and maintain the ink thickness accuracy and uniformity, and has good practicality.
[0064] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0065] The above description is an explanation of the utility model, not a limitation of the utility model. The scope of the utility model is defined by the claims. Any form of modification can be made within the protection scope of the utility model.
Claims
1. An ink coating mechanism for the edge wrapping of silicon wafers and solar cells, characterized in that: The invention comprises a bottom plate (1), on which supports (4) are installed at intervals, a rotating shaft (2) is installed between the supports (4) on both sides for common rotation, and an ink roller (20) is mounted on the rotating shaft (2); a vertical plate (7) with an inverted L-shaped structure is installed on each of the supports (4) on one side, and a micrometer (8) is installed on the vertical plate (7); a knife seat (5) is arranged between the micrometer (8) and the rotating shaft (2), and a scraper (10) is installed on the knife seats (5) on both sides, and the scraper (10) is located above the ink roller (20) at intervals; and each of the knife seats (5) on one side is installed in a floating manner with respect to the vertical plate (7).
2. The ink coating mechanism for edge wrapping of silicon wafer and solar cell according to claim 1, characterized in that: The micrometer (8) is mounted on the vertical plate (7) via a threaded structure, and the downward end of the micrometer (8) abuts against the top surface of the tool holder (5).
3. The ink coating mechanism for silicon wafer and solar cell edge wrapping according to claim 1, characterized in that: An elastic member (6) is installed between the two sides of the vertical plate (7) and the two sides of the knife seat (5), thereby forming a floating installation of the knife seat (5) on the inner side of the vertical plate (7); a guide member (71) is installed between the vertical plate (7) and the knife seat (5), thereby forming a guide for the knife seat (5) to float relative to the vertical plate (7).
4. The ink coating mechanism for edge wrapping of silicon wafer and solar cell according to claim 1, characterized in that: A scraper frame (11) is installed between the two side blade seats (5), and a scraper (10) facing the ink roller (20) is installed on the scraper frame (11); a circular hole (51) is opened on the blade seat (5), a through groove (52) is opened from the circular hole (51) to the end surface of the blade seat (5), and a locking hole (53) is opened perpendicular to the through groove (52); the end of the scraper frame (11) is fitted into the circular hole (51) and locked via a fastener in the locking hole (53).
5. The ink coating mechanism for edge wrapping of silicon wafer and solar cell according to claim 1, characterized in that: The rotating shaft (2) is driven by a rotating drive mechanism (9) and rotates with the axial direction of the rotating shaft (2) as the center of the circle.
6. The ink coating mechanism for silicon wafer and solar cell edge wrapping according to claim 1, characterized in that: The ink cartridge (3) is also included. The ink cartridge (3) is located below the ink roller (20). An opening (30) is provided on the top surface of the ink cartridge (3). When the ink roller (20) rotates, the ink is dipped into the ink cartridge (3) through the opening (30).
7. The ink coating mechanism for edge wrapping of silicon wafer and solar cell according to claim 6, characterized in that: The opposing side surfaces of the two side supports (4) extend inwards to form limit blocks (41), a top block (31) is floatingly mounted on the bottom plate (1) below the limit blocks (41), and two ends of the ink cartridge (3) are floatingly mounted between the limit blocks (41) and the top block (31).
8. The ink coating mechanism for edge wrapping of silicon wafer and solar cell according to claim 7, characterized in that: The limiting blocks (41) on the side of the support (4) are in an inverted L-shaped structure arranged facing each other, and the top block (31) is located at the lower side of the limiting blocks (41).
9. The ink coating mechanism for edge wrapping of silicon wafer and solar cell according to claim 8, characterized in that: The bottom plate (1) located outside the lateral side of the support (4) extends upward to form a convex strip (101); a spacing distance is provided between the bottom end of the vertical arm of one of the limit blocks (41) on the side of the support (4) and the bottom plate (1); the side of the support (4) and the convex strip (101) are combined at the spacing distance to form a sliding fitting channel; a cushion block (13) is installed at the sliding fitting channel, and a plunger (14) is inserted from top to bottom through the cushion block (13) toward the bottom plate (1); and the top block (31) is floatingly installed on the cushion block (13).
10. The ink coating mechanism for edge wrapping of silicon wafer and solar cell according to claim 9, characterized in that: A support block (34) is installed on the cushion block (13) located outside the plunger (14), a top block (31) is mounted above the support block (34), and an elastic body (33) and a guide column (32) are installed between the support block (34) and the top block (31).