Oiling machine anti-cheating chip, encoder circuit and encoder
By encapsulating the Hall sensor and encoder MCU in a tanker anti-cheat chip, the problem that the existing tanker encoder is prone to cheating is solved, and the accuracy of fuel volume measurement and the reliability of anti-cheat are achieved.
Patent Information
- Application Number
- CN202421036690.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-05-13
AI Technical Summary
In existing tanker encoders, the independence between the Hall sensor and the encoder MCU makes it easy to be damaged by cheating circuits, resulting in inaccurate fuel volume measurement.
Design a tanker anti-cheating chip, which prevents cheating by encapsulating the Hall sensor wafer and the encoder MCU wafer in one chip, ensures that the connection between the two cannot be destroyed independently, thereby preventing the occurrence of cheating.
By encapsulating the Hall sensor and encoder MCU in one chip, it effectively prevents the refueling machine from cheating and ensures the accuracy and reliability of fuel volume measurement.
Smart Images
Figure CN222545637U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor technology, and in particular to an anti-cheating chip, an encoder circuit and an encoder for a fuel dispenser. Background Art
[0002] The fuel dispenser encoder is the core component of the fuel dispenser system. When the start button of the fuel dispenser is turned on, the system's motor is started, the gasoline enters the flow measurement converter and drives the encoder to rotate, thereby converting the corresponding angular displacement signal into an electrical pulse signal and transmitting it to the metering MCU end of the fuel dispenser mainboard to obtain the accurate fuel volume. In other words, the electrical pulse signal output by the encoder directly determines the accuracy of the fuel volume measurement.
[0003] At present, the existing fuel dispenser encoder includes a Hall sensor and an encoder MCU, and the Hall sensor and the encoder MCU are two completely independent devices, which are connected by circuit wiring. In this case, the encoder can be turned on, the original circuit wiring between the Hall sensor and the encoder MCU can be disconnected, and a cheating circuit can be connected between the Hall sensor and the encoder MCU, so that the pulse signal of the Hall sensor cannot be directly transmitted to the encoder MCU, but is transmitted to the cheating circuit, and then the cheating circuit changes the number of pulse signals and transmits them to the encoder MCU, thereby controlling the encoder pulse source signal to complete the cheating. Therefore, how to prevent fuel dispenser cheating is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention
[0004] In view of this, the present disclosure proposes a fuel dispenser anti-cheating chip, an encoder circuit and an encoder, which can prevent the occurrence of fuel dispenser cheating.
[0005] According to a first aspect of the present disclosure, a fuel dispenser anti-cheating chip is provided, characterized in that it includes: a substrate, a Hall sensor wafer, an encoder MCU wafer, and a package;
[0006] The substrate at least includes a Hall power pin, a Hall ground pin and an encoder MCU output pin; the Hall sensor wafer includes a power contact, a ground contact and a pulse output contact, and the encoder MCU wafer includes at least a pulse input contact and a signal output contact;
[0007] The power contact and the ground contact on the Hall sensor wafer are respectively connected to the Hall power pin and the Hall ground pin on the substrate, and the pulse output contact on the Hall sensor wafer is electrically connected to the pulse input contact on the encoder MCU wafer;
[0008] The signal output contact on the encoder MCU wafer is electrically connected to the encoder MCU output pin on the substrate;
[0009] The package is packaged on the substrate.
[0010] In a possible implementation, the pulse output contact of the Hall sensor wafer is electrically connected to the pulse input contact on the encoder MCU wafer through a preset microcircuit.
[0011] In a possible implementation manner, the microcircuit is arranged on the substrate.
[0012] In a possible implementation, the microcircuit includes a first contact and a second contact, and the first contact and the second contact are electrically connected;
[0013] The pulse output contact of the Hall sensor wafer is electrically connected to the first contact of the microcircuit, and the pulse input contact on the encoder MCU wafer is electrically connected to the second contact of the microcircuit.
[0014] In a possible implementation, the Hall sensor wafer and the encoder MCU further include CLK contacts, DIO contacts and CS contacts, respectively, and the CLK contacts, DIO contacts and CS contacts in the Hall sensor wafer are respectively electrically connected to the CLK contacts, DIO contacts and CS contacts in the encoder MCU.
[0015] In a possible implementation manner, the packaging component is a packaging cover plate, and the packaging cover plate is buckled on the substrate.
[0016] According to a second aspect of the present disclosure, there is provided an anti-cheating encoder circuit, comprising the fuel dispenser anti-cheating chip and the signal output circuit as described in any one of the first aspect of the present disclosure;
[0017] The anti-cheating chip of the fuel dispenser includes a Hall power pin, a Hall ground pin and an encoder MCU output pin;
[0018] The Hall power pin is electrically connected to an external power supply to obtain a working power supply, and the Hall ground pin is grounded;
[0019] The encoder MCU output pin is electrically connected to the signal input terminal of the metering MCU through the signal output circuit.
[0020] According to a third aspect of the present disclosure, an anti-cheating encoder is provided, characterized in that it includes the anti-cheating encoder circuit as described in the second aspect of the present disclosure.
[0021] The present invention provides an anti-cheating chip for a fuel dispenser, an anti-cheating encoder circuit and an encoder. The anti-cheating chip for a fuel dispenser includes: a substrate, a Hall sensor wafer, an encoder MCU wafer and a package; the substrate includes at least a Hall power pin, a Hall ground pin and an encoder MCU output pin; the Hall sensor wafer includes a power contact, a ground contact and a pulse output contact, and the encoder MCU wafer includes at least a pulse input contact and a signal output contact; the power contact and the ground contact on the Hall sensor wafer are respectively connected to the Hall power pin and the Hall ground pin on the substrate, and the pulse output contact on the Hall sensor wafer is electrically connected to the pulse input contact on the encoder MCU wafer; the signal output contact on the encoder MCU wafer is electrically connected to the encoder MCU output pin on the substrate; the package is packaged on the substrate. Since in this embodiment, the Hall sensor wafer and the encoder MCU wafer are packaged in a gas station anti-cheating chip, if you want to destroy the connection between the Hall sensor wafer and the encoder MCU wafer, you need to destroy the packaging of the gas station anti-cheating chip. However, when the chip package is destroyed, the Hall sensor wafer and the encoder MCU wafer in the chip will be destroyed at the same time and lose their original functions. Therefore, the occurrence of gas station cheating can be fundamentally prevented.
[0022] Further features and aspects of the present disclosure will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure.
[0024] Figure 1 A structural block diagram of an anti-cheating chip for a fuel dispenser according to an embodiment of the present disclosure is shown;
[0025] Figure 2 A structural block diagram showing an anti-cheating chip for a fuel dispenser according to another embodiment of the present disclosure is shown;
[0026] Figure 3 A pin diagram of a fuel dispenser anti-cheating chip according to an embodiment of the present disclosure is shown;
[0027] Figure 4 A circuit diagram of an anti-cheating encoder circuit according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION
[0028] Various exemplary embodiments, features and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.
[0029] Among them, it needs to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the utility model or simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model.
[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0031] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.
[0032] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present disclosure can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present disclosure.
[0033] <Chip Example>
[0034] Figure 1 FIG. 2 shows a structural block diagram of a fuel dispenser anti-cheating chip according to an embodiment of the present disclosure. Figure 1 As shown, the fuel dispenser anti-cheating chip 100 includes: a substrate 110, a Hall sensor wafer 120, an encoder MCU wafer 130 and a package;
[0035] Among them, the substrate 110 includes at least a Hall power pin 111, a Hall ground pin 112 and an encoder MCU output pin 113; the Hall sensor wafer 120 includes a power contact 121, a ground contact 122 and a pulse output contact 123, and the encoder MCU wafer 130 includes a pulse input contact 131 and a signal output contact 132.
[0036] The power contact 121 of the Hall sensor wafer 120 is electrically connected to the Hall power pin 111 of the substrate 110. The ground contact 122 of the Hall sensor wafer 120 is electrically connected to the Hall ground pin 112 of the substrate 110. The pulse output contact 123 of the Hall sensor wafer 120 is electrically connected to the pulse input contact 131 on the encoder MCU wafer 130.
[0037] The signal output contacts 132 on the encoder MCU wafer 130 are electrically connected to the encoder MCU output pins 113 of the substrate 110 .
[0038] The package is packaged on the substrate 110 .
[0039] In the present disclosure, a gas station anti-cheating chip is obtained by packaging a Hall sensor wafer and an encoder MCU wafer in one chip, so that the gas station anti-cheating chip has the functions of both the Hall sensor and the encoder MCU. At the same time, since the Hall sensor wafer and the encoder MCU wafer are packaged in one chip, if you want to destroy the connection between the Hall sensor wafer and the encoder MCU wafer, you need to destroy the package of the gas station anti-cheating chip. However, when the chip package is destroyed, the Hall sensor wafer and the encoder MCU wafer in the chip will be destroyed at the same time and lose their original functions. Therefore, the gas station anti-cheating chip in the present disclosure can fundamentally prevent the occurrence of gas station cheating.
[0040] In one possible implementation, Figure 2 As shown, the pulse output contact 123 of the Hall sensor wafer 120 is electrically connected 150 to the pulse input contact 131 on the encoder MCU wafer 130 via a preset microcircuit.
[0041] In a possible implementation, the microcircuit 150 may be disposed on the substrate 110. Specifically, the microcircuit 150 includes a first contact and a second contact, and the first contact and the second contact are electrically connected.
[0042] In this implementation, the pulse output contact 123 of the Hall sensor wafer 120 is electrically connected to the first contact of the microcircuit 150 , and the pulse input contact 131 on the encoder MCU wafer 130 is electrically connected to the second contact of the microcircuit 150 .
[0043] In a possible implementation, the package may be a package cover plate, which is buckled on the substrate 110 , wherein the package cover plate may be a metal cover plate, thereby improving the heat dissipation performance of the chip.
[0044] In a possible implementation, the Hall sensor wafer 120 further includes a PRO contact. In this implementation, the substrate 110 further includes a Hall PRO pin, and the PRO contact of the Hall sensor wafer 120 is electrically connected to the Hall PRO pin of the substrate 110 .
[0045] In a possible implementation, the Hall sensor wafer 120 further includes a first CS contact, a first CLK contact, and a first DIO contact. In this implementation, the encoder MCU wafer 130 also includes a second CS contact, a second CLK contact, and a second DIO contact. The first CS contact of the Hall sensor wafer 120 is electrically connected to the second CS contact of the encoder MCU wafer 130, the first CLK contact of the Hall sensor wafer 120 is electrically connected to the second CLK contact of the encoder MCU wafer 130, and the first DIO contact of the Hall sensor wafer 120 is electrically connected to the second DIO contact of the encoder MCU wafer 130.
[0046] In a possible implementation, the Hall sensor wafer 120 includes two pulse output contacts 123, which are respectively recorded as pulse output contact A and pulse output contact B. In this implementation, the encoder MCU wafer 130 includes two corresponding pulse input contacts, which are respectively recorded as pulse input contact A and pulse input contact B. Among them, the pulse output contact A on the Hall sensor wafer 120 is electrically connected to the pulse input contact A of the encoder MCU wafer 130. The pulse output contact B on the Hall sensor wafer 120 is electrically connected to the pulse input contact B of the encoder MCU wafer 130.
[0047] In the embodiment where the encoder MCU wafer 130 includes a pulse input contact A and a pulse input contact B, the encoder MCU wafer 130 will include two signal output contacts, respectively denoted as signal output contact A and signal output contact B, and the corresponding substrate 110 includes two encoder MCU output pins, respectively denoted as MCU-RXD1 pin and MCU-TXD1 pin. Among them, the signal output contact A on the encoder MCU wafer 130 is electrically connected to the MCU-RXD1 pin on the substrate 110, and the signal output contact B on the encoder MCU wafer 130 is electrically connected to the MCU-TXD1 pin on the substrate 110.
[0048] In a possible implementation, the encoder MCU wafer 130 also includes other functional contacts such as MCU-LDO-CAP contacts, MCU-VDD contacts, MCU-AVDD contacts, MCU-VSS contacts, MCU-AVSS contacts, MCU-XTAL contacts, MCU-ICE-CLK contacts, MCU-ICE-DAT contacts and RST contacts, and the corresponding substrate 110 also includes other functional pins such as MCU-LDO-CAP pins, MCU-VDD pins, MCU-AVDD pins, MCU-VSS pins, MCU-AVSS pins, MCU-XTAL pins, MCU-ICE-CLK pins, MCU-ICE-DAT pins and RST pins corresponding to these contacts, and these other functional contacts are electrically connected to other functional pins on the substrate 110, respectively. In this implementable embodiment, the encapsulated anti-cheating chip for the fuel dispenser can be as follows Figure 3 As shown in U1 in .
[0049] <Circuit Embodiment>
[0050] In this embodiment, an anti-cheating encoder circuit is provided, and the anti-cheating encoder circuit includes the anti-cheating chip of the fuel dispenser in the chip embodiment, a signal output circuit and an output port. Among them, the fuel dispenser anti-cheating chip includes a Hall power pin, a Hall ground pin and an encoder MCU output pin;
[0051] The Hall power pin is electrically connected to an external power supply to obtain a working power supply, and the Hall ground pin is grounded;
[0052] The encoder MCU output pin is electrically connected to the output port through the signal output circuit, so as to be electrically connected to the signal input terminal of the metering MCU through the output port.
[0053] In one possible implementation, the Hall power pins include: Figure 4 The SEN-VDD pin and the SEN-VDD3V3 pin shown in the figure are electrically connected to the external power supply VCC and are also grounded through the capacitor C6.
[0054] In one possible implementation, the encoder MCU output pins include: Figure 4The MCU-RXD1 pin and the MCU-TXD1 pin shown in the embodiment, in this implementation, the signal output circuit includes a first signal output circuit and a second signal output circuit, the output port includes a second terminal and a third terminal, and the signal input end of the metering MCU includes a first metering input end and a second calculation input end. Among them, the MCU-RXD1 pin is electrically connected to the third terminal of the output port through the first signal output circuit, and is electrically connected to the first metering input end of the metering MCU through the third terminal. The MCU-TXD1 pin is electrically connected to the second terminal of the output port through the second signal output circuit, and is electrically connected to the second metering input end of the metering MCU through the third terminal.
[0055] In this implementation, the circuit diagram of the first signal output circuit may be as follows: Figure 4 As shown in , it includes a resistor R6, a transistor Q3 and a capacitor C7. Among them, the first end of the resistor R6 is electrically connected to the MCU-RXD1 pin in the anti-cheating chip of the tanker, which is used to receive the signal MCU-A output by the anti-cheating chip of the tanker. The second end of the resistor R6 is electrically connected to the base of the transistor Q3, the emitter of the transistor Q3 is grounded, and the collector of the transistor Q3 is electrically connected to the third terminal of the output port of the anti-cheating encoder circuit, so as to send the metering signal A-OUT converted by the transistor Q3 to the first metering input end of the metering MCU through the third terminal. Capacitor C7 is electrically connected between the emitter and collector of the transistor Q3.
[0056] In this implementation, the circuit diagram of the second signal output circuit may be as follows: Figure 4 As shown in , it includes a resistor R7, a transistor Q4 and a capacitor C8. Among them, the first end of the resistor R7 is electrically connected to the MCU-TXD1 pin in the anti-cheating chip of the tanker, and is used to receive the signal MCU-B output by the anti-cheating chip of the tanker. The second end of the resistor R7 is electrically connected to the base of the transistor Q4, the emitter of the transistor Q4 is grounded, and the collector of the transistor Q4 is electrically connected to the second terminal of the output port of the anti-cheating encoder circuit, so as to send the metering signal B-OUT converted by the transistor Q4 to the second metering input end of the metering MCU through the second terminal. Capacitor C8 is electrically connected between the emitter and collector of the transistor Q4.
[0057] In a possible implementation, the anti-cheating chip of the fuel dispenser also includes: Figure 4The MCU-RXD pin and MCU-TXD pin shown, the corresponding anti-cheating encoder circuit also includes an RXD circuit and a TXD circuit. Wherein, the RXD circuit includes a resistor R3, a resistor R4, a resistor R8 and a transistor Q1. The first end of the resistor R3 is electrically connected to the external power supply VCC, the second end of the resistor R3 is electrically connected to the collector of the transistor Q1, and the second end of the resistor R3 is also electrically connected to the MCU-RXD pin in the anti-cheating chip of the tanker. The base of the transistor Q1 is grounded through the series resistors R4 and R8. The emitter of the transistor Q1 is grounded. The connection point of the resistor R4 and the resistor R8 is electrically connected to the fifth terminal of the output port of the anti-cheating encoder circuit.
[0058] The TXD circuit includes a resistor R2, a resistor R5, and a transistor Q2. The first end of the resistor R2 is electrically connected to the external power supply VCC, the second end of the resistor R2 is electrically connected to the collector of the transistor Q2, and the second end of the resistor R2 is also electrically connected to the sixth terminal of the output port of the anti-cheating encoder circuit. The base of the transistor Q2 is electrically connected to the MCU-TXD pin of the tanker anti-cheating chip through the resistor R5. The emitter of the transistor Q2 is grounded.
[0059] <Encoder Embodiment>
[0060] In this embodiment, an anti-cheating encoder is provided. The anti-cheating encoder includes an anti-cheating encoder circuit.
[0061] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.
Claims
1. A fuel dispenser anti-cheating chip, characterized in that: include: Substrates, Hall sensor wafers, encoder MCU wafers and packages; The substrate at least includes a Hall power pin, a Hall ground pin and an encoder MCU output pin; the Hall sensor wafer includes a power contact, a ground contact and a pulse output contact, and the encoder MCU wafer includes at least a pulse input contact and a signal output contact; The power contact and the ground contact on the Hall sensor wafer are respectively connected to the Hall power pin and the Hall ground pin on the substrate, and the pulse output contact on the Hall sensor wafer is electrically connected to the pulse input contact on the encoder MCU wafer; The signal output contact on the encoder MCU wafer is electrically connected to the encoder MCU output pin on the substrate; The package is packaged on the substrate.
2. The chip according to claim 1, characterized in that: The pulse output contacts of the Hall sensor wafer are electrically connected to the pulse input contacts on the encoder MCU wafer via a preset microcircuit.
3. The chip according to claim 2, characterized in that: The microcircuit is arranged on the substrate.
4. The chip according to claim 3, characterized in that: The microcircuit comprises a first contact and a second contact, wherein the first contact and the second contact are electrically connected; The pulse output contact of the Hall sensor wafer is electrically connected to the first contact of the microcircuit, and the pulse input contact on the encoder MCU wafer is electrically connected to the second contact of the microcircuit.
5. The chip according to claim 1, characterized in that: The Hall sensor wafer and the encoder MCU further include CLK contacts, DIO contacts and CS contacts, respectively, and the CLK contacts, DIO contacts and CS contacts in the Hall sensor wafer are electrically connected to the CLK contacts, DIO contacts and CS contacts in the encoder MCU, respectively.
6. The chip according to claim 1, characterized in that: The packaging component is a packaging cover plate, and the packaging cover plate is buckled on the substrate.
7. An anti-cheating encoder circuit, characterized in that: It comprises the anti-cheating chip and signal output circuit of the fuel dispenser as described in any one of claims 1 to 6; The anti-cheating chip of the fuel dispenser includes a Hall power pin, a Hall ground pin and an encoder MCU output pin; The Hall power pin is electrically connected to an external power supply to obtain a working power supply, and the Hall ground pin is grounded; The encoder MCU output pin is electrically connected to the signal input terminal of the metering MCU through the signal output circuit.
8. An anti-cheating encoder, characterized in that: Comprising the anti-cheating encoder circuit as described in claim 7.