Hot-pressing bonding aluminum die

Abstract

The utility model discloses a hot-press bonding aluminum die, which relates to the technical field of circuit board production and comprises a base, two supporting plates are symmetrically and fixedly connected to the top of the base, a top plate is fixedly connected to the tops of the supporting plates, a push rod penetrates through the top plate and is in sliding connection with the top plate, and a laminated plate is fixedly connected to the bottom end of the push rod. A forming groove is slidably connected to the top of the base, a first electric cylinder is installed on one supporting plate, an output shaft of the first electric cylinder is fixedly connected with a first rod, the other end of the first rod is fixedly connected to the outer side wall of the forming groove, a through groove is formed in the surface of the other supporting plate, and the forming groove penetrates out of the supporting plate through the through groove. A plurality of fans are fixedly connected to the top of the through groove; through work of the multiple fans, air cooling of the circuit board in the forming groove is achieved, and the cooling speed of the circuit board is increased, so that the circuit board is conveniently and rapidly taken out of the forming groove, and hot pressing of the next circuit board is conveniently and rapidly achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, in particular to a hot pressing and bonding aluminum mold. Background Art

[0002] In the manufacturing process of circuit boards, multiple layers of substrates, copper foils and pre-processed circuit patterns need to be stacked together and processed under high temperature and high pressure to make them firmly bonded together. Lamination is a very important step in circuit board manufacturing, which directly affects the quality and performance of the circuit board.

[0003] After searching, a Chinese patent application, a utility model patent with publication number CN216852554U, discloses a laminating device for metal-based printed circuit boards, which relates to the technical field of circuit board processing equipment, including a base frame, and also includes: a laminate, which is arranged on the top of the base frame; a lifting mechanism, one end of which is connected to the base frame, and the other end is connected to the laminate, which is used to drive the laminate to move longitudinally; a placement plate, which is arranged on the top of the base frame; a buffering and limiting mechanism, one end of which is connected to the base frame, and the other end of which is connected to the placement plate, which is used to buffer and limit the pressure on the placement plate. The utility model places the circuit board body on the placement plate, starts the lifting mechanism to drive the laminate to move longitudinally, and the laminate laminates the circuit board body. The buffering and limiting mechanism buffers the pressure on the circuit board body to prevent the circuit board body from being damaged by sudden large pressure.

[0004] In the above application documents, after the lamination of the circuit board is completed, the circuit board needs to be manually removed from the placement plate. However, the temperature of the circuit board that has just been laminated is high and it cannot be taken down directly. The device is not provided with a cooling structure, so it takes a long time for natural cooling, thereby reducing production efficiency. For this reason, the utility model provides a hot pressing bonding aluminum mold. Utility Model Content

[0005] The technical problem solved by the utility model is as follows: in the prior art, after lamination of the circuit board is completed, the circuit board needs to be manually removed from the placement plate, and the temperature of the circuit board that has just been laminated is high and cannot be taken down directly, and the device is not provided with a cooling structure, so it takes a long time for natural cooling, thereby reducing production efficiency.

[0006] The utility model can be implemented through the following technical scheme: a hot-pressed aluminum mold, including a base, two support plates are symmetrically fixedly connected to the top of the base, a top plate is fixedly connected to the top of the support plate, a push rod passes through and is slidably connected to the top plate, and the bottom end of the push rod is fixedly connected to a laminate; a molding groove is slidably connected to the top of the base, a first electric cylinder is installed on one of the support plates, the output shaft of the first electric cylinder is fixedly connected to a rod No. 1, and the other end of the rod No. 1 is fixedly connected to the outer side wall of the molding groove, and a through groove is arranged on the surface of the other support plate, the through groove is used for the molding groove to pass through the support plate, and a plurality of fans are fixedly connected to the top of the through groove.

[0007] A further technical improvement of the utility model is that the molding groove is composed of a bottom plate, a front side plate, a rear side plate and a left side plate, the front side plate and the rear side plate are symmetrically fixed to the front and rear sides of the bottom plate, and the left side plate is fixed to the left side of the bottom plate.

[0008] A further technical improvement of the utility model is that the laminated plate is composed of a push plate and a hot pressing plate, and the hot pressing plate is fixedly connected to the bottom of the push plate.

[0009] A further technical improvement of the utility model is that a right baffle is arranged on the right side of the push plate, a sliding groove is opened on the side wall of the right baffle, a sliding block is fixedly connected to the side wall of the push plate, and the sliding block is slidably arranged in the sliding groove, a spring is fixedly connected to the top of the sliding block, and the top end of the spring is fixedly connected to the top inner wall of the sliding groove.

[0010] A further technical improvement of the utility model is that the outer contour of the hot pressing plate is the same as the inner contour of the forming groove, and the length of the right baffle is greater than the distance between the front side plate and the rear side plate.

[0011] A further technical improvement of the utility model is that a second electric cylinder is fixedly connected to the top of the top plate, and an output shaft of the second electric cylinder is fixedly connected to the top end of the push rod.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] In the utility model, after the lamination of the circuit board is completed, the laminate returns to the initial position, and the first electric cylinder drives the No. 1 rod and the molding groove to move toward the direction of the fan. Through the operation of multiple fans, the circuit board in the molding groove is air-cooled, which speeds up the cooling speed of the circuit board, thereby facilitating and quickly taking it out of the molding groove, and facilitating and quickly realizing hot pressing of the next circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings.

[0015] Figure 1 It is a schematic diagram of the external structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the cross-sectional structure of the connection between the middle laminate and the right baffle of the utility model;

[0017] Figure 3 It is a structural schematic diagram of the forming groove in the utility model.

[0018] In the figure: 1. base; 2. support plate; 3. top plate; 4. push rod; 5. forming groove; 6. No. 1 rod; 7. through groove; 8. fan; 9. bottom plate; 10. front side plate; 11. rear side plate; 12. left side plate; 13. push plate; 14. hot pressing plate; 15. right baffle; 16. slide groove; 17. slider; 18. spring. DETAILED DESCRIPTION

[0019] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose of the utility model, the specific implementation method, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0020] See also Figure 1-Figure 3 As shown, a hot pressing and bonding aluminum mold comprises a base 1, the bottom of the base 1 is fixedly connected with supporting feet, the top of the base 1 is symmetrically fixedly connected with two supporting plates 2 on the left and right sides, the top of the supporting plate 2 is fixedly connected with a top plate 3, the top plate 3 is penetrated and slidably connected with a push rod 4, the top of the top plate 3 is fixedly connected with a second electric cylinder, the output shaft of the second electric cylinder is fixedly connected to the top of the push rod 4, and the push rod 4 is driven by the second electric cylinder; the bottom end of the push rod 4 is fixedly connected with a laminate; by stacking multiple layers of substrate, copper foil and pre-processed circuit pattern on the top of the base 1, and then starting the second electric cylinder, so that the second electric cylinder drives the push rod 4 and the laminate to move downward, through high temperature and high pressure, they are firmly bonded together, thereby realizing hot pressing of the circuit board.

[0021] Furthermore, a molding groove 5 is slidably connected to the top of the base 1, and a support plate 2 is installed with a first electric cylinder. The output shaft of the first electric cylinder is fixedly connected to a rod 6. The other end of the rod 6 penetrates and is slidably connected to the side wall of the support plate 2. The other end of the rod 6 is fixedly connected to the outer side wall of the molding groove 5. A through groove 7 is provided on the surface of the other support plate 2. The through groove 7 is used for the molding groove 5 to pass through the support plate 2. A plurality of fans 8 are fixedly connected to the top of the through groove 7. When the lamination of the circuit board is completed, the laminate returns to the initial position, and then the first electric cylinder is started, so that the first electric cylinder drives the rod 6 and the molding groove 5 to move in the direction of the fan 8. Through the operation of the plurality of fans 8, the circuit board in the molding groove 5 is air-cooled, which accelerates the cooling speed of the circuit board, thereby facilitating and quickly removing it from the molding groove 5, and facilitating and quickly realizing hot pressing of the next circuit board.

[0022] In the above, the molding groove 5 is composed of a bottom plate 9, a front side plate 10, a rear side plate 11 and a left side plate 12. The front side plate 10 and the rear side plate 11 are symmetrically fixed to the front and rear sides of the bottom plate 9, and the left side plate 12 is fixed to the left side of the bottom plate 9. Initially, the right side wall of the left side plate 12 and the left side wall of the laminate are in the same vertical plane, and the distance between the front side plate 10 and the rear side plate 11 is just enough to accommodate the laminate.

[0023] In the above description, the laminating plate is composed of a push plate 13 and a hot pressing plate 14 , and the hot pressing plate 14 is fixedly connected to the bottom of the push plate 13 , and the push rod 4 is fixedly connected to the top of the push plate 13 .

[0024] In order to block the right side of the forming groove 5, a right baffle 15 is provided on the right side of the push plate 13, and a slide groove 16 is opened on the side wall of the right baffle 15. A slider 17 is fixedly connected to the side wall of the push plate 13, and the slider 17 is slidably set in the slide groove 16. A spring 18 is fixedly connected to the top of the slider 17, and the top of the spring 18 is fixedly connected to the top inner wall of the slide groove 16; the outer contour of the hot pressing plate 14 is the same as the inner contour of the forming groove 5, and the length of the right baffle 15 is greater than the distance between the front side plate 10 and the rear side plate 11; when in use, when the second electric cylinder drives the push rod 4 and the laminate to move downward, the right baffle 15 will slide downward along the right side wall of the front side plate 10 and the rear side plate 11, and block the right side of the forming groove 5. As the laminate moves downward, the slider 17 will slide downward in the slide groove 16, so that the spring 18 is stretched, which facilitates the laminate to achieve lamination of the circuit board.

[0025] When the utility model is in use, the multi-layer substrate, copper foil and pre-processed circuit pattern are stacked in the molding groove 5 on the top of the base 1, and then the second electric cylinder is started, so that the second electric cylinder drives the push rod 4 and the laminate to move downward, and through high temperature and high pressure, they are firmly bonded together, thereby realizing hot pressing of the circuit board; when the second electric cylinder drives the push rod 4 and the laminate to move downward, the right baffle 15 will slide downward along the right side wall of the front side plate 10 and the rear side plate 11, and realize blocking the right side of the molding groove 5, and as the laminate moves downward, the slider 17 will slide downward in the slide groove 16, so that the spring 18 is stretched, so that the laminate can realize lamination of the circuit board; when the lamination of the circuit board is completed, the laminate returns to the initial position, and then the first electric cylinder is started, so that the first electric cylinder drives the No. 1 rod 6 and the molding groove 5 to move toward the direction of the fan 8, and through the operation of multiple fans 8, the circuit board in the molding groove 5 is air-cooled, and the cooling speed of the circuit board is accelerated, so that it is convenient to quickly remove it from the molding groove 5, and conveniently and quickly realize hot pressing of the next circuit board.

[0026] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. Hot-pressing aluminum mold, characterized by: The invention comprises a base (1), wherein two support plates (2) are symmetrically fixedly connected to the top of the base (1), a top plate (3) is fixedly connected to the top plate (2), a push rod (4) passes through and is slidably connected to the top plate (3), and a laminate is fixedly connected to the bottom end of the push rod (4); a molding groove (5) is slidably connected to the top of the base (1), a first electric cylinder is installed on one of the support plates (2), the output shaft of the first electric cylinder is fixedly connected to a rod (6), and the other end of the rod (6) is fixedly connected to the outer wall of the molding groove (5); a through groove (7) is arranged on the surface of the other support plate (2), and the through groove (7) is used for the molding groove (5) to pass through the support plate (2), and a plurality of fans (8) are fixedly connected to the top of the through groove (7).

2. The heat-compression bonding aluminum mold according to claim 1, characterized in that: The molding groove (5) is composed of a bottom plate (9), a front side plate (10), a rear side plate (11) and a left side plate (12); the front side plate (10) and the rear side plate (11) are symmetrically fixed to the front and rear sides of the bottom plate (9); and the left side plate (12) is fixed to the left side of the bottom plate (9).

3. The heat-compression bonding aluminum mold according to claim 2, characterized in that: The laminating plate is composed of a push plate (13) and a hot pressing plate (14), and the hot pressing plate (14) is fixedly connected to the bottom of the push plate (13).

4. The heat-compression bonding aluminum mold according to claim 3, characterized in that: A right baffle (15) is arranged on the right side of the push plate (13), a slide groove (16) is opened on the side wall of the right baffle (15), a slider (17) is fixedly connected to the side wall of the push plate (13), and the slider (17) is slidably arranged in the slide groove (16), a spring (18) is fixedly connected to the top of the slider (17), and the top end of the spring (18) is fixedly connected to the top inner wall of the slide groove (16).

5. The heat-compression bonding aluminum mold according to claim 4, characterized in that: The outer contour of the hot pressing plate (14) is the same as the inner contour of the forming groove (5), and the length of the right baffle plate (15) is greater than the distance between the front side plate (10) and the rear side plate (11).

6. The heat-compression bonding aluminum mold according to claim 1, characterized in that: A second electric cylinder is fixedly connected to the top of the top plate (3), and an output shaft of the second electric cylinder is fixedly connected to the top end of the push rod (4).

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