Paster supporting table capable of adaptively adjusting posture

Abstract

The utility model discloses a patch support table capable of adaptively adjusting postures, which comprises a self-adaptive base and a constant-temperature heating platform arranged on the self-adaptive base and used for bearing a substrate, the self-adaptive base is provided with an upper part and a lower part, the upper end of the lower part is provided with a spherical concave cambered surface, and the lower end of the lower part is provided with a spherical concave cambered surface; the lower end part of the upper part is provided with a spherical surface matched with the spherical concave arc surface, the constant-temperature heating platform is fixedly arranged on the upper surface of the upper part of the self-adaptive base, and a heating device is arranged on the constant-temperature heating platform. Through the self-adaptive base, the angle can be adjusted in a self-adaptive manner during pressing and bonding, so that the fitting precision between the substrate and the chip is ensured, and warping is avoided.

Description

Technical Field

[0001] The utility model belongs to chip production equipment, and in particular relates to a chip support table capable of self-adapting and adjusting posture. Background Art

[0002] In the production process of semiconductor chips, the process shrinkage has become very difficult and the cost-effectiveness has encountered challenges. The arrival of multi-chip packaging technology has become the key to further improving chip performance. Flip chip bonding technology has become one of the most important technologies for advanced multi-chip packaging. Today, the most common flip chip bonding packaging technology based on solder balls is reflow soldering. The main process of reflow soldering is: first, the solder joints on the chip are stained with flux or a certain amount of flux is sprayed on the solder joint area on the substrate, and then the chip is placed on the substrate relatively accurately using a patch support table that adjusts the posture adaptively, and then the chip and substrate are placed in a reflow soldering furnace as a whole, and then the temperature of the reflow furnace is controlled to achieve the welding of the chip and the substrate. The entire reflow soldering time is usually 5 to 10 minutes. However, there are not too many restrictions on the chip and the substrate during the reflow soldering process, which will cause the warping of the chip and the substrate to be effectively controlled, so that the distance between the chip and the substrate changes greatly under the chip surface. Excessive warping will lead to the two most common defects of cold soldering and bridging. Therefore, the yield rate of complex multi-chip bonding based on reflow soldering may be very low, making reflow soldering no longer the most suitable bonding method. With the emergence of thermocompression bonding process, it has gradually replaced the reflow soldering process, but how to better control the warpage of the chip and substrate during the thermocompression bonding process is still an urgent problem that needs to be solved. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a chip support platform with adaptive posture adjustment, which can adaptively adjust the angle when pressing down for bonding, ensure the fitting accuracy between the substrate and the chip, and effectively control the warping problem.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0005] A patch support platform with adaptive posture adjustment includes an adaptive base and a constant temperature heating platform arranged on the adaptive base for carrying a substrate. The adaptive base has an upper and a lower part. The upper end of the lower part has a spherical concave arc surface, and the lower end of the upper part has a spherical surface arranged to match the spherical concave arc surface. The constant temperature heating platform is fixedly arranged on the upper surface of the upper part of the adaptive base, and a heating device is arranged on the constant temperature heating platform.

[0006] The heating device is a heating rod, which is passed into the interior of the constant temperature heating platform from the side thereof.

[0007] The constant temperature heating platform is also provided with a temperature sensor.

[0008] The constant temperature heating platform also has a vacuum pumping mechanism for adsorbing the substrate.

[0009] The patch support platform is arranged on the support platform position adjustment mechanism, the support platform position adjustment mechanism includes a mobile platform, an X-axis translation mechanism and a Y-axis translation mechanism, the adaptive base is arranged on the mobile platform, the mobile platform is arranged on the X-axis translation mechanism, and the X-axis translation mechanism is arranged on the Y-axis translation mechanism.

[0010] The X-axis translation mechanism and the Y-axis translation mechanism both adopt linear motor modules.

[0011] The patch support platform and patch method of the utility model with adaptive posture adjustment have the following advantages:

[0012] 1. The adaptive base can adaptively adjust the angle when pressing down for bonding to ensure the fitting accuracy between the substrate and the chip, and effectively control the warping problem;

[0013] 2. The constant temperature heating platform has a heating device and a temperature sensor, which can achieve precise constant temperature of the heating temperature, and can ensure the fixed position of the substrate through vacuum adsorption;

[0014] 3. Through the support table position adjustment mechanism, the position of the support table can be adjusted accordingly according to the position of the chip above. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is described in detail below with reference to the accompanying drawings and specific implementation methods:

[0016] Figure 1 , Figure 2 They are schematic diagrams of different viewing angles of the patch support platform of the utility model applied to a thermal compression bonding device;

[0017] Figure 3 It is a structural stereogram of the patch support platform of the utility model;

[0018] Figure 4 It is a structural sectional view of the patch support platform of the utility model. DETAILED DESCRIPTION

[0019] The utility model is a patch support platform 2 which can adjust the posture adaptively. Figure 3-Figure 4As shown, it mainly includes an adaptive base 7 and a constant temperature heating platform 8 fixed on the adaptive base 7 for carrying the substrate. The adaptive base 7 has an upper and lower part 71, 72, and the upper end of the lower part 72 has a spherical concave arc surface. The lower end 72 of the upper part 71 has a spherical surface that is in contact with the spherical concave arc surface, so that the upper part 71 can achieve angle adjustment within the spherical concave arc surface of the lower part 72. When the chip is pressed down on the substrate adsorbed on the constant temperature heating platform 8, the upper part 71 can be adaptively adjusted on the spherical concave arc surface of the lower part 72 to ensure the fit between the chip and the substrate and avoid warping.

[0020] The constant temperature heating platform 8 is fixed on the upper surface of the upper part of the adaptive base 7. The constant temperature heating platform 8 is heated by passing a heating device such as a heating rod 9, and the substrate adsorbed thereon is heated at a constant temperature. In addition, a temperature sensor 91 is also provided on the constant temperature heating platform 8, and the temperature sensor 91 detects the heating temperature in real time to ensure its precise constant temperature. In addition, the constant temperature heating platform 8 also has the function of vacuum adsorption of the substrate, that is, the upper surface has a vacuum adsorption hole, and a vacuum channel connected to the vacuum adsorption hole is provided inside. The vacuum channel is externally connected to a vacuum device to realize vacuum adsorption of the substrate arranged on its upper surface, so as to play the role of fixing the substrate (not shown in the figure).

[0021] Please combine Figure 1-2 As shown, when the patch support platform 2 of the utility model is applied to the hot pressing bonding equipment, a support platform position adjustment mechanism can be set on the machine base 1, and the support platform position adjustment mechanism includes a mobile platform 6, an X-axis translation mechanism 4 and a Y-axis translation mechanism 5, and the adaptive base 7 of the patch support platform 2 is arranged on the mobile platform 6. The mobile platform 6 is installed on the X-axis translation mechanism 4, and the X-axis translation mechanism 4 and the Y-axis translation mechanism 5 can both use linear motor modules. By installing the X-axis translation mechanism 4 on the Y-axis translation mechanism 5, the position adjustment of the patch support platform 2 in the X and Y axis directions can be achieved.

[0022] When in use, according to the position of the pressure head 3 with the chip adsorbed on it, the patch support platform 2 with the substrate adsorbed on it is adjusted to just below the pressure head 3 through the support platform position adjustment mechanism. At this time, the substrate is heated by a constant temperature, and then the pressure head 3 is pressed down onto the substrate with the chip (dipped in glue). At the same time, the pressure head is also quickly heated to achieve hot pressing bonding. During the pressing process, the position is adaptively adjusted through the adaptive base 7 to ensure the fit between the chip and the substrate to avoid warping.

[0023] However, those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention. As long as they are within the spirit of the present invention, any changes or modifications to the above embodiments will fall within the scope of the claims of the present invention.

Claims

1. A patch support platform with adaptive posture adjustment, characterized in that: It includes an adaptive base and a constant temperature heating platform arranged on the adaptive base for carrying a substrate. The adaptive base has an upper and a lower part. The upper end of the lower part has a spherical concave arc surface, and the lower end of the upper part has a spherical surface arranged to match the spherical concave arc surface. The constant temperature heating platform is fixedly arranged on the upper surface of the upper part of the adaptive base, and a heating device is arranged on the constant temperature heating platform.

2. The patch support platform with adaptive posture adjustment according to claim 1, characterized in that: The heating device is a heating rod, which is passed into the interior of the constant temperature heating platform from the side thereof.

3. The patch support platform with adaptive posture adjustment according to claim 1, characterized in that: The constant temperature heating platform is also provided with a temperature sensor.

4. The patch support platform with adaptive posture adjustment according to claim 1, characterized in that: The constant temperature heating platform also has a vacuum pumping mechanism for adsorbing the substrate.

5. The patch support platform with adaptive posture adjustment according to claim 1, characterized in that: The patch support platform is arranged on the support platform position adjustment mechanism, the support platform position adjustment mechanism includes a mobile platform, an X-axis translation mechanism and a Y-axis translation mechanism, the adaptive base is arranged on the mobile platform, the mobile platform is arranged on the X-axis translation mechanism, and the X-axis translation mechanism is arranged on the Y-axis translation mechanism.

6. The patch support platform with adaptive posture adjustment according to claim 5, characterized in that: The X-axis translation mechanism and the Y-axis translation mechanism both adopt linear motor modules.

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