Illumination module and outdoor projection lamp

Abstract

The utility model discloses a lighting module which comprises a heat dissipation piece, a PCB and a light emitting piece, the heat dissipation piece comprises a heat dissipation body, the heat dissipation body is provided with a heat dissipation face and an installation face, the heat dissipation face and the installation face are oppositely arranged, and the heat dissipation face is connected with the outside; the PCB comprises a substrate and a light-emitting unit, the substrate is provided with a first base surface, a second base surface and a substrate side wall, and the first base surface is tightly connected with the mounting surface; the light-emitting unit is attached to the second base surface; the light-emitting part comprises a light-emitting body, a frame and a lens unit, the light-emitting body is provided with a light-emitting surface, the frame is arranged on the periphery of the light-emitting body and extends in the direction away from the light-emitting surface, the frame is fixedly connected to the second base surface, and the lens unit is arranged on the light-emitting unit; the heat dissipation body is provided with a heat dissipation side wall, the frame is provided with a frame side wall, the substrate side wall is arranged between the heat dissipation side wall and the frame side wall, and the substrate side wall is directly connected with the outside. According to the lighting module, the heat dissipation area and the laying area of the light-emitting units can be increased, more light-emitting units are arranged, the lighting efficiency is improved, and meanwhile the heat dissipation efficiency is improved. The utility model further discloses an outdoor projection lamp comprising the lighting module.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED lighting fixtures, and in particular relates to a lighting module and an outdoor floodlight. Background Art

[0002] LED lamps are widely used in outdoor places such as road lighting, building wall lighting and landscape lighting due to their high efficiency, long life, energy saving and environmental protection. Due to the particularity of the outdoor lighting installation environment, LED lamps must have stable and reliable waterproof performance. In addition, since the service life and photoelectric performance of LEDs are very sensitive to heat, LED lamps are also required to have good heat dissipation performance.

[0003] Existing LED heat dissipation devices generally fix the heat sink on the PCB board to increase the heat dissipation area for heat dissipation. In terms of waterproof structure, due to the connection relationship of the components, the size of the PCB board is usually smaller than the size of the lens cover, and the PCB board is fixed in a closed cavity composed of the heat sink and the lens cover. The LED lamp structure has the following problems: (1) Under the premise that the size of the heat sink remains unchanged, the PCB board cannot be made larger, that is, it is impossible to arrange more light sources to improve the power density of the lamp; (2) In terms of heat dissipation, heat conduction is achieved only by relying on one contact surface between the PCB board and the heat sink, so that the heat generated by the light source cannot be transferred to the heat sink in time; excessive heat accumulation will have a significant impact on the stability of the LED lamp. In order to solve the problem of untimely heat transfer, the volume of the lamp needs to be increased, which will lead to increased costs.

[0004] For example, the prior art discloses a new type of lens mounting structure of a street lamp module, which includes a lens, a sealing ring, a PCB board, a radiator and an input line. The PCB board is arranged between the lens and the radiator, the sealing ring is arranged around the PCB board and is located between the lens and the radiator, and the input line is electrically connected to the PCB board via the middle of the radiator. In this street lamp module, the PCB board is still wrapped in a closed cavity formed by the lens and the radiator, and the heat dissipation performance still needs to be improved. Utility Model Content

[0005] In order to solve the deficiencies of the prior art, the utility model provides a lighting module, in which the side wall of the substrate of the PCB board extends to the periphery of the light-emitting cavity, directly connects with the outside and performs heat exchange, which can increase the laying area of ​​the substrate, lay more light-emitting units, and improve lighting efficiency, and increase the heat dissipation area and improve heat dissipation efficiency. The utility model also provides an outdoor floodlight including the lighting module.

[0006] The technical effects to be achieved by the utility model are achieved through the following technical aspects:

[0007] In a first aspect, the utility model provides a lighting module, comprising:

[0008] The heat sink comprises a heat sink body, wherein the heat sink body is provided with a heat sink surface and a mounting surface, the heat sink surface is arranged opposite to the mounting surface, and the heat sink surface is connected to the outside;

[0009] A PCB board, comprising a substrate and a light-emitting unit, wherein the substrate is provided with a first base surface, a second base surface and a substrate side wall, the first base surface is arranged opposite to the second base surface, and the first base surface is closely connected to the mounting surface; the light-emitting unit is attached to the second base surface; and

[0010] A light emitting member, comprising a light emitting body, a frame and a lens unit, wherein the light emitting body is provided with a light emitting surface, the frame is provided at the periphery of the light emitting body and extends in a direction away from the light emitting surface, the frame is fixedly connected to the second base surface, and the lens unit is provided on the light emitting unit;

[0011] The heat dissipation body is provided with a heat dissipation side wall, the frame is provided with a frame side wall, the substrate side wall is arranged between the heat dissipation side wall and the frame side wall, and the substrate side wall is directly connected to the outside.

[0012] In some embodiments, the substrate sidewall is flush with or recessed in the heat dissipation sidewall.

[0013] In some embodiments, the heat dissipation body, the substrate and the frame are respectively provided with a first through hole, a second through hole and a third through hole, wherein the second through hole is close to the side wall of the substrate; a first fastener passes through the third through hole and the second through hole in sequence and is fixed in the first through hole, thereby fixing the PCB board and the light output element to the heat dissipation element in sequence.

[0014] In some embodiments, the light emitting body and the frame surround to form a light emitting chamber, the lens unit and the light emitting unit are disposed together in the light emitting chamber, and the lens unit and the light emitting unit are disposed in a one-to-one correspondence.

[0015] In some embodiments, the substrate sidewall is disposed outside the light output cavity.

[0016] In some embodiments, it also includes a first seal; the heat dissipation body is provided with a wire hole and a first sealing groove, the first sealing groove is recessed from the mounting surface toward the heat dissipation surface, and the first sealing groove is provided at the outer periphery of the wire hole, and the first seal is embedded in the first sealing groove.

[0017] In some embodiments, the first sealing groove and the first sealing member are both annular structures; the first sealing member and the first sealing groove have the following relationship:

[0018] 1.2B≤A≤1.3B;

[0019] 0.8D≤C≤1.0D;

[0020] Wherein, A is the height of the first sealing member, and B is the height of the first sealing groove;

[0021] C is the width of the first seal, and D is the width of the second seal groove.

[0022] In some embodiments, the heat dissipation body is provided with a connecting seat between the wire hole and the first sealing groove, the connecting seat and the substrate are respectively provided with a fourth through hole and a fifth through hole, and the second fastener passes through the fifth through hole and is fixed in the fourth through hole.

[0023] In some embodiments, a second seal is also included; the frame is provided with a second sealing groove, the second sealing groove is formed by being recessed from the frame surface toward the light emitting surface, the second sealing groove is provided between the light emitting chamber and the frame side wall, and the second seal is embedded in the second sealing groove.

[0024] In a second aspect, the utility model provides an outdoor floodlight, comprising a cable and a waterproof connector sleeved on the outer periphery of the cable, and the above-mentioned lighting module;

[0025] The heat dissipation body is provided with a boss and heat dissipation fins on the heat dissipation surface, and the heat dissipation fins are arranged on both sides of the boss;

[0026] The waterproof connector is fixedly connected to the boss, and the cable passes through the wire hole of the heat dissipation body and is electrically connected to the PCB board.

[0027] In summary, the utility model has at least the following benefits:

[0028] 1. The lighting module provided by the utility model fixes the PCB board and the light-emitting element on the heat sink in sequence, and the side wall of the substrate is arranged between the heat dissipation side wall and the frame side wall, and the side wall of the substrate is directly connected to the outside for heat exchange, so that the heat dissipation area and the laying area of ​​the light-emitting unit can be increased. While more light-emitting units can be laid on the substrate to improve the lighting efficiency, the heat dissipation efficiency is also effectively improved.

[0029] 2. The lighting module provided by the utility model adopts a first sealing component embedded in a first sealing groove installed in the heat dissipation body to achieve waterproofing of the PCB board and the heat dissipation component; a second sealing component is embedded in a second sealing groove installed in the light output component to achieve waterproofing of the PCB board and the light output component; the above two-layer waterproof structure can effectively block water vapor from entering the light output cavity to ensure stability in use.

[0030] 3. The outdoor floodlight provided by the utility model adopts a lighting module with a side wall of the substrate extending to the outer periphery of the light-emitting chamber. Since the side wall of the substrate is completely exposed to the air, it can play a role in heat exchange. At the same time, the larger the size of the substrate, the greater the laying area of ​​the light-emitting unit and the heat conduction area with the heat sink, thereby improving the heat dissipation efficiency of the lamp while improving the lighting efficiency. The lighting module adopts a two-layer waterproof structure, which can effectively block water vapor from entering the interior of the lamp body, thereby improving the stability of the outdoor floodlight. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is an exploded view of the lighting module of Example 1 of the utility model.

[0032] Figure 2 This is a schematic diagram of the structure of the lighting module of Example 1.

[0033] Figure 3 for Figure 2 Section view along line AA.

[0034] Figure 4 for Figure 3 Schematic diagram from another perspective.

[0035] Figure 5 This is a top view of the PCB board of Example 1 of the utility model.

[0036] Figure 6 for Figure 4 Enlarged schematic diagram of part H in the middle.

[0037] Figure 7 for Figure 4 Enlarged schematic diagram of part K in the middle.

[0038] Figure 8 This is a schematic structural diagram of the heat sink and PCB board of Example 1 of the utility model.

[0039] Fig. 9 This is a schematic diagram of the dimensions of the first sealing member and the first sealing groove of Example 1 of the utility model.

[0040] Fig.10 This is a comparison diagram of LED packaging of the lighting module of Example 2 of the utility model and the lighting module of the prior art.

[0041] Fig.11 This is an exploded view of the outdoor floodlight of Example 3 of the utility model.

[0042] Markings in the figure:

[0043] 100- Lighting module;

[0044] 1- heat sink;

[0045] 11- heat dissipation body, 12- heat dissipation fins, 13- boss;

[0046] 101- heat dissipation surface, 102- mounting surface, 103- heat dissipation side wall;

[0047] 111-wire hole, 112-first sealing groove, 113-connecting seat;

[0048] 2-PCB board;

[0049] 21-substrate, 22-light emitting unit,

[0050] 211 - first base surface, 212 - second base surface, 213 - substrate side wall, 220 - light emitting area;

[0051] 3-Light emitting parts;

[0052] 31-light output body, 32-frame, 33-lens unit;

[0053] 301 - light emitting surface, 302 - light emitting chamber, 321 - frame side wall, 322 - second sealing groove;

[0054] 4-seal assembly, 41-first seal, 42-second seal;

[0055] 1001 - first through hole, 1002 - second through hole, 1003 - third through hole, 1004 - fourth through hole, 1005 - fifth through hole. DETAILED DESCRIPTION

[0056] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively in conjunction with the accompanying drawings and specific embodiments. The accompanying drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0057] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0058] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0060] Example 1

[0061] refer to Figure 1-Figure 6 The present embodiment provides a lighting module 100, including a heat sink 1, a PCB board 2 and a light emitting member 3, wherein the PCB board 2 and the light emitting member 3 are fixed on the heat sink in sequence.

[0062] The lighting module 100 for outdoor floodlight is a standard part and can be applied to lighting devices such as street lamps, outdoor floodlights or wall washers. These lighting devices can be applied to outdoor (outdoor) lighting places or indoor lighting places.

[0063] The heat sink 1 is the main support of the lighting module 100 and is made of metal material with good heat dissipation performance, such as aluminum profile stamping. The heat sink 1 includes a heat sink body 11, which is a plate-like structure and has a heat dissipation surface 101 and a mounting surface 102. The heat dissipation surface 101 and the mounting surface 102 are arranged opposite to each other, and the heat dissipation surface 101 is connected to the outside to perform heat exchange. Figure 1 As shown, the heat dissipation surface 101 and the mounting surface 102 are respectively arranged on two end surfaces of the heat dissipation body 11 , and the heat dissipation body 11 is provided with a heat dissipation side wall 103 between the heat dissipation surface 101 and the mounting surface 102 .

[0064] In some embodiments, the heat dissipation body 11 may be provided with heat dissipation fins 12 protruding from the heat dissipation surface 101 to increase the heat dissipation area. In this way, the heat conducted to the heat dissipation body 11 can be dissipated to the outside through the heat dissipation surface 101, the heat dissipation sidewalls 103 and the heat dissipation fins 12, thereby improving the heat dissipation efficiency.

[0065] The PCB board 2 includes a substrate 21 and a light-emitting unit 22. The PCB board 2 is also called PCB, which is a printed circuit board or printed circuit board in Chinese. The material of the substrate 21 can be a glass fiber substrate or an aluminum substrate, etc. The substrate 21 is provided with a first base surface 211, a second base surface 212 and a substrate side wall 213. The first base surface 211 and the second base surface 212 are arranged on the two end surfaces of the substrate 21 opposite to each other, and the substrate side wall 213 is arranged between the first base surface 211 and the second base surface 212. The first base surface 211 is closely connected to the mounting surface 102, and the light-emitting unit 22 is attached to the second base surface 212. In some embodiments, the light-emitting unit 22 is an LED chip packaged to the substrate 21, and the light-emitting unit 22 can emit at least one of white, blue, red and green light, and can be combined to emit white light for lighting, or other color light for lighting. The heat generated by the light-emitting unit 22 during operation is conducted to the mounting surface 102 through the first base surface 211, and then dissipated to the outside.

[0066] The light emitted by the light-emitting unit 22 is processed by the light-emitting component 3 and then emitted to the outside. The light-emitting component 3 can be made of transparent resin materials such as polymethacrylate (PMMA), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), cycloolefin copolymer (COP) or polycarbonate (PC), or glass materials. The light-emitting component 3 includes a light-emitting body 31, a frame 32 and a lens unit 33. Among them, the light-emitting body 31 is provided with a light-emitting surface 301, and the frame 32 is arranged on the periphery of the light-emitting body 31 and extends in a direction away from the light-emitting surface 301. The lens unit 33 is arranged above the light-emitting unit 22, and is used to refract and reflect the light emitted by the light-emitting unit 22 to improve the light output efficiency.

[0067] In this embodiment, the PCB board 2 is stacked and fixed on the heat sink 1, and then the light output member 3 is directly stacked on the PCB board 2. In the installation structure where the light output member 3 is stacked on the PCB board 2, the frame 32 does not encapsulate the substrate 21 on the inner side of the frame 32. That is, during the installation process, the frame 32 is directly fixedly connected to the second base surface 212, and the substrate side wall 213 is not located on the inner side of the frame 32. Specifically, the frame 32 is provided with a frame side wall 321, and the substrate side wall 213 is provided between the heat dissipation side wall 103 and the frame side wall 321, and the substrate side wall 213 is directly connected to the outside world for heat exchange.

[0068] It is understandable that part of the heat generated by the light-emitting unit 22 can be conducted to the mounting surface 102 of the heat sink 1 through the first base surface 211, and further dissipated to the outside through the heat sink surface 101, the heat sink side wall 103 and the heat sink fins 12; the other part can be directly dissipated to the outside through the base plate side wall 213. The lighting module can effectively improve the heat dissipation efficiency by directly exchanging heat with the outside by setting the base plate side wall 213, together with the original heat dissipation structure of the heat sink.

[0069] In some embodiments, the heat dissipation body 11 can be cut into a circular, elliptical, triangular, rectangular or other polygonal plate structure as required, and the substrate 21 and the light output body 31 are also correspondingly cut into a circular, elliptical, triangular, rectangular or other polygonal plate structure. In this embodiment, the heat dissipation body 11, the substrate 21 and the light output body 31 are all rectangular structures.

[0070] In some embodiments, the substrate sidewall 213 may be flush with the heat dissipation sidewall 103, or may be recessed in the heat dissipation sidewall 103. Furthermore, the substrate sidewall 213 may be flush with the heat dissipation sidewall 103 and the frame sidewall 321 at the same time.

[0071] The substrate side wall 213 extends to the frame side wall 321 outside the light output body 31, and the substrate side wall 213 is flush with the frame side wall 321 and the heat dissipation side wall 103, so that the substrate side wall 213 is directly connected to the outside world, that is, it is exposed to the outside world for heat exchange, while ensuring that an overall waterproof structure can be formed between the heat sink 1, the PCB board 2 and the light output component 3, and ensuring that the lighting module has a beautiful appearance and a smooth touch.

[0072] In some embodiments, the substrate sidewall 213 may be recessed inward relative to the frame sidewall 321 and (or) the heat dissipation sidewall 103. For example, the substrate sidewall 213 may be rounded at the corner, so that the substrate sidewall 213 is recessed in the frame sidewall 321 and (or) the heat dissipation sidewall 103.

[0073] In other embodiments, depending on the cutting conditions of the plate, the substrate side wall 213 may also protrude relative to the frame side wall 321 and (or) the heat dissipation side wall 103, that is, the substrate side wall 213 may protrude from the frame side wall 321 and (or) the heat dissipation side wall 103.

[0074] It is understandable that when the substrate side wall 213 is flush with the heat dissipation side wall 103, the projection of the substrate 21 on the plane where the mounting surface 102 is located coincides with the heat dissipation body 11. When the substrate side wall 213 is recessed inwardly relative to the heat dissipation side wall 103 but still connected to the outside, the projection of the substrate 21 on the plane where the mounting surface 102 is located is located on the inner side of the heat dissipation body 11.

[0075] When the substrate side wall 213 is flush with the frame side wall 321, the projection of the substrate 21 on the plane where the mounting surface 102 is located coincides with the projection of the light emitting body 31 on the plane where the mounting surface 102 is located. When the substrate side wall 213 is recessed inward relative to the frame side wall 321 but still connected to the outside, the projection of the substrate 21 on the plane where the mounting surface 102 is located is located inside the projection of the light emitting body 31 on the plane where the mounting surface 102 is located; or it can be said that the projection of the substrate 21 on the plane where the mounting surface 102 is located is surrounded by the projection of the light emitting body 31 on the plane where the mounting surface 102 is located.

[0076] On the connection structure of the heat sink 1, the PCB board 2 and the light output component 3, the heat sink body 11, the substrate 21 and the frame 32 are respectively provided with a first through hole 1001, a second through hole 1002 and a third through hole 1003, the second through hole 1002 corresponds to the first through hole 1001 and the third through hole 1003, and the second through hole 1002 is close to the substrate side wall 213.

[0077] refer to Figure 5 In some embodiments, the light emitting unit 22 is arranged on the second base surface 212 to form a light emitting area 220 , and the second through hole 1002 is located at the periphery of the light emitting area 220 and is adjacent to the substrate side wall 213 .

[0078] The first fastener 51 , such as a countersunk screw, passes through the third through hole 1003 and the second through hole 1002 in sequence and is fixed in the first through hole 1001 , so that the PCB board 2 and the light output element 3 are stacked and fixed on the heat sink 1 in sequence.

[0079] Combined with reference Figure 4 and Figure 5 The frame 32 is formed by protruding and extending from the periphery of the light emitting body 31 in a direction away from the light emitting surface 301, and the frame 32 and the light emitting body 31 surround a light emitting chamber 302, the lens unit 33 and the light emitting unit 22 are located together in the light emitting chamber 302, and the lens unit 33 and the light emitting unit 22 are arranged one by one. Further, the frame 32 is closely connected to the second base surface 212, so that the light emitting chamber 302 and the second base surface 212 together form a closed chamber, which contains the light emitting area 220.

[0080] It should be noted that, since the substrate side wall 213 of the substrate 21 extends outward and directly connects to the outside, the substrate side wall 213 is located outside the light emitting chamber 302 and is not contained in the light emitting chamber 302. When the substrate 21 is a rectangular structure, the four sides of the substrate side wall 213 are completely exposed to the air, and the PCB board 2 acts as a heat sink, increasing the heat dissipation area and improving the heat dissipation efficiency.

[0081] Specifically, the light-emitting unit 22 and other electronic components of the PCB board 2 generate heat during operation, which increases the overall temperature of the substrate 21. In the lighting module of this embodiment, the substrate side wall 213 of the substrate 21 is completely exposed to the outside, which can be used for active radiation heat dissipation; and the air convection near the heat sink can be accelerated to a greater extent, playing a role in active convection heat dissipation; in addition, the area of ​​the substrate 21 is increased, which can increase the heat conduction area. Therefore, the PCB board 2 adopts a method in which the substrate side wall 213 is directly connected to the outside world, and three methods of radiation, convection and conduction can be used to dissipate heat, thereby reducing the temperature of the PCB board and the heat sink.

[0082] In terms of waterproof structure, the lighting module 100 of this embodiment adopts a sealing component 4 to achieve two levels of waterproofing. The sealing component 4 includes a first sealing member 41 and a second sealing member 42. Figure 7 and Figure 8 The heat dissipation body 11 is provided with a wire hole 111 and a first sealing groove 112. The wire hole 111 is used for passing power cables and the like, and the first sealing groove 112 is formed by being recessed from the mounting surface 102 toward the heat dissipation surface 101, and the first sealing groove 112 is located at the periphery of the wire hole 111. When the external cable is passed through the wire hole 111 of the heat dissipation element 1 and electrically connected to the PCB board 2, it can be fixed on the boss on the heat dissipation surface 101 by a waterproof connector in a snap-on or screw-on manner to prevent water vapor from entering the mounting surface 102 and the PCB board 2. Furthermore, even if water vapor enters the wire hole 111, the first sealing member 41 is embedded and installed in the first sealing groove 112 on the periphery of the wire hole 111 in this embodiment to prevent water vapor from dispersing along the mounting surface 102.

[0083] In some embodiments, the first sealing groove 112 and the first sealing member 41 may be configured as an annular structure. According to sealing requirements, in other embodiments, the first sealing groove 112 may be configured as an elliptical, triangular, rectangular or other polygonal structure, and the first sealing member 41 is configured correspondingly to the first sealing groove 112.

[0084] The first seal 41 needs to be adapted and embedded in the first sealing groove 112, that is, the matching connection relationship between the first seal 41 and the first sealing groove 112 must be just right. If the compression of the first seal is too large, the substrate and the heat sink body cannot be completely fitted, and the gap between the substrate and the heat sink body is too large, which is not conducive to the PCB board to conduct heat to the heat sink; if the compression of the first seal is too small, the first seal cannot completely fill the gap between the substrate and the heat sink body, resulting in waterproof failure.

[0085] In the lighting module 100 provided in this embodiment, the first sealing groove 112 and the first sealing member 41 are both annular structures, and the dimensions of the first sealing groove 112 and the first sealing member 41 are optimized in this embodiment, as follows:

[0086] like Fig. 9 As shown, the direction from the mounting surface 102 to the heat dissipation surface 101 is the y direction, and the x direction is perpendicular to the y direction. The first sealing groove 112 and the first sealing member 41 have the following relationship:

[0087] 1.2B≤A≤1.3B;

[0088] 0.8D≤C≤1.0D;

[0089] Wherein, A is the height of the first sealing member 41 , B is the height (depth) of the first sealing groove 112 ; C is the width of the first sealing member 41 , and D is the width of the second sealing groove 112 .

[0090] That is, in the y direction, the height A of the first sealing member 41 is 1.2-1.3 times the height (depth) B of the first sealing groove 112 .

[0091] In the x direction, the width C of the first sealing member 41 is 0.8-1.0 times the width D of the second sealing groove 112 .

[0092] By using the first sealing groove 112 and the first sealing member 41 with optimized dimensions, the substrate can be completely attached to the heat dissipation body, and good heat dissipation and waterproof effects can be obtained.

[0093] In some embodiments, in order to ensure that the substrate is stably fitted and fixed on the heat dissipation body, the heat dissipation body 11 is provided with a connection seat 113 between the wire hole 111 and the first sealing groove 112. The surface of the connection seat 113 is flush with or slightly recessed from the mounting surface 102. A fourth through hole 1004 is provided on the connection seat 113, and correspondingly, a fifth through hole 1005 is provided on the substrate 21. The second fastener 52, such as a screw, passes through the fifth through hole 1005 and is fixed in the fourth through hole 1004, so that the first sealing member 41 is embedded and installed in the first sealing groove 112 with an optimal elastic compression amount.

[0094] On the basis of the first waterproof structure between the heat sink and the PCB board, the present embodiment further provides a second waterproof structure between the PCB board and the light emitting member. The light emitting member 3 is provided with a second sealing groove 322 on the frame 32, the second sealing groove 322 is formed by being recessed from the frame surface toward the light emitting surface 301, and the second sealing groove 322 is located between the light emitting chamber 302 and the frame side wall 321, and the second sealing member 42 is embedded and installed in the second sealing groove 322, so that the light emitting chamber 302 and the second base surface 212 form a closed chamber, water vapor cannot enter, and waterproofing between the light emitting member 3 and the PCB board 2 is achieved.

[0095] The lighting module provided in this embodiment fixes the PCB board and the light output member on the heat sink in sequence, and the substrate side wall is arranged between the heat dissipation side wall and the frame side wall, and the substrate side wall is directly connected to the outside for heat exchange, so as to increase the heat dissipation area and effectively improve the heat dissipation efficiency. In addition, the lighting module adopts a first sealing member embedded in a first sealing groove installed in the heat dissipation body to achieve waterproofing of the PCB board and the heat sink; and adopts a second sealing member embedded in a second sealing groove installed in the light output member to achieve waterproofing of the PCB board and the light output member; the above two-layer waterproof structure can effectively prevent water vapor from entering the light output cavity, ensuring the stability of use.

[0096] Example 2

[0097] exist Figure 1-Figure 9 Based on reference Fig.10 This embodiment compares the LED packaging of the lighting module (10B) of the above-mentioned embodiment 1 with that of the lighting module (10A) of the prior art. Fig.10 As shown, when the heat dissipation body size of the heat dissipation element is the same, the lighting module can be equipped with a larger PCB board and more light-emitting units (LED chips) than the existing lighting module.

[0098] For example, in the lighting module (10B) and the existing lighting module (10A), the dimensions of the heat dissipation body are both: length 260 mm, width 70 mm, that is, the area of ​​the installation surface is 260 mm*70 mm.

[0099] In the lighting module of Example 1, the substrate side wall of the PCB board is extended to the periphery of the heat dissipation side wall (or frame side wall), so that the size of the substrate is the same as the size of the heat dissipation body, which is also 260mm in length and 70mm in width, that is, the area of ​​the second base surface is also 260mm*70mm. However, in the existing lighting module (10A), since the PCB board needs to be accommodated and sealed in the light emitting chamber, the size of its substrate is 236mm in length and 44mm in width, and the substrate size of the lighting module is obviously smaller than that of the lighting module.

[0100] After obtaining a larger-sized substrate, the lighting module can be equipped with more light-emitting units, thereby improving the lighting efficiency of the lamp.

[0101] At the same time, as the substrate size of the PCB board becomes larger, the contact area between the substrate and the heat dissipation body also increases, effectively transferring heat from the first base surface to the mounting surface and dissipating it to the outside through the heat dissipation surface 101, the heat dissipation side wall 103 and the heat dissipation fins 12.

[0102] It can be seen that the lighting module provided in this embodiment increases the heat dissipation area and the laying area of ​​the light-emitting unit by setting the side wall of the substrate between the heat dissipation side wall and the frame side wall, and the side wall of the substrate is directly connected to the outside for heat exchange. While more light-emitting units can be laid out on the substrate and the lighting efficiency is improved, the heat dissipation efficiency is also effectively improved.

[0103] Example 3

[0104] Fig.11 This is an exploded view of the outdoor floodlight of this embodiment. Figure 1-Figure 10 Based on reference Fig.11 This embodiment provides an outdoor floodlight, including a cable 6, a waterproof connector 7 and the lighting module 100 of the above-mentioned embodiment 1. The lighting module 100 is a standard part and can be applied to lighting devices such as street lamps, outdoor floodlights or wall washers. This embodiment is described by taking an outdoor floodlight as an example.

[0105] In the outdoor floodlight of this embodiment, the heat dissipation body 11 is provided with heat dissipation fins 12 and bosses 13 on the heat dissipation surface 101, and the heat dissipation fins 12 are located on both sides of the bosses 13. The waterproof connector is sleeved on the outer periphery of the cable 6 and fixedly connected to the bosses. The cable 6, such as a power cable, passes through the wire hole 111 of the heat dissipation body 11 and is electrically connected to the PCB board 2.

[0106] The outdoor floodlight provided in this embodiment adopts a lighting module in which the side wall of the substrate extends to the outer periphery of the light-emitting cavity. Since the side wall of the substrate is completely exposed to the air, it can play a role in heat exchange. At the same time, the larger the size of the substrate, the larger the laying area of ​​the light-emitting unit and the heat conduction area with the heat sink, thereby improving the heat dissipation efficiency of the lamp while improving the lighting performance.

[0107] In addition, the outdoor floodlight uses a first sealing component embedded in a first sealing groove installed in the heat dissipation body to achieve waterproofing of the PCB board and the heat dissipation component; a second sealing component is embedded in a second sealing groove installed in the light output component to achieve waterproofing of the PCB board and the light output component; the above two-layer waterproof structure can effectively block water vapor from entering the light output cavity, thereby improving the stability of the lighting device.

[0108] The above contents are merely examples and illustrations of the structure of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these obvious replacement forms all belong to the protection scope of the utility model.

Claims

1. A lighting module, characterized in that: include: The heat sink comprises a heat sink body, wherein the heat sink body is provided with a heat sink surface and a mounting surface, the heat sink surface is arranged opposite to the mounting surface, and the heat sink surface is connected to the outside; A PCB board, comprising a substrate and a light-emitting unit, wherein the substrate is provided with a first base surface, a second base surface and a substrate side wall, the first base surface is arranged opposite to the second base surface, and the first base surface is closely connected to the mounting surface; the light-emitting unit is attached to the second base surface; as well as A light emitting member, comprising a light emitting body, a frame and a lens unit, wherein the light emitting body is provided with a light emitting surface, the frame is provided at the periphery of the light emitting body and extends in a direction away from the light emitting surface, the frame is fixedly connected to the second base surface, and the lens unit is provided on the light emitting unit; The heat dissipation body is provided with a heat dissipation side wall, the frame is provided with a frame side wall, the substrate side wall is arranged between the heat dissipation side wall and the frame side wall, and the substrate side wall is directly connected to the outside.

2. The lighting module according to claim 1, characterized in that: The substrate side wall is flush with the heat dissipation side wall.

3. The lighting module according to claim 1, characterized in that: The heat dissipation body, the substrate and the frame are respectively provided with a first through hole, a second through hole and a third through hole, wherein the second through hole is close to the side wall of the substrate; a first fastener passes through the third through hole and the second through hole in sequence and is fixed in the first through hole, thereby fixing the PCB board and the light output component to the heat dissipation component in sequence.

4. The lighting module according to claim 3, characterized in that: The light emitting body and the frame surround to form a light emitting chamber, the lens unit and the light emitting unit are arranged together in the light emitting chamber, and the lens unit and the light emitting unit are arranged in a one-to-one correspondence.

5. The lighting module according to claim 4, characterized in that: The substrate side wall is arranged outside the light exit cavity.

6. The lighting module according to claim 4, characterized in that: It also includes a first seal; the heat dissipation body is provided with a wire hole and a first sealing groove, the first sealing groove is recessed from the mounting surface toward the heat dissipation surface, and the first sealing groove is arranged on the outer periphery of the wire hole, and the first seal is embedded in the first sealing groove.

7. The lighting module according to claim 6, characterized in that: The first sealing groove and the first sealing member are both annular structures; the first sealing member and the first sealing groove have the following relationship: 1.2B≤A≤1.3B; 0.8D≤C≤1.0D; Wherein, A is the height of the first sealing member, and B is the height of the first sealing groove; C is the width of the first seal, and D is the width of the second seal groove.

8. The lighting module according to claim 6, characterized in that: The heat dissipation body is provided with a connection seat between the wire-passing hole and the first sealing groove, the connection seat and the base plate are respectively provided with a fourth through hole and a fifth through hole, and the second fastener passes through the fifth through hole and is fixed in the fourth through hole.

9. The lighting module according to claim 6, characterized in that: It also includes a second sealing member; the frame is provided with a second sealing groove, the second sealing groove is formed by being recessed from the frame surface toward the light emitting surface, the second sealing groove is arranged between the light emitting chamber and the frame side wall, and the second sealing member is embedded in the second sealing groove.

10. Outdoor floodlight, characterized in that: Comprising a cable and a waterproof connector sleeved on the outer periphery of the cable, and a lighting module according to any one of claims 1 to 9; The heat dissipation body is provided with a boss and heat dissipation fins on the heat dissipation surface, and the heat dissipation fins are arranged on both sides of the boss; The waterproof connector is fixedly connected to the boss, and the cable passes through the wire hole of the heat dissipation body and is electrically connected to the PCB board.

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