Process verification test tool for composite sensor chip
Through the process verification and testing tooling of composite sensor chips, and using technical means such as stress-free tape and sealing cavity, the problems of low detection accuracy and adhesive stress in sensor chip testing are solved, and high-precision and low-cost chip testing are achieved.
Patent Information
- Application Number
- CN202420600220.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-03-26
AI Technical Summary
In the test of existing sensor chips, there are different effects of detection accuracy that does not meet the standards, excessive accuracy range, different adhesives and substrates on chip accuracy and temperature characteristics, and adverse effects of adhesive stress on the test results.
A process verification and testing tool for composite sensor chips was designed, and the chip was fixed with a small substrate using stress-free tape, so that parameters and environmental consistency were achieved through the sealing cavity and gas circuit joints, avoiding the impact of adhesive stress on the test results.
Stressless chip testing is realized, which improves detection accuracy and consistency, reduces testing costs, and can quickly replace the test environment and equipment, improving testing efficiency.
Smart Images
Figure CN222599686U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip testing, and in particular relates to a process verification testing tool for a composite sensor chip. Background Art
[0002] With the continuous improvement of product accuracy requirements, the requirements for product design and process are also constantly increasing. How to optimize product design, how to optimize product process, and how to verify whether the process improvement is correct are all problems that need to be solved. Because sensor accuracy is a parameter affected by multiple processes, and there is a linear relationship between different processes. In addition to the influence of equipment and environmental repeatability errors, in the experiment, it is necessary to reduce the error impact of the previous process on the next process as much as possible, and compare and analyze different situations in one experiment as much as possible.
[0003] The problems that arise in existing sensor chip testing are as follows: 1. The sensor chip performance verification cannot ensure that the detection accuracy meets the standard. 2. The sensor chip accuracy range is too large to be used as a benchmark for subsequent measurements. 3. Different adhesives have different effects on the accuracy and temperature characteristics of the sensor chip. 4. Different bonding substrates have different effects on the accuracy and temperature characteristics of the sensor chip. And the bonding stress will have an adverse effect on the test results.
[0004] Therefore, there is an urgent need for a stress-free chip testing device that can ensure test accuracy and test consistency under controllable parameters and consistent environmental conditions. Utility Model Content
[0005] The utility model aims to solve the problem that stress generated by bonding during existing sensor chip testing affects the test results, and provides a process verification test tool for a composite sensor chip.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A process verification test tool for a composite sensor chip comprises a cover body and a base body, wherein the cover body and the base body are sealed and connected, a sealed cavity is provided between the cover body and the inside of the base body, the cover body comprises an air path joint, one end of the air path joint is sealed and embedded in one end of a front cover, the base body comprises a base body main body and a small base body, the small base body is adhered to a chip to be tested by a stress-free adhesive tape, the inner side of the other end of the front cover is sealed and connected to the outer side of one end of the base body, the outer side of the small base body is sealed and connected to the base body, two small base bodies are provided, a PCB board is installed between the ends of the two small base bodies close to the air path joint, a spring needle seat is sealed and installed between the base bodies connected at one side of the two small bases, a spring needle is installed on the spring needle seat, a solder pad of the PCB board is connected to one end of the spring needle, and the other end of the spring needle is connected to an output line.
[0008] Furthermore, the small substrate is bonded to the chip to be tested by a stress-free adhesive tape.
[0009] Furthermore, the pins of the chip to be tested are connected to the pads of the PCB board, and the PCB board is connected to the small substrate via pan head screws.
[0010] Furthermore, a wire hole is provided on the base body for leading the output wire out of the tooling.
[0011] Furthermore, a sealing gasket is installed at the connection between the air path interface and the front cover.
[0012] Furthermore, a front cover O-ring is installed between the inner side of the other end of the front cover and the outer side of one end of the base body.
[0013] Furthermore, a small substrate O-ring is installed between the inside of the substrate body and the small substrate.
[0014] Furthermore, a needle seat O-ring is installed between the base body and the spring needle seat.
[0015] Furthermore, potting glue is provided between the spring pin seat and the spring pin.
[0016] Furthermore, threads are provided on the outer side of the gas path interface, the outer side of one end of the base body and the inner side of the front cover.
[0017] Compared with the prior art, the utility model has the following beneficial technical effects:
[0018] The utility model relies on stress-free adhesive tape to fix the chip and the small substrate together, which can avoid the influence of stress caused by bonding on the output of the chip itself, thereby obtaining the true performance of the chip itself. The utility model has a reasonable solution, a simple structure, and is easy to implement, and can fully improve the chip test accuracy and test efficiency.
[0019] The utility model relies on the stress-free adhesive tape to fix the chip and the small substrate, can realize the rapid removal of adhesives, and has the characteristics of no residue on the substrate body, is easy to reuse, and reduces costs.
[0020] The utility model adopts small substrates of different materials, and can test the influence of materials with different thermal expansion coefficients on chip stress, thereby reducing chip thermal stress and improving accuracy.
[0021] The utility model adopts spring pin connection, which can realize the rapid replacement of PCB boards, prevent tooling from being scrapped due to pad damage, pad filling and other reasons, and reduce tooling costs.
[0022] The utility model can realize operations such as pressurizing and depressurizing the chip through the sealed cavity formed by the front cover and the base body, thereby obtaining a complete function curve of pressure and chip output.
[0023] The utility model adopts a quick gas circuit connector, which is convenient for quickly changing the gas source and the test environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The drawings in the specification are used to provide further understanding of the present invention and constitute a part of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.
[0025] Figure 1 The utility model is a schematic cross-sectional structure diagram of a process verification test tool for a composite sensor chip.
[0026] Figure 2 This is a front view structural diagram of a process verification test tooling for a composite sensor chip of the utility model.
[0027] Figure 3 It is a right view structural schematic diagram of a process verification test tooling for a composite sensor chip of the utility model.
[0028] 1 is the air circuit connector, 2 is the sealing gasket, 3 is the front cover, 4 is the base body, 5 is the wire hole, 6 is the output line, 7 is the pan head screw, 8 is the PCB board, 9 is the small base, 10 is the spring needle, 11 is the spring needle seat, 12 is the potting glue, 13 is the needle seat O-ring, 14 is the small base O-ring, and 15 is the front cover O-ring. DETAILED DESCRIPTION
[0029] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0031] Embodiment 1
[0032] See also Figure 1 , Figure 2 and Figure 3 A process verification test tool for a composite sensor chip comprises a cover body and a base body, the cover body and the base body are sealed and connected, a sealed cavity is provided between the cover body and the inside of the base body, the cover body comprises an air path connector 1, one end of the air path connector 1 is sealed and embedded in one end of a front cover 3, the base body comprises a base body 4 and a small base body 9, the small base body 9 is adhered to the test chip by a stress-free adhesive tape, the inner side of the other end of the front cover 3 is sealed and connected to the outer side of one end of the base body 4, the outer side of the small base body 9 is sealed and connected to the base body 4, two small base bodies 9 are provided, a PCB board 8 is installed between the ends of the two small base bodies 9 close to the air path connector 1, a spring needle seat 11 is sealed and installed between the base body 4 connected to the adjacent side of the two small base bodies 9, a spring needle 10 is installed on the spring needle seat 11, a pad of the PCB board 8 is connected to one end of the spring needle 10, and the other end of the spring needle 10 is connected to the output line 6.
[0033] Preferably, the small substrate 9 is bonded to the chip to be tested by a stress-free adhesive tape.
[0034] Preferably, the pins of the chip to be tested are connected to the pads of the PCB board 8 , and the PCB board 8 is connected to the small substrate 9 via pan head screws 7 .
[0035] Preferably, a wire hole 5 is provided on the base body 4 for leading the output wire 6 out of the tooling.
[0036] Preferably, a sealing gasket 2 is installed at the connection between the air circuit interface 1 and the front cover 3 .
[0037] Preferably, a front cover O-ring 15 is installed between the inner side of the other end of the front cover 3 and the outer side of one end of the base body 4 .
[0038] Preferably, a small substrate O-ring 14 is installed between the inside of the substrate body 4 and the small substrate 9 .
[0039] Preferably, a needle seat O-ring 13 is installed between the base body 4 and the spring needle seat 11 .
[0040] Preferably, a potting glue 12 is provided between the spring pin seat 11 and the spring pin 10 .
[0041] Preferably, threads are provided on the outer side of the gas path interface 1 , the outer side of one end of the base body 4 , and the inner side of the front cover 3 .
[0042] Embodiment 2
[0043] A process verification test method for a composite sensor chip, using a process verification test tool for a composite sensor chip, includes the following steps:
[0044] The chip to be tested is bonded to the small substrate 9 by an adhesive, and then the small substrate 9 is placed in the substrate body 4, and they are sealed by an O-ring.
[0045] The spring pin 10 is fixed on the spring pin seat 11 . The spring pin seat 11 and the base body 4 are sealed by a potting glue 12 .
[0046] The pins of the chip to be tested are bonded to the pads of the PCB board 8 by gold wire, and the PCB board 8 is connected to the spring pin 10.
[0047] The front cover 3 is connected to the base body 4 by threads and sealed by the front cover O-ring 15. The gas circuit connector 1 is also connected to the front cover 3 by threads and sealed by the O-ring of the sealing gasket 2. Thus, the gas circuit can be quickly connected and switched.
[0048] The gas circuit interface 1 is connected to the pressurized gas circuit to test the chip. The chip is pressurized and depressurized through the sealed cavity formed by the front cover 3 and the base body 4 to obtain a complete function curve of pressure and output of the chip to be tested.
[0049] The chip to be tested is powered through the output line 6 at the rear end of the spring pin 10 and the output test result is read.
[0050] Embodiment 3
[0051] like Figure 1 , Figure 2 and Figure 3 As shown, this embodiment provides a process verification test tool for a composite sensor chip. Under the condition of controllable parameters and consistent environmental conditions, the process verification test tool for the composite sensor chip can ensure test accuracy and test consistency, thereby achieving the purpose of reducing costs and increasing efficiency.
[0052] The present embodiment provides a process verification test tool for a composite sensor chip, comprising a cover part and a base part;
[0053] The cover body includes: a gas circuit connector 1, a sealing gasket 2, and a front cover 3. Through the gas circuit connector 1, the tooling can be quickly connected to the gas circuit, and the gas circuit connector 1 and the front cover 3 are sealed with a sealing gasket 2 to ensure the air tightness of the tooling and make the gas source pressure equal to the chip sensing air pressure.
[0054] The base part includes: a base body 4, a wire hole 5, an output line 6, a pan head screw 7, a PCB board 8, a small base 9, a spring needle 10, a spring needle seat 11, a potting glue 12, a needle seat O-ring 13, a small base O-ring 14, and a front cover O-ring 15. The chip to be tested is bonded to the small base 9 by a stress-free tape, so that the stress received by the chip during bonding is minimized, thereby obtaining true measurement data. The small base 9 and the base 4 are sealed by a small base O-ring 14 to ensure that the air source pressure is equal to the air pressure felt by the chip to be tested. The upper pin of the chip to be tested is connected to the pad of the PCB board 8 by gold wire bonding, so as to power the chip to be tested and read the output. The spring needle 10 is fixed on the spring needle seat 11 and fixed to the base body 4 by the potting glue 12. The spring needle 10 contacts the pad on the PCB board 8, leads the output of the chip to be tested to the output line 6, and then directly powers and reads the data through the output line 6.
[0055] The cover body and the base body are sealed by the front cover O-ring 15, thereby isolating the internal and external air and ensuring stable pressure.
[0056] The small substrate 9 has a variety of materials, and different materials of the small substrate 9 can be selected according to different chips, adhesives, and environmental conditions, so as to simulate the use status under various working conditions, and can also be used to compare the effects of different substrates on chip output.
[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit its protection scope. Although the utility model is described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that after reading the utility model, those skilled in the art can still make various changes, modifications or equivalent substitutions to the specific implementation methods of the utility model, but these changes, modifications or equivalent substitutions are all within the protection scope of the pending claims of the utility model.
Claims
1. A process verification test tool for a composite sensor chip, characterized in that: The invention comprises a cover body and a base body, wherein the cover body and the base body are sealed and connected, and a sealed cavity is provided between the cover body and the base body. The cover body comprises an air path connector (1), and one end of the air path connector (1) is sealed and embedded in one end of a front cover (3). The base body comprises a base body main body (4) and a small base body (9), and the small base body (9) is bonded to a test chip by means of a stress-free adhesive tape. The inner side of the other end of the front cover (3) is sealed and connected to the outer side of one end of the base body main body (4), and the outer side of the small base body (9) is sealed and connected to the base body main body (4). Two small base bodies (9) are provided, and a PCB board (8) is installed between the ends of the two small base bodies (9) close to the air path connector (1). A spring needle seat (11) is sealed and installed between the base bodies (4) connected to the two sides of the two small base bodies (9), and a spring needle (10) is installed on the spring needle seat (11). The solder pad of the PCB board (8) is connected to one end of the spring needle (10), and the other end of the spring needle (10) is connected to an output line (6).
2. The process verification test tool for a composite sensor chip according to claim 1, characterized in that: The pins of the chip to be tested are connected to the pads of the PCB board (8).
3. The process verification test tool for a composite sensor chip according to claim 1, characterized in that: The PCB board (8) and the small base (9) are connected via pan head screws (7).
4. The process verification test tool for a composite sensor chip according to claim 1, characterized in that: A wire hole (5) is provided on the base body (4) for leading the output wire (6) out of the tooling.
5. The process verification test tool for a composite sensor chip according to claim 1, characterized in that: Install the sealing gasket (2) at the connection between the gas line connector (1) and the front cover (3).
6. The process verification test tool for a composite sensor chip according to claim 1, characterized in that: A front cover O-ring (15) is installed between the inner side of the other end of the front cover (3) and the outer side of one end of the base body (4).
7. The process verification test tool for a composite sensor chip according to claim 1, characterized in that: A small substrate O-ring (14) is installed between the interior of the substrate main body (4) and the small substrate (9).
8. The process verification test tool for a composite sensor chip according to claim 1, characterized in that: A needle seat O-ring (13) is installed between the base body (4) and the spring needle seat (11).
9. The process verification test tool for a composite sensor chip according to claim 1, characterized in that: A potting glue (12) is provided between the spring pin seat (11) and the spring pin (10).
10. The process verification test tool for a composite sensor chip according to claim 1, characterized in that: The outer side of the gas path connector (1), the outer side of one end of the base body (4) and the inner side of the front cover (3) are all provided with threads.