Annealing equipment

Abstract

The utility model discloses annealing equipment which comprises a furnace body with a heating cavity, an air inlet plate and an air outlet plate with an air outlet cavity, wherein the air inlet plate and the air outlet plate are respectively arranged on two sides of the furnace body; the gas inlet plate is provided with a plurality of gas inlets conveying gas to the heating cavity, the side, close to the furnace body, of the gas outlet plate is provided with a strip-shaped circulation opening which is communicated with the heating cavity and the gas outlet cavity and is in a gradually-expanding shape, a gas outlet pipeline independent of the gas outlet cavity is formed in the gas outlet plate, and a plurality of gas outlets are formed between the gas outlet cavity and the gas outlet pipeline. An extraction opening communicated with the air outlet pipeline is formed in the side part of the air outlet pipeline; wherein the corresponding diameter of the air outlet close to the extraction opening is smaller than the corresponding diameter of the air outlet far away from the extraction opening. According to the utility model, the uniformity of a gas flow field and a temperature field of the heating cavity in the annealing equipment is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of heat treatment, in particular to an annealing device. Background Art

[0002] In the manufacture of semiconductor devices, the wafer needs to be heat treated to eliminate defects inside the wafer and optimize the grain boundary structure and crystal quality. Annealing is a common wafer heat treatment method. Annealing furnace is a common equipment used for annealing wafers. By heating the wafer and keeping it warm under certain conditions, the lattice structure can be changed, impurities and stress can be eliminated, and the electrical properties and structural integrity of the wafer can be improved.

[0003] The basic structure of a wafer annealing furnace usually consists of a heating chamber, a control system, a feeding device and a discharging device. The heating chamber is used to uniformly heat and keep the wafer warm, and the heating temperature, time, atmosphere and other parameters are controlled by the control system to achieve the desired annealing effect. The air pressure during the wafer annealing process needs to be controlled within a certain range to ensure that the wafer is heated evenly and to avoid problems such as oxidation and contamination. Different wafer materials have different requirements for air pressure. For example, for silicon wafers, annealing is generally required in a vacuum or nitrogen atmosphere, while for silicon nitride wafers, annealing is required in a nitrogen atmosphere. However, there is a problem of uneven front-end temperature and rear-end temperature in the heating chamber of the current wafer annealing furnace. A major reason for this problem is that the gas (for example, the aforementioned nitrogen) entering the heating chamber at the rear end of the chamber cannot be discharged from the front end in time, and is easily accumulated in the chamber and the hatch. The role of the gas is to take away heat when passing through the wafer and the carrier, to take away impurities in the chamber when the gas enters the chamber, and to ensure that the chamber is at a certain positive pressure to prevent external impurities from entering the chamber. In the existing wafer annealing furnace, when the gas is discharged, there is a problem of uneven exhaust due to the inconsistent distance between the gas outlet and the exhaust port, which leads to an unsmooth flow field at the front end and the door of the heating chamber, and an uneven temperature field in the rest of the chamber.

[0004] In view of this, it is necessary to improve the wafer annealing furnace in the prior art to solve the above problems. Utility Model Content

[0005] The utility model aims to disclose the problem that the existing wafer annealing furnace has uneven gas extraction during gas exhaust, which causes unsmooth flow fields at the front end and the door of the heating chamber and uneven temperature fields in the rest of the chamber.

[0006] To achieve the above object, the utility model discloses an annealing device, comprising:

[0007] A furnace body with a heating cavity, and an air inlet plate and an air outlet plate with an air outlet cavity respectively arranged on both sides of the furnace body;

[0008] The air inlet plate is provided with a plurality of air inlets for conveying gas to the heating cavity, the air outlet plate is provided with a strip-shaped flow opening connecting the heating cavity and the air outlet cavity and in a gradually expanding shape on one side close to the furnace body, an air outlet pipe independent of the air outlet cavity is formed inside the air outlet plate, a plurality of air outlets are formed between the air outlet cavity and the air outlet pipe, and an air extraction port connected to the air outlet pipe is provided on the side of the air outlet pipe;

[0009] Wherein, the diameter corresponding to the air outlet close to the air suction port is smaller than the diameter corresponding to the air outlet far from the air suction port.

[0010] As a further improvement of the utility model, an air intake pipe is formed inside the air intake plate, the air inlet is formed on the side of the air intake pipe to connect the air intake pipe with the heating cavity, and an air delivery port connected to the air intake pipe is opened on the side of the air intake plate.

[0011] As a further improvement of the present invention, the plurality of air inlets are configured into two groups, the air inlet pipes are configured into two and are independent of each other, and the two groups of air inlets are respectively formed on the sides of the two air inlet pipes to respectively connect the two air inlet pipes with the heating cavity.

[0012] As a further improvement of the present invention, the air outlet is configured into two groups, the air outlet pipes are configured into two and are independent of each other, and the two groups of air outlets are respectively formed between the two air outlet pipes and the air outlet cavity to respectively connect the two air outlet pipes and the air outlet cavity.

[0013] As a further improvement of the present invention, the air outlet plate includes: a first plate body and a second plate body that are embedded in each other, the side of the second plate body close to the first plate body is recessed inward and is enclosed with the side of the first plate body close to the second plate body to form the air outlet cavity, and the strip flow port is opened in the first plate body.

[0014] As a further improvement of the present invention, the air outlet pipe is opened on the second plate body and is located at the bottom of the air outlet cavity, and the air suction port is opened at the bottom of the air outlet pipe.

[0015] As a further improvement of the present invention, the annealing equipment further includes: a first cabin plate disposed between the furnace body and the air inlet plate, wherein a first flow pipe for guiding gas from the air inlet to the heating chamber is formed inside the first cabin plate.

[0016] As a further improvement of the utility model, a first stopper and a second stopper are respectively arranged at the inner longitudinal ends of the furnace body close to the air inlet plate, and the first stopper and the second stopper enclose a second flow pipe for transporting gas from the first flow pipe to the heating cavity, and the longitudinal width of the first flow pipe is less than or equal to the longitudinal width of the second flow pipe.

[0017] As a further improvement of the present invention, the annealing equipment also includes: a second cabin plate arranged between the furnace body and the gas outlet plate, and a third flow pipe is formed inside the second cabin plate to guide the gas in the heating cavity to be transported to the gas outlet cavity.

[0018] As a further improvement of the utility model, a third block and a fourth block are respectively arranged at the inner longitudinal ends of the furnace body close to the gas outlet plate, and the third block and the fourth block enclose a fourth flow pipe for transporting gas from the heating cavity to the third flow pipe, and the longitudinal width of the third flow pipe is less than or equal to that of the fourth flow pipe.

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] Gas (for example, nitrogen) is delivered to the heating chamber through multiple air inlets provided by the air inlet plate, and the gas passes through the side of the wafer placed in the heating chamber, and is delivered to the outlet chamber through the strip flow port provided by the air outlet plate, and is delivered to the outlet pipe through multiple air outlets, and finally the gas is extracted through the air extraction port provided on the side of the outlet pipe, thereby realizing the entire circulation of the gas inside the annealing equipment. At the same time, when the gas is delivered to the outlet pipe through multiple air outlets, the diameter corresponding to the air outlet close to the air extraction port is smaller than the diameter corresponding to the air outlet far from the air extraction port, thereby providing uniformity of exhausting the gas in the heating chamber, making the gas flow field more uniform, so as to reduce the temperature difference in the heating chamber, thereby solving the problem of uneven flow field at the front end and the door of the heating chamber and uneven temperature field in the rest of the chamber caused by uneven exhaust of the gas during the exhaust of the existing wafer annealing furnace. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional diagram of an annealing device shown in the present invention at a viewing angle;

[0022] Figure 2 It is a cross-sectional view of the furnace body, the air inlet plate, the air outlet plate, the first cabin plate and the second cabin plate;

[0023] Figure 3 A three-dimensional diagram of an air intake plate at a certain viewing angle;

[0024] Figure 4 is a cross-sectional view of the air intake plate;

[0025] Figure 5 A three-dimensional image of the first plate at a viewing angle;

[0026] Figure 6 is a cross-sectional view of the first plate;

[0027] Figure 7 is a three-dimensional image of the second plate at a viewing angle;

[0028] Figure 8 is a cross-sectional view of the second plate. DETAILED DESCRIPTION

[0029] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these embodiments are all within the scope of protection of the present invention.

[0030] It should be understood that, in the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present technical solution and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present technical solution.

[0031] Ginseng Figures 1 to 8 As shown, the utility model shows a specific implementation of an annealing device 100, the application scenario of the annealing device 100 is to anneal wafers in semiconductor device manufacturing, that is, the wafer is placed in the annealing device 100, and the heating element (for example, the quartz tube and lamp tube group described below) arranged in the annealing device 100 heats the wafer to a certain temperature and keeps it warm, so as to change the lattice structure, eliminate impurities and stress, and improve the electrical properties and structural integrity of the wafer.

[0032] Ginseng Figure 1 , Figure 2 , Figure 3 and Figure 8As shown, the annealing equipment 100 includes: a furnace body 10 with a heating cavity 11, and an air inlet plate 20 and an air outlet plate 30 with an air outlet cavity 31 respectively arranged on both sides of the furnace body 10. The air inlet plate 20 is provided with a plurality of air inlets 21 for conveying gas to the heating cavity 11, and the air outlet plate 30 is provided with a strip-shaped flow opening 33 which is connected with the heating cavity 11 and the air outlet cavity 31 and is gradually expanded on one side close to the furnace body 10, and an air outlet pipe 32 which is independent of the air outlet cavity 31 is formed inside the air outlet plate 30, and a plurality of air outlets 34 are formed between the air outlet cavity 31 and the air outlet pipe 32, and an air extraction port 35 which is connected with the air outlet pipe 32 is provided on the side of the air outlet pipe 32; wherein, the diameter corresponding to the air outlet 34 close to the air extraction port 35 is smaller than the diameter corresponding to the air outlet 34 far from the air extraction port 34. Gas (for example, nitrogen) is delivered to the heating chamber 11 through the multiple air inlets 12 opened by the air inlet plate 20. The gas passes through the side of the wafer placed in the heating chamber 11, and is delivered to the air outlet chamber 31 through the strip flow port 33 provided on the air outlet plate 30, and is delivered to the air outlet pipe 32 through the multiple air outlets 34. Finally, the gas is extracted through the exhaust port 35 provided on the side of the air outlet pipe 32, thereby realizing the entire circulation of the gas inside the annealing equipment 100. At the same time, when the gas is transported to the gas outlet pipe 32 through multiple gas outlets 34, the diameter corresponding to the gas outlet 34 close to the exhaust port 35 is smaller than the diameter corresponding to the gas outlet 34 far from the exhaust port 35, thereby providing uniformity in exhausting the gas in the heating chamber 11, making the gas flow field more uniform, so as to reduce the temperature difference in the heating chamber 11, thereby solving the problem of uneven flow field at the front end and door of the heating chamber and uneven temperature field in the rest of the chamber caused by uneven exhaust of gas in the existing wafer annealing furnace.

[0033] In the present application, taking the equipment operating temperature of 950°C as an example, during the wafer annealing temperature holding stage, the temperatures before and after the heating chamber in the existing wafer annealing furnace are approximately 931°C and 926°C, with a temperature difference of approximately 5°C, while the temperatures before and after the heating chamber in the annealing equipment 100 disclosed itself are approximately 929°C and 926°C, with a temperature difference of approximately 3°C. It can be seen that the annealing equipment 100 disclosed in the present application can improve the temperature uniformity in the heating chamber.

[0034] Ginseng Figure 3As shown, an air intake pipe 22 is formed inside the air intake plate 20, an air intake port 21 is formed on the side of the air intake pipe 22 to connect the air intake pipe 22 with the heating chamber 11, and a gas delivery port 23 connected to the air intake pipe 22 is provided on the side of the air intake plate 20. Gas is delivered into the air intake pipe 22 through the gas delivery port 23, and the air intake pipe 22 and the heating chamber 11 are connected through the air intake port 21, thereby delivering the gas in the air intake pipe 22 to the heating chamber 11 through the air intake port 21. The air intake port 21 is formed on the inner side wall of the air intake plate 20, and a plurality of air intake ports 21 can be arranged transversely along the length direction of the air intake plate 20 to uniformly deliver gas into the heating chamber 11 at the same time.

[0035] In one embodiment, the plurality of air inlets 21 are configured into two groups, the air inlet pipes 22 are configured into two and are independent of each other, and the two groups of air inlets 21 are respectively formed on the sides of the two air inlet pipes 22 to respectively connect the two air inlet pipes 22 and the heating chamber 11. Figure 4 Taking the air inlet plate 20 shown in the figure as an example, a first air inlet group 21a consisting of a plurality of air inlets 21, and a second air inlet group 21b consisting of a plurality of air inlets 21, the air inlet pipe 22 is configured as a first air inlet pipe 22a and a second air inlet pipe 22b, the first air inlet group 21a is formed on the side of the first air inlet pipe 22a to connect the first air inlet pipe 22a with the heating chamber 11, and the second air inlet group 21b is formed on the side of the second air inlet pipe 22b to connect the second air inlet pipe 22b with the heating chamber 11. More specifically, the first air inlet pipe 22a and the second air inlet pipe 22b are arranged transversely along the length direction of the air inlet plate 20, and two air delivery ports 23a are opened on the side of the first air inlet pipe 22a, and are respectively formed at the top and side of the first air inlet pipe 22a, and two air delivery ports 23b are opened on the side of the second air inlet pipe 22b, and are respectively formed at the top and side of the second air inlet pipe 22b, thereby gas is respectively delivered to the first air inlet pipe 22a and the second air inlet pipe 22b through multiple gas delivery ports (i.e., gas delivery ports 23a and gas delivery ports 23b), and gas is respectively delivered to the heating chamber 11 through the transversely arranged first air inlet group 21a and the second air inlet group 21b, so as to ensure the uniformity of gas delivery.

[0036] Similarly, the air outlet 34 is similar to the air inlet 21, and the air outlet 34 is configured into two groups. The air outlet pipe 32 is similar to the air inlet pipe 22, and the air outlet pipe 32 is configured into two and independent of each other. The two groups of air outlets 34 are respectively formed between the two air outlet pipes 32 and the air outlet cavity 31 to respectively connect the two air outlet pipes 32 and the air outlet cavity 31. Figure 8Taking the second plate 37 shown in the figure as an example, a first air outlet group 34a is composed of multiple air outlets 34, and a second air outlet group 34b is composed of multiple air outlets 34. The air outlet pipe 32 is configured as a first air outlet pipe 32a and a second air outlet pipe 32b. The first air outlet group 34a is formed between the first air outlet pipe 32a and the air outlet cavity 31 to connect the air outlet cavity 31 with the first air outlet pipe 32a. The second air outlet group 34b is formed between the second air outlet pipe 32b and the air outlet cavity 31 to connect the air outlet cavity 31 with the second air outlet pipe 32b. More specifically, the first air outlet pipe 32a and the second air outlet pipe 32b are arranged horizontally along the length direction of the second plate body 37, and two air extraction ports 35a are opened on the side of the first air outlet pipe 32a, and are respectively formed at the bottom and side of the first air outlet pipe 32a, and two air extraction ports 35b are opened on the side of the second air outlet pipe 32b, and are respectively formed at the bottom and side of the second air outlet pipe 32b, thereby simultaneously delivering gas to the first air outlet pipe 32a and the second air outlet pipe 32b through the first air outlet group 34a and the second air outlet group 34b, and simultaneously extracting gas inside the first air outlet pipe 32a and gas inside the second air outlet pipe 32b through the air extraction ports 35a and the air extraction ports 35b.

[0037] It should be noted that in the present application, the diameter corresponding to the air outlet 34 close to the air exhaust port 35a among the multiple air outlets 34 constituting the first air outlet group 34a is smaller than the diameter corresponding to the air outlet 34 far from the air exhaust port 35a; similarly, the diameter corresponding to the air outlet 34 close to the air exhaust port 35b among the multiple air outlets 34 constituting the second air outlet group 34b is smaller than the diameter corresponding to the air outlet 34 far from the air exhaust port 35b. Therefore, when the gas inside the first air outlet pipe 32a and the gas inside the second air outlet pipe 32b are respectively exhausted through the air exhaust port 35a and the air exhaust port 35b, the uniformity of gas exhaust is ensured, and the gas flow field is made more uniform, so as to reduce the temperature difference in the heating chamber 11, thereby solving the problem of uneven flow field at the front end and door of the heating chamber and uneven temperature field in the rest of the chamber caused by uneven exhaust of gas in the existing wafer annealing furnace.

[0038] Ginseng Figure 5 and Figure 7As shown, the gas outlet plate 30 includes: a first plate body 36 and a second plate body 37 which are arranged in a chimeric arrangement, a side of the second plate body 37 close to the first plate body 36 is recessed inwards and encloses a side of the first plate body 36 close to the second plate body 37 to form a gas outlet cavity 31, and a strip flow opening 33 is opened in the first plate body 36. The first plate body 36 is arranged on a side of the gas outlet plate 30 close to the furnace body 10, and the second plate body 37 is arranged on a side of the gas outlet plate 30 away from the furnace body 10. Both ends of the first plate body 36 protrude outwards so that the second plate body 36 can be inserted into the first plate body 36, and a side of the second plate body 37 close to the first plate body 36 is recessed inwards, thereby the gas outlet cavity 37 is enclosed by the inwardly recessed portion of the second plate body 37 and the side wall of the first plate body 36. The strip flow opening 33 provided on the first plate 36 is arranged transversely along the length direction of the first plate 36, and the strip flow opening 33 is gradually expanded from the furnace body 10 to the second plate 37, thereby ensuring that the gas in the heating cavity 11 is quickly transported to the gas outlet cavity 31. The gas outlet pipe 32 is provided on the second plate 37 and is located at the bottom of the gas outlet cavity 31, and the gas extraction port 35 is provided at the bottom of the gas outlet pipe 32. When the gas is transported to the inside of the gas outlet cavity 31, it is transported to the inside of the gas outlet pipe 32 from the gas outlet port 34 provided between the gas outlet pipe 32 and the gas outlet cavity 31, and the gas in the gas outlet pipe 32 is extracted through the gas extraction port 35, thereby achieving gas discharge.

[0039] Ginseng Figure 1 and Figure 2 As shown, the annealing equipment 100 further includes: a first cabin plate 40 disposed between the furnace body 10 and the air inlet plate 20, and a first flow pipe 41 for guiding the gas to be transported from the air inlet 21 to the heating chamber 11 is formed inside the first cabin plate 40. At the same time, a first stopper 12 and a second stopper 13 are respectively disposed at both ends of the furnace body 10 near the air inlet plate 20 in the longitudinal direction, and the first stopper 12 and the second stopper 13 enclose a second flow pipe 14 for transporting gas from the first flow pipe 41 to the heating chamber 11, and the longitudinal width r1 of the first flow pipe 41 is less than or equal to the longitudinal width r2 of the second flow pipe 14. The gas is transported from the air inlet 21 to the first flow pipe 41, and then from the first flow pipe 41 to the second flow pipe 14, and then from the second flow pipe 14 to the heating chamber 11, and the longitudinal width r1 of the first flow pipe 41 is less than or equal to the longitudinal width r2 of the second flow pipe 14, and preferably, the longitudinal width r1 of the first flow pipe 41 is equal to the longitudinal width r2 of the second flow pipe 14 (see Figure 2 As shown, that is, r1=r2), so as to ensure that the gas will not accumulate in the first flow pipe 41, thereby further ensuring the uniformity of the gas in the heating chamber 11.

[0040] Similarly, the annealing device 100 further includes: a second cabin plate 50 disposed between the furnace body 10 and the gas outlet plate 30, and a third flow pipe 51 is formed inside the second cabin plate 50 for guiding the gas in the heating cavity 11 to be transported to the gas outlet cavity 31. At the same time, a third stopper 15 and a fourth stopper 16 are respectively disposed at both ends of the furnace body 10 near the gas outlet plate 30 in the longitudinal direction, and a fourth flow pipe 17 for transporting gas from the heating cavity 11 to the third flow pipe 51 is formed by the third stopper 15 and the fourth stopper 16, and a longitudinal width r3 of the third flow pipe 51 is less than or equal to a longitudinal width r4 of the fourth flow pipe 17. The gas is transported from the heating chamber 11 to the fourth circulation pipe 17, and then from the fourth circulation pipe 17 to the third circulation pipe 51, and then transported from the strip circulation port 33 to the gas outlet chamber 31, and the longitudinal width r3 of the third circulation pipe 51 is less than or equal to the longitudinal width r4 of the fourth circulation pipe 17, and preferably, the longitudinal width r3 of the third circulation pipe 51 is less than the longitudinal width r4 of the fourth circulation pipe 17 (see Figure 2 As shown, that is, r3<r4), thereby better guiding the gas to flow from the fourth flow channel 17 to the third flow channel 51.

[0041] Ginseng Figure 3 As shown, in the present application, the gas is transported from the gas delivery port 23 to the gas inlet pipe 22, and then transported from the gas inlet 21 opened on the side of the gas inlet pipe 22 to the first circulation pipe 41, and then transported from the first circulation pipe 41 to the second circulation pipe 14, and then transported from the second circulation pipe 14 to the heating chamber 11, and then transported from both sides of the wafer to the fourth circulation pipe 17 in the heating chamber 11, and then transported from the fourth circulation pipe 17 to the third circulation pipe 51, and then transported from the strip circulation port 33 to the gas outlet chamber 31, and then transported from the gas outlet 34 opened in the gas outlet chamber 31 to the gas outlet pipe 32, and then extracted from the gas extraction port 35 at the bottom of the gas outlet pipe 32. The entire gas circulation process ensures that the flow field at the front end (i.e., the end close to the gas inlet plate 20) and the rear end (i.e., the end close to the gas outlet plate 30) of the heating chamber 10 is smooth, and the temperature field in the heating chamber 11 is uniform.

[0042] Ginseng Figure 1As shown, the annealing equipment 100 also includes: a connecting member 61 disposed on the side of the gas outlet plate 30 and movably assembled with the gas outlet plate 30, and a push-pull cylinder 62 and a lifting cylinder 63 connected to the bottom of the connecting member 61. The connecting member 61 is driven to move horizontally by the push-pull cylinder 62 to drive the gas outlet plate 30 to move horizontally; the connecting member 61 is driven to move longitudinally by the lifting cylinder 63 to drive the gas outlet plate 301 to move longitudinally. A carrier 18 is arranged inside the furnace body 10 to carry the wafer, and a heating element 191 (for example, a quartz tube and a lamp tube group) is arranged on the top of the furnace body 10, and the heating element 191 is isolated from the heating chamber 11 by an isolating member 192 (for example, a quartz plate), and the heat emitted by the heating element 191 is transmitted to the inside of the heating chamber 11 through the isolating member 192 to heat the wafer carried on the carrier 18. A cooling water channel 193 is arranged at the bottom of the furnace body 10 to cool the wafer carried on the carrier 18. When it is necessary to place or remove wafers into or out of the heating chamber 11, the push-pull cylinder 62 drives the connecting piece 61 to move laterally away from the furnace body 10, thereby driving the gas outlet plate 30 to move laterally away from the furnace body 10, and the lifting cylinder 63 drives the connecting piece 61 to move longitudinally away from the furnace body 10, thereby driving the gas outlet plate 30 to move laterally away from the furnace body 10, thereby exposing the third circulation duct 51, and wafers can be placed or removed from the third circulation duct 51.

[0043] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

[0044] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An annealing device, characterized in that: include: A furnace body with a heating cavity, and an air inlet plate and an air outlet plate with an air outlet cavity respectively arranged on both sides of the furnace body; The air inlet plate is provided with a plurality of air inlets for conveying gas to the heating cavity, the air outlet plate is provided with a strip-shaped flow opening connecting the heating cavity and the air outlet cavity and in a gradually expanding shape on one side close to the furnace body, an air outlet pipe independent of the air outlet cavity is formed inside the air outlet plate, a plurality of air outlets are formed between the air outlet cavity and the air outlet pipe, and an air extraction port connected to the air outlet pipe is provided on the side of the air outlet pipe; Wherein, the diameter corresponding to the air outlet close to the air suction port is smaller than the diameter corresponding to the air outlet far from the air suction port.

2. The annealing equipment according to claim 1, characterized in that: An air intake pipe is formed inside the air intake plate, the air intake port is formed on the side of the air intake pipe to connect the air intake pipe with the heating cavity, and an air delivery port connected to the air intake pipe is opened on the side of the air intake plate.

3. The annealing equipment according to claim 2, characterized in that: The plurality of air inlets are configured into two groups, the air inlet pipes are configured into two and are independent of each other, and the two groups of air inlets are respectively formed on the sides of the two air inlet pipes to respectively connect the two air inlet pipes with the heating chamber.

4. The annealing equipment according to claim 1, characterized in that: The air outlets are configured into two groups, the air outlet pipes are configured into two and are independent of each other, and the two groups of air outlets are respectively formed between the two air outlet pipes and the air outlet cavity to respectively connect the two air outlet pipes and the air outlet cavity.

5. The annealing equipment according to claim 1, characterized in that: The air outlet plate includes: a first plate body and a second plate body which are embedded in each other, wherein a side of the second plate body close to the first plate body is recessed inwards and encloses a side of the first plate body close to the second plate body to form the air outlet cavity, and the strip flow opening is opened in the first plate body.

6. The annealing equipment according to claim 5, characterized in that: The air outlet pipe is opened on the second plate body and is located at the bottom of the air outlet cavity, and the air suction port is opened at the bottom of the air outlet pipe.

7. The annealing equipment according to claim 1, characterized in that: The annealing equipment further includes: a first cabin plate disposed between the furnace body and the air inlet plate, wherein a first flow pipe for guiding gas from the air inlet to the heating chamber is formed inside the first cabin plate.

8. The annealing equipment according to claim 7, characterized in that: A first stopper and a second stopper are respectively arranged at both ends of the inner longitudinal direction of the furnace body close to the air inlet plate, and the first stopper and the second stopper enclose a second flow pipe for transporting gas from the first flow pipe to the heating chamber, and the longitudinal width of the first flow pipe is less than or equal to the longitudinal width of the second flow pipe.

9. The annealing equipment according to claim 1, characterized in that: The annealing equipment further includes: a second cabin plate disposed between the furnace body and the gas outlet plate, wherein a third flow pipe is formed inside the second cabin plate for guiding the gas in the heating cavity to be transported to the gas outlet cavity.

10. The annealing equipment according to claim 9, characterized in that: A third block and a fourth block are respectively arranged at both ends of the inner longitudinal direction of the furnace body close to the gas outlet plate, and the third block and the fourth block enclose a fourth flow pipe for transporting gas from the heating cavity to the third flow pipe, and the longitudinal width of the third flow pipe is less than or equal to that of the fourth flow pipe.

Images