Clamp and polishing equipment

Abstract

The utility model provides a clamp which is arranged on a polishing pad and comprises a rotating structure and a body. The rotating structure can rotate around the axis under the action of the driving mechanism; the body is used for arranging a workpiece to be machined, the body is connected to the rotating structure so as to rotate around the axis along with the rotating structure, and the body can move in the direction parallel to the axis relative to the rotating structure so as to press the workpiece to be machined on the polishing pad. When the chip is polished, the chip is arranged on the body, then the clamp is placed on the polishing pad, the body is located above the chip so that the chip can be tightly pressed on the polishing pad, then the driving mechanism drives the rotating structure and the body to rotate around the axis in the vertical direction, and then the chip can be polished. The body can provide polishing pressure for the chip by means of the gravity of the body, so that the stability of the polishing pressure is ensured, and the stability of the polishing rate is further ensured. The utility model further relates to polishing equipment.

Description

Technical Field

[0001] The present application belongs to the technical field of polishing equipment, and in particular, relates to a fixture and polishing equipment. Background Art

[0002] CMP (Chemically Mechanical Polishing) uses the combined effects of chemistry and mechanics to avoid the surface damage caused by pure mechanical polishing and the shortcomings of pure chemical polishing, such as slow polishing speed, poor surface flatness and polishing consistency. It uses the principle of "soft grinding hard" in wear, that is, using softer materials for polishing to achieve high-quality surface polishing. Under a certain pressure and the presence of polishing slurry, the workpiece being polished moves relative to the polishing pad, and with the help of the organic combination of the grinding effect of nanoparticles and the corrosive effect of oxidants, a smooth surface is formed on the surface of the workpiece being polished.

[0003] A large number of ripples will be generated on the surface of mercury cadmium telluride during the growth process, so CMP is needed to reduce the flatness and roughness of the chip. During the CMP process, the chip usually needs to be fixed. The current mainstream fixing method is to stick the chip on a glass sheet with wax, and then use a vacuum to adsorb the glass sheet to the bottom of the grinding and polishing fixture. The pressure is controlled by the spring inside the grinding and polishing fixture. Since the spring keeps shaking up and down during the polishing process, the polishing pressure is unstable, which leads to unstable polishing rate. Utility Model Content

[0004] Based on this, the present application provides a fixture and a polishing device that can stabilize the polishing pressure, thereby stabilizing the polishing rate.

[0005] The technical solution proposed in this application is:

[0006] A fixture is arranged on a polishing pad, the fixture comprising:

[0007] The rotating structure can rotate around the axis under the action of the driving mechanism;

[0008] The body is used to set the workpiece to be processed, the body is connected to the rotating structure to rotate around the axis with the rotating structure, and the body can move relative to the rotating structure in a direction parallel to the axis to press the workpiece to be processed onto the polishing pad.

[0009] Furthermore, the main body is provided with a slot for accommodating the workpiece to be processed.

[0010] Furthermore, the main body is also provided with a drainage groove, which is arranged around the clamping slot, and the drainage groove has a drainage section extending toward the clamping slot.

[0011] Furthermore, the drainage groove includes an annular groove and a vertical groove, the annular groove is arranged around the clamping groove, the vertical groove passes through and connects to the annular groove, and one end of the vertical groove extends toward the clamping groove to form the drainage section.

[0012] Furthermore, the main body is also provided with a taking slot connected to the card slot.

[0013] Furthermore, a first docking member is provided on one of the rotating structure and the main body, and a second docking member is provided on the other, the first docking member and the second docking member are constructed to be controllably docked and separated from each other, and when the first docking member and the second docking member are docked, the first docking member is non-rotatable relative to the second docking member, and the first docking member is capable of moving relative to the second docking member in a direction parallel to the axis.

[0014] Further, the number of the first butt joint parts and the number of the second butt joint parts are both plural, and the plurality of the first butt joint parts and the plurality of the second butt joint parts are arranged in one-to-one correspondence.

[0015] Furthermore, the second docking member is provided with a docking groove matching the first docking member, the docking groove extends in a direction parallel to the axis, and at least one end passes through the second docking member, and the first docking member can be inserted into the docking groove and move in a direction parallel to the axis.

[0016] Furthermore, the rotating structure is annular, the body is connected to the inner diameter surface of the rotating structure, and a friction layer is formed on the outer diameter surface of the rotating structure, and the friction layer is used to contact the driving mechanism.

[0017] A polishing device comprises a driving mechanism and the clamp as described above.

[0018] Compared with the prior art, the beneficial effects of this application are:

[0019] When polishing a chip, the chip is placed on the body, and then the fixture is placed on the polishing pad. The body is located above the chip to press the chip against the polishing pad, and then the driving mechanism drives the rotating structure and the body to rotate around the vertical axis to polish the chip. Since the body can provide polishing pressure to the chip by its own gravity, the polishing pressure is stable, thereby ensuring that the polishing rate remains stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide further understanding of the present application and constitute a part of the specification. They are used to explain the present application together with the embodiments of the present application and do not constitute a limitation of the present application.

[0021] Figure 1A schematic diagram of the structure of a clamp provided in one embodiment of the present application;

[0022] Figure 2 A schematic diagram of the structure of a clamp provided in another embodiment of the present application;

[0023] Figure 3 for Figure 1 A schematic diagram of the structure of the rotating structure in the fixture shown;

[0024] Figure 4 for Figure 1 Schematic diagram of the structure of the main body in the fixture shown.

[0025] Description of labels:

[0026] 100, clamp; 110, rotating structure; 111, first circular ring; 112, second circular ring; 113, guide groove; 120, main body; 121, clamping groove; 122, guide groove; 1221, annular groove; 1222, vertical groove; 123, piece removal groove; 131, first docking piece; 132, second docking piece; 1321, docking groove. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] An embodiment of the present application provides a polishing device, including a driving mechanism and a clamp, wherein the clamp is used to fix a workpiece to be processed, and the driving mechanism can drive the clamp to rotate around an axis.

[0030] Furthermore, the polishing device also includes a polishing pad, and the clamp is arranged on the polishing pad and can press the workpiece to be processed against the polishing pad. The rotation of the clamp drives the workpiece to be processed to rotate on the polishing pad, thereby achieving polishing of the workpiece to be processed.

[0031] It should be noted that in this embodiment, the workpiece to be processed is a mercury cadmium telluride chip. Of course, in other embodiments, the workpiece to be processed may also be a chip, or may also be other products, which are not limited here. For ease of understanding, the following description takes a chip as an example.

[0032] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a clamp 100 including a rotating structure 110 and a body 120 .

[0033] The rotating structure 110 can rotate around the axis under the action of the driving mechanism. The body 120 is used to set the chip and is connected to the rotating structure 110 to rotate around the axis with the rotating structure 110. The body 120 can move relative to the rotating structure 110 in a direction parallel to the axis to press the chip onto the polishing pad.

[0034] When polishing a chip, the chip is placed on the body 120, and then the fixture is placed on the polishing pad. The body 120 is located above the chip to press the chip against the polishing pad, and then the rotating structure 110 and the body 120 are driven by the driving mechanism to rotate around the vertical axis to polish the chip. Since the body 120 can move in the vertical direction relative to the rotating structure 110, the body 120 can provide pressure for chip polishing by its own gravity, thereby ensuring the stability of the polishing pressure and further ensuring that the polishing rate remains stable.

[0035] It should be noted that, in this embodiment, the body 120 is made of polytetrafluoroethylene and weighs 100 g. When the polishing pressure needs to be increased, a counterweight block can be placed above the body 120 to ensure the stability of the polishing pressure and the polishing rate while meeting the polishing pressure requirements. In other embodiments, the body 120 can also be made of other materials or by changing the size specifications to change its weight, so as to meet the polishing pressure requirements.

[0036] Next, combine Figure 1 and Figure 3 The rotating structure 110 is described as follows:

[0037] In one embodiment, the rotating structure 110 is annular, and a friction layer is formed on the outer diameter surface of the rotating structure 110. The friction layer is used to contact the driving mechanism to ensure the friction between the rotating structure 110 and the driving mechanism, avoid slipping, ensure the stability of the rotation speed of the fixture, and thus ensure the polishing rate.

[0038] It should be noted that the driving mechanism contacts the friction layer through the roller, and the friction layer can be formed by grinding the outer diameter surface of the rotating structure 110 to increase the roughness, or by laying a friction layer to increase the friction force on the outer diameter surface of the rotating structure 110. At the same time, when the driving mechanism is connected to the rotating structure 110 through a gear, a rack meshing with the gear can be arranged circumferentially on the outer diameter surface of the rotating structure 110, or meshing teeth arranged in sequence along the circumference can be directly provided.

[0039] Preferably, the rotating structure 110 has a double-layer structure, specifically including a first ring 111 and a second ring 112 that are integrally and stacked, the first ring 111 and the second ring 112 are coaxially arranged, and the inner diameters of the first ring 111 and the second ring 112 are the same, that is, the inner diameter surfaces of the first ring 111 and the second ring 112 together constitute the inner diameter surface of the rotating structure 110. The outer diameter of the first ring 111 is greater than the outer diameter of the second ring 112, and the outer diameter surface of one or both of the first ring 111 and the second ring 112 is used to contact the driving mechanism.

[0040] In actual use, the first ring 111 is located above the second ring 112 to avoid a large contact area between the rotating structure 110 and the polishing pad, reduce the friction between the rotating structure 110 and the polishing pad, further avoid slipping between the rotating structure 110 and the driving mechanism, and ensure the stability of the rotation speed.

[0041] In one embodiment, the body 120 is connected to the inner diameter surface of the rotating structure 110 so as to rotate around the axis with the rotating structure 110. Specifically, since the rotating structure 110 is annular, the body 120 is circular and is coaxially arranged with the rotating structure 110. The chip is located in the middle of the body 120 so that the chip rotates around the axis. In this way, when the chip contacts the polishing pad and rotates, the fixture is prevented from shaking.

[0042] In addition, in this embodiment, the rotating structure 110 is made of stainless steel and weighs more than 2 kg, so that the rotation of the fixture is more stable and the reliability of the polishing equipment is improved. Of course, the rotating structure 110 can also be made of other materials with higher density, which is not limited here.

[0043] It should be noted that the dimensions of the main body 120 and the rotating structure 110 can be determined according to actual conditions. For example, in this embodiment, the inner diameter of the rotating structure 110 is slightly larger than 87 mm.

[0044] In one embodiment, a guide groove 113 is provided on one side surface of the rotating structure 110 along its axial direction, for guiding the polishing liquid to flow toward the body 120, thereby ensuring that the polishing liquid is in full contact with the chip and ensuring the polishing effect.

[0045] Specifically, the guide groove 113 is provided on the side of the first ring 111 away from the second ring 112, that is, the top of the rotating structure 110, for guiding the polishing liquid to flow toward the inner diameter of the rotating structure 110. Of course, the guide groove 113 can also be simultaneously or separately provided on the side of the second ring 112 away from the first ring 111 to guide the polishing liquid to flow toward the body 120.

[0046] In other embodiments, the rotating structure 110 may also be in other forms, such as a disc, and the body 120 is connected to the bottom surface of the rotating structure 110 and is coaxially arranged with the rotating structure 110, which is not limited here.

[0047] See also Figure 2 In another embodiment, in actual application, the second ring 112 is located above the first ring 111. At this time, the contact area between the first ring 111 and the polishing pad is larger. Under the premise of ensuring the friction between the outer diameter surface and the driving mechanism, the first ring 111 is located at the bottom to improve the stability of the fixture 100, thereby ensuring the stability of the polishing process.

[0048] Next, combine Figure 1 and Figure 4 The main body 120 is described as follows:

[0049] In one embodiment, the body 120 is provided with a slot 121 for accommodating a chip, and the shape and size of the slot 121 match the chip so that the chip can be stably placed in the slot 121 to prevent the chip from shifting during the polishing process. For example, in one embodiment, the slot 121 is rectangular in shape.

[0050] It can be understood from the above embodiments that the card slot 121 is located in the middle of the body 120 , so that the chip placed in the card slot 121 is also located in the middle of the body 120 .

[0051] Furthermore, the depth of the slot 121 is less than the thickness of the chip, so that the surface to be polished can protrude after the chip is placed in the slot 121, ensuring that the polishing pad contacts the chip. Specifically in this embodiment, the depth of the slot 121 is 200 μm less than the thickness of the chip.

[0052] Meanwhile, it should be noted that, in this embodiment, the depth deviation of the card slot 121 does not exceed ±0.15 μm.

[0053] In one embodiment, the main body 120 is further provided with a drainage groove 122, which is arranged around the card slot 121, and the drainage groove 122 has a drainage section extending toward the card slot 121 to guide the polishing liquid into the card slot 121, ensuring that the polishing liquid is in full contact with the chip, thereby ensuring the polishing effect.

[0054] Further, the drainage groove 122 includes an annular groove 1221 and a vertical groove 1222, the annular groove 1221 is arranged around the clamping groove 121, the vertical groove 1222 passes through and connects the annular groove 1221, and one end of the vertical groove 1222 extends toward the clamping groove 121 to form the above-mentioned drainage section. It can be understood that the polishing liquid can flow along the annular groove 1221 and the vertical groove 1222, and flow to the clamping groove 121 under the guidance of the vertical groove 1222.

[0055] It should be noted that, through actual testing, one end of the vertical groove 1222 can provide drainage by extending toward the slot 121 , and this end can be connected to the slot 121 or separated from the slot 121 .

[0056] Specific to Figure 4 In the illustrated embodiment, the annular groove 1221 and the vertical groove 1222 each include a plurality of annular grooves 1221 that are coaxially arranged and spaced apart from each other, the plurality of vertical grooves 1222 each extend radially along the main body 120 , and each vertical groove 1222 passes through and connects the plurality of annular grooves 1221 .

[0057] In one embodiment, the body 120 is further provided with a take-out slot 123, which is connected to the card slot 121 to facilitate the removal of the chip in the card slot 121. Figure 4 As shown, the size of the position where the taking slot 123 communicates with the card slot 121 is smaller than the size of the chip to prevent the chip from shaking.

[0058] Furthermore, the number of the extraction slots 123 includes a plurality, and each extraction slot 123 corresponds to a corner of the card slot 121. In this way, when the chip is polygonal, the corner of the chip is prevented from being worn between the card slot 121 during the polishing process, thereby ensuring the integrity of the chip.

[0059] Specific to Figure 4 In the illustrated embodiment, there are four pickup slots 123 , and the four pickup slots 123 correspond to the four corners of the card slot 121 .

[0060] Next, combine Figures 1 to 4 The connection method between the rotating structure 110 and the main body 120 is described as follows:

[0061] In one embodiment, a first docking member 131 is provided on one of the rotating structure 110 and the body 120, and a second docking member 132 is provided on the other. The first docking member 131 and the second docking member 132 are configured to dock and separate with each other in a controllable manner, and when the first docking member 131 and the second docking member 132 are docked, the first docking member 131 cannot rotate relative to the second docking member 132, and the first docking member 131 can move relative to the second docking member 132 in a direction parallel to the axis. In this way, after the first docking member 131 and the second docking member 132 are docked, the body 120 cannot rotate relative to the rotating structure 110, that is, the body 120 can rotate with the rotating structure 110, and at the same time, the body 120 can move relative to the rotating structure 110 in a direction parallel to the axis.

[0062] Furthermore, the second docking member 132 is provided with a docking groove 1321 matching the first docking member 131, the docking groove 1321 extends in a direction parallel to the axis, and at least one end passes through the second docking member 132, and the first docking member 131 can be inserted into the docking groove 1321 and move in a direction parallel to the axis.

[0063] Specific to Figure 1 In the illustrated embodiment, the first docking member 131 is disposed on the circumferential surface of the body 120, and the second docking member 132 is disposed on the inner diameter surface of the rotating structure 110. Of course, in other embodiments, the positions of the first docking member 131 and the second docking member 132 may also be interchanged.

[0064] It should be noted that Figure 1 For example, the first docking member 131 can be integrally formed with the body 120 , and the docking groove 1321 can also be directly opened in the rotating structure 110 , which is not limited here.

[0065] In one embodiment, there are multiple first docking members 131 and multiple second docking members 132, and the multiple first docking members 131 correspond to the multiple second docking members 132 one by one to further stabilize the connection between the main body 120 and the rotating structure 110 to prevent the main body 120 from shaking and affecting the polishing effect.

[0066] In order to facilitate understanding of the technical solution of this application, Figure 1 and Figure 2 The working process of the polishing equipment in the above embodiment is described as follows:

[0067] First, dip the chip in water and put it into the card slot 121. The chip is absorbed in the card slot 121 by water. Next, the first docking member 131 and the second docking member 132 are docked to connect the body 120 with the rotating structure 110. Then, the fixture is placed on the polishing pad. The body 120 presses the chip against the polishing pad. The driving mechanism contacts the outer diameter surface of the rotating structure 110, thereby driving the fixture to rotate and polish the chip. After polishing, the chip can be removed from the card slot 121 through the removal slot 123.

[0068] It should be explained that in this embodiment, the chip is adsorbed in the card slot 121 by water, and in other embodiments, it can also be adsorbed and fixed by polishing liquid. Compared with the existing fixation by wax, the use of water or polishing liquid can avoid uneven force on the chip during polishing due to uneven wax coating, ensure the polishing effect, and at the same time will not pollute the chip surface.

[0069] In addition, after polishing the chip using the polishing equipment in the above embodiment, experiments show that the surface roughness Ra of the chip is less than 1 nm, the surface warpage Rt is less than 2 μm, and the change in polishing rate can be controlled within ±0.01 μm / min.

[0070] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A fixture, arranged on a polishing pad, characterized in that: The fixture comprises: The rotating structure can rotate around the axis under the action of the driving mechanism; The body is used to set the workpiece to be processed, the body is connected to the rotating structure to rotate around the axis with the rotating structure, and the body can move relative to the rotating structure in a direction parallel to the axis to press the workpiece to be processed onto the polishing pad.

2. The clamp according to claim 1, characterized in that: The main body is provided with a slot for accommodating the workpiece to be processed.

3. The clamp according to claim 2, characterized in that: The main body is further provided with a drainage groove, which is arranged around the clamping slot and has a drainage section extending toward the clamping slot.

4. The clamp according to claim 3, characterized in that: The drainage groove comprises an annular groove and a vertical groove, the annular groove is arranged around the clamping groove, the vertical groove passes through and communicates with the annular groove, and one end of the vertical groove extends toward the clamping groove to form the drainage section.

5. The clamp according to claim 2, characterized in that: The main body is also provided with a piece taking slot which is communicated with the card slot.

6. The clamp according to any one of claims 1 to 5, characterized in that: A first docking member is provided on one of the rotating structure and the main body, and a second docking member is provided on the other. The first docking member and the second docking member are constructed to be controllably docked and separated from each other, and when the first docking member and the second docking member are docked, the first docking member cannot rotate relative to the second docking member, and the first docking member can move relative to the second docking member in a direction parallel to the axis.

7. The clamp according to claim 6, characterized in that The number of the first butt joint parts and the number of the second butt joint parts are both plural, and the plural first butt joint parts and the plural second butt joint parts are arranged in one-to-one correspondence.

8. The clamp according to claim 6, characterized in that: The second docking member is provided with a docking groove matching the first docking member, the docking groove extends in a direction parallel to the axis, and at least one end passes through the second docking member, and the first docking member can be inserted into the docking groove and move in a direction parallel to the axis.

9. The clamp according to any one of claims 1 to 5, characterized in that: The rotating structure is annular, the body is connected to the inner diameter surface of the rotating structure, and a friction layer is formed on the outer diameter surface of the rotating structure, and the friction layer is used to contact the driving mechanism.

10. A polishing device, characterized in that: It comprises a driving mechanism and the clamp described in any one of claims 1 to 9.

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