Desktop temperature control laser tin soldering equipment

Abstract

The utility model discloses desktop temperature control laser tin soldering equipment, which belongs to the field of electronic detonator manufacturing equipment and comprises a welding workbench (1), a conveying channel (2) arranged on the welding workbench (1), a conveying tool (3) arranged on the conveying channel (2), a laser welding unit arranged on one side above the conveying channel (2), and a temperature control unit arranged on the other side above the conveying channel (2). The laser welding unit comprises a laser transmitter (6), an infrared temperature sensor (7) and a lighting unit (8), and a tin welding station (4) is arranged on the other side of the laser welding unit; the tin soldering machine is not contacted with a workpiece in the tin soldering process, so that no contact stress is generated; heat radiation is small, and no static electricity is generated; the laser heating speed is high, and the welding speed is high; narrow areas and micro elements can be welded, and the space limitation is small; consumables are few, and more cost is saved; preferably, a CCD visual system is adopted, visual programming is achieved, and operation and control are easy; the system is smaller in size, simple to operate and more flexible to use; the device is suitable for being combined with various assembly lines.

Description

Technical Field

[0001] The utility model relates to the field of electronic detonator manufacturing equipment, in particular to a desktop temperature-controlled laser soldering equipment. Background Art

[0002] During the production of electronic detonators, the electronic detonator chip module needs to be welded to the foot line. Currently, the solder paste heating welding process is used. During the welding process, a large number of tin beads and flux are easily produced and adhere to the front and back of the module solder joints and the surface of the equipment. Some tin beads are small and adhere to the back of the solder joints. They cannot be detected by the human eye, and the existing detection equipment cannot fully and accurately detect them, resulting in some module products with tin beads flowing into users, and errors in the high-voltage detonation process affecting user use. The workshop adopts auxiliary measures such as adding reflector strips and adhesive strips under the module, which can only partially reduce the adhesion of tin beads and fail to completely solve the problem of solder bead adhesion.

[0003] Specifically, tin beads sticking to the static conductive teeth can easily cause partial circuit short circuits, and the low-voltage detection part of the production line cannot be detected; if high-voltage detection is used for module detection, the detection time is long and the efficiency is greatly reduced; the high-voltage detection current is relatively high, and there is a greater safety risk in conducting high-voltage detection of modules with medicine on the production line. Summary of the invention

[0004] The purpose of the utility model is to provide a desktop temperature-controlled laser soldering device to solve the above problems.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows: a desktop temperature-controlled laser soldering equipment, including a welding workbench, a conveying channel is arranged on the welding workbench, a conveying tooling for carrying a chip module is arranged on the conveying channel, and a laser welding unit is arranged on one side above the conveying channel, and the laser welding unit includes a laser emitter, an infrared temperature sensor and a lighting unit, wherein the laser emitter is located at the top, the infrared temperature sensor and the lighting unit are respectively located on the left and right sides below the laser emitter, and a soldering station for applying solder paste is arranged on the other side above the conveying channel.

[0006] As a preferred technical solution, the laser emitter is a direct semiconductor water-cooled laser system.

[0007] Compared with traditional lasers, semiconductor lasers have higher photoelectric conversion efficiency, lower power consumption and cost savings. Direct semiconductor lasers are compact and easy to use. Due to their flexible laser output mode, they can be easily integrated with system equipment and can also prevent damage to their chips. The direct semiconductor water-cooled laser system is an existing commercially available device.

[0008] As a preferred technical solution, the infrared temperature sensor is a medium-temperature short-wave infrared tester.

[0009] It uses a short-wave detector, which is suitable for metal and ceramic material processing with a distribution ratio of up to 300:1. Different focal lengths can be selected to adjust the temperature measurement position; it has a short response time and strong high temperature resistance and anti-interference ability; it can effectively reduce the measurement deviation caused by the emissivity setting.

[0010] As a preferred technical solution, the lighting unit is a coaxial annular lighting source.

[0011] As a further preferred technical solution, the coaxial ring-shaped illumination light source is also provided with a light source controller. The coaxial ring-shaped illumination light source combined with laser welding is more efficient, and the light source controller can freely adjust the brightness; the light source controller is preferably placed under the welding workbench, which does not increase its extra space.

[0012] Compared with the prior art, the advantages of the utility model are: the utility model adopts an infrared temperature sensor to monitor the soldering point temperature in real time, ensure that the soldering point temperature is within the set welding temperature range, and prevent damage to the pad and components due to excessive temperature; the system does not contact the workpiece during soldering, and no contact stress is generated; the heat radiation is small, and no static electricity is generated; the laser heating speed is fast, the welding speed is fast, and the problem of solder bead adhesion is completely solved; narrow areas and micro components can be welded, and the space restriction is small; less consumables, more cost-saving; the system is smaller in size, simple to operate, and more flexible to use; suitable for use in combination with various assembly lines. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a side view of the utility model;

[0014] Figure 2 It is a top view of the utility model.

[0015] In the figure: 1. Welding workbench; 2. Conveying channel; 3. Conveying tooling; 4. Soldering station; 5. Chip module; 6. Laser transmitter; 7. Infrared temperature sensor; 8. Lighting unit. DETAILED DESCRIPTION

[0016] The utility model will be further described below in conjunction with the accompanying drawings. Example

[0017] See also Figure 1 and Figure 2, a desktop temperature-controlled laser soldering equipment, comprising a welding workbench 1, a conveying channel 2 is arranged on the welding workbench 1, a conveying tool 3 for carrying a chip module 5 is arranged on the conveying channel 2, a laser welding unit is arranged on one side above the conveying channel 2, the laser welding unit comprises a laser emitter 6, an infrared temperature sensor 7 and an illumination unit 8, wherein the laser emitter 6 is located at the top, the infrared temperature sensor 7 and the illumination unit 8 are respectively located on the left and right sides below the laser emitter 6, and a soldering station 4 for applying solder paste is arranged on the other side above the conveying channel 2;

[0018] In this embodiment, the laser emitter 6 is a commercially available direct semiconductor water-cooled laser system; the laser system integrates an optical system consisting of five optical coaxial (achromatic lens) components, including laser real-time temperature feedback, CCD coaxial positioning, laser and laser indicator light, and shadowless light;

[0019] The infrared temperature sensor 7 is a medium temperature short wave infrared tester, also commercially available;

[0020] The lighting unit 8 is a coaxial annular lighting source, and the coaxial annular lighting source is also provided with a light source controller;

[0021] The remaining conveying channel 2, conveying tooling 3, etc. are also prior art;

[0022] When in use, the conveying tool 3 with the chip module and the foot line passes through the conveying channel 2 to the soldering station 4 for applying solder paste. After the tinning is completed, it passes through the conveying channel 2 to the laser welding station for welding. The lighting unit 8 is turned on, and the laser emitter 6 emits a laser to heat and melt the solder paste. At the same time, the infrared temperature sensor 7 detects the temperature of the welding point. After reaching the set temperature, the laser emitter 6 is turned off to complete the welding.

[0023] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A desktop temperature-controlled laser soldering equipment, characterized in that: The invention comprises a welding workbench (1), a conveying channel (2) is arranged on the welding workbench (1), a conveying tool (3) for carrying a chip module (5) is arranged on the conveying channel (2), a laser welding unit is arranged on one side above the conveying channel (2), and the laser welding unit comprises a laser emitter (6), an infrared temperature sensor (7) and an illumination unit (8), wherein the laser emitter (6) is located at the top, the infrared temperature sensor (7) and the illumination unit (8) are respectively located on the left and right sides below the laser emitter (6), and a soldering station (4) for applying solder paste is arranged on the other side above the conveying channel (2).

2. The desktop temperature-controlled laser soldering equipment according to claim 1, characterized in that: The laser transmitter (6) is a direct semiconductor water-cooled laser system.

3. The desktop temperature-controlled laser soldering equipment according to claim 1, characterized in that: The infrared temperature sensor (7) is a medium-temperature short-wave infrared tester.

4. The desktop temperature-controlled laser soldering equipment according to claim 1, characterized in that: The lighting unit (8) is a coaxial annular lighting light source.

5. The desktop temperature-controlled laser soldering equipment according to claim 4, characterized in that: The coaxial annular illumination light source is also provided with a light source controller.

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