BIDI optical module

Abstract

The utility model relates to the technical field of optical communication, in particular to a BIDI optical module, which is characterized in that an optical emitter part and a tube shell are integrated into a one-piece component, an opening is arranged at the top of the tube shell, and all optical elements are inserted into the tube shell from the opening, so that the space for placing the optical elements left and right is saved. All optical elements are arranged in the tube shell, the length of the BIDI device can be compressed by 2 mm, the packaging size of the BIDI device is reduced, and meanwhile, optical signals are transmitted through the first optical window and the second optical window, and the performance of the BIDI device cannot be weakened.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, in particular to a BIDI optical module. Background Art

[0002] Bidirectional Data Transmission Devices (BIDI) have the ability to transmit data in both directions. In some cases, due to limited resources or other factors, it is not possible to use two separate transmission lines for bidirectional communication. In this case, BIDI devices can be used to achieve bidirectional communication on a single transmission line, thereby saving resources and costs. In some applications, bidirectional data transmission is required between devices, but only a single data line is available. BIDI devices can achieve bidirectional data transmission on this single data line, making communication more concise and efficient. BIDI devices are widely used in fiber optic communication systems. Due to the unidirectional nature of optical fibers, two optical fibers are traditionally required for bidirectional communication. However, by using BIDI devices, bidirectional data transmission can be achieved on a single optical fiber, improving the flexibility and efficiency of fiber optic communication systems. The working principle of BIDI devices involves data encoding, decoding, modulation and demodulation technologies to ensure that data can be correctly transmitted in both directions on a single transmission line. It has a wide range of applications in network communications, telecommunications equipment, industrial automation and other fields. When selecting and designing BIDI devices, factors such as its transmission rate, data format support, power consumption, and cost need to be considered to meet the needs of specific applications.

[0003] The traditional BIDI device is a 4-piece structure consisting of LD-TO, tube shell, PD-TO and pin. Since the shell is wrapped on all four sides and opened on the left and right sides, all optical components need to enter from the left and right directions, so there is wasted length space on both sides.

[0004] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in the field of this technology. Utility Model Content

[0005] The technical problem to be solved by the utility model is how to reduce the package size of the BIDI device while ensuring normal functions.

[0006] The utility model adopts the following technical solutions:

[0007] The utility model provides a BIDI optical module, comprising: a tube shell 1, an optical transmitter 2, a light splitting unit 3, an optical receiving component 4 and a pin component 5; the top of the tube shell 1 has an opening, and the optical transmitter 2 and the light splitting unit 3 are arranged in the tube shell 1; wherein the opening is used to provide an installation channel for the optical transmitter 2 and the light splitting unit 3;

[0008] A first light window 10 is disposed on one side wall of the tube shell 1 , a second light window 11 is disposed on the other side wall of the tube shell 1 , the light receiving component 4 is coupled to the second light window 11 , and the pin component 5 is coupled to the first light window 10 .

[0009] Preferably, the pin assembly 5 comprises a first bracket 50, a guide structure 51, a packaging shell 52 and a pin 53; the first bracket 50 is fixed on an outer side wall of the tube shell 1; the first light window 10 is coupled to the first bracket 50;

[0010] The guide structure 51 is disposed inside the packaging shell 52 , the insertion pin 53 is disposed in the guide structure 51 , the insertion pin 53 is aligned with the first light window 10 , and the packaging shell 52 is coupled to the first bracket 50 .

[0011] Preferably, a first lens 6 is provided between the light emitter 2 and the light splitting unit 3 .

[0012] Preferably, the light splitting unit 3 comprises an isolator 30 and a light splitting block 31; the isolator 30 and the light splitting block 31 are integrated;

[0013] The isolator 30 is used to transmit the first optical signal emitted by the optical transmitter 2, and is also used to isolate the second optical signal from the pin assembly 5;

[0014] The light splitting block 31 is used to transmit the first optical signal to the pin assembly 5 , and is used to transmit the second optical signal to the optical receiving assembly 4 .

[0015] Preferably, the light receiving assembly 4 includes a second bracket 40, a second lens 41 and a light detection chip 42; the second light window 11 is coupled to the second bracket 40; the second bracket 40 is fixed to the outer side wall of the tube shell 1;

[0016] The second bracket 40 includes a first groove 400 and a second groove 401, the second lens 41 is coupled in the first groove 400, and the component where the light detection chip 42 is located is coupled in the second groove 401;

[0017] The second lens 41 is also coupled to the light splitting block 31 to receive the second optical signal from the second lens 41 .

[0018] Preferably, a lens assembly 7 is provided between the light splitting unit 3 and the first light window 10, the lens assembly 7 comprises a third lens 70 and a lens holder 71, the third lens 70 is provided on the lens holder 71, and one side edge of the lens holder 71 is closely attached to the side wall of the tube shell 1;

[0019] The side chamfer of the lens holder 71 matches the corresponding inner chamfer of the side wall of the tube housing 1 .

[0020] Preferably, the BIDI optical module further comprises a circuit board 8 , the optical transmitter 2 is arranged on the circuit board 8 , a gold finger connector 80 is arranged at the end of the circuit board 8 , and the parts of the circuit board 8 except the gold finger connector 80 are all arranged in the tube shell 1 .

[0021] Preferably, the type of the light emitter 2 includes one or more of a vertical cavity surface emitting laser (Vertical-Cavity Surface-Emitting Laser, abbreviated as VCSEL), a Fabry-Perot (Fabry-Perot, abbreviated as FP) laser, a distributed feedback (Distributed Feedback, abbreviated as DFB) laser and an electro-absorption modulated laser (Electro-absorption Modulated Laser, abbreviated as EML).

[0022] Preferably, the first light window 10 and the second light window 11 are both coated with an anti-reflection film, a band-pass film or a band-stop film.

[0023] Preferably, the packaging type of the BIDI optical module is Small Form-factor Pluggable (SFP), SFP+, SFP28, SFP-DD (full name in English: Small Form-factor Pluggable Double Density), Quad Small Form-factor Pluggable Plus (QSFP+), QSFP28 or QSFP-DD (full name in English: Quad Small Form-factor Pluggable Plus Double Density) packaging.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] The utility model integrates the optical transmitter part and the tube shell into a one-piece component, sets an opening at the top of the tube shell, and inserts all optical components into the tube shell from the opening, thereby eliminating the space required to place optical components on the left and right. By installing all optical components in the tube shell, the length of the BIDI device can be compressed by 2mm, reducing the package size of the BIDI device. At the same time, the transmission of optical signals through the first optical window and the second optical window will not weaken the performance of the BIDI device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a structural schematic diagram of a BIDI optical module provided by an embodiment of the utility model;

[0028] Figure 2 It is a structural schematic diagram of an existing BIDI optical module provided by an embodiment of the utility model;

[0029] Figure 3 It is a partial cross-sectional structural schematic diagram of a BIDI optical module provided by an embodiment of the utility model;

[0030] Figure 4 This is a schematic diagram of a top view of a BIDI optical module provided by an embodiment of the utility model;

[0031] Figure 5 It is a partial cross-sectional structural schematic diagram of another BIDI optical module provided by an embodiment of the utility model;

[0032] Figure 6 It is a structural schematic diagram of an optical transmitter and a circuit board of a BIDI optical module provided by an embodiment of the utility model;

[0033] Figure 7 It is a structural schematic diagram of a light splitting unit of a BIDI optical module provided by an embodiment of the utility model;

[0034] Figure 8 It is a structural schematic diagram of a pin assembly of a BIDI optical module provided by an embodiment of the utility model;

[0035] Fig. 9 It is a structural schematic diagram of a lens assembly and a light receiving assembly of a BIDI optical module provided by an embodiment of the utility model;

[0036] Fig.10 This is a schematic diagram of the structure of a second bracket of a BIDI optical module provided by an embodiment of the utility model;

[0037] Fig.11 This is a schematic diagram of the optical path structure of a BIDI optical module provided by an embodiment of the utility model;

[0038] Fig.12It is a structural schematic diagram of a tube shell of a BIDI optical module provided by an embodiment of the utility model;

[0039] Fig.13 It is a specific structural schematic diagram of a tube shell of a BIDI optical module provided by an embodiment of the utility model.

[0040] In all drawings, like reference numerals refer to like structures, wherein:

[0041] Tube shell 1, first light window 10, second light window 11, light transmitter 2, splitter unit 3, isolator 30, splitter block 31, light receiving component 4, second bracket 40, first groove 400, second groove 401, second lens 41, light detection chip 42, pin assembly 5, first bracket 50, guide structure 51, packaging shell 52, pin 53, first lens 6, lens assembly 7, third lens 70, lens bracket 71, circuit board 8, gold finger connector 80. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0043] The terms "first", "second", etc. in this utility model are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this utility model, unless otherwise specified, "plurality" means two or more.

[0044] In the present invention, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0045] Embodiment 1:

[0046] In order to reduce the package size of the existing BIDI device, this embodiment provides a BIDI optical module, such as Figure 1As shown, it includes: a tube shell 1, an optical transmitter 2, a splitter unit 3, an optical receiving component 4 and a pin assembly 5; the top of the tube shell 1 has an opening, and the optical transmitter 2 and the splitter unit 3 are arranged in the tube shell 1; wherein the opening is used to provide an installation channel for the optical transmitter 2 and the splitter unit 3; a first light window 10 is arranged on one side wall of the tube shell 1, and a second light window 11 is arranged on the other side wall of the tube shell 1, the optical receiving component 4 is coupled to the second light window 11, and the pin assembly 5 is coupled to the first light window 10. The optical transmitter 2 is used to emit a first optical signal, and the optical receiving component 4 is used to receive a second optical signal transmitted from the pin assembly 5. Figure 1 For example, the opening refers to an opening above the light emitter 2 and the light splitting unit 3, so as to facilitate the packaging of the light emitter 2 and the light splitting unit 3. It is worth noting that in order to facilitate the display of the structure, Figure 1 In the following figures, the internal structure of the tube shell 1 is displayed from the perspective of viewing from the opening, and the light receiving component 4 and the pin component 5 are displayed through a cross-sectional view from the opening direction, which will not be repeated in the subsequent figures.

[0047] like Figure 2 The figure shows a cross-sectional view of an existing BIDI device, which is a four-piece structure consisting of LD-TO1', tube shell 2', PD-TO3' and pin 4'. The difference between this embodiment and the traditional BIDI device is that the optical transmitter 2 and other related optical devices are arranged in the same tube shell 1, which greatly saves the package size. Next, the structure of the BIDI optical module will be specifically described.

[0048] Figure 3 , Figure 4 and Figure 5 The first light window 10 and the second light window 11 are shown from different viewing angles, respectively. More details will not be described in detail in this embodiment.

[0049] The BIDI optical module allows the transmission and reception of optical signals in a single module at the same time, and it is achieved through different optical paths, which greatly saves space and cost. The tube shell 1 not only protects the internal components, but also provides a path for the transmission of optical signals through openings and optical windows. The opening at the top can be used to install or maintain internal optical devices, while the first optical window 10 and the second optical window 11 on the side wall are used for the transmission and reception of optical signals, respectively. Among them, the first optical window 10 and the second optical window 11 are coated with an anti-reflection film, a bandpass film or a band-stop film. The specific type of film coated is determined by the isolation required by the optical receiving component 4, and is not specifically limited in this embodiment.

[0050] The optical transmitter 2 is located inside the tube shell 1 and is responsible for emitting a first optical signal. This optical signal is transmitted to the pin assembly 5 through the first optical window 10 on the side wall of the tube shell 1, and may be further transmitted through an external optical fiber network. In one embodiment, Figure 6 As shown, the BIDI optical module further includes a circuit board 8, the optical transmitter 2 is arranged on the circuit board 8, a gold finger connector 80 is arranged at the end of the circuit board 8, and the parts of the circuit board 8 except the gold finger connector 80 are all arranged in the tube shell 1. The type of the optical transmitter 2 includes one or more of VCSEL, FP laser, DFB laser and EML.

[0051] The light emitter 2 is a semiconductor chip with an integrated light-emitting function, which can emit light through current excitation. The gold finger connector 80 is used to insert an electronic device into a slot or interface. Their name comes from their appearance. They are usually made of metal and look like fingers, and are used to provide reliable electrical connections. The gold finger connector 21 and the light emitter 2 are bonded by gold wires. Gold wire bonding refers to a common technique for connecting a semiconductor chip (light emitter 2) to its package or connector (gold finger connector 80). During the gold wire bonding process, a thin metal wire is soldered to the connection point of the chip and connected to the package substrate or connector to achieve the transmission of electrical signals. It is worth noting that each type of light emitter 2 has different characteristics and applicable scenarios, and a suitable model can be selected according to specific application requirements. The type of light emitter 2 can be selected according to factors such as the required signal strength and wavelength. Other electronic devices are also provided on the circuit board 8, which will not be described in detail in this embodiment.

[0052] The optical splitter 3 is also arranged inside the tube shell 1, and its main function is to distribute the optical signal between the transmission and reception paths. This means that it can introduce the second optical signal from the outside into the optical receiving component 4, while allowing the first optical signal emitted by the optical transmitter 2 to be transmitted to the outside. In one embodiment, Figure 7 As shown, the splitter unit 3 includes an isolator 30 and a splitter block 31; the isolator 30 and the splitter block 31 are arranged as a whole; the isolator 30 is used to transmit the first optical signal emitted by the optical transmitter 2, and is also used to isolate the second optical signal from the pin assembly 5; the splitter block 31 is used to transmit the first optical signal to the pin assembly 5, and is used to transmit the second optical signal to the optical receiving assembly 4.

[0053] Among them, the function of the isolator 30 is to transmit the first optical signal to the splitter block 31 and prevent the second optical signal from being transmitted to the optical transmitter 2. In the optical system, the isolator 30 is generally used to prevent the reverse propagation or interference of the optical signal to ensure the unidirectional transmission of the signal and protect the light source from reflection or interference. The function of the splitter block 31 is to transmit the first optical signal to the pin assembly 5 and transmit the second optical signal to the optical receiving assembly 4 at the same time. The splitter block 31 is an optical element, which is generally used in applications such as optical path distribution and interference instruments. The isolator 30 and the splitter block 31 are configured as a whole, which means that they are packaged into a single optical element or module for easy installation. This integrated design can simplify the structure of the optical system, reduce the package size and improve the performance and stability of the system.

[0054] The pin assembly 5 is coupled to the first optical window 10 and is responsible for introducing the optical signal from the external optical fiber into the optical module. This is usually achieved through a physical connection, such as an optical fiber connector. Figure 8 As shown, the pin assembly 5 includes a first bracket 50, a guide structure 51, a packaging shell 52 and a pin 53; the first bracket 50 is fixed to an outer side wall of the tube shell 1; the first light window 10 is coupled to the first bracket 50; the guide structure 51 is arranged inside the packaging shell 52, the pin 53 is arranged in the guide structure 51, the pin 53 is aligned with the first light window 10, and the packaging shell 52 is coupled to the first bracket 50.

[0055] Among them, the first bracket 50 provides a structure for supporting and fixing the first light window 10. The light window is usually a window for transmitting optical signals in an optical system. The design and manufacturing quality of the first bracket 50 directly affect the transmission quality and stability of the optical signal. The guide structure 51 is located inside the packaging shell 52, and its main function is to guide and position the light window and its connecting parts. At the same time, the pin 53 is coupled to the first light window 10 to ensure the correct transmission and alignment of the optical signal. The packaging shell 52 is the outer shell of the pin assembly 5, which is used to protect the internal components from the external environment and provide mechanical support and connection. The packaging shell 52 is usually made of durable materials, such as metal or plastic, to ensure the stability and reliability of the pin assembly 5. The specific design of the pin assembly 5 needs to take into account the precise position and alignment of the light window to avoid the loss or offset of the optical signal. More specifically, it will not be explained in detail in this embodiment.

[0056] In order to make the transmission of the optical signal in the BIDI optical module more stable, in a preferred embodiment, continue to refer to Figure 8A first lens 6 is disposed between the optical transmitter 2 and the optical splitter unit 3. The first lens 6 is used to focus the first optical signal emitted from the optical transmitter 2 so that the first optical signal can be better transmitted to the isolator 30 in the optical splitter unit 3.

[0057] The optical receiving component 4 is coupled to the second optical window 11 on the other side wall of the tube shell 1, and is used to receive the second optical signal transmitted from the pin component 5. The optical receiving component 4 is responsible for converting the received optical signal into an electrical signal for further processing. Fig. 9 and Fig.10 As shown, the optical receiving component 4 includes a second bracket 40, a second lens 41 and a light detection chip 42; the second light window 11 is coupled to the second bracket 40; the second bracket 40 is fixed to the outer side wall of the tube shell 1; the second bracket 40 includes a first groove 400 and a second groove 401, the second lens 41 is coupled in the first groove 400, and the component where the light detection chip 42 is located is coupled in the second groove 401; the second lens 41 is also coupled to the splitter block 31 to receive the second optical signal from the second lens 41.

[0058] Among them, the second bracket 40 is an important component of the optical receiving component 4, similar to the first bracket 50 in the pin assembly 5, which provides a structure for supporting and fixing the second optical window 11. The second optical window 11 is used to receive the second optical signal from the splitter block 31. The design and manufacturing quality of the second bracket 40 directly affect the receiving quality and stability of the optical signal. The second lens 41 is located in the optical receiving component 4, and its main function is to focus the second optical signal from the splitter block 31. Through proper design and installation, the second lens 41 can focus the scattered light into a concentrated light spot and transmit it to the optical detection chip 42 to improve the receiving efficiency and sensitivity of the optical signal. The optical detection chip 42 is the core component of the optical receiving component 4, which is responsible for converting the received optical signal into an electrical signal. The optical detection chip 42 is usually made of semiconductor materials, has the characteristics of high sensitivity and fast response, and can realize efficient detection and conversion of optical signals. It is worth noting that the specific type of the optical detection chip 42 is not described in detail in this embodiment.

[0059] In a preferred embodiment, continue to refer to Fig. 9 A lens assembly 7 is provided between the light splitting unit 3 and the first light window 10, and the lens assembly 7 includes a third lens 70 and a lens holder 71. The third lens 70 is arranged on the lens holder 71, and one side of the lens holder 71 is in close contact with the side wall of the tube shell 1; the side chamfer of the lens holder 71 matches the inner chamfer corresponding to the side wall of the tube shell 1.

[0060] Among them, the main function of the lens assembly 7 is to optimize the transmission path of the optical signal. Through the third lens 70, the optical signal can be focused or diffused to adapt to the optical signal emitted by the optical transmitter 2 or the need to transmit the optical signal to the optical receiving component 4. This helps to improve the transmission efficiency and quality of the optical signal, reduce signal loss, and ensure the stability and accuracy of the signal during transmission. The third lens 70 is the core component of the lens assembly 7, and its quality, material and design have a direct impact on the processing effect of the optical signal. The lens can be designed as a convex lens or a concave lens as needed to achieve the purpose of focusing or diffusing the optical signal. In some application scenarios, a complex lens system may also be used to further optimize the optical path and signal quality. The lens bracket 71 is not only used to fix the third lens 70, but also its design details have an important impact on the overall performance and installation accuracy of the lens assembly 7. One side of the lens bracket 71 is close to the side wall of the tube shell 1 to ensure the correct positioning and stability of the lens assembly 7 inside the optical module. The side chamfers of the lens holder 71 match the inner chamfers and outer chamfers corresponding to the side walls of the tube shell 1. Such a design is not only conducive to improving the accuracy and stability of component assembly, but also helps to reduce the reflection and scattering of optical signals at the interface and optimize the signal transmission path. The presence of the lens assembly 7 enables the optical signal to be properly adjusted and optimized before entering the optical splitter unit 3 or after exiting the optical splitter unit 3. This is crucial for achieving efficient optical signal transmission and reducing optical loss, especially in high-speed data transmission and long-distance transmission applications.

[0061] like Fig.11 The figure shows the optical path diagram of the entire BIDI optical module. Fig.12 , wherein the inner and outer chamfers of one end of the tube shell 1 are set to be arc-shaped ( Fig.11 In the example shown in the dotted circle in the middle, this will lead to the reduction of the wall of the tube shell 1, which will reduce the entity supporting the light window on both sides and reduce the strength. In addition, if there is an inner arc, in order not to increase the length, the lens bracket 71 needs to be cut into a matching arc, which will reduce the area of ​​the lens assembly 7 close to the wall of the tube shell 1. If the lens assembly 7 has a rotation angle, it will affect the entire optical path and cannot couple to the light (i.e., in the Fig.11 In the embodiment, the light splitting block 31 and the isolator 30 are rotated by an angle, so the light path is offset and no longer transmitted along the correct light path. Fig.13 By setting the inner and outer chamfers corresponding to the side walls of the tube shell 1 to right angles, the volume of the entity supporting the light window on both sides can be increased. At the same time, the lens holder 71 can also be designed to be a right angle matching therewith, which can enhance the stability of the optical path and enable the optical signal to be transmitted along the correct optical path.

[0062] In a preferred embodiment, the BIDI optical module specifically includes SFP, SFP+, SFP28, SFP-DD, QSFP+, QSFP28 or QSFP-DD packaging. Specifically, the packaging method of the BIDI is not specifically limited in this embodiment.

[0063] In this embodiment, the optical transmitter 2 and the tube shell 1 are integrated into a one-piece component, an opening is set at the top of the tube shell 1, and all optical components are inserted into the tube shell 1 through the opening, thereby eliminating the space required to place optical components on the left and right. By installing all optical components into the tube shell 1, the length of the BIDI device can be compressed by 2 mm, reducing the package size of the BIDI device. At the same time, the transmission of optical signals through the first optical window 10 and the second optical window 11 will not weaken the performance of the BIDI device.

[0064] Embodiment 2:

[0065] In the first embodiment, a BIDI optical module is introduced. In this embodiment, a packaging method is introduced. Figures 1 to 12 The packaging method is used to package the BIDI optical module, comprising:

[0066] The first step is to mount the optical transmitter 2.

[0067] The second step is to bond the optical transmitter 2 to the gold finger connector 80 through gold wire bonding.

[0068] The third step is to mount the spectrometer unit 3. In this step, the spectrometer block 31 and the isolator 30 are already integrated into one.

[0069] The fourth step is to mount the lens assembly 7 . In this step, the third lens 70 and the lens holder 71 are integrated in advance, and the upper edge of the lens holder 71 is closely attached to the inner wall of the tube shell 1 .

[0070] The fifth step is to couple the parallel light from the first lens 6 using a beam quality meter.

[0071] Step 6: coupling pin assembly 5.

[0072] Step 7: assemble the second lens 41.

[0073] The eighth step is to couple the light receiving component 4 so that the photocurrent of the light detection chip is maximized and the light receiving component 4 is cured by ultraviolet light or welding.

[0074] For the specific structure of the BIDI optical module, please refer to Example 1, which will not be repeated in this embodiment.

[0075] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A BIDI optical module, characterized in that: include: A tube shell (1), a light transmitter (2), a light splitting unit (3), a light receiving assembly (4) and a pin assembly (5); the top of the tube shell (1) has an opening, and the light transmitter (2) and the light splitting unit (3) are arranged in the tube shell (1); wherein the opening is used to provide an installation channel for the light transmitter (2) and the light splitting unit (3); A first light window (10) is provided on one side wall of the tube shell (1), a second light window (11) is provided on the other side wall of the tube shell (1), the light receiving component (4) is coupled to the second light window (11), and the pin component (5) is coupled to the first light window (10).

2. The BIDI optical module according to claim 1, characterized in that: The pin assembly (5) comprises a first bracket (50), a guide structure (51), a packaging shell (52) and a pin (53); the first bracket (50) is fixed on an outer side wall of the tube shell (1); the first light window (10) is coupled to the first bracket (50); The guide structure (51) is arranged inside the packaging shell (52), the insertion pin (53) is arranged in the guide structure (51), the insertion pin (53) is aligned with the first light window (10), and the packaging shell (52) is coupled to the first bracket (50).

3. The BIDI optical module according to claim 1, characterized in that: A first lens (6) is provided between the light emitter (2) and the light splitting unit (3).

4. The BIDI optical module according to claim 1, characterized in that: The light splitting unit (3) comprises an isolator (30) and a light splitting block (31); the isolator (30) and the light splitting block (31) are integrated; The isolator (30) is used to transmit the first optical signal emitted by the optical transmitter (2), and is also used to isolate the second optical signal from the pin assembly (5); The light splitting block (31) is used to transmit the first optical signal to the pin assembly (5), and is used to transmit the second optical signal to the optical receiving assembly (4).

5. The BIDI optical module according to claim 4, characterized in that: The light receiving component (4) comprises a second bracket (40), a second lens (41) and a light detection chip (42); the second light window (11) is coupled to the second bracket (40); the second bracket (40) is fixed to the outer side wall of the tube shell (1); The second bracket (40) comprises a first groove (400) and a second groove (401), the second lens (41) is coupled in the first groove (400), and the component where the light detection chip (42) is located is coupled in the second groove (401); The second lens (41) is also coupled to the light splitting block (31) to receive a second optical signal from the second lens (41).

6. The BIDI optical module according to claim 1, characterized in that: A lens assembly (7) is provided between the light splitting unit (3) and the first light window (10), the lens assembly (7) comprising a third lens (70) and a lens holder (71), the third lens (70) being arranged on the lens holder (71), and one side edge of the lens holder (71) being in close contact with a side wall of the tube shell (1); The side chamfer of the lens support (71) matches the corresponding inner chamfer of the side wall of the tube shell (1).

7. The BIDI optical module according to claim 1, characterized in that: The BIDI optical module also includes a circuit board (8), the optical transmitter (2) is arranged on the circuit board (8), a gold finger connector (80) is arranged at the end of the circuit board (8), and the parts of the circuit board (8) other than the gold finger connector (80) are all arranged in the tube shell (1).

8. The BIDI optical module according to claim 7, characterized in that: The type of the optical transmitter (2) includes one or more of VCSEL, FP laser, DFB laser and EML.

9. The BIDI optical module according to any one of claims 1 to 8, characterized in that: The first light window (10) and the second light window (11) are both coated with an anti-reflection film, a band-pass film or a band-stop film.

10. The BIDI optical module according to any one of claims 1 to 8, characterized in that: The packaging type of the BIDI optical module is SFP, SFP+, SFP28, SFP-DD, QSFP+, QSFP28 or QSFP-DD packaging.

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