Thermoelectric refrigeration chip temperature control device

Abstract

The utility model discloses a thermoelectric refrigeration chip temperature control device which comprises a device refrigeration conduction part, an upper heat insulation gasket part arranged below the device refrigeration conduction part, and a thermoelectric refrigeration chip part arranged below the upper heat insulation gasket part. According to the utility model, the upper heat insulation gasket body and the lower heat insulation gasket body which are made of silicon rubber materials are arranged, so that a good heat insulation and separation effect can be achieved, and the lower outer side buckling pad is arranged on the periphery below the lower heat insulation gasket body, so that the lower outer side buckling pad can be buckled on the outer side of a heat dissipation and conduction part of the device to prevent heat from influencing the refrigeration effect; the inner surfaces of the refrigeration conduction base caulking groove and the heat dissipation conduction base caulking groove are coated with heat conduction silicone grease, so that the heat conduction performance can be improved, and meanwhile, the silicone grease can be effectively prevented from overflowing through an upper heat insulation gasket body and a lower heat insulation gasket body which are attached to the outer sides; a better refrigeration effect can be achieved by combining the refrigeration blowing fan with the spiral heat exchange pipe.

Description

Technical Field

[0001] The utility model relates to the technical field of thermoelectric refrigeration chip equipment, in particular to a thermoelectric refrigeration chip temperature control device. Background Art

[0002] Thermoelectric cooling chips, also known as semiconductor cooling chips or thermoelectric coolers, are refrigeration devices based on the thermoelectric effect. Thermoelectric cooling chips use the Peltier effect of semiconductor materials for cooling. When direct current passes through a couple made of two different semiconductor materials in series, heat can be absorbed and released at both ends of the couple, thereby achieving the purpose of cooling.

[0003] The refrigeration temperature control device made of thermoelectric refrigeration chip has the advantages of small size, low noise and high stability. However, the existing thermoelectric refrigeration chip temperature control device has a cooling and heating surface at both ends, and the refrigeration effect is easily reduced due to the heat of the heating surface during use. Utility Model Content

[0004] The purpose of the utility model is to provide a thermoelectric refrigeration chip temperature control device to solve the problem that the existing thermoelectric refrigeration chip temperature control device has a cooling surface and a heating surface at its two ends, and the refrigeration effect is easily reduced due to the heat of the heating surface during use.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a thermoelectric refrigeration chip temperature control device, comprising: a device refrigeration conduction component, an upper thermal insulation gasket component is arranged below the device refrigeration conduction component, a thermoelectric refrigeration chip component is arranged below the upper thermal insulation gasket component, a lower thermal insulation gasket component is arranged below the thermoelectric refrigeration chip component, a device heat dissipation conduction component is arranged below the lower thermal insulation gasket component, the device refrigeration conduction component includes a refrigeration conduction base, the upper thermal insulation gasket component includes an upper thermal insulation gasket body, the lower thermal insulation gasket component includes a lower thermal insulation gasket body, the device heat dissipation conduction component includes a device heat dissipation conduction base, and the thermoelectric refrigeration chip component includes a thermoelectric refrigeration chip body.

[0006] As a further solution of the utility model: a refrigeration blowing fan is provided above the refrigeration conduction component of the device, and a heat dissipation blowing fan is provided below the heat dissipation conduction component of the device, and the heat dissipation blowing fans are provided in two groups.

[0007] As a further solution of the utility model: a refrigeration conduction fin is fixedly provided at one end above the refrigeration conduction base, a spiral heat exchange tube is provided inside the refrigeration conduction fin, a connecting pipe opening is fixedly connected through one end of the spiral heat exchange tube, the refrigeration conduction fins are provided in multiple groups, the spiral heat exchange tube is located in the multiple groups of refrigeration conduction fins and is closely embedded, and the connecting pipe opening is provided in two groups and is located at both ends of the spiral heat exchange tube.

[0008] As a further solution of the utility model: a refrigeration conduction base embedding groove is opened in the middle of the lower part of the refrigeration conduction base, an upper insulation gasket embedding hole is opened in the middle of the upper insulation gasket body, an upper wire embedding groove is opened at one end below the upper insulation gasket, a lower insulation gasket embedding hole is opened in the middle of the lower insulation gasket body, a lower wire embedding groove is opened at one end above the lower insulation gasket body, a heat dissipation conduction base embedding groove is opened in the middle of the upper part of the device heat dissipation conduction base, and one end of the thermoelectric refrigeration chip body is electrically connected to a chip power supply wire.

[0009] As a further solution of the utility model: lower outer buckle pads are fixedly arranged around the lower side of the lower thermal insulation gasket body, heat dissipation conduction fins are fixedly arranged under the heat dissipation conduction base of the device, the lower outer buckle pads are adapted to be buckled on the outside of the heat dissipation conduction base of the device, and the heat dissipation conduction fins are arranged in multiple groups.

[0010] As a further solution of the utility model: refrigeration base through holes are opened inside on all sides of the refrigeration conduction base, upper thermal insulation gasket through holes are opened inside on all sides of the upper thermal insulation gasket body, lower thermal insulation gasket through holes are opened inside on all sides of the lower thermal insulation gasket body, and heat dissipation base screw holes are opened inside on all sides above the heat dissipation conduction base of the device. The number of refrigeration base through holes, upper thermal insulation gasket through holes, lower thermal insulation gasket through holes and heat dissipation base screw holes are all provided in multiple groups and the position specifications are matched.

[0011] As a further solution of the utility model: the thermoelectric cooling chip body is adapted and embedded in the cooling conduction base embedding groove, the upper insulation gasket embedding hole, the lower insulation gasket embedding hole and the heat dissipation conduction base embedding groove, and the chip power supply wire is adapted and embedded between the upper wire embedding groove and the lower wire embedding groove.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model provides an upper insulation gasket body and a lower insulation gasket body made of silicone rubber, which can achieve a good insulation and separation effect. By arranging lower outer buckle pads around the bottom of the lower insulation gasket body, the lower insulation gasket body can be buckled on the outer side of the heat dissipation conduction component of the device to prevent heat from affecting the cooling effect. The thermal conductivity can be improved by applying thermal conductive silicone grease on the inner surface of the cooling conduction base groove and the heat dissipation conduction base groove. At the same time, the upper insulation gasket body and the lower insulation gasket body fitted on the outside can effectively prevent the silicone grease from overflowing. By connecting the heat exchange pipeline at the connecting pipe mouth, a better cooling effect can be achieved through the cooling fan combined with the spiral heat exchange tube. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of a thermoelectric refrigeration chip temperature control device described in the utility model;

[0015] Figure 2 It is a structural schematic diagram of a refrigeration conduction component installed in a thermoelectric refrigeration chip temperature control device described in the utility model;

[0016] Figure 3 It is a structural schematic diagram of an upper heat-insulating gasket component in a thermoelectric refrigeration chip temperature control device described in the utility model;

[0017] Figure 4 It is a structural schematic diagram of a lower heat insulation gasket component in a thermoelectric refrigeration chip temperature control device described in the utility model;

[0018] Figure 5 It is a structural schematic diagram of a heat dissipation conduction component of a thermoelectric refrigeration chip temperature control device described in the utility model;

[0019] Figure 6 It is a structural schematic diagram of a thermoelectric refrigeration chip component in a thermoelectric refrigeration chip temperature control device described in the utility model.

[0020] In the figure: 1. refrigeration conduction component of the device; 2. upper insulation gasket component; 3. thermoelectric refrigeration chip component; 4. lower insulation gasket component; 5. heat dissipation conduction component of the device; 6. refrigeration conduction base; 7. upper insulation gasket body; 8. lower insulation gasket body; 9. heat dissipation conduction base of the device; 10. thermoelectric refrigeration chip body; 11. refrigeration blowing fan; 12. heat dissipation blowing fan; 13. refrigeration conduction fins; 14. spiral heat exchange tube; 15. connecting pipe mouth; 16. refrigeration conduction base embedded groove; 17. upper insulation gasket embedded hole; 18. upper wire embedded groove; 19. lower insulation gasket embedded hole; 20. lower wire embedded groove; 21. heat dissipation conduction base embedded groove; 22. chip power wire; 23. lower outer buckle pad; 24. heat dissipation conduction fins; 25. refrigeration base through hole; 26. upper insulation gasket through hole; 27. lower insulation gasket through hole; 28. heat dissipation base screw hole. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation of the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. The following is an explanation of the embodiments of the present utility model based on the overall structure of the present utility model.

[0023] Reference Figures 1 to 6 In an embodiment of the utility model, a thermoelectric refrigeration chip temperature control device includes: a device refrigeration conduction component 1, an upper thermal insulation gasket component 2 is arranged below the device refrigeration conduction component 1, a thermoelectric refrigeration chip component 3 is arranged below the upper thermal insulation gasket component 2, a lower thermal insulation gasket component 4 is arranged below the thermoelectric refrigeration chip component 3, and a device heat dissipation conduction component 5 is arranged below the lower thermal insulation gasket component 4. The device refrigeration conduction component 1 includes a refrigeration conduction base 6, the upper thermal insulation gasket component 2 includes an upper thermal insulation gasket body 7, the lower thermal insulation gasket component 4 includes a lower thermal insulation gasket body 8, the device heat dissipation conduction component 5 includes a device heat dissipation conduction base 9, the thermoelectric refrigeration chip component 3 includes a thermoelectric refrigeration chip body 10, a refrigeration blowing fan 11 is buckled above the device refrigeration conduction component 1, and a heat dissipation blowing fan 12 is buckled below the device heat dissipation conduction component 5, and the heat dissipation blowing fan 12 is provided in two groups.

[0024] A refrigeration conduction fin 13 is fixedly provided at one end above the refrigeration conduction base 6, a spiral heat exchange tube 14 is provided inside the refrigeration conduction fin 13, one end of the spiral heat exchange tube 14 is penetrated and fixedly connected with a connecting pipe opening 15, there are multiple groups of refrigeration conduction fins 13, the spiral heat exchange tube 14 is located inside the multiple groups of refrigeration conduction fins 13 and is closely embedded, and there are two groups of connecting pipe openings 15 located at both ends of the spiral heat exchange tube 14.

[0025] A cooling conduction base embedding groove 16 is provided in the middle of the lower part of the cooling conduction base 6, an upper insulation gasket embedding hole 17 is provided in the middle of the upper insulation gasket body 7, an upper wire embedding groove 18 is provided at one end below the upper insulation gasket, a lower insulation gasket embedding hole 19 is provided in the middle of the lower insulation gasket body 8, a lower wire embedding groove 20 is provided at one end above the lower insulation gasket body 8, a heat dissipation conduction base embedding groove 21 is provided in the middle of the upper part of the device heat dissipation conduction base 9, a chip power supply wire 22 is electrically connected to one end of the thermoelectric cooling chip body 10, and the thermoelectric cooling chip body 10 is adapted to be embedded in the cooling conduction base embedding groove 16, the upper insulation gasket embedding hole 17, the lower insulation gasket embedding hole 19 and the heat dissipation conduction base embedding groove 21, and the chip power supply wire 22 is adapted to be embedded between the upper wire embedding groove 18 and the lower wire embedding groove 20.

[0026] By adopting the above scheme, the thermal conductivity can be improved by applying thermal grease on the inner surface of the refrigeration conduction base groove 16 and the heat dissipation conduction base groove 21, and the upper insulation gasket body 7 and the lower insulation gasket body 8 attached to the outside can effectively prevent the grease from overflowing.

[0027] Lower outer buckle pads 23 are fixedly arranged around the lower side of the lower thermal insulation gasket body 8, and heat dissipation conduction fins 24 are fixedly arranged below the device heat dissipation conduction base 9. The lower outer buckle pads 23 are adapted to be buckled on the outside of the device heat dissipation conduction base 9, and the heat dissipation conduction fins 24 are arranged in multiple groups.

[0028] By adopting the above solution, by arranging the lower outer buckle pad 23 around the lower side of the lower heat-insulating gasket body 8, it can be buckled on the outer side of the heat dissipation conduction component 5 of the device to prevent the heat from affecting the cooling effect.

[0029] Refrigeration base through holes 25 are opened inside the refrigeration conduction base 6, upper insulation gasket through holes 26 are opened inside the upper insulation gasket body 7, lower insulation gasket through holes 27 are opened inside the lower insulation gasket body 8, and heat dissipation base screw holes 28 are opened inside the upper part of the device heat dissipation conduction base 9. There are multiple groups of refrigeration base through holes 25, upper insulation gasket through holes 26, lower insulation gasket through holes 27 and heat dissipation base screw holes 28, and the position specifications are matched.

[0030] By adopting the above scheme: the device refrigeration conduction component 1, the upper insulation gasket component 2, the thermoelectric refrigeration chip component 3, the lower insulation gasket component and the device heat dissipation conduction component 5 can be installed and fixed by passing the fixing screws through the refrigeration base through hole 25, the upper insulation gasket through hole 26, and the lower insulation gasket through hole 27 and screwing them into the heat dissipation base screw hole 28.

[0031] The working principle of the utility model is as follows: when in use, the upper insulation gasket component 2 and the lower insulation gasket component 4 are placed at both ends of the thermoelectric cooling chip component 3, the thermoelectric cooling chip body 10 is embedded between the upper insulation gasket embedding hole 17 and the lower insulation gasket embedding hole 19, the chip power supply wire 22 is embedded between the upper wire embedding groove 18 and the lower wire embedding groove 20, and then the device cooling conduction component 1 and the device heat dissipation conduction component 5 are installed on both sides of the upper insulation gasket component 2 and the lower insulation gasket component 4, and the upper insulation gasket body 7 and the lower insulation gasket body 8 made of silicone rubber are provided, which can play a role in It has a very good heat insulation and separation effect. By arranging lower outer buckle pads 23 around the lower side of the lower insulation gasket body 8, it can be buckled on the outside of the heat dissipation conduction component 5 of the device to prevent heat from affecting the cooling effect. By applying thermal conductive silicone grease on the inner surface of the cooling conduction base groove 16 and the heat dissipation conduction base groove 21, the thermal conductivity can be improved. At the same time, the upper insulation gasket body 7 and the lower insulation gasket body 8 that are fitted on the outside can effectively prevent the silicone grease from overflowing. By connecting the heat exchange pipeline at the connecting pipe port 15, the cooling fan 11 combined with the spiral heat exchange tube 14 can achieve a better cooling effect.

[0032] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A thermoelectric cooling chip temperature control device, characterized in that: include: A device cooling conduction component (1), an upper heat insulation gasket component (2) is arranged below the device cooling conduction component (1), a thermoelectric cooling chip component (3) is arranged below the upper heat insulation gasket component (2), a lower heat insulation gasket component (4) is arranged below the thermoelectric cooling chip component (3), a device heat dissipation conduction component (5) is arranged below the lower heat insulation gasket component (4), the device cooling conduction component (1) includes a cooling conduction base (6), the upper heat insulation gasket component (2) includes an upper heat insulation gasket body (7), the lower heat insulation gasket component (4) includes a lower heat insulation gasket body (8), the device heat dissipation conduction component (5) includes a device heat dissipation conduction base (9), and the thermoelectric cooling chip component (3) includes a thermoelectric cooling chip body (10).

2. A thermoelectric cooling chip temperature control device according to claim 1, characterized in that: A cooling blower fan (11) is provided above the refrigeration conduction component (1) of the device, and a heat dissipation blower fan (12) is provided below the heat dissipation conduction component (5) of the device. The heat dissipation blower fans (12) are provided in two groups.

3. A thermoelectric cooling chip temperature control device according to claim 1, characterized in that: A refrigeration conduction fin (13) is fixedly provided at one end above the refrigeration conduction base (6), a spiral heat exchange tube (14) is provided inside the refrigeration conduction fin (13), one end of the spiral heat exchange tube (14) is penetrated and fixedly connected with a connecting pipe opening (15), the refrigeration conduction fins (13) are provided in multiple groups, the spiral heat exchange tube (14) is located inside the multiple groups of refrigeration conduction fins (13) and is closely embedded, and the connecting pipe opening (15) is provided in two groups and is arranged at both ends of the spiral heat exchange tube (14).

4. A thermoelectric cooling chip temperature control device according to claim 1, characterized in that: A cooling conduction base embedding groove (16) is provided in the middle of the lower part of the cooling conduction base (6); an upper insulation gasket embedding hole (17) is provided in the middle of the upper insulation gasket body (7); an upper wire embedding groove (18) is provided at one end of the lower part of the upper insulation gasket; a lower insulation gasket embedding hole (19) is provided in the middle of the lower insulation gasket body (8); a lower wire embedding groove (20) is provided at one end of the upper part of the lower insulation gasket body (8); a heat dissipation conduction base embedding groove (21) is provided in the middle of the upper part of the device heat dissipation conduction base (9); and one end of the thermoelectric cooling chip body (10) is electrically connected to a chip power supply wire (22).

5. The thermoelectric cooling chip temperature control device according to claim 1, characterized in that: Lower outer buckle pads (23) are fixedly arranged around the lower side of the lower thermal insulation gasket body (8), and heat dissipation conduction fins (24) are fixedly arranged below the device heat dissipation conduction base (9). The lower outer buckle pads (23) are adapted to be buckled on the outside of the device heat dissipation conduction base (9), and the heat dissipation conduction fins (24) are arranged in multiple groups.

6. A thermoelectric cooling chip temperature control device according to claim 1, characterized in that: The refrigeration conduction base (6) is provided with refrigeration base through holes (25) on its periphery, the upper thermal insulation gasket body (7) is provided with upper thermal insulation gasket through holes (26) on its periphery, the lower thermal insulation gasket body (8) is provided with lower thermal insulation gasket through holes (27) on its periphery, and the heat dissipation conduction base (9) of the device is provided with heat dissipation base screw holes (28) on its periphery. The refrigeration base through holes (25), upper thermal insulation gasket through holes (26), lower thermal insulation gasket through holes (27) and heat dissipation base screw holes (28) are provided in multiple groups and their positions and specifications are matched.

7. A thermoelectric cooling chip temperature control device according to claim 4, characterized in that: The thermoelectric cooling chip body (10) is adapted to be embedded in the cooling conduction base embedding groove (16), the upper insulation gasket embedding hole (17), the lower insulation gasket embedding hole (19) and the heat dissipation conduction base embedding groove (21), and the chip power supply wire (22) is adapted to be embedded between the upper wire embedding groove (18) and the lower wire embedding groove (20).

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