Cathode assembly and deposition device

Abstract

A cathode assembly (10) and a deposition apparatus (100) are provided. The cathode assembly includes: a rotatable tube (622) having an axis of rotation, a first end and a second end, the first end being opposite the second end in a direction of the axis of rotation; a coolant receiving enclosure (20), the coolant receiving enclosure (20) being in the rotatable tube (622); and a side element (624) disposed at the first end of the rotatable tube (622), the side element (624) having at least one opening (625) configured to enable coolant to exit the rotatable tube (622) from the coolant receiving housing (20).

Description

Technical Field

[0001] Embodiments described herein relate to a cathode assembly and a deposition apparatus having one or more cathode assemblies. In particular, embodiments described herein relate to a cathode assembly having a side member provided with at least one opening for draining coolant from the cathode assembly. Background Art

[0002] In many applications, it is necessary to deposit a thin layer on a substrate. The substrate can be coated in one or more chambers of a coating apparatus. The substrate can be coated in a vacuum using vapor deposition techniques.

[0003] Several methods for depositing materials on substrates are known. For example, the substrate can be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, or a plasma enhanced vapor deposition (PECVD) process, etc. The process is performed in a process device or a process chamber where the substrate to be coated is located. The deposition material is provided in the device. A variety of materials and oxides, nitrides or carbides of these materials can be used for deposition on the substrate. The coating material can be used in several applications and several technical fields. For example, substrates for displays are usually coated by a physical vapor deposition (PVD) process. Other applications include insulating panels, organic light emitting diode (OLED) panels, substrates with thin film transistors (TFTs), color filters or the like.

[0004] For PVD process, the deposited material can exist in the target in the solid phase. By bombarding the target with high-energy particles, atoms of the target material (i.e., the material to be deposited) are ejected from the target. The atoms of the target material are deposited on the substrate to be coated. In the PVD process, the sputtered material (i.e., the material to be deposited on the substrate) can be arranged in different ways. For example, the target can be made of the material to be deposited, or can have a backing element on which the material to be deposited is fixed. The target including the material to be deposited is supported or fixed in a predetermined position in the deposition chamber. In the case of using a rotatable target, the target is connected to a rotating shaft or a connecting element, and the connecting element connects the shaft and the target.

[0005] Segmented planar targets, monolithic planar targets and rotatable targets can be used for sputtering. Due to the geometry and design of the cathode, rotatable targets usually have higher utilization and longer operating time than planar targets. Using rotatable targets can extend service life and reduce costs.

[0006] Sputtering can be performed as magnetron sputtering, where a magnet assembly is used to confine the plasma to improve sputtering conditions. Plasma confinement can be used to adjust the particle distribution of the material to be deposited on the substrate.

[0007] During deposition, the target is usually heated. Therefore, a coolant is usually provided to cool the target. However, there is a possibility that the coolant is discharged into the deposition device, especially during target exchange. This may contaminate the deposition device, reduce production quality and shorten maintenance intervals.

[0008] Therefore, it is necessary to safely remove the coolant from the target to ensure that the deposition apparatus is not contaminated. In some cases, exhausting the coolant may impair the quality of the deposited layer, or in some cases even cause damage or failure of the apparatus. Therefore, there is currently a need to improve the removal of coolant from the deposition apparatus. Utility Model Content

[0009] According to an embodiment, a cathode assembly is provided. The cathode assembly includes a rotatable tube having a rotation axis, a first end, and a second end, the first end being opposite to the second end in the direction of the rotation axis. The cathode assembly includes a coolant receiving housing in the rotatable tube. The cathode assembly includes a side element disposed at the first end of the rotatable tube. The side element has at least one opening, the at least one opening being configured to enable coolant to exit the rotatable tube from the coolant receiving housing.

[0010] In some embodiments, the side elements are flanges.

[0011] In some embodiments, the at least one opening is provided in a first half of the side element, the first half being defined by a line orthogonal to the rotation axis. According to an embodiment, the side element does not include an opening in a complementary second half configured to enable coolant to exit the rotatable tube from the coolant receiving housing. According to an embodiment, the cathode assembly comprises a gripping element configured to support removal of the cathode assembly, the gripping element being provided in a portion of the cathode assembly corresponding to the first half.

[0012] In some embodiments, the cathode assembly further includes a gas inlet configured to receive a gas for supporting the coolant to exit the rotatable tube from the coolant receiving housing.

[0013] In some embodiments, at least a portion of the coolant receiving housing is interior to the cathode assembly.

[0014] In some embodiments, the cathode assembly includes a target having a curved surface, the target being rotatable about an axis of rotation of the target.

[0015] In some embodiments, the coolant receiving housing is configured for cooling the cathode assembly.

[0016] According to another embodiment, a deposition device for depositing material on a substrate is provided. The deposition device includes a cathode assembly. The cathode assembly includes a rotatable tube having a rotation axis, a first end and a second end, the first end being opposite to the second end in the direction of the rotation axis. The cathode assembly includes a coolant receiving housing in the rotatable tube. The cathode assembly includes a side element disposed at the first end of the rotatable tube. The side element has at least one opening, and the at least one opening is configured to enable coolant to be discharged from the coolant receiving housing to the rotatable tube. The deposition device includes a support device that can be connected to the cathode assembly. The support device has a channel for discharging coolant from the cathode assembly.

[0017] In some embodiments, the support device includes at least one outlet opening, the at least one outlet opening corresponding to the at least one opening of the cathode assembly.

[0018] In some embodiments, the supporting device is a cathode driving unit, which is configured to: supply power to the cathode assembly; or supply coolant to the cathode assembly; or drive the rotation of the cathode assembly; or any combination of the above items.

[0019] In some embodiments, the deposition apparatus is a sputtering deposition apparatus and the cathode assembly is a sputtering cathode assembly.

[0020] In some embodiments, the coolant receiving housing is configured for cooling the cathode assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] A complete and enabling disclosure for one skilled in the art is more particularly set forth in the remainder of the specification, including reference to the accompanying drawings, in which:

[0022] Figure 1 showing a cathode assembly and support apparatus according to embodiments described herein;

[0023] Figure 2 showing a cathode assembly and support apparatus according to embodiments described herein;

[0024] Figure 3 shows an example of introducing a gas into a cathode assembly to drive coolant out of the cathode assembly according to embodiments described herein;

[0025] Figure 4 shows an example of introducing a gas into a cathode assembly to drive coolant out of the cathode assembly according to embodiments described herein;

[0026] Figure 5 showing a deposition apparatus as described herein; and

[0027] Figure 6 A method for deinstalling a cathode assembly from a support device according to embodiments described herein is shown. DETAILED DESCRIPTION

[0028] Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, like reference numerals denote like parts. Generally, only the differences with respect to various embodiments are described. Each example is provided by way of explanation, and the examples are not meant to be limiting. Further, features illustrated or described as part of one embodiment may be used on other embodiments or used in conjunction with other embodiments to produce yet another embodiment. This specification is intended to include such modifications and variations.

[0029] The drawings are schematic diagrams that are not drawn to scale. Some elements in the drawings may have exaggerated dimensions for the purpose of highlighting aspects of the disclosure and / or for clarity of presentation.

[0030] Embodiments described herein relate to a deposition apparatus for depositing a material on a substrate. In a deposition process or coating process, a layer of a target material is deposited on a substrate. The substrate is coated with the material. In this document, the terms "coating process" and "deposition process" are used synonymously.

[0031] Deposition devices according to embodiments described herein may be configured for deposition on a horizontally oriented substrate. The term "horizontally oriented" may include substrates arranged with small deviations from a precise horizontal, for example there may be an angle of up to 10° or even 15° between the substrate and a precise horizontal direction.

[0032] Deposition apparatus according to embodiments described herein may be configured for deposition on large area substrates.

[0033] The substrate as described herein may be a large area substrate. The term "substrate" as used herein includes substrates commonly used in display manufacturing. For example, the substrate as described herein may be a substrate commonly used in LCD (liquid crystal display), OLED panels, and the like. For example, a large area substrate may correspond to about 0.67 m 2 The GEN 4.5 of the substrate (0.73m×0.92m) corresponds to about 1.4m 2 The GEN 5 of the substrate (1.1m×1.3m) corresponds to about 2.8m 2 The GEN6 substrate (1.85m×1.5m) corresponds to about 4.29m 2 The GEN 7.5 of the substrate (1.95m×2.2m) corresponds to about 5.7m 2The base plate (2.2m×2.5m) of GEN 8.5 or even corresponds to about 8.7m 2 Even larger generations and corresponding substrate areas such as GEN 11 and GEN 12 may be similarly implemented.

[0034] The term "substrate" as used herein shall particularly include substantially inflexible substrates, such as wafers, slices of transparent crystals such as sapphire or the like, or glass plates. In particular, the substrate may be a glass substrate and / or a transparent substrate. The present disclosure is not limited thereto, and the term "substrate" may also include flexible substrates, such as coils or foils. The term "substantially inflexible" shall be understood to be distinguished from "flexible". Specifically, a substantially inflexible substrate may have a certain degree of flexibility, such as a glass plate having a thickness of 0.5 mm or less, wherein the flexibility of the substantially inflexible substrate is less than that of a flexible substrate.

[0035] Deposition devices according to embodiments described herein may comprise one or more cathode assemblies, in particular a plurality of cathode assemblies. A cathode assembly is to be understood as an assembly adapted for use as a cathode in a coating process such as a sputtering deposition process.

[0036] The cathode assembly according to the embodiments described herein may be a rotatable cathode assembly. The cathode assembly may include a target, in particular a rotatable target. The rotatable target may be rotatable around an axis of rotation of the rotatable target. The rotatable target may have a curved surface, such as a cylindrical surface. The rotatable target may rotate around an axis of rotation that is the axis of a cylinder or tube. The cathode assembly may include a back tube. A target material forming the target may be mounted on the back tube, and the target material may include a material that is deposited onto the substrate during the coating process. Alternatively, the target material may be shaped as a tube and not arranged on the back tube.

[0037] The cathode assembly may include a magnet assembly. The magnet assembly may be arranged in a cathode assembly of the cathode assembly. The magnet assembly may be surrounded by a target material. The magnet assembly may be arranged so that the target material sputtered by the cathode assembly is sputtered toward the substrate. The magnet assembly may generate a magnetic field. During the sputtering deposition process, the magnetic field may cause one or more plasma regions to form near the magnetic field. The position of the magnet assembly within the cathode assembly affects the direction in which the target material is sputtered away from the cathode assembly during the sputtering deposition process.

[0038] In operation, an uncooled cathode assembly, in particular an uncooled magnet assembly of the cathode assembly, may heat up due to the magnet assembly being surrounded by target material bombarded with ions. The resulting collisions cause the cathode assembly to heat up. In order to maintain the magnet assembly at a suitable operating temperature, cooling of the cathode assembly, in particular cooling of the target material and the magnet assembly, may be provided.

[0039] The deposition apparatus according to the embodiments described herein may be configured for vacuum deposition. The deposition apparatus may include a process chamber, in particular a vacuum chamber. The cathode assembly as described herein or at least a portion of the cathode assembly may be arranged in the process chamber.

[0040] Figure 1 A cross section of a deposition apparatus 100 according to an embodiment described herein is shown. The cross section is in a direction parallel to the rotation axis of the cathode assembly 10 .

[0041] According to the embodiment, for example Figure 1 As shown in FIG. 1 , a deposition apparatus 100 for depositing materials on a substrate and / or a cathode assembly is provided. The deposition apparatus 100 may include a cathode assembly 10. The deposition apparatus 100 includes a coolant space or a coolant receiving housing 20. The coolant receiving housing 20 may receive a coolant 22 for cooling the cathode assembly 10.

[0042] The deposition device 100 according to the embodiments described herein may be a sputtering deposition device. The cathode assembly 10 as described herein may be a sputtering cathode assembly. The cathode assembly 10 may include a target as described herein. The target may be rotatable around the axis of rotation of the target. The target may have a curved (e.g., substantially cylindrical) surface. The cathode assembly 10 may include a magnet assembly as described herein. The magnet assembly may be arranged in the cathode assembly 10.

[0043] The cathode assembly 10 as described herein may include a target. During operation of the cathode assembly 10 (e.g., during a coating process in which material from the target is deposited on a substrate), the cathode assembly 10 (particularly the target) may experience heating. The coolant receiving housing 20 with the coolant 22 may be configured to cool the target of the cathode assembly 10. The coolant receiving housing 20 with the coolant 22 may be configured to cool the cathode assembly 10, particularly the target, during a deposition process such as a sputtering process.

[0044] The coolant 22 as described herein can be configured to cool the cathode assembly 10. The coolant 22 can be configured to cool the magnet assembly of the cathode assembly 10. The magnet assembly can be arranged in an interior region of the cathode assembly, for example, in a hollow region surrounded by the target material. The coolant 22 can be a liquid coolant, such as water, more particularly cooling water. Other liquid coolants suitable for cooling the cathode assembly 10 can also be used.

[0045] For example Figure 1 As shown in FIG, at least a portion of the coolant receiving housing 20 may be inside the cathode assembly 10. At least a portion (particularly a major portion) of the coolant receiving housing 20 may be surrounded by a curved surface (particularly a tubular surface) of the cathode assembly 10. The curved surface may be a curved surface of a target of the cathode assembly 10.

[0046] For example Figure 1 As shown in , a portion of the coolant receiving housing 20 can be inside a support device 230 as described herein. The support device 230 can support the cathode assembly 10. The portion of the coolant receiving housing 20 inside the support device 230 can be smaller in volume than the remaining portion of the coolant receiving housing 20 outside the support device 230.

[0047] Figure 2 A cross section of a deposition apparatus 100 according to embodiments described herein is shown. Figure 2 The deposition apparatus 100 shown in FIG. 1 includes a cathode assembly 10 and a support device 230. Further, Figure 2 The coolant receiving housing 20 is depicted filled with coolant 22 , for example up to a coolant level 21 .

[0048] The cathode assembly 10 as described herein may be a rotatable cathode assembly. Figure 2 , the cathode assembly 10 may have a rotation axis 250 extending in a first direction 252. The cathode assembly 10 may be rotatable about the rotation axis 250. The rotation axis 250 may be a horizontal rotation axis. The coolant receiving shell 20 may be a longitudinal shell having a length in the first direction 252. At least a portion of the coolant receiving shell 20 may extend in the first direction 252 over a length that is 60% or more of the length of the cathode assembly 10 in the first direction 252. The coolant receiving shell 20 may be configured to cool the target of the cathode assembly 10 in the first direction 252 substantially over the entire length of the target.

[0049] The coolant receiving housing 20 as described herein may be tubular in a direction parallel to the axis of rotation of the cathode assembly 10 .

[0050] For example Figure 2 As shown in , the deposition apparatus 100 as described herein may include a support device 230 that supports the cathode assembly 10. For example, the cathode assembly 10 may have a flange or be mounted to a flange. The flange may be mounted on the support device 230.

[0051] The support device 230 as described herein may be adapted to be mounted to a non-revolving portion of the deposition apparatus 100 , typically to a wall, flap, or door.

[0052] The support device 230 as described herein may be a cathode drive unit. The cathode drive unit may be configured to supply power to the cathode assembly 10. The cathode drive unit may include or be connected to a power source for supplying power to the cathode assembly 10. Additionally or alternatively, the cathode drive unit may be configured to supply water or coolant to the cathode assembly 10 and / or to the coolant receiving housing 20. The cathode drive unit may include or be connected to a water or coolant supply source for supplying water or coolant to the cathode assembly 10. Additionally or alternatively, the cathode drive unit may be configured to drive the cathode assembly 10 to rotate. The cathode drive unit may include an actuator for driving the cathode assembly 10 to rotate. The cathode drive unit may be configured to perform any combination of the above functions.

[0053] A cathode driving unit as described herein may be referred to as an end block or a cathode driving block.

[0054] A support device 230 as described herein can be arranged near the cathode assembly 10. The support device 230 can have a body portion 232 or body. The body portion 232 can have a hollow space in the body portion 232. The support device 230, and in particular the body portion 232, can be configured to remain stationary during rotation of the target of the cathode assembly 10. The target can be configured to rotate relative to the support device 230, in particular relative to the body portion 232. The support device 230 does not rotate with the target.

[0055] According to embodiments described herein, the cathode assembly 10 may include a rotatable tube 622. The rotatable tube 622 may have an axis of rotation that coincides with the axis of rotation 250 of the cathode assembly 10. The rotatable tube 622 may be configured to rotate around the axis of rotation (e.g., the axis of rotation 250 of the cathode assembly 10). The rotatable tube 622 may further have a first end and / or a second end. The first end may be opposite to the second end in the direction of the axis of rotation. The rotatable tube 622 may surround at least a portion of the coolant receiving housing 20.

[0056] According to embodiments described herein, the cathode assembly 10 can include a side member 624. The side member 624 can be disposed at a first end of the rotatable tube 622. The side member 624 can have at least one opening 625. The at least one opening can be configured to enable the coolant 22 to exit the rotatable tube 622 from the coolant receiving housing 20. For example, according to embodiments described herein, the coolant can exit from the coolant receiving housing 20 into the support device 230, particularly into the body portion 232, wherein the side member 624 is a flange.

[0057] The embodiments described herein provide the following benefits: in particular during disassembly of the cathode assembly, leakage of the coolant 22 out of the coolant receiving housing 20, for example through a draining opening, can be reduced or even avoided. In view of this, potential failures of the deposition device or damage to the deposition device 100 caused by coolant leakage can be contained or even prevented. For example, short circuits or corrosion of parts of the deposition device 100 can be avoided. In view of this, the embodiments described herein allow for an increased service life of the deposition device.

[0058] According to embodiments described herein, at least one opening 625 is disposed in a first half of the side element 624. The first half may be defined by a line orthogonal to the axis of rotation. For example, in the case of a horizontally arranged cathode assembly, i.e., with a horizontally aligned axis of rotation, the first half may be defined by a horizontal line that passes through the axis of rotation and is orthogonal to the axis of rotation. Specifically, the first half may be the portion of the side element 624 below this horizontal line.

[0059] More specifically, the side element 624 may be formed to not include an opening configured to enable coolant to exit the rotatable tube 622 from the coolant receiving housing 20 in, for example, a complementary second half of the side element. That is, the side element 624 may include an opening configured to enable coolant to exit the rotatable tube 622 from the coolant receiving housing 20 in only one half.

[0060] Figure 3 Gas 254 is shown introduced into the cathode assembly 10 to force the coolant out of the cathode assembly 10 .

[0061] Figure 3 The example shows that gas 254 is introduced into the cathode assembly 10. In particular, the gas can be provided with a pressure entering the cathode assembly 10 so that the gas supports actively discharging the coolant out of the cathode assembly 10, in particular out of the coolant receiving housing 20. For example, the gas can be applied at a pressure of 2 to 6 bar overpressure, in particular 3 to 5 bar overpressure. The term "overpressure" in the context of the present application may be understood as a pressure value that is higher than the surrounding or ambient pressure. For example, if the cathode assembly 10 is at a pressure of about 1 bar, applying the gas at an overpressure of 5 bar means applying the gas at a pressure of 5 bar more than the surrounding or ambient pressure of 1 bar, i.e., applying the gas at a pressure of 6 bar. The introduction of the gas may support lowering the coolant level 21 to, for example, the height of the opening 625.

[0062] The side member 624 can have a width along the rotation axis 250. For example, the width can be about 10 to about 30 mm, specifically about 15 to about 25 mm. Further, the width can depend on the expected water flow. The at least one opening 625 can have a length sufficient to extend along the width of the side member 624. Therefore, at least one opening 625 can be formed by the side member 624.

[0063] like Figure 3 As shown in the example of , at least one opening may be sloped or inclined. Specifically, at least one opening 625 may form an angle relative to the rotation axis 250. For example, at least one opening 625 may form an acute angle relative to the rotation axis 250. The acute angle may be open toward the cathode assembly 10. The acute angle may provide an arrangement in which a portion of the at least one opening 625 at the side of the cathode assembly is farther from the rotation axis 250, and a portion of the at least one opening 625 at the side of the support device 230 is closer to the rotation axis 250.

[0064] According to embodiments described herein, the support device 230 includes at least one outlet opening 234 corresponding to at least one opening 625 of the cathode assembly. In the case of an inclined or slanted opening, the at least one outlet opening 234 may be closer to the rotation axis 250 than the portion of the at least one opening 625 at the side of the cathode assembly 10. At least one outlet opening 234 and / or at least one opening 625 may be connected to a channel 233 of the support device 230. The channel 233 may be fluidly connected to the coolant receiving housing 20. The channel 233 may be configured to receive coolant from the cathode assembly 10 and / or discharge the coolant out of the support device 230. The channel 233 may be configured to discharge the received coolant, in particular the heated coolant. In particular, the channel 233 may transport the coolant away from the cathode assembly 10, for example to a location where the coolant can be safely disposed of. Through the channel 233 configured to receive the coolant, the leaked coolant does not contact other parts of the system.

[0065] According to the embodiments described herein, at least one opening 625 may be formed close to the curved surface surrounding the coolant receiving housing 20, specifically at the side of the cathode assembly 10. That is, the portion of the at least one opening 625 at the side of the cathode assembly 10 may be formed at the radially outermost position. Providing at least one opening 625 at a radially outward position may provide the benefit of supporting the discharge of coolant from the coolant receiving housing 20 and / or the rotatable tube 622. In other words, at least one opening 625 (particularly the portion of the at least one opening 625 at the side of the cathode assembly 10) may be formed as far away from the rotation axis 250 as possible. When practicing the embodiments, the water blow-out level may be reduced, resulting in less water remaining in the cathode assembly 10. The angled / sloped orientation may even support this effect.

[0066] As described herein, a gas may be introduced into the cathode assembly 10 to force the coolant out of the cathode assembly 10, and in particular out of the coolant receiving housing 20. According to an embodiment, the cathode assembly 10 may include a gas inlet configured to receive a gas. A pressure may be provided to the gas to push the coolant out of, for example, the coolant receiving housing 20 through at least one opening 625. In the case of an inclined or slanted opening, the pressure may be high enough to push the coolant upward through the inclined or slanted at least one opening 625 and, for example, into the channel 223.

[0067] Figure 4 A cross section of a deposition apparatus 100 according to embodiments described herein is shown.

[0068] For example Figure 4 As shown in , a support device 230 as described herein may include a gas supply channel 610 for supplying gas, in particular cold gas, as indicated by arrow 612.

[0069] For example Figure 6 As shown in , the coolant receiving shell 20 as described herein may include a coolant receiving portion for receiving a coolant. The coolant receiving portion may define a volume. The coolant receiving portion may be a radially outward portion of the coolant receiving shell 20. The terms "radially outward" and "radially inward" may be defined relative to the axis of rotation of the cathode assembly 10. The coolant receiving portion may be surrounded by a rotatable tube 622 of the cathode assembly 10. The gas supply channel 610 may be configured to supply gas, in particular cold gas, to the coolant receiving shell 20 (in particular, the coolant receiving portion). The gas supplied by the gas supply channel 610 may be guided through the gas receiving portion. The gas may be guided through the coolant receiving portion in a horizontal direction. The gas may be guided to an area of ​​the target adjacent to the cathode assembly 10.

[0070] For example Figure 6As shown in , the gas supply channel 610 can be radially inward relative to the coolant receiving portion. The gas supply channel 610 can be a volume in an interior area of ​​the rotating shaft 632 of the cathode assembly 10. The rotating shaft 632 can be configured to rotate to drive the target to rotate. The gas can be guided through the gas supply channel 610, as shown by arrows 612. The gas can be guided through the gas supply channel 610 in a horizontal direction, particularly through the rotating shaft 632.

[0071] According to the embodiments described herein, the gas supply channel 610 may be connected to or form a gas inlet of the cathode assembly 10. Further, the cathode assembly 10 may include more than one gas inlet. Having more than one gas inlet may support uniformity of gas distribution in the coolant receiving enclosure and ensure that the gas has high pressure.

[0072] According to embodiments described herein, the cathode assembly 10 includes a gripping element 626. The gripping element 626 can be configured to support removal of the cathode assembly 10. For example, the gripping element can be a hook or similar structure, and a mating structure can grip and, for example, pull the cathode assembly 10 upward.

[0073] The gripping element 626 may be disposed in a portion of the cathode assembly 10 corresponding to the first half. In other words, the gripping element 626 may be disposed at a side of the cathode assembly where the at least one opening 625 is disposed. Specifically, the gripping element 626 may be disposed in a portion of the circumference of the rotatable tube 622 that corresponds to a portion where the at least one opening 625 is disposed. Providing the gripping element at the same side as the at least one opening may provide an advantage in that the cathode assembly is first rotated before the cathode assembly is detachable. The rotation of the cathode assembly may bring the at least one opening to an upper position, preventing the remaining coolant from flowing out of the at least one opening.

[0074] Figure 5 A cross section of a deposition apparatus 100 along a rotation axis 250 according to an embodiment is schematically shown. The deposition apparatus 100 may include a process chamber 710 formed by walls 712 and 714. According to typical embodiments, the rotation axis 250, the target and / or the backing tube are substantially parallel to the wall 712, and the support device 230, in particular the cathode drive unit, is attached to the wall 712. A drop-in configuration of the cathode assembly may be realized.

[0075] For example Figure 5As shown in , at least one support device 230 as described herein is mounted to the processing chamber 710 so that the main body portion 232 of the support device 230 is non-rotatable relative to the wall 712 of the processing chamber 710. The main body portion 232 is typically fastened to a flap or door 730 of the processing chamber 710 via an insulating plate 722. During sputtering, the flap or door 730 is closed. Accordingly, during sputtering, the main body portion 232 is typically stationary, at least non-rotatable. Alternatively, the outer housing 735 can be fastened directly to the wall 712 of the processing chamber 710.

[0076] According to an embodiment, the target flange 770 is arranged on the bearing housing 723 and is vacuum-tightly mounted to the bearing housing 723. Typically, an O-ring seal is arranged between the bearing housing 723 and the target flange 770. Since the target flange 770 and the bearing housing 723 are typically non-rotatably coupled to each other, the rotatable target mounted on the top of the target flange 770 can be rotated by a rotary drive.

[0077] During sputtering, the outer housing is typically not rotated relative to the process chamber in which the sputtering is performed. During sputtering, at least the upper portion of the target flange 770 is typically disposed outside the outer housing, i.e., in a low pressure or vacuum environment. In contrast, the interior space of the outer housing is typically at normal and / or higher pressure than the process chamber.

[0078] According to an embodiment, a rotary drive 750, typically an electric drive, is arranged outside the processing chamber 710 via a mounting support 752. The rotary drive 750 may also be placed within the outer housing 735. Typically, the rotary drive 750 drives the rotatable target 740 of the cathode assembly during sputtering via a motor shaft 754, a pinion 753 connected to the rotary drive 750 and a chain or toothed belt (not shown) around the pinion 753, and a gear-wheel 751 attached to the bearing housing 723 of the rotor 725. The rotor 725 may be adapted to mechanically support the rotatable target 740.

[0079] Typically, coolant support tubes 734 and / or electrical support lines are fed from the coolant supply and bleed unit 780 and / or electrical support unit to the exterior of the processing chamber 710 through the outer housing 735 .

[0080] The coolant support tube 734 can be in fluid communication with the coolant receiving housing 20 as described herein. For example, the coolant support tube 734 can be in fluid communication with at least one opening 625 as described herein. Further, the coolant support tube 734 can be in fluid communication with the channel 233 as described herein.

[0081] The cathode assembly 10 may include a rotatable tube 622 and side members 624 as described herein. The cathode drive unit may be a support device 230 as described herein.

[0082] According to embodiments described herein, a deposition apparatus 100 for depositing a material on a substrate may be provided. The deposition apparatus may include a cathode assembly 10. The deposition apparatus 100 may include a support device 230 that can be connected to the cathode assembly 10. The support device may have a channel 223 for discharging a coolant 22 from the cathode assembly 10. The cathode assembly 10 may include a rotatable tube 622 having a rotation axis, a first end, and a second end, the first end being opposite to the second end in the direction of the rotation axis. The cathode assembly 10 may include a coolant receiving housing 20 in the rotatable tube (622). The cathode assembly 10 may include a side element 624 disposed at a first end of the rotatable tube 622. The side element 624 may have at least one opening 625 configured to enable coolant to be discharged from the coolant receiving housing 20 to the rotatable tube 622.

[0083] According to the embodiments described herein, the support device 230 is a cathode driving unit configured to: supply power to the cathode assembly; or supply coolant to the cathode assembly; or drive the cathode assembly to rotate; or any combination of the above items.

[0084] According to embodiments described herein, the deposition apparatus 100 is a sputtering deposition apparatus, and the cathode assembly is a sputtering cathode assembly.

[0085] Figure 6 A method 900 for removing cathode assembly 10 from support apparatus 230 is shown in accordance with the described embodiment.

[0086] The method 900 includes block 910, which is directed to introducing a gas into the cathode assembly 10 to force coolant out of the cathode assembly 10. For example, the gas may be introduced into the cathode assembly 10 with pressure to force coolant in the cathode assembly 10 out of the cathode assembly 10.

[0087] The method 900 includes block 920, which is directed to rotating the cathode assembly 10. Specifically, the cathode assembly 10 may be rotated after the coolant has been exhausted from the cathode assembly 10. For example, the cathode assembly 10 may be rotated about 150 to about 210°, such as about 180°.

[0088] The method 900 includes block 930, which is directed to disconnecting the cathode assembly 10 from the support device 230. The disconnection of the cathode assembly 10 may be supported by a gripping element 626, such as described herein.

[0089] According to embodiments described herein, the cathode assembly 10 may include at least one opening configured to enable coolant to exit the coolant receiving housing 20, such as the at least one opening 625 described herein. Rotating the cathode assembly 10 may include rotating the at least one opening 625 from a lower position to an upper position relative to gravity. By rotating the at least one opening from a lower position to an upper position relative to gravity, residual coolant may be prevented from exiting the cathode assembly during and / or after disassembly.

[0090] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, and the scope of the present disclosure is determined by the claims that follow.

Claims

1. A cathode assembly (10), characterized in that: a rotatable tube (622) having a rotation axis, a first end and a second end, the first end being opposite to the second end in the direction of the rotation axis; a coolant receiving casing (20) within the rotatable tube (622); and a side member (624) disposed at the first end of the rotatable tube (622), the side member (624) having at least one opening (625) configured to enable coolant to exit the rotatable tube (622) from the coolant receiving housing (20), Wherein the at least one opening is provided in a first half of the side element, the first half being defined by a line orthogonal to the rotation axis.

2. The cathode assembly (10) of claim 1, wherein the side member (624) is a flange.

3. The cathode assembly (10) of claim 1, wherein the side member does not include an opening in the complementary second half configured to enable coolant to exit the rotatable tube from the coolant receiving housing (20).

4. The cathode assembly (10) of claim 3, wherein the cathode assembly comprises a gripping element (626) configured to support disassembly of the cathode assembly (10), the gripping element being disposed in a portion of the cathode assembly corresponding to the first half.

5. The cathode assembly (10) according to any one of claims 1 to 3, further comprising: A gas inlet is configured to receive a gas for supporting the coolant to exit the rotatable tube (622) from the coolant receiving housing (20).

6. The cathode assembly (10) of any one of claims 1 to 3, wherein at least a portion of the coolant receiving casing is inside the cathode assembly.

7. The cathode assembly (10) of any one of claims 1 to 3, wherein the cathode assembly comprises a target having a curved surface, the target being rotatable about a rotation axis of the target.

8. The cathode assembly (10) of any one of claims 1 to 3, wherein the coolant receiving casing (20) is configured for cooling the cathode assembly (10).

9. A deposition device (100) for depositing a material on a substrate, characterized in that: The cathode assembly (10) according to any one of claims 1 to 4; and A support device (230) is connectable to the cathode assembly (10), the support device having a channel (223) for draining coolant (22) out of the cathode assembly.

10. The deposition apparatus (100) of claim 9, wherein the support device comprises at least one outlet opening (234), the at least one outlet opening (234) corresponding to the at least one opening of the cathode assembly.

11. The deposition apparatus of claim 9, wherein the support device is a cathode driving unit, the cathode driving unit being configured to: supplying power to the cathode assembly; or supplying a coolant to the cathode assembly; or driving the cathode assembly to rotate; or Any combination of the above.

12. The deposition apparatus of claim 9, wherein the deposition apparatus is a sputtering deposition apparatus and the cathode assembly is a sputtering cathode assembly.

13. The deposition apparatus of claim 9, wherein the coolant receiving housing (20) is configured to cool the cathode assembly (10).

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