Thermal resistance and power cycle testing device for power module of automobile inverter

Abstract

The utility model relates to a thermal resistance and power cycle testing device for a power module of an automobile inverter. The thermal resistance and power cycle testing device comprises a device base, a cooling liquid cavity, a fixed seat and a quick clamp, the cooling liquid cavity and the fixing seat are both fixed on the device base, the quick clamp is fixed on the cooling liquid cavity, and the quick clamp is used for fixing the power module between the quick clamp and the cooling liquid cavity; a signal terminal side pressing plate, a signal terminal upper pressing plate, a high-voltage terminal mounting block and a high-voltage terminal pressing plate are arranged on the fixed seat; the signal terminal upper pressing plate is used for fixing pins of a power module, the high-voltage terminal mounting block is provided with a high-voltage wire harness, the high-voltage terminal pressing plate is used for fixing the high-voltage terminal mounting block and the high-voltage wire harness, and the signal terminal side pressing plate is used for fixing a signal wire harness and a signal terminal. Compared with the prior art, the thermal resistance testing device has the advantages of high testing stability and accuracy and simple testing process, and can be suitable for thermal resistance testing and power testing of a complete module under the condition that the thermal resistance testing device is not disassembled and assembled.

Description

Technical Field

[0001] The utility model relates to a testing device for a power module, in particular to a thermal resistance and power cycle testing device for a power module of an automobile inverter. Background Art

[0002] As the core component of electric and hybrid vehicles, the inverter plays the role of current conversion and vehicle control. With the continuous changes in the market, the heat flux density of the IGBT / MOSFET devices in the power module inside the inverter has increased rapidly. When the temperature of the IGBT / MOSFET device exceeds the allowed safe temperature, it will cause its related components to burn out. Therefore, in order to ensure the reliability of the power module, the thermal resistance and power cycle tests of the device must be carried out to determine the thermal performance and thermal reliability of the device.

[0003] At present, power modules in the industry are generally composed of multiple IGBT / MOSFET devices. Thermal resistance and power cycle tests are often performed only on a single IGBT / MOSFET. The testing process is cumbersome and it is difficult to quickly test all IGBT / MOSFET devices in the packaged power module. In addition, when testing a single IGBT / MOSFET device, a cold plate is often used as a heat sink to simulate a liquid-cooled radiator. However, there are differences in the heat dissipation efficiency between the radiator and the cold plate of an actual product. Therefore, it is very necessary to develop a thermal resistance test and power cycle test device suitable for a complete module, which can effectively reduce the difficulty of test assembly and reduce test costs.

[0004] Patent CN202111250841.4 discloses a universal test platform and test method for IGBT power modules, which includes a host computer software system, a DSP control board controlled by the host computer through an RS485 bus, and a DSP control board that can control its peripheral test and power distribution system. The host computer controls the output of a high-voltage DC programming power supply through a communication interface, and the host computer controls the programmable heating table through a communication interface to heat the UUT module. The DSP control board controls the start and stop of the cooling fan, and the FPGA drive wave board is connected to the UUT module drive side after photoelectric isolation. The temperature and humidity collector uploads the collected information to the host computer through the communication interface, and the oscilloscope reports the collected voltage and current waveform data of the UUT module to the host computer through the communication interface for analysis and calculation. However, the test cost is high, and the main problem is the adjustment and automatic control of the test environment.

[0005] Patent CN202320189428.X discloses a vehicle-mounted charging device and a device power testing system, which relates to the field of charging technology. The power module is installed on the mainboard, and a heat dissipation duct is provided inside the power module. The power discrete device is provided on the mainboard and pressed on the side wall of the power module through a limiting pressing piece. The heat dissipation of the power module and the power discrete device is achieved by setting an internal air duct, and the structure is simple. At the same time, by setting a limiting pressing piece, the power discrete device can be quickly locked or unlocked, which improves the speed of disassembly and assembly of the power discrete device and reduces the time and difficulty of device replacement. However, this patent still requires the power device to be disassembled and assembled before testing, and the testing cost and overall testing workload are very large. Utility Model Content

[0006] The purpose of the utility model is to provide a thermal resistance and power cycle test device for an automotive inverter power module in order to overcome the defects of the above-mentioned prior art that only a single IGBT / MOSFET device can be tested, the test process is cumbersome, and the cold plate is used as an indirect test object resulting in inaccurate testing.

[0007] The purpose of the utility model can be achieved through the following technical solutions:

[0008] The device fixes the power module on the device through quick clamps and pressure heads, connects to an external water tank, and the liquid cooling medium flows through the power module radiator to dissipate the heat of the device fixed on the device. By connecting the copper bus, a load current is applied to the device to achieve the purpose of heating the device. The signal terminal is connected to the thermal resistance tester T3STER through a wiring harness for signal acquisition, thereby achieving the purpose of rapid testing.

[0009] The utility model provides a thermal resistance and power cycle test device for a power module of an automobile inverter, comprising: a device base, a cooling liquid cavity, a fixing seat, and a quick clamp;

[0010] The coolant cavity and the fixing seat are both fixed on the device base, the quick clamp is fixed on the coolant cavity, and two fixing seats are arranged on both sides of the coolant cavity. One end of the coolant cavity is provided with a water inlet joint, and the other end is provided with a water outlet joint. The quick clamp is used to fix the power module between the quick clamp and the coolant cavity;

[0011] The fixing seat is provided with a signal terminal side pressing plate, a signal terminal upper pressing plate, a high-voltage terminal mounting block, and a high-voltage terminal pressing plate;

[0012] The upper pressure plate of the signal terminal is used to fix the pins of the power module. The high-voltage terminal mounting block is provided with a high-voltage wiring harness. The high-voltage terminal pressure plate is used to fix the high-voltage terminal mounting block and the high-voltage wiring harness. The side pressure plate of the signal terminal is used to fix the signal wiring harness and the signal terminal.

[0013] Furthermore, a sealing ring is provided between the power module and the cooling liquid cavity, and the sealing ring is used to prevent leakage.

[0014] Furthermore, a positioning pin is provided on the cooling liquid cavity, and the positioning pin is used to position the power module during installation.

[0015] Furthermore, the upper pressure plate of the signal terminal and the pins of the power module are fixed by bolts.

[0016] Furthermore, the high-voltage terminal pressing plate, the high-voltage wiring harness, and the high-voltage terminal mounting block are fixedly connected by bolts.

[0017] Furthermore, the signal terminal side pressure plate, the signal terminal, and the signal harness are fixedly connected by bolts. Bolt holes are arranged on the signal terminal side pressure plate, the signal terminal, and the signal harness, and the signal terminal side pressure plate, the signal terminal, and the signal harness are fixedly connected by the bolt holes and the bolts arranged in the bolt holes.

[0018] Further, the high voltage terminal mounting block includes a collector / drain high voltage terminal and an emitter / source high voltage terminal.

[0019] Furthermore, the collector / drain high voltage terminal and the emitter / source high voltage terminal are respectively arranged on the high voltage terminal mounting blocks on the two fixing seats.

[0020] Furthermore, the signal terminal includes a collector / drain signal terminal, a gate signal terminal, and an emitter / source signal terminal arranged in sequence.

[0021] Furthermore, the high-voltage harness is connected to an external TSTER power supply to apply a load current, and the signal harness is connected to a TSTER acquisition system to perform signal acquisition.

[0022] During the test, the power module is installed on the device body by quick clamping, and is fixed with bolts through the upper pressure plate of the signal terminal. The high-voltage wiring harness is bolted to the high-voltage terminal mounting block through the high-voltage terminal pressure plate. The collector / drain high-voltage terminal corresponds to the collector pin of the IGBT device or the drain pin of the MOSFET device, the emitter / source high-voltage terminal corresponds to the emitter pin of the IGBT device or the source pin of the MOSFET device, the signal wiring harness is bolted to the signal terminal through the signal terminal side pressure plate, the collector / drain signal terminal corresponds to the collector signal pin of the IGBT device or the drain signal pin of the MOSFET device, the gate signal terminal corresponds to the gate pin of the IGBT device or the gate pin of the MOSFET device, the emitter / source signal terminal corresponds to the emitter signal pin of the IGBT device or the source signal pin of the MOSFET device, and finally the high-voltage wiring harness is connected to the external TSTER power supply to apply load current, and the signal wiring harness is connected to the TSTER acquisition system for signal acquisition, and the test can be carried out.

[0023] The coolant flows in the coolant cavity, flows in from the water inlet joint, flows through the power module radiator, and flows out from the water outlet joint. The test device can quickly connect the heating current and signal acquisition of each device on the power module. The IGBT / MOSFET pin is fixed on the signal terminal of the device, and the current flow is realized by the pressing plate to tighten the contact. The high-voltage wiring harness is fixedly pressed on the end of the integrated wiring harness terminal, and the test sequence is switched by the electrical signal controller to meet the requirements of rapid testing.

[0024] Working principle:

[0025] The thermal resistance and power cycle test is combined with the Siemens T3STER equipment. This device can fix the IGBT (emitter and collector) / MOSFET (source and drain) respectively and connect it to the external high-voltage wiring harness, so that the external T3STER power supply provides a large current to heat the IGBT / MOSFET. The fixed device signal acquisition pin is connected to the device signal terminal 13 to collect the voltage signal in the cooling stage after the device stops loading the large current, and convert it into a temperature signal to obtain the real-time junction temperature of the IGBT / MOSFET in the cooling stage. Finally, the load power loss when the IGBT / MOSFET device applies a large current and the real-time junction temperature data of the IGBT / MOSFET in the cooling stage are used to calculate the thermal resistance of the IGBT / MOSFET through the thermal resistance calculation formula of the electronic device.

[0026] Compared with the prior art, the utility model has the following advantages:

[0027] (1) High test stability and accuracy, simple test process: Through this device, after a large number of tests and verifications, the thermal resistance and power cycle tests are performed using this device. The test process consistency is good, which greatly enhances the stability of the IGBT / MOSFET thermal resistance test and can be applied to the thermal resistance test and power of the complete module without disassembly.

[0028] (2) Wide range of applications: This device can be used for all inverter separated double-sided water-cooled power module IGBT / MOSFET devices that require thermal resistance testing.

[0029] (3) Easy to maintain: The device has a simple structure, the power module is easy to install quickly, the water inlet and outlet are easy to disassemble and assemble, and easy to maintain separately. In addition, most parts can be disassembled and replaced, and parts can be easily replaced when damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Schematic diagram of the structure of the thermal resistance and power cycle test device for automotive inverter power module Figure 1 .

[0031] Figure 2Schematic diagram of the structure of the thermal resistance and power cycle test device for automotive inverter power module Figure 2 (Including the power module and wiring harness under test).

[0032] Figure 3 Schematic diagram of the connection points of the thermal resistance and power cycle test device of the automotive inverter power module.

[0033] Figure 4 This is a schematic diagram of the thermal resistance and power cycle test of the IGBT device of the utility model.

[0034] Figure 5 This is a schematic diagram of the thermal resistance and power cycle test of the MOSFET device of the utility model.

[0035] Figure markings: 1. Device base; 2. Water inlet connector; 3. Coolant cavity; 4. Signal terminal side pressure plate; 5. Signal terminal upper pressure plate; 6. Fixed seat; 7. High-voltage terminal mounting block; 8. High-voltage terminal pressure plate; 9. Water outlet connector; 10. Quick clamp; 11. Sealing ring; 12. Positioning pin; 13. Signal terminal; 14. Signal wiring harness; 15. High-voltage wiring harness; 16. Power module; 7-1. Collector / drain high-voltage terminal; 7-2. Emitter / source high-voltage terminal; 13-1. Collector / drain signal terminal; 13-2. Gate signal terminal; 13-3. Emitter / source signal terminal. DETAILED DESCRIPTION

[0036] The following is a detailed description of the present invention in conjunction with the accompanying drawings and specific embodiments. Component models, material names, connection structures, control methods, algorithms and other features not clearly described in this technical solution are all considered to be common technical features disclosed in the prior art.

[0037] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to another component, or connected to another component through an intermediate component. The "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if the connected components, circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0038] Example 1

[0039] This embodiment provides a thermal resistance and power cycle test device for an automotive inverter power module. Figure 1 , Figure 2 As shown, it includes: a device base 1, a coolant cavity 3, a fixing seat 6, and a quick clamp 10;

[0040] The cooling liquid cavity 3 and the fixing seat 6 are both fixed on the device base 1, the quick clamp 10 is fixed on the cooling liquid cavity 3, two fixing seats 6 are arranged on both sides of the cooling liquid cavity 3, one end of the cooling liquid cavity 3 is provided with a water inlet connector 2, and the other end is provided with a water outlet connector 9, and the quick clamp 10 is used to fix the power module 16 between the quick clamp 10 and the cooling liquid cavity 3;

[0041] The fixing seat 6 is provided with a signal terminal side pressing plate 4, a signal terminal upper pressing plate 5, a high-voltage terminal mounting block 7, and a high-voltage terminal pressing plate 8;

[0042] The signal terminal upper pressure plate 5 is used to fix the pins of the power module 16, the high-voltage terminal mounting block 7 is provided with a high-voltage wiring harness 15, the high-voltage terminal pressure plate 8 is used to fix the high-voltage terminal mounting block 7 and the high-voltage wiring harness 15, and the signal terminal side pressure plate 4 is used to fix the signal wiring harness 14 and the signal terminal 13.

[0043] In a specific implementation, a sealing ring 11 is provided between the power module 16 and the cooling liquid cavity 3 .

[0044] In a specific embodiment, a positioning pin 12 is provided on the cooling liquid cavity 3. The positioning pin 12 is used to position the power module 16 during installation.

[0045] In a specific implementation, the signal terminal upper pressing plate 5 and the pins of the power module 16 are fixed by bolts.

[0046] In a specific implementation, the high-voltage terminal pressing plate 8 , the high-voltage wire harness 15 , and the high-voltage terminal mounting block 7 are fixedly connected by bolts.

[0047] In a specific embodiment, the signal terminal side pressure plate 4, the signal terminal 13, and the signal harness 14 are fixedly connected by bolts. Bolt holes are provided on the signal terminal side pressure plate 4, the signal terminal 13, and the signal harness 14, and the signal terminal side pressure plate 4, the signal terminal 13, and the signal harness 14 are fixedly connected by the bolt holes and the bolts provided in the bolt holes.

[0048] like Figure 3 As shown, in a specific embodiment, the high voltage terminal mounting block 7 includes a collector / drain high voltage terminal 7 - 1 and an emitter / source high voltage terminal 7 - 2 .

[0049] In a specific embodiment, the collector / drain high voltage terminal 7 - 1 and the emitter / source high voltage terminal 7 - 2 are respectively arranged on the high voltage terminal mounting blocks 7 on the two fixing seats 6 .

[0050] In a specific embodiment, the signal terminal 13 includes a collector / drain signal terminal 13 - 1 , a gate signal terminal 13 - 2 , and an emitter / source signal terminal 13 - 3 which are arranged in sequence.

[0051] In a specific implementation, the high-voltage harness 15 is connected to an external T3STER power supply to apply a load current, and the signal harness 14 is connected to a T3STER acquisition system to perform signal acquisition.

[0052] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, during the test, the power module 16 is pressed onto the device body through the quick clamp 10 and fixed with bolts through the signal terminal upper pressure plate, the high-voltage wire harness 15 is bolted to the high-voltage terminal mounting block 7 through the high-voltage terminal pressure plate 8, the collector / drain high-voltage terminal 7-1 corresponds to the collector pin of the IGBT device or the drain pin of the MOSFET device, the emitter / source high-voltage terminal 7-2 corresponds to the emitter pin of the IGBT device or the source pin of the MOSFET device, the signal wire harness 14 is bolted to the signal terminal 13 through the signal terminal side pressure plate 4, The collector / drain signal terminal 13-1 corresponds to the collector signal pin of the IGBT device or the drain signal pin of the MOSFET device, the gate signal terminal 13-2 corresponds to the gate pin of the IGBT device or the gate pin of the MOSFET device, and the emitter / source signal terminal 13-3 corresponds to the emitter signal pin of the IGBT device or the source signal pin of the MOSFET. Finally, the high-voltage wiring harness 15 is connected to the external T3STER power supply to apply load current, and the signal wiring harness 14 is connected to the T3STER acquisition system for signal acquisition, and then the test can be carried out.

[0053] The coolant flows in the coolant cavity 3, flows in from the water inlet joint 2, flows through the power module radiator, and flows out from the water outlet joint 9. The test device can quickly connect the heating current and signal acquisition of each device on the power module 16. The IGBT / MOSFET pin is fixed on the signal terminal of the device, and the current flow is realized by the pressing plate to tighten the contact. The high-voltage wiring harness is fixedly pressed on the end of the integrated wiring harness terminal, and the test sequence is switched by the electrical signal controller to meet the requirements of rapid testing.

[0054] Components not described in detail in this embodiment are all existing components that can be purchased through public channels.

[0055] The above description of the embodiments is to facilitate the understanding and use of the utility model by those skilled in the art. It is obvious that those familiar with the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the utility model is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the disclosure of the utility model without departing from the scope of the utility model should be within the scope of protection of the utility model.

Claims

1. A thermal resistance and power cycle test device for automobile inverter power module, characterized in that: include: Device base (1), coolant chamber (3), fixing seat (6), quick clamp (10); The cooling liquid cavity (3) and the fixing seat (6) are both fixed on the device base (1); the quick clamp (10) is fixed on the cooling liquid cavity (3); two fixing seats (6) are arranged on both sides of the cooling liquid cavity (3); one end of the cooling liquid cavity (3) is provided with a water inlet joint (2) and the other end is provided with a water outlet joint (9); the quick clamp (10) is used to fix the power module (16) between the quick clamp (10) and the cooling liquid cavity (3); The fixing seat (6) is provided with a signal terminal side pressing plate (4), a signal terminal upper pressing plate (5), a high-voltage terminal mounting block (7), and a high-voltage terminal pressing plate (8); The signal terminal upper pressure plate (5) is used to fix the pins of the power module (16); a high-voltage wire harness (15) is provided on the high-voltage terminal mounting block (7); the high-voltage terminal pressure plate (8) is used to fix the high-voltage terminal mounting block (7) and the high-voltage wire harness (15); and the signal terminal side pressure plate (4) is used to fix the signal wire harness (14) and the signal terminal (13).

2. The automotive inverter power module thermal resistance and power cycle testing device according to claim 1, characterized in that: A sealing ring (11) is provided between the power module (16) and the cooling liquid cavity (3).

3. The automotive inverter power module thermal resistance and power cycle testing device according to claim 1, characterized in that: The cooling liquid cavity (3) is provided with a positioning pin (12), and the positioning pin (12) is used to position the power module (16) during installation.

4. The automotive inverter power module thermal resistance and power cycle testing device according to claim 1, characterized in that: The signal terminal upper pressure plate (5) and the pins of the power module (16) are fixed by bolts.

5. The thermal resistance and power cycle testing device for automotive inverter power module according to claim 1, characterized in that: The high-voltage terminal pressing plate (8), the high-voltage wire harness (15), and the high-voltage terminal mounting block (7) are fixedly connected by bolts.

6. The automotive inverter power module thermal resistance and power cycle testing device according to claim 1, characterized in that: The signal terminal side pressure plate (4), the signal terminal (13), and the signal wiring harness (14) are fixedly connected by bolts. Bolt holes are provided on the signal terminal side pressure plate (4), the signal terminal (13), and the signal wiring harness (14). The signal terminal side pressure plate (4), the signal terminal (13), and the signal wiring harness (14) are fixedly connected by the bolt holes and the bolts provided in the bolt holes.

7. The automotive inverter power module thermal resistance and power cycle testing device according to claim 1, characterized in that: The high-voltage terminal mounting block (7) comprises a collector / drain high-voltage terminal (7-1) and an emitter / source high-voltage terminal (7-2).

8. The automotive inverter power module thermal resistance and power cycle testing device according to claim 7, characterized in that: The collector / drain high-voltage terminal (7-1) and the emitter / source high-voltage terminal (7-2) are respectively arranged on high-voltage terminal mounting blocks (7) on the two fixing seats (6).

9. The automotive inverter power module thermal resistance and power cycle testing device according to claim 1, characterized in that: The signal terminal (13) comprises a collector / drain signal terminal (13-1), a gate signal terminal (13-2), and an emitter / source signal terminal (13-3) which are arranged in sequence.

10. The automotive inverter power module thermal resistance and power cycle testing device according to claim 1, characterized in that: The high-voltage wire harness (15) is connected to an external T3STER power supply to apply a load current, and the signal wire harness (14) is connected to a T3STER acquisition system to perform signal acquisition.

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