Heat insulation device in closed space

Abstract

The utility model discloses a heat insulation device in a closed space, which comprises a base, a cover plate and an accommodating cavity arranged in the base and the cover plate, a heat shield and a PCB (Printed Circuit Board) are arranged in the accommodating cavity, a heating unit and an optical device are fixedly arranged on the PCB, and the heat shield is positioned between the heating unit and the optical device and can block the heating unit and the optical device at corresponding positions. According to the heat insulation device in the closed space, the heat shield is arranged between the heating unit and the optical device, so that air convection and heat radiation conduction between the heating unit and the optical device are isolated, the optical device can be kept within the working temperature range of the optical device, the normal working stability of the optical device is guaranteed, and the service life of the optical device is prolonged. Meanwhile, the occupied space in the closed space is small, and miniaturization design of the application device is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of communication devices, in particular to a heat insulation device in a closed space. Background Art

[0002] With the rapid development of communication technology and the enrichment of people's lives, the demand for more powerful fiber optic networking terminals is increasing.

[0003] In the past, optical fiber network terminals had fewer functions and generated little heat. However, as the functions of existing optical fiber network terminals are improved, their heat generation has also increased. Existing heat dissipation devices are large in size and have high heat dissipation costs, which is not conducive to the miniaturization design of communication devices. Summary of the invention

[0004] In view of the deficiencies of the prior art, the utility model provides a heat insulation device in a closed space which has good heat dissipation effect and simple structure.

[0005] In order to achieve the above objectives, the utility model is implemented through the following technical solutions.

[0006] The present application provides a heat insulation device in a closed space, comprising a housing assembly, wherein a housing cavity is provided in the housing assembly, a PCB board is fixed on the inner wall of the housing cavity, and a heating unit and an optical device are fixed on the PCB board;

[0007] Wherein, a heat shield is also provided in the accommodating cavity, and the heat shield is located between the heating unit and the optical device and can block the heating unit and the optical device at corresponding positions.

[0008] Further defined, in the above-mentioned heat insulation device in a closed space, a heat insulation groove is provided through the PCB board 200, and the heat insulation groove is located between the heating unit and the optical device and is plugged into the heat shield;

[0009] Wherein, two ends of the heat shield plate in the through direction of the heat insulation groove are respectively in contact with the inner walls of the corresponding sides of the accommodating cavity.

[0010] It is further defined that, in the above-mentioned heat insulation device in a closed space, a base plate is fixedly provided at one end of the heat shield plate in the through direction of the heat insulation groove, and the base plate is perpendicular to the heat shield plate and can abut against the corresponding side end surface of the accommodating cavity.

[0011] It is further defined that, in the above-mentioned heat insulation device in a closed space, a plurality of the heating units and the optical devices are respectively fixedly provided on the PCB board;

[0012] There are a plurality of heat-insulating grooves on the PCB board, and the plurality of heat-insulating grooves are respectively located between the heating unit and the adjacent optical device and are provided with heat shielding plates.

[0013] It is further defined that, in the above-mentioned heat insulation device in a closed space, the housing assembly includes a base and a cover plate detachably connected to the base;

[0014] Wherein, the base and the cover are buckled together to form a containing cavity.

[0015] It is further defined that, in the above-mentioned heat insulation device in a closed space, the accommodating cavity is arranged in the base and is open on one side, and the cover plate of the shell assembly is buckled with the base and can close the opening of the accommodating cavity;

[0016] The PCB board is located in the accommodating cavity and is fixedly connected to the base, and the heat shield plate is respectively in contact with the base and the cover plate at two ends in the through direction of the heat insulation groove.

[0017] It is further defined that, in the above-mentioned heat insulation device in a closed space, a plurality of buckles are fixedly provided on the base along the edge of the opening of the accommodating cavity, and a clamping plate is fixedly provided on the cover plate at positions corresponding to the plurality of buckles;

[0018] Wherein, the clamping plate can be snap-connected with the corresponding position.

[0019] The utility model has at least the following beneficial effects:

[0020] 1. A heat shield is set between the heating unit and the optical device to isolate the air convection and heat radiation conduction between the heating unit and the optical device, so that the optical device can be kept within its own working temperature range, ensuring the stability of its normal operation. At the same time, it occupies a small space in the closed space, which is convenient for the miniaturization design of the application device;

[0021] 2. The heat shield is movably arranged in the accommodating cavity, which can reduce the processing cost of the housing assembly on the one hand, and improve the adaptability to the specifications of the PCB board on the other hand. The heat shield can be flexibly installed based on the arrangement position of the heating unit and the optical device on the PCB board, thereby improving the overall practicality of the device. At the same time, the heat shield can be positioned through the heat insulation groove to ensure the working stability of the heat shield;

[0022] 3. The substrate and the heat shield are arranged vertically, and the contact area between the substrate and the inner wall of the accommodating cavity is larger, thereby improving the contact and limiting stability of the inner wall of the accommodating cavity to the heat shield, thereby improving the vibration resistance between the heat shield and the PCB board, and ensuring precise thermal insulation between the heating unit and the optical device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the structure explosion of the heat insulation device in the closed space of the embodiment of the present application;

[0024] Figure 2This is a structural cross-sectional view of a heat insulation device in a closed space according to an embodiment of the present application.

[0025] Reference numerals

[0026] Base 110, buckle 111, cover 120, card board 121, PCB board 200, heat insulation groove 210, heating unit 300, optical device 400, substrate 510, heat shield 520. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0028] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0029] The heat insulation device in the closed space provided by the embodiment of the present application is described in detail below through specific embodiments and application scenarios in combination with the accompanying drawings.

[0030] like Figure 1 , Figure 2 As shown, an embodiment of the present application provides a heat insulation device in a closed space, including a base 110 and a cover 120. The base 110 and the cover 120 are detachably connected and have an accommodating cavity inside. A PCB board 200 is fixedly connected to the inner wall of the accommodating cavity.

[0031] The heating unit 300 and the optical device 400 are fixedly mounted on the PCB board 200. A heat shield 520 is also disposed in the accommodating cavity. The heat shield 520 is located between the heating unit 300 and the optical device 400 and can block the heating unit 300 and the optical device 400 at corresponding positions.

[0032] It is understandable that the temperature of the heating unit 300 is relatively high during operation, and the temperature is transmitted to the corresponding position of the optical device 400 through air convection conduction and heat radiation conduction, causing the temperature of the corresponding position of the optical device 400 to increase, thus affecting the working performance of the optical device 400.

[0033] In an embodiment of the present application, the above-mentioned heat insulation device in a closed space is adopted, and a heat shield 520 is set between the heating unit 300 and the optical device 400, so as to isolate the air convection and heat radiation conduction between the heating unit 300 and the optical device 400, so that the optical device 400 can be maintained within its own operating temperature range, ensuring the stability of its normal operation, and at the same time, the space occupied in the closed space is small, which is convenient for the miniaturized design of the application device.

[0034] In a preferred embodiment, Figure 1 , Figure 2 As shown, a heat-insulating groove 210 is provided through the PCB board 200 . The heat-insulating groove 210 is located between the heating unit 300 and the optical device 400 and is plugged into the heat shield 520 .

[0035] The heat shield plate 520 is respectively in contact with the inner wall of the corresponding side of the accommodating cavity at two ends in the through direction of the heat insulation groove 210 .

[0036] During installation, the PCB board 200 is first fixed on the inner wall of the accommodating cavity, and then the heat shield 520 is inserted into the heat insulation groove 210. When the base 110 and the cover plate 120 are fixedly connected, the inner wall of the accommodating cavity is used to resist and limit the substrate 510.

[0037] In an embodiment of the present application, the above-mentioned heat insulation device in a closed space is adopted, and the heat shield 520 is movably arranged in the accommodating cavity. On the one hand, it can reduce the processing cost of the shell component, and on the other hand, it can improve the adaptability to the specifications of the PCB board 200. Based on the setting position of the heating unit 300 and the optical device 400 on the PCB board 200, the heat shield 520 can be flexibly installed, thereby improving the overall practicality of the device. At the same time, the heat shield 520 can be positioned through the heat insulation groove 210, thereby ensuring the working stability of the heat shield 520.

[0038] In a preferred embodiment, Figure 1 , Figure 2 As shown, a plurality of heating units 300 and optical devices 400 are fixedly disposed on the PCB board 200 , respectively. A heat insulation groove 210 is disposed between the heating unit 300 and the adjacent optical device 400 , and a heat shield 520 is inserted into the heat insulation groove 210 .

[0039] In a preferred embodiment, Figure 1 , Figure 2As shown, the accommodating cavity is disposed in the base 110 and has an opening on one side. The cover plate 120 is buckled with the base 110 and can close the opening of the accommodating cavity.

[0040] The PCB board 200 is located in the accommodating cavity and is fixedly connected to the base 110 . The heat shielding plate 520 is respectively in contact with the base 110 and the cover plate 120 at two ends in the through direction of the heat insulation groove 210 .

[0041] It is understandable that the substrate 510 can also be configured to be fixedly connected to the base 110 or the cover 120, but when facing PCB boards 200 of different specifications, the positions of the heating unit 300 and the optical device 400 may be different. If the heat shield 520 is configured to be fixedly connected to the base 110 or the cover 120, it can only be applicable to one specification of PCB board 200, which is suitable for mass production. It is slightly lacking in versatility and applicability. The specific selection is based on actual needs and will not be elaborated here.

[0042] In a preferred embodiment, Figure 1 , Figure 2 As shown, a base plate 510 is fixedly provided at one end of the heat shield plate 520 in the through direction of the heat insulation groove 210 , and the base plate 510 is perpendicular to the heat shield plate 520 and can abut against the corresponding side end surface of the accommodating cavity.

[0043] It can be understood that since the substrate 510 and the heat shield plate 520 are arranged vertically, the contact area between them and the inner wall of the accommodating cavity is larger, thereby improving the contact and limiting stability of the inner wall of the accommodating cavity on the heat shield plate 520, thereby improving the vibration resistance between the heat shield plate 520 and the PCB board 200, and ensuring precise thermal insulation between the heating unit 300 and the optical device 400.

[0044] In a preferred embodiment, Figure 1 , Figure 2 As shown, a plurality of buckles 111 are fixedly provided on the inner wall of the accommodating cavity of the base 110 along the opening edge, and a clamping plate 121 is fixedly provided on the cover 120 at positions corresponding to the plurality of buckles 111 .

[0045] The clamping plate 121 can be clamped with the corresponding position buckle 111 .

[0046] It is understandable that the connection method between the base 110 and the cover 120 is not limited to the above-mentioned one. For example, a card plate 121 can be set on the base 110, and a buckle 111 that cooperates with the card plate 121 can be set on the cover 120. As long as a detachable connection between the base 110 and the cover 120 can be achieved, it will not be elaborated here.

[0047] It should be noted that, in this article, the term "comprises", "includes" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the method and device in the embodiment of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0048] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A heat insulation device in a closed space, characterized in that: It comprises a housing component, wherein a housing cavity is provided in the housing component, a PCB board is fixed on the inner wall of the housing cavity, and a heating unit and an optical device are fixed on the PCB board; Wherein, a heat shield is also provided in the accommodating cavity, and the heat shield is located between the heating unit and the optical device and can block the heating unit and the optical device at corresponding positions.

2. A heat insulation device in a closed space according to claim 1, characterized in that: The PCB board 200 is provided with a heat insulation groove, which is located between the heating unit and the optical device and is plugged into the heat shield; Wherein, two ends of the heat shield plate in the through direction of the heat insulation groove are respectively in contact with the inner walls of the corresponding sides of the accommodating cavity.

3. A heat insulation device in a closed space according to claim 1 or 2, characterized in that: A base plate is fixedly provided at one end of the heat shield plate in the through direction of the heat insulation groove. The base plate is perpendicular to the heat shield plate and can abut against the corresponding side end surface of the accommodating cavity.

4. A heat insulation device in a closed space according to claim 1 or 2, characterized in that: The heating unit and the optical device are respectively fixedly provided with a plurality of them on the PCB board; There are a plurality of heat-insulating grooves on the PCB board, and the plurality of heat-insulating grooves are respectively located between the heating unit and the adjacent optical device and are provided with heat shielding plates.

5. The heat insulation device in a closed space according to claim 1, characterized in that: The housing assembly comprises a base and a cover plate detachably connected to the base; Wherein, the base and the cover are buckled together to form a containing cavity.

6. A heat insulation device in a closed space according to claim 2 or 5, characterized in that: The accommodating cavity is arranged in the base and has an opening on one side, and the cover plate of the shell assembly is buckled with the base and can close the opening of the accommodating cavity; The PCB board is located in the accommodating cavity and is fixedly connected to the base, and the heat shield plate is respectively in contact with the base and the cover plate at two ends in the through direction of the heat insulation groove.

7. A heat insulation device in a closed space according to claim 5, characterized in that: A plurality of buckles are fixedly provided on the base along the opening edge of the accommodating cavity, and a clamping plate is fixedly provided on the cover at positions corresponding to the plurality of buckles; Wherein, the clamping plate can be snap-connected with the corresponding position.

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