Chip packaging structure

Abstract

The utility model relates to the technical field of semiconductors, in particular to a chip packaging structure. The chip packaging structure comprises a substrate, a chip, a first photocuring layer and a light-transmitting layer, the chip is provided with a first surface and a second surface which are opposite to each other, the chip is arranged on the substrate through the first surface, and the chip is electrically coupled with the substrate; the first photocuring layer is arranged on the substrate and covers the peripheral side of the chip and the part, close to the peripheral side of the chip, of the second surface; the light-transmitting layer is arranged on the first photocuring layer and is distributed opposite to the chip; wherein the light-transmitting layer, the first light-curing layer and the part, not covered by the first light-curing layer, of the second surface are jointly surrounded to form a functional space. According to the chip packaging structure, the problem that light is reflected by the adhesive layer for arranging the light-transmitting layer on the chip can be solved, so that the performance of the chip packaging structure is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a chip packaging structure. Background Art

[0002] In the field of packaging technology for light emitting chips or light sensing chips, a light-transmitting layer (eg, a transparent glass plate) is usually required as a light emitting or light sensing window. In the related art, the light-transmitting layer is usually disposed on the chip through a glue layer.

[0003] However, the adhesive layer used to set the light-transmitting layer on the chip is prone to reflect light, thereby causing adverse effects on the performance of the chip packaging structure. Utility Model Content

[0004] The utility model aims to provide a chip packaging structure, which can improve the problem of light reflection caused by the adhesive layer used to set the light-transmitting layer on the chip, so as to ensure the performance of the chip packaging structure.

[0005] The embodiment of the utility model is achieved as follows:

[0006] The utility model provides a chip packaging structure, comprising:

[0007] substrate;

[0008] A chip, wherein the chip has a first surface and a second surface opposite to each other, the chip is disposed on the substrate with the first surface, and the chip is electrically coupled to the substrate;

[0009] a first photocurable layer, the first photocurable layer being disposed on the substrate, and the first photocurable layer covering the outer peripheral side of the chip and a portion of the second surface close to the outer peripheral side of the chip; and

[0010] The light-transmitting layer is arranged on the first photocuring layer and is distributed relative to the chip; wherein the light-transmitting layer, the first photocuring layer and the portion of the second surface not covered by the first photocuring layer together surround and form a functional space.

[0011] In an optional embodiment, the chip packaging structure further includes a second photocurable layer disposed on the first photocurable layer, the light-transmitting layer is disposed on the first photocurable layer through the second photocurable layer, and the light-transmitting layer, the second photocurable layer, the first photocurable layer and the portion of the second surface not covered by the first photocurable layer are surrounded together to form a functional space; wherein,

[0012] The second photocurable layer is provided with grooves.

[0013] In an optional embodiment, a plurality of photocuring blocks are arranged on the first photocuring layer, the plurality of photocuring blocks are spaced apart, the plurality of photocuring blocks form a second photocuring layer, and a groove is formed between two spaced apart photocuring blocks.

[0014] In an optional embodiment, the first photocurable layer has a first side facing the functional space, and the second photocurable layer has a second side facing the functional space, and the distance between the second side and the central axis of the functional space is greater than the distance between the first side and the central axis of the functional space.

[0015] In an optional embodiment, the chip packaging structure further includes a second photocurable layer disposed on the first photocurable layer, and the second photocurable layer surrounds the outer peripheral side of the light-transmitting layer.

[0016] In an optional embodiment, a gap is formed between the second photocurable layer and the light-transmitting layer, and the gap is filled with light-shielding glue.

[0017] In an optional embodiment, the chip and the substrate are electrically coupled via metal wires; and the first photocured layer covers the metal wires.

[0018] In an optional embodiment, the chip packaging structure also includes a second photocurable layer arranged on the first photocurable layer, the light-transmitting layer is arranged on the first photocurable layer through the second photocurable layer, or the second photocurable layer is surrounded by the outer periphery of the light-transmitting layer; the first photocurable layer covers a part of the metal wire, and the second photocurable layer covers another part of the metal wire.

[0019] In an optional embodiment, a bonding pad is formed on the substrate, and one end of the metal wire is connected to the bonding pad.

[0020] In an alternative embodiment, the chip and the substrate are electrically coupled via a plurality of metal lines.

[0021] The beneficial effects of the chip packaging structure of the embodiment of the utility model include: the chip packaging structure of the embodiment of the utility model includes a substrate, a chip, a first photocurable layer and a light-transmitting layer, the chip has a first surface and a second surface relative to each other, the chip is arranged on the substrate with the first surface, and the chip is electrically coupled to the substrate; the first photocurable layer is arranged on the substrate, and the first photocurable layer covers the outer peripheral side of the chip and the part of the second surface close to the outer peripheral side of the chip; the light-transmitting layer is arranged on the first photocurable layer and is distributed relative to the chip; wherein the light-transmitting layer, the first photocurable layer and the part of the second surface not covered by the first photocurable layer are surrounded together to form a functional space. By setting the first photocurable layer, the light-transmitting layer and the chip can be separated, and the adhesive layer used to fix the light-transmitting layer does not need to be directly arranged on the chip, so as to improve the adverse effects of the adhesive layer on the photosensitivity or luminescence of the chip due to the reflection of light, thereby ensuring the performance of the chip packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 This is a schematic diagram of the chip packaging structure in the embodiment of the utility model;

[0024] Figure 2 This is a manufacturing flow chart of the chip packaging structure in the embodiment of the utility model;

[0025] Figure 3 This is a schematic diagram of using a first light-curing mold to make a chip packaging structure in an embodiment of the utility model;

[0026] Figure 4 This is a schematic structural diagram of a chip packaging structure in another embodiment of the present invention;

[0027] Figure 5 This is a manufacturing flow chart of a chip packaging structure in another embodiment of the utility model;

[0028] Figure 6 This is a schematic structural diagram of a chip packaging structure in another embodiment of the present invention;

[0029] Figure 7 This is a manufacturing flow chart of a chip packaging structure in another embodiment of the present invention.

[0030] Icon: 010-chip packaging structure; 100-substrate; 200-chip; 210-first surface; 220-second surface; 230-functional space; 300-first photocuring layer; 301-first side; 400-light-transmitting layer; 500-second photocuring layer; 501-second side; 502-gap; 510-groove; 520-photocuring block; 600-metal wire; 610-bonding pad; 700-first photocuring mold; 710-light shield; 720-light source; 730-first demoulding rubber column; 800-photocuring liquid; a-central axis. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of the present utility model, it should be noted that the terms "upper", "lower", "inner", "outer", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Please refer to Figure 1 This embodiment provides a chip packaging structure 010, which is a photosensitive chip packaging structure. Of course, in other embodiments, the chip packaging structure 010 can also be a light-emitting chip packaging structure, which is not specifically limited here.

[0037] The chip package structure 010 includes a substrate 100 and a chip 200 . The chip 200 has a first surface 210 and a second surface 220 opposite to each other. The chip 200 is disposed on the substrate 100 with the first surface 210 , and the chip 200 is electrically coupled to the substrate 100 .

[0038] The chip 200 is disposed on the substrate 100 and electrically coupled to the substrate 100 in a manner similar to the related art; illustratively, the chip 200 and the substrate 100 are electrically coupled via a metal wire 600 .

[0039] Furthermore, a bonding pad 610 is formed on the substrate 100 , and one end of the metal wire 600 is connected to the bonding pad 610 .

[0040] Optionally, the second surface 220 of the chip 200 has a connection pad (not shown), and the other end of the metal wire 600 is connected to the connection pad.

[0041] The number of metal wires 600 electrically coupling the chip 200 and the substrate 100 can be selected as needed, for example, one, two, three, four, etc. Figure 1 Each chip 200 shown in the figure is electrically coupled to the substrate 100 via two metal wires 600 .

[0042] The chip packaging structure 010 of this embodiment further includes a first photocurable layer 300 and a light-transmitting layer 400. The first photocurable layer 300 is formed on the substrate 100, and the first photocurable layer 300 covers the outer peripheral side of the chip 200 and the second surface 220 of the chip 200 close to the outer peripheral side of the chip 200, and is distributed circumferentially around the chip 200 to expose the functional area in the middle of the chip 200; the light-transmitting layer 400 has a third surface and a fourth surface relative to each other, and the light-transmitting layer 400 is arranged on the first photocurable layer 300 with the third surface, and the third surface of the light-transmitting layer 400 is distributed relative to the functional area of ​​the chip 200; wherein, the third surface of the light-transmitting layer 400, the first photocurable layer 300 and the portion (functional area) of the second surface 220 of the chip 200 not covered by the first photocurable layer 300 together surround to form a functional space 230.

[0043] It should be noted that the light-transmitting layer 400 may be bonded to the first photocurable layer 300 via an adhesive layer.

[0044] By setting the first photocuring layer 300, the light-transmitting layer 400 and the chip 200 can be separated. The adhesive layer for fixing the light-transmitting layer 400 does not need to be directly set on the chip 200, but is set between the first photocuring layer 300 and the light-transmitting layer 400 to improve the adverse effects of the light reflection of the adhesive layer on the photosensitivity or luminescence of the chip 200, thereby ensuring the performance of the chip packaging structure 010.

[0045] It should be noted that, since the chip packaging structure 010 is a photosensitive chip packaging structure, the functional area of ​​the chip 200 mentioned above refers to the photosensitive area of ​​the chip 200. It should be understood that in other embodiments, the chip packaging structure 010 is a light-emitting chip packaging structure, and the functional area of ​​the chip 200 refers to the light-emitting area of ​​the chip 200.

[0046] Optionally, the light-transmitting layer 400 may be glass, or other transparent packaging materials, which are not specifically limited herein.

[0047] Optionally, the metal wire 600 is covered by the first photocurable layer 300. This arrangement can ensure the stability of the metal wire 600 electrically coupling the chip 200 and the substrate 100.

[0048] Optionally, the first photocurable layer 300 may be a UV photocurable layer (ultraviolet light curable layer).

[0049] Please refer to Figure 2 and Figure 3 , the manufacturing method of the chip packaging structure 010 of this embodiment includes:

[0050] 1. Mount the chip 200 on the substrate 100 and use metal wires 600 to electrically couple the chip 200 and the substrate 100 .

[0051] 2. Transfer the substrate 100 with the chip 200 mounted thereon to the first photocuring mold 700, wherein the first photocuring mold 700 includes a light shield 710 and a light source 720 (e.g., a UV lamp) disposed on the top of the light shield 710, and a first demolding rubber column 730 connected to the top of the light shield 710; when transferring the substrate 100 with the chip 200 mounted thereon to the first photocuring mold 700, the first demolding rubber column 730 is held against the functional area of ​​the chip 200.

[0052] 3. The loaded first light-curing mold 700 is gradually moved downward and immersed in the light-curing liquid 800, and the light source 720 is turned on during the immersion, so as to form a light-curing layer on the substrate 100 layer by layer from bottom to top, until the light-curing layer covers the second surface 220 of the chip 200; wherein, Figure 3 The arrow in the figure indicates the direction in which the first photocuring mold 700 takes the substrate 100 provided with the chip 200 and immerses it into the photocuring liquid 800 .

[0053] 4. Take out the first photocurable mold 700 from the photocurable liquid 800, and then demold and take out the substrate 100 with the chip 200 mounted thereon from the first photocurable mold 700. After the first demolding rubber column 730 and the chip 200 are separated, the functional area not covered by the photocurable layer can be left.

[0054] 5. Mount the light-transmitting layer 400 on the light-curing layer.

[0055] It should be noted that after the light-transmitting layer 400 is mounted, the chip packaging structure 010 can also be cut. In this way, the overall mounting of the light-transmitting layer 400 can be achieved, which can reduce the process difficulty and improve the packaging efficiency. Among them, the cutting method is similar to the related technology and will not be repeated here.

[0056] In order to further reduce the risk of the adhesive of the light-transmitting layer 400 contaminating the chip 200. Figure 4 and Figure 5In other embodiments, the chip packaging structure 010 further includes a second photocurable layer 500 disposed on the first photocurable layer 300, the light-transmitting layer 400 is disposed on the first photocurable layer 300 through the second photocurable layer 500, and the light-transmitting layer 400, the second photocurable layer 500, the first photocurable layer 300 and the portion of the second surface 220 not covered by the first photocurable layer 300 are surrounded together to form a functional space 230; wherein the second photocurable layer 500 is provided with a groove 510. In this way, the groove 510 of the second photocurable layer 500 can be used to receive excess glue to reduce the glue flowing to the chip 200, and the risk of glue contaminating the chip 200 by mounting the light-transmitting layer 400 can be further reduced.

[0057] Furthermore, the first photocurable layer 300 has a first side 301 facing the functional space 230, and the second photocurable layer 500 has a second side 501 facing the functional space 230, and the distance between the second side 501 and the central axis a of the functional space 230 is greater than the distance between the first side 301 and the central axis a of the functional space 230. In this way, the side of the second photocurable layer 500 facing the functional space 230 and the side of the first photocurable layer 300 facing the functional space 230 jointly form a step portion, and even if the glue used to mount the light-transmitting layer 400 flows down along the side of the second photocurable layer 500 facing the functional space 230, it will be received by the first photocurable layer 300, effectively reducing the problem of glue flowing to the chip 200, that is, effectively reducing the risk of glue contaminating the chip 200 by mounting the light-transmitting layer 400.

[0058] Optionally, the second photocurable layer 500 may be formed by a plurality of photocurable blocks 520; specifically, a plurality of photocurable blocks 520 are disposed on the first photocurable layer 300, the plurality of photocurable blocks 520 are spaced apart, the plurality of photocurable blocks 520 form the second photocurable layer 500, and a groove 510 is formed between two spaced apart photocurable blocks 520. The second photocurable layer 500 is obtained by directly forming a plurality of photocurable blocks 520, which can improve the efficiency of packaging.

[0059] In some embodiments, the metal wire 600 is only covered by the first photocurable layer 300 . In other embodiments, a portion of the metal wire 600 is covered by the first photocurable layer 300 , and another portion of the metal wire 600 is covered by the second photocurable layer 500 .

[0060] It should be noted that, in some embodiments, the process flow of manufacturing the chip packaging structure 010 with the second photocurable layer 500 is similar to that of the embodiment without the second photocurable layer 500, except that the top of the light shield 710 of the first photocurable mold 700 is further connected with a second demolding rubber column (not shown in the figure), and when the substrate 100 with the chip 200 mounted thereon is placed in the light shield 710, the position of the second demolding rubber column corresponds to the position of the groove 510 to be formed subsequently, and the first light-curable mold 700 is gradually formed. After the photocuring layer 300 is formed, the photocuring liquid 800 can soak into the second demolding rubber column. The photocuring structure formed on the periphery of the second demolding rubber column is the photocuring block 520. When the photocuring block 520 reaches the set height, the first photocuring mold 700 is taken out from the photocuring liquid 800, and then the substrate 100 with the chip 200 mounted is demolded and taken out from the first photocuring mold 700, so that the chip 200 mounting structure with the second photocuring layer 500 having the groove 510 formed on the first photocuring layer 300 can be obtained.

[0061] Of course, in other embodiments, the process flow of manufacturing the chip packaging structure 010 with the second photocurable layer 500 is different from that of manufacturing the embodiment without the second photocurable layer 500 in that the first photocurable mold 700 and the second photocurable mold (not shown) need to be used in sequence, and the structures of the first photocurable mold 700 and the second photocurable mold are similar, wherein a second release rubber is provided on the top of the light shield of the second photocurable mold; when manufacturing the chip packaging structure 010 with the second photocurable layer 500, the first photocurable mold 700 is first used to manufacture the chip packaging structure 010 with the first photocurable layer 300 formed thereon; The chip structure is then demolded and taken out from the first photocuring mold 700, and placed on the light shield of the second photocuring mold, and the second demoulding rubber is pressed against the first photocuring layer 300, and the position where the second demoulding rubber presses against the first photocuring layer 300 is the position where the groove 510 is subsequently formed. After the second photocuring layer 500 is formed in the same manner as the first photocuring layer 300, the substrate 100 with the chip 200 mounted thereon is demoulded and taken out from the second photocuring mold, and a chip packaging structure 010 having the second photocuring layer 500 and the second photocuring layer 500 having the groove 510 can be manufactured.

[0062] In some other embodiments, the grooves 510 on the second photocurable layer 500 may be formed by cutting on the second photocurable layer 500 which is completely formed on the first photocurable layer 300 and does not have the grooves 510 , which is not specifically limited here.

[0063] To reduce side light, refer to Figure 6 and Figure 7In other embodiments, the chip packaging structure 010 further includes a second photocurable layer 500 disposed on the first photocurable layer 300, and the second photocurable layer 500 surrounds the outer periphery of the light-transmitting layer 400. Such a configuration can also reduce the overall thickness of the chip packaging structure 010.

[0064] Furthermore, a gap 502 is formed between the second photocurable layer 500 and the light-transmitting layer 400, and the gap 502 is filled with a light-shielding glue (not shown). The light-shielding glue may refer to a light-proof glue, for example, a black glue. In this arrangement, not only can the light-shielding glue reduce the problem of light entering from the side of the light-transmitting layer 400, but also the light-shielding glue can be arranged in the gap 502 between the second photocurable layer 500 and the light-transmitting layer 400 by filling the glue. The filling glue method is simple and easy to operate, which is conducive to improving the mounting efficiency.

[0065] Optionally, the second photocurable layer 500 can be formed secondarily on the first photocurable layer 300 after the first photocurable layer 300 is formed first; or the second photocurable layer 500 can be formed once while forming the first photocurable layer 300 by adjusting the shape of the first demolding rubber column 730.

[0066] Optionally, a portion of the metal wire 600 is covered by the first photocurable layer 300 , and another portion of the metal wire 600 is covered by the second photocurable layer 500 .

[0067] Optionally, the second photocurable layer 500 may be a UV photocurable layer (ultraviolet light curable layer).

[0068] To sum up, the chip packaging structure 010 of the present invention can separate the light-transmitting layer 400 and the chip 200 through the setting of the photocuring layer, and the adhesive layer used to fix the light-transmitting layer 400 does not need to be directly set on the chip 200, so as to improve the adverse effects of the adhesive layer on the photosensitivity or luminescence of the chip 200 caused by the reflection of light, thereby ensuring the performance of the chip packaging structure 010.

[0069] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip packaging structure, characterized in that: include: substrate(100); A chip (200), the chip (200) having a first surface (210) and a second surface (220) that are opposite to each other, the chip (200) being disposed on the substrate (100) with the first surface (210), and the chip (200) being electrically coupled to the substrate (100); a first photocurable layer (300), the first photocurable layer (300) being disposed on the substrate (100), and the first photocurable layer (300) covering the outer peripheral side of the chip (200) and a portion of the second surface (220) close to the outer peripheral side of the chip (200); and A light-transmitting layer (400), wherein the light-transmitting layer (400) is disposed on the first photocuring layer (300) and is distributed relative to the chip (200); wherein the light-transmitting layer (400), the first photocuring layer (300) and a portion of the second surface (220) not covered by the first photocuring layer (300) together surround and form a functional space (230).

2. The chip packaging structure according to claim 1, characterized in that: The chip packaging structure further comprises a second photocurable layer (500) arranged on the first photocurable layer (300); the light-transmitting layer (400) is arranged on the first photocurable layer (300) through the second photocurable layer (500); the light-transmitting layer (400), the second photocurable layer (500), the first photocurable layer (300) and a portion of the second surface (220) not covered by the first photocurable layer (300) together surround the functional space (230); wherein: The second photocurable layer (500) is provided with a groove (510).

3. The chip packaging structure according to claim 2, characterized in that: A plurality of photocuring blocks (520) are arranged on the first photocuring layer (300), the plurality of photocuring blocks (520) are distributed at intervals, the plurality of photocuring blocks (520) form the second photocuring layer (500), and the groove (510) is formed between two of the photocuring blocks (520) distributed at intervals.

4. The chip packaging structure according to claim 2, characterized in that: The first photocurable layer (300) has a first side (301) facing the functional space (230), and the second photocurable layer (500) has a second side (501) facing the functional space (230), and the distance between the second side (501) and the central axis (a) of the functional space (230) is greater than the distance between the first side (301) and the central axis (a) of the functional space (230).

5. The chip packaging structure according to claim 1, characterized in that: The chip packaging structure further comprises a second photocurable layer (500) arranged on the first photocurable layer (300), and the second photocurable layer (500) surrounds the outer peripheral side of the light-transmitting layer (400).

6. The chip packaging structure according to claim 5, characterized in that: A gap (502) is formed between the second photocurable layer (500) and the light-transmitting layer (400), and the gap (502) is filled with light-shielding glue.

7. The chip packaging structure according to claim 1, characterized in that: The chip (200) and the substrate (100) are electrically coupled via a metal wire (600); and the first photocurable layer (300) covers the metal wire (600).

8. The chip packaging structure according to claim 7, characterized in that: The chip packaging structure further comprises a second photocurable layer (500) arranged on the first photocurable layer (300); the light-transmitting layer (400) is arranged on the first photocurable layer (300) through the second photocurable layer (500), or the second photocurable layer (500) surrounds the outer periphery of the light-transmitting layer (400); the first photocurable layer (300) covers a part of the metal wire (600), and the second photocurable layer (500) covers another part of the metal wire (600).

9. The chip packaging structure according to claim 7 or 8, characterized in that: A bonding pad (610) is formed on the substrate (100), and one end of the metal wire (600) is connected to the bonding pad (610).

10. The chip packaging structure according to claim 7 or 8, characterized in that: The chip (200) and the substrate (100) are electrically coupled via a plurality of metal wires (600).

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