Surface-mounted lamp bead with self-heat-dissipation mechanism

Abstract

The utility model provides a patch lamp bead with a self-heat-dissipation mechanism, which comprises a heat-dissipation structure, the heat-dissipation structure comprises a heat-dissipation copper plate, the heat-dissipation copper plate is arranged right below a substrate, two sides of the heat-dissipation copper plate are provided with mounting plates, one side of each mounting plate is attached to the outer wall of a resin colloid, the other side of each mounting plate is provided with a heat-conducting strip, and the heat-conducting strips are connected with the heat-dissipation copper plate. The number of the heat conduction strips is multiple, and the multiple heat conduction strips are distributed on the outer wall of the mounting plate at equal intervals. According to the surface-mounted lamp bead, the heat dissipation structures are arranged on the outer walls of the resin colloid and the substrate, so that heat can be conducted into the heat conduction strips, and external air passes through the heat conduction strips and takes away the heat in the heat conduction strips in the air circulation process, so that the self-heat-dissipation function of the surface-mounted lamp bead is realized, and the service life of the surface-mounted lamp bead is prolonged. And heat is prevented from being accumulated in the patch lamp beads to influence the service life of the patch lamp beads.

Description

Technical Field

[0001] The utility model belongs to the technical field of patch lamp beads, and in particular relates to a patch lamp bead with a self-heating mechanism. Background Art

[0002] The SMD lamp bead is a simple lamp. Its light-emitting principle is to pass current through compound semiconductors. Through the combination of electrons and holes, excess energy will be released in the form of light to achieve the effect of light emission.

[0003] Among them, SMD lamp beads do not convert all electrical energy into light energy, but convert part of the electrical energy into heat energy. The light efficiency of SMD lamp beads is currently only 1001m / W, and its electro-optical conversion efficiency is only about 20%-30%. In other words, about 70% of the electrical energy is converted into heat energy, and SMD lamp beads do not have a heat dissipation function, which will cause more heat to accumulate inside the SMD lamp beads, affecting the service life of the SMD lamp beads. Utility Model Content

[0004] Purpose of the utility model

[0005] In view of the above technical problems, the utility model provides a SMD lamp bead with a self-heating mechanism to solve the technical problems mentioned in the background technology.

[0006] Technical Solution

[0007] In order to achieve the above-mentioned purpose, the technical solution provided by the utility model is a patch lamp bead with a self-heating mechanism, comprising a substrate, mounting grooves are provided on both sides of the substrate, the interior of the mounting groove is slidably connected to a limiting structure, a resin colloid is provided on the top of the substrate, a heat dissipation structure is provided on the outer walls of the substrate and the resin colloid, and pin plates are provided on both sides of the top of the substrate;

[0008] The heat dissipation structure includes a heat dissipation copper plate, which is arranged directly below the substrate. Mounting plates are arranged on both sides of the heat dissipation copper plate. One side of the mounting plate is in contact with the outer wall of the resin colloid. The other side of the mounting plate is provided with a thermal conductive strip. The number of the thermal conductive strips is set to multiple, and the multiple thermal conductive strips are evenly spaced and distributed on the outer wall of the mounting plate.

[0009] Preferably, the heat conducting strip is arranged at an angle and is made of brass.

[0010] Preferably, the limiting structure comprises a first rotating ring and a second rotating ring, wherein the first rotating ring is slidably connected to an inner wall of the mounting groove on one side of the substrate, and the second rotating ring is slidably connected to the inside of the mounting groove on the other side of the substrate.

[0011] Preferably, a slot is provided on the inner side of one end of the first rotating ring, and a block is provided on the inner side of one end of the second rotating ring, and the outer wall of the block is engaged with the inner wall of the slot.

[0012] Preferably, an arc-shaped positioning groove is provided on one side of the pin plate, a spring rod is provided on the inner wall of the positioning groove, and a fitting strip is provided at one end of the spring rod.

[0013] Preferably, an outer wall of one side of the bonding strip is bonded to an outer wall of the conductive column, and the bonding strip is configured to be half a circle.

[0014] Beneficial Effects

[0015] Compared with the prior art, the technical solution provided by the utility model has the following beneficial effects:

[0016] The utility model uses a heat dissipation structure arranged on the outer wall of the resin colloid and the substrate to conduct heat to the inside of the heat-conducting strip. During the air circulation process, the external air passes through the heat-conducting strip and takes away the heat inside the heat-conducting strip, thereby realizing the self-heating function of the SMD lamp bead and avoiding heat accumulation inside the SMD lamp bead to affect the service life of the SMD lamp bead.

[0017] When the SMD lamp bead needs to be connected to the circuit board or the wire, the first rotating ring and the second rotating ring are pulled outward so that the first rotating ring and the second rotating ring are engaged with each other through the clamping block and the clamping groove, and the conductive column is placed between the limiting structure and the fitting strip. The spring rod pushes the fitting strip to move to one side and connects with the conductive column to realize the conduction of the SMD lamp bead. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional diagram of the utility model;

[0019] Figure 2 This is a three-dimensional diagram of the heat dissipation copper plate of the utility model;

[0020] Figure 3 It is a three-dimensional development diagram of the limiting structure of the utility model;

[0021] Figure 4 It is a three-dimensional diagram of the pin plate of the utility model.

[0022] Reference numerals

[0023] 1. Base plate; 2. Resin colloid; 3. Mounting groove; 4. Limiting structure; 401. First rotating ring; 402. Card slot; 403. Second rotating ring; 404. Card block; 5. Pin plate; 6. Positioning groove; 7. Spring rod; 8. Laminating strip; 9. Heat dissipation copper plate; 10. Mounting plate; 11. Thermal conductive strip. DETAILED DESCRIPTION

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "page", "bottom", "inside", "outside", "clockwise", "counterclockwise", "coaxial", "bottom", "one end", "top", "the other end", "one side", "front", "two ends", "both sides" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0026] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", "provided with", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Reference is now made to the accompanying drawings, in which the purpose of each illustration is only to show certain exemplary embodiments, and is not intended to limit the present invention. In each of the drawings, the same reference numerals represent the same or corresponding parts. The dimensions and proportions in each of the drawings are also only for illustration and should not be interpreted as limiting the present invention. These dimensions may be enlarged relative to the actual product.

[0028] Reference Figure 1-4 , a SMD lamp bead with a self-heating mechanism as shown, comprising a substrate 1, mounting grooves 3 are provided on both sides of the substrate 1, the interior of the mounting groove 3 is slidably connected to a limiting structure 4, a resin colloid 2 is provided on the top of the substrate 1, a heat dissipation structure is provided on the outer walls of the substrate 1 and the resin colloid 2, and pin plates 5 are provided on both sides of the top of the substrate 1;

[0029] The heat dissipation structure includes a heat dissipation copper plate 9, which is arranged directly below the substrate 1. Mounting plates 10 are arranged on both sides of the heat dissipation copper plate 9. One side of the mounting plate 10 is in contact with the outer wall of the resin colloid 2. A thermal conductive strip 11 is arranged on the other side of the mounting plate 10. The number of the thermal conductive strips 11 is set to multiple, and the multiple thermal conductive strips 11 are evenly spaced and distributed on the outer wall of the mounting plate 10.

[0030] Furthermore, in the above technical solution, the thermally conductive strip 11 is tilted and made of brass. The thermally conductive strip 11 made of brass has high thermal conductivity and can quickly conduct heat away from the SMD lamp beads.

[0031] Furthermore, in the above technical scheme, the limiting structure 4 includes a first rotating ring 401 and a second rotating ring 403. The first rotating ring 401 is slidably connected to the inner wall of the mounting groove 3 on one side of the substrate 1, and the second rotating ring 403 is slidably connected to the inside of the mounting groove 3 on the other side of the substrate 1. A slot 402 is provided on the inner side of one end of the first rotating ring 401, and a block 404 is provided on the inner side of one end of the second rotating ring 403. The outer wall of the block 404 is engaged with the inner wall of the slot 402. When the SMD lamp bead needs to be connected to the circuit board or the wire, the first rotating ring 401 and the second rotating ring 403 are respectively rotated outward so that the first rotating ring 401 and the second rotating ring 403 are engaged through the slot 402 and the block 404, so that the first rotating ring 401, the second rotating ring 403 and the bonding strip 8 are closed, and then the conductive column is inserted between the limiting structure 4 and the bonding strip 8.

[0032] Furthermore, in the above technical solution, an arc-shaped positioning groove 6 is opened on one side of the pin plate 5, and a spring rod 7 is provided on the inner wall of the positioning groove 6. A bonding strip 8 is provided on one end of the spring rod 7. The outer wall of one side of the bonding strip 8 is bonded with the outer wall of the conductive column. The bonding strip 8 is set to be half a circle. After the conductive column is inserted between the limiting structure 4 and the bonding strip 8, the spring rod 7 pushes the bonding strip 8 to reset and squeeze the conductive column, thereby realizing conduction between the conductive column and the bonding strip 8 and the light-emitting element inside the internal resin colloid 2.

[0033] How this utility works:

[0034] Refer to the instruction manual Figure 1-4First, when the SMD lamp beads need to be installed, the bottom of the substrate 1 is removed from the circuit board and mounted on the surface of other devices, and then the first rotating ring 401 and the second rotating ring 403 are rotated outward to make the first rotating ring 401 and the second rotating ring 403 engage through the card slot 402 and the card block 404, so that the first rotating ring 401, the second rotating ring 403 and the bonding strip 8 are closed, and then the conductive column is inserted between the limiting structure 4 and the bonding strip 8, and the spring rod 7 pushes the bonding strip 8 to fit with the conductive column to realize the conduction of the SMD lamp beads;

[0035] In the process of SMD lamp beads heating up, SMD lamp beads will generate heat. After the heat is conducted to the inside of the heat dissipation copper plate 9, the mounting plate 10 and the thermal conductive strip 11, when the air circulates, the air passing through the heat dissipation copper plate 9, the mounting plate 10 and the thermal conductive strip 11 will drive the heat inside the heat dissipation copper plate 9, the mounting plate 10 and the thermal conductive strip 11, thereby realizing self-heating of the SMD lamp beads and avoiding heat accumulation inside the SMD lamp beads.

[0036] The above-described embodiments only express a certain implementation method of the utility model, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the patent of the utility model shall be based on the attached claims.

Claims

1. A SMD lamp bead with a self-heating mechanism, characterized in that: include A substrate (1), wherein mounting grooves (3) are provided on both sides of the substrate (1), the interior of the mounting grooves (3) is slidably connected to a limiting structure (4), a resin colloid (2) is provided on the top of the substrate (1), a heat dissipation structure is provided on the outer walls of the substrate (1) and the resin colloid (2), and pin plates (5) are provided on both sides of the top of the substrate (1); A heat dissipation structure, comprising a heat dissipation copper plate (9), wherein the heat dissipation copper plate (9) is arranged directly below a substrate (1), mounting plates (10) are arranged on both sides of the heat dissipation copper plate (9), one side of the mounting plate (10) is in contact with the outer wall of a resin colloid (2), and the other side of the mounting plate (10) is provided with a heat conducting strip (11), wherein the number of the heat conducting strips (11) is set to be multiple, and the multiple heat conducting strips (11) are evenly spaced and distributed on the outer wall of the mounting plate (10).

2. A SMD lamp bead with a self-heating mechanism according to claim 1, characterized in that: The heat conducting strip (11) is arranged at an angle and is made of brass.

3. A SMD lamp bead with a self-heating mechanism according to claim 1, characterized in that: The limiting structure (4) comprises a first rotating ring (401) and a second rotating ring (403), wherein the first rotating ring (401) is slidably connected to the inner wall of the mounting groove (3) on one side of the substrate (1), and the second rotating ring (403) is slidably connected to the inside of the mounting groove (3) on the other side of the substrate (1).

4. A SMD lamp bead with a self-heat dissipation mechanism according to claim 3, characterized in that: A clamping groove (402) is provided on the inner side of one end of the first rotating ring (401), and a clamping block (404) is provided on the inner side of one end of the second rotating ring (403), and the outer wall of the clamping block (404) is clamped and connected with the inner wall of the clamping groove (402).

5. The SMD lamp bead with a self-heat dissipation mechanism according to claim 1, characterized in that: A circular arc-shaped positioning groove (6) is provided on one side of the pin plate (5), a spring rod (7) is provided on the inner wall of the positioning groove (6), and a fitting strip (8) is provided at one end of the spring rod (7).

6. The SMD lamp bead with a self-heat dissipation mechanism according to claim 5, characterized in that: One side outer wall of the bonding strip (8) is bonded to the outer wall of the conductive column, and the bonding strip (8) is configured to be a half circle.

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