Silicon wafer transmission device for wafer inserting machine
CN222539604UActive Publication Date: 2025-02-28JINGHAIYANG SEMICON MATERIALS DONGHAI CO LTD
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Patent Information
- Application Number
- CN202420023545.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-04
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-01-04
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Figure CN222539604U_ABST
Abstract
The utility model provides a silicon wafer transmission device for a wafer inserting machine. The silicon wafer transmission device comprises a transmission belt for transmitting silicon wafers; the rotating shaft is connected with the conveying belt; the substrate extends along a first direction, the substrate comprises an upper surface and a lower surface which are oppositely arranged, the substrate is used for being connected to a wafer inserting machine, and the first direction is a silicon wafer transmission direction of the wafer inserting machine; the bearing assembly and the conveying belt supporting assembly are arranged in the first direction and are arranged on the upper surface of the base plate, and the bearing assembly comprises a base detachably installed on the upper surface of the base plate; the bearing box is fixedly connected with the base, a bearing hole formed in the second direction is formed in the bearing box, at least one first groove sunken inwards is formed in the inner wall of the bearing hole, and the second direction is the axial direction of the bearing and is perpendicular to the first direction; the supporting assembly comprises two supports arranged at intervals in the first direction, and the lower ends of the supports are slidably connected with the base plate. The supporting plate extends in the first direction, and the two ends of the supporting plate are connected with the upper ends of the two supports respectively.
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