CPU (Central Processing Unit) liquid cooling heat dissipation module applied in server case

Abstract

The utility model discloses a CPU (Central Processing Unit) liquid cooling heat dissipation module applied in a server chassis, which comprises a heat sink, a liquid cooling piece and a heat pipe, and is characterized in that the heat sink is used for leading out the heat of a CPU; the liquid cooling part comprises a liquid cooling main body, S-shaped channels are formed in the top surface and the bottom surface of the liquid cooling main body, a liquid inlet hole and a liquid outlet hole are formed in the left side and the right side of the liquid cooling main body respectively, the liquid inlet hole communicates with one ends of the two S-shaped channels, and the liquid outlet hole communicates with the other ends of the two S-shaped channels; the heat pipe is arranged between the heat sink and the liquid cooling part and used for transmitting heat of the heat sink to the liquid cooling part, the two ends of the heat pipe are provided with a condensation section and an evaporation section respectively, the evaporation section is embedded into the heat sink, the condensation section is embedded into the liquid cooling body, and the condensation section is located between the two S-shaped channels. According to the CPU liquid cooling heat dissipation module applied to the interior of the server case, the heat pipes can be reasonably arranged in a limited space, so that the heat dissipation module is rapid in heat conduction, good in heat dissipation effect and high in reliability, and rapid, efficient and stable heat dissipation efficiency is provided for heat dissipation of a CPU of a server.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a CPU liquid cooling heat dissipation module used in a server chassis. Background Art

[0002] At present, there are two main cooling methods used in server CPUs: air cooling and liquid cooling. Air cooling uses a fan and a heat sink as the main heat dissipation method, and the heat of the heat sink is quickly dissipated through forced convection of the fan. Liquid cooling consists of a water-cooled plate module, a circulating fluid, a water pump, a pipe, and a water tank or a heat exchanger. A water-cooled module is a metal component with a water channel inside, made of copper or aluminum, which contacts the CPU and absorbs the heat of the CPU. The circulating fluid flows in the circulating pipe by the action of the water pump. If the liquid is water, it is what we commonly call a water cooling system. Most heat sinks use aluminum as a heat-conducting medium, and the thermal conductivity is about 90~186w / (mk). The power consumption of server cooling modules on the market is mostly in the range of 300~750W, but this power consumption of cooling modules cannot meet the market demand, so a higher power consumption demand is derived. Because the heat generated by the server CPU when working is very large, it needs to be quickly conducted out and dissipated to make it work normally, so the high-power server CPU has higher requirements for heat dissipation.

[0003] In the past, the efficiency of conduction between metals, that is, the heat from the CPU is conducted to the substrate and then to the aluminum heat sink, can no longer meet the heat dissipation needs. Even if the heat can be dissipated by increasing the contact area between the heat sink and the air, the slow conduction efficiency cannot meet the heat dissipation performance requirements. Therefore, it is particularly important to use heat pipes as an efficient conduction and heat distribution method for high-power CPU heat dissipation.

[0004] However, since there are many factors that affect the heat transfer efficiency of heat pipes, the layout of heat pipes in existing liquid cooling modules is unreasonable. When a high-power and high-heat CPU is working, it is difficult for the cooling module to meet the CPU cooling requirements, making it difficult to ensure CPU reliability. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a CPU liquid cooling heat dissipation module used in a server chassis, which can reasonably arrange heat pipes in a limited space, so that the heat dissipation module has fast heat conduction, good heat dissipation effect, and high reliability, providing fast, efficient and stable heat dissipation efficiency for the CPU heat dissipation of the server.

[0006] According to the first aspect of the utility model, a CPU liquid cooling heat dissipation module used in a server chassis includes: a heat sink, which is arranged on the CPU of the server and is used to export the heat of the CPU; a liquid cooling component, including a liquid cooling body, the top and bottom surfaces of the liquid cooling body are both provided with S-shaped grooves, the two S-shaped grooves accommodate cooling liquid to pass through to take away the heat of the liquid cooling body, and the left and right sides of the liquid cooling body are respectively provided with a liquid inlet hole and a liquid outlet hole, the liquid inlet hole is connected to one end of the two S-shaped grooves, and the liquid outlet hole is connected to the other end of the two S-shaped grooves; a heat pipe is arranged between the heat sink and the liquid cooling component, and is used to transfer the heat of the heat sink to the liquid cooling component, and has a condensation section and an evaporation section at both ends, respectively, the evaporation section is embedded in the heat sink, and the condensation section is embedded in the liquid cooling body, and the condensation section is located between the two S-shaped grooves.

[0007] According to an embodiment of the utility model, a CPU liquid cooling heat dissipation module used in a server chassis has at least the following beneficial effects:

[0008] 1. The utility model provides a heat sink, which is arranged on the CPU of the server. The heat sink is used to export the heat of the CPU, so that the heat sink can contact with the CPU to export the heat of the CPU, thereby improving the heat export efficiency of the CPU.

[0009] 2. The utility model provides a liquid cooling component, which includes a liquid cooling body. The top and bottom surfaces of the liquid cooling body are both provided with S-shaped grooves. The two S-shaped grooves accommodate coolant to pass through so as to take away the heat of the liquid cooling body. Thus, the coolant can pass through the liquid cooling body from the two S-shaped grooves, thereby increasing the contact area between the liquid cooling body and the coolant, thereby improving the cooling efficiency of the liquid cooling component and achieving a better heat dissipation effect of the heat dissipation module.

[0010] 3. The utility model provides a liquid inlet hole and a liquid outlet hole on the left and right sides of the liquid cooling body respectively, the liquid inlet hole is connected to one end of the two S-shaped grooves, and the liquid outlet hole is connected to the other end of the two S-shaped grooves, so that the liquid inlet hole can supply cooling liquid to the two S-shaped grooves at the same time, and the cooling liquid in the two S-shaped grooves can be output from the liquid outlet at the same time, thereby reducing the arrangement of the liquid inlet hole and the liquid outlet hole, reducing the processing difficulty of the liquid cooling body and reducing the number of water pipes connecting the liquid inlet hole and the liquid outlet hole, saving the layout space of the liquid cooling heat dissipation module in the chassis.

[0011] 4. The utility model sets a heat pipe between the heat sink and the liquid cooling component. The heat pipe is used to transfer the heat of the heat sink to the liquid cooling component. Thus, the heat pipe can actively transfer the heat of the heat sink to the liquid cooling component by utilizing the heat conduction principle and the rapid heat transfer property of the phase change medium, thereby improving the heat transfer efficiency between the heat sink and the liquid cooling component, and further accelerating the heat dissipation efficiency of the liquid cooling heat dissipation module.

[0012] 5. The utility model respectively arranges a condensing section and an evaporating section at both ends of the heat pipe, the evaporating section is embedded in a heat sink, the condensing section is embedded in a liquid cooling body, and the condensing section is located between two S-shaped grooves. It can be understood that the condensing section is embedded between the two S-shaped grooves so that the coolant in the two S-shaped grooves can cool the liquid cooling body from two relative directions of the heat pipe, so that the temperature of the liquid cooling body in two relative directions of the heat pipe is more balanced, thereby enabling the liquid cooling body to dissipate heat evenly to the condensing section of the heat pipe, thereby improving the heat dissipation effect of the liquid cooling heat dissipation module, improving the reliability of the liquid cooling heat dissipation module, providing fast, efficient and stable heat dissipation efficiency for the CPU heat dissipation of the server, effectively ensuring that the temperature of the CPU is stable and consistent during operation and is controlled to work within an effective temperature, ensuring that the CPU will not be abnormal due to excessively high temperature during heating, causing the server system to crash, and at the same time, the efficient heat dissipation efficiency can extend the service life of the server.

[0013] According to some embodiments of the present invention, two heat sinks are provided, and eight heat pipes are provided, wherein four heat pipes are provided between one heat sink and the liquid cooling component, and the other four heat pipes are provided between another heat sink and the liquid cooling component.

[0014] According to some embodiments of the utility model, the two heat sinks are respectively located on the front and rear sides of the liquid cooling component, the heat pipe is U-shaped, the evaporation section is embedded in the heat sink along the left and right directions, and the condensation section is embedded in the liquid cooling body along the left and right directions.

[0015] According to some embodiments of the present invention, two heat pipes are respectively disposed on the left and right sides of the heat sink.

[0016] According to some embodiments of the present invention, a D-shaped groove is provided on the bottom surface of the heat sink, the cross-section of the evaporation section is D-shaped, the D-shaped groove accommodates the evaporation section, and the bottom surface of the evaporation section is flush with the bottom surface of the heat sink.

[0017] According to some embodiments of the present utility model, the liquid cooling body is provided with a circular hole, the cross-section of the condensing section is circular, and the circular hole accommodates the condensing section.

[0018] According to some embodiments of the present invention, the circular hole penetrates the liquid cooling body from front to back, and the condensation section penetrates the liquid cooling body through the circular hole.

[0019] According to some embodiments of the present invention, the top of the S-shaped groove is open, and the liquid cooling component further includes an upper cover and a lower cover, and the upper cover and the lower cover are respectively used to cover the two S-shaped grooves.

[0020] According to some embodiments of the utility model, the S-shaped groove meanders on the liquid cooling body, and the top and bottom surfaces of the liquid cooling body are both provided with a first cavity, and a plurality of first partition bars and second partition bars are provided in the first cavity, one end of the first partition bar is connected to the left side wall of the first cavity, and the free end of the first partition bar extends to the right, one end of the second partition bar is connected to the right side wall of the first cavity, and the free end of the second partition bar extends to the left, the first partition bars and the second partition bars are alternately arranged along the front-to-back direction of the first cavity, and the first partition bars and the second partition bars are used to form the side walls of the S-shaped groove.

[0021] According to some embodiments of the utility model, the side corners of the first cavity, the free end of the first partition bar, the connection between the first partition bar and the left side wall of the first cavity, the free end of the second partition bar, and the connection between the second partition bar and the right side wall of the first cavity are chamfered.

[0022] According to some embodiments of the present utility model, the S-shaped channel is provided with a plurality of channel ribs, and the channel ribs are arranged along the flow guiding direction of the S-shaped channel.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 This is a schematic diagram of the structure of a CPU liquid cooling module used in a server chassis according to an embodiment of the utility model;

[0026] Figure 2 for Figure 1 A top view is shown;

[0027] Figure 3 for Figure 2 AA cross-sectional view shown;

[0028] Figure 4 for Figure 1 An exploded view of the parts shown;

[0029] Figure 5 for Figure 4 A schematic diagram of the structure of the heat sink is shown;

[0030] Figure 6 for Figure 4 Schematic diagram of the structure of the liquid cooling body in the market;

[0031] Figure 7 for Figure 4 A schematic diagram of the structure of a heat pipe is shown.

[0032] Figure markings: 100 - heat sink, 110 - liquid cooling part, 120 - liquid cooling body, 130 - S-shaped groove, 140 - liquid inlet, 150 - liquid outlet, 160 - heat pipe, 170 - condensation section, 180 - evaporation section, 190 - D-shaped groove, 200 - circular hole, 210 - upper cover, 220 - lower cover, 230 - first partition bar, 240 - second partition bar, 250 - groove rib. DETAILED DESCRIPTION

[0033] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0034] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0036] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] A CPU liquid cooling module for use in a server chassis according to an embodiment of the present invention will be described below in conjunction with the accompanying drawings.

[0038] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 A CPU liquid cooling heat dissipation module used in a server chassis according to an embodiment of the utility model includes a heat sink 100 , a liquid cooling element 110 and a heat pipe 160 .

[0039] Reference Figure 5 As for the heat sink 100, the heat sink 100 is set on the CPU of the server, and the heat sink 100 is used to export the heat of the CPU, so that the heat sink 100 can contact with the CPU to export the heat of the CPU, thereby improving the heat export efficiency of the CPU.

[0040] Reference Figure 6 For the liquid cooling component 110, the liquid cooling component 110 includes a liquid cooling body 120, and the top and bottom surfaces of the liquid cooling body 120 are both provided with S-shaped grooves 130. The two S-shaped grooves 130 accommodate the cooling liquid to pass through so as to take away the heat of the liquid cooling body 120, so that the cooling liquid can pass through the liquid cooling body 120 from the two S-shaped grooves 130, increase the contact area between the liquid cooling body 120 and the cooling liquid, and then improve the cooling efficiency of the liquid cooling component 110, so that the heat dissipation effect of the heat dissipation module is better.

[0041] Furthermore, a liquid inlet hole 140 and a liquid outlet hole 150 are respectively provided on the left and right sides of the liquid cooling body 120. The liquid inlet hole 140 is connected to one end of the two S-shaped grooves 130, and the liquid outlet hole 150 is connected to the other end of the two S-shaped grooves 130. Thus, the liquid inlet hole 140 can supply cooling liquid to the two S-shaped grooves 130 at the same time. At the same time, the cooling liquid of the two S-shaped grooves 130 can be output from the liquid outlet at the same time, thereby reducing the setting of the liquid inlet hole 140 and the liquid outlet hole 150, reducing the processing difficulty of the liquid cooling body 120, and reducing the number of water pipes connecting the liquid inlet hole 140 and the liquid outlet hole 150, thereby saving the layout space of the liquid cooling heat dissipation module in the chassis.

[0042] In some specific embodiments, the top of the S-shaped groove 130 is open, and the liquid cooling component 110 further includes an upper cover 210 and a lower cover 220 , and the upper cover 210 and the lower cover 220 are respectively used to cover the two S-shaped grooves 130 .

[0043] It can be understood that the top of the S-shaped groove 130 is open, which can facilitate the processing of the S-shaped groove 130 on the liquid-cooled body 120. At the same time, the upper cover 210 and the lower cover 220 are respectively used to cover the two S-shaped grooves 130, so that the upper cover 210 and the lower cover 220 can cover and seal the S-shaped groove 130 after the processing of the S-shaped groove 130 is completed, thereby avoiding leakage of the coolant in the S-shaped groove 130.

[0044] In some specific embodiments, the S-shaped groove 130 meanders on the liquid cooling body 120, and the top and bottom surfaces of the liquid cooling body 120 are both provided with a first cavity, and a plurality of first partition bars 230 and second partition bars 240 are provided in the first cavity, one end of the first partition bar 230 is connected to the left side wall of the first cavity, and the free end of the first partition bar 230 extends to the right, one end of the second partition bar 240 is connected to the right side wall of the first cavity, and the free end of the second partition bar 240 extends to the left, the first partition bars 230 and the second partition bars 240 are alternately arranged along the front and rear direction of the first cavity, and the first partition bars 230 and the second partition bars 240 are used to form the side walls of the S-shaped groove 130.

[0045] It needs to be explained that the S-shaped groove 130 winding around the liquid-cooling body 120 means that the shape of the S-shaped groove 130 twists and turns like a snake, that is, the S-shaped groove 130 extends from one side of the liquid-cooling body 120 to the other side, then turns 180 degrees and continues to extend, and then continues to turn and extend while winding around the liquid-cooling body 120, thereby making the distribution area of ​​the S-shaped groove 130 on the liquid-cooling body 120 larger, and further, making the cooling area of ​​the coolant in the S-shaped groove 130 for the liquid-cooling body 120 larger, thereby improving the cooling efficiency of the coolant on the liquid-cooling body 120.

[0046] Furthermore, the side corners of the first cavity, the free end of the first partition bar 230, the connection between the first partition bar 230 and the left side wall of the first cavity, the free end of the second partition bar 240, and the connection between the second partition bar 240 and the right side wall of the first cavity are chamfered. Thus, the chamfered rib end design of the S-shaped groove 130 is beneficial to reducing the flow loss of the coolant, the cooling liquid pressure drop is low, and there is room for improvement and optimization of the structure of the water-cooled plate to achieve better energy-saving effects.

[0047] In some specific embodiments, the S-shaped groove 130 is provided with a plurality of groove ribs 250, and the groove ribs 250 are arranged along the guide direction of the S-shaped groove 130, so that the groove ribs 250 can contact the coolant, further increasing the contact area between the coolant and the liquid cooling body 120, and further improving the heat dissipation efficiency of the liquid cooling part 110.

[0048] In some specific embodiments, the liquid cooling element 110 and the heat sink 100 are fixed on the circuit board of the CPU by screw locking, so as to ensure the mechanical reliability of the liquid cooling heat dissipation module.

[0049] In some specific embodiments, the liquid cooling element 110 and the heat sink 100 are both made of aluminum alloy 6063 with a thermal conductivity of 201 W / m·K. Thus, while ensuring the heat dissipation efficiency of the liquid cooling heat dissipation module, the mechanical vibration reliability of the entire product is also improved, and the assembly of the entire liquid cooling heat dissipation module is relatively simple and the cost is low.

[0050] Reference Figure 7 As for the heat pipe 160, the heat pipe 160 is arranged between the heat sink 100 and the liquid cooling part 110. The heat pipe 160 is used to transfer the heat of the heat sink 100 to the liquid cooling part 110, so that the heat pipe 160 can actively transfer the heat of the heat sink 100 to the liquid cooling part 110 by using the heat conduction principle and the rapid heat transfer property of the phase change medium, thereby improving the heat transfer efficiency between the heat sink 100 and the liquid cooling part 110, and then accelerating the heat dissipation efficiency of the liquid cooling heat dissipation module.

[0051] Specifically, the heat pipe 160 has a condensing section 170 and an evaporating section 180 at both ends, the evaporating section 180 is embedded in the heat sink 100 , the condensing section 170 is embedded in the liquid cooling body 120 , and the condensing section 170 is located between the two S-shaped grooves 130 .

[0052] It can be understood that the condensation section 170 is embedded between the two S-shaped grooves 130, so that the coolant in the two S-shaped grooves 130 can cool the liquid cooling body 120 from two relative directions of the heat pipe 160, so that the temperature of the liquid cooling body 120 in two relative directions of the heat pipe 160 is more balanced, so that the liquid cooling body 120 can evenly dissipate heat to the condensation section 170 of the heat pipe 160, thereby improving the heat dissipation effect of the liquid cooling heat dissipation module, improving the reliability of the liquid cooling heat dissipation module, providing fast, efficient and stable heat dissipation efficiency for the CPU heat dissipation of the server, effectively ensuring that the temperature of the CPU is stable and consistent during operation and is controlled to work within an effective temperature, ensuring that the CPU will not malfunction due to excessively high temperature during heating, causing the server system to crash, and at the same time, efficient heat dissipation efficiency can extend the service life of the server.

[0053] In some specific embodiments, the heat pipe 160 is fixed to the liquid cooling body 120 and the heat sink 100 by low-temperature solder paste welding, thereby making the connection between the heat pipe 160 and the liquid cooling body 120 and the heat sink 100 more secure.

[0054] In some specific embodiments, two heat sinks 100 are provided and eight heat pipes 160 are provided, wherein four heat pipes 160 are provided between one heat sink 100 and the liquid cooling element 110 , and the other four heat pipes 160 are provided between another heat sink 100 and the liquid cooling element 110 .

[0055] It is understandable that 8 heat pipes 160 are arranged in a limited space, the total power consumption of the 8 heat pipes 160 can reach more than 400W, and the thermal conductivity of the heat pipe 160 is about 20000w / (mk)~40000w / (mk), which can quickly transfer the heat generated by the CPU to the liquid cooling component 110, thereby improving the heat transfer efficiency.

[0056] In some specific embodiments, the two heat sinks 100 are respectively located on the front and rear sides of the liquid cooling component 110, the heat pipe 160 is U-shaped, the evaporation section 180 is embedded in the heat sink 100 along the left and right directions, and the condensation section 170 is embedded in the liquid cooling body 120 along the left and right directions. Thus, the heat sink 100 can be arranged on the front and rear sides of the liquid cooling component 110, while maintaining a small occupied space of the liquid cooling heat dissipation component, the distance between the two heat sinks 100 can be increased, so that the arrangement position interval of the two heat sinks 100 on the CPU is increased, and then, the heat sink 100 can evenly export heat to the CPU.

[0057] In some specific embodiments, two heat pipes 160 are respectively arranged on the left and right sides of the heat sink 100. Thus, the close-packed and left-right symmetrical distribution design of the heat pipes 160 can improve the heat dissipation capacity of the liquid cooling module, and the overall thermal resistance is low, so that the surface temperature distribution of the two heat sinks 100 is more uniform, which is beneficial to improving the stability of the CPU and enhancing the heat dissipation effect.

[0058] In some specific embodiments, a D-shaped groove 190 is provided on the bottom surface of the heat sink 100, and the cross-section of the evaporation section 180 is D-shaped. The D-shaped groove 190 accommodates the evaporation section 180, and the bottom surface of the evaporation section 180 is flush with the bottom surface of the heat sink 100. Therefore, when the heat sink 100 is fixed on the CPU, the bottom surface of the heat sink 100 abuts against the CPU, so that the bottom surface of the evaporation section 180 abuts against the CPU, so that the evaporation section 180 can directly and actively transfer the heat of a part of the CPU to the liquid cooling part 110, thereby accelerating the heat transfer efficiency. In addition, the cross-section of the evaporation section 180 is D-shaped, so that one side of the plane of the evaporation section 180 abuts against the CPU, thereby increasing the contact area between the evaporation section 180 and the CPU, and further accelerating the heat transfer efficiency.

[0059] In some specific embodiments, the liquid cooling body 120 is provided with a circular hole 200, and the cross-section of the condensing section 170 is circular. The circular hole 200 accommodates the condensing section 170, thereby making the contact area between the condensing section 170 and the liquid cooling body 120 larger, and further making the condensation efficiency of the liquid cooling body 120 on the condensing section 170 higher.

[0060] In some specific embodiments, the circular hole 200 passes through the liquid cooling body 120 from front to back, and the condensation section 170 passes through the liquid cooling body 120 through the circular hole 200, thereby further increasing the contact area between the condensation section 170 and the liquid cooling body 120, and further improving the condensation efficiency of the liquid cooling body 120 on the condensation section 170.

[0061] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0062] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A CPU liquid cooling module used in a server chassis, characterized in that: include: A heat sink (100), arranged on a CPU of a server, for dissipating heat from the CPU; A liquid cooling component (110) comprises a liquid cooling body (120), wherein the top surface and the bottom surface of the liquid cooling body (120) are both provided with S-shaped grooves (130), wherein the two S-shaped grooves (130) are used to receive cooling liquid to pass through so as to take away the heat of the liquid cooling body (120), and the left and right sides of the liquid cooling body (120) are respectively provided with a liquid inlet hole (140) and a liquid outlet hole (150), wherein the liquid inlet hole (140) is connected to one end of the two S-shaped grooves (130), and the liquid outlet hole (150) is connected to the other end of the two S-shaped grooves (130); A heat pipe (160) is arranged between the heat sink (100) and the liquid cooling component (110) and is used to transfer the heat of the heat sink (100) to the liquid cooling component (110). Two ends of the heat pipe (160) are respectively provided with a condensation section (170) and an evaporation section (180). The evaporation section (180) is embedded in the heat sink (100), and the condensation section (170) is embedded in the liquid cooling body (120). The condensation section (170) is located between the two S-shaped grooves (130).

2. A CPU liquid cooling module for use in a server chassis according to claim 1, characterized in that: Two heat sinks (100) are provided, and eight heat pipes (160) are provided, wherein four heat pipes (160) are provided between one heat sink (100) and the liquid cooling component (110), and the other four heat pipes (160) are provided between another heat sink (100) and the liquid cooling component (110).

3. A CPU liquid cooling module for use in a server chassis according to claim 2, characterized in that: The two heat sinks (100) are respectively located at the front and rear sides of the liquid cooling component (110), the heat pipe (160) is U-shaped, the evaporation section (180) is embedded in the heat sink (100) along the left and right directions, and the condensation section (170) is embedded in the liquid cooling body (120) along the left and right directions.

4. A CPU liquid cooling module for use in a server chassis according to claim 2, characterized in that: Two heat pipes (160) are respectively arranged on the left and right sides of the heat sink (100).

5. The CPU liquid cooling module used in a server chassis according to claim 1, characterized in that: The bottom surface of the heat sink (100) is provided with a D-shaped groove (190), the cross section of the evaporation section (180) is D-shaped, the D-shaped groove (190) accommodates the evaporation section (180), and the bottom surface of the evaporation section (180) is flush with the bottom surface of the heat sink (100).

6. A CPU liquid cooling module for use in a server chassis according to claim 1, characterized in that: The liquid cooling body (120) is provided with a circular hole (200), the cross section of the condensing section (170) is circular, and the circular hole (200) accommodates the condensing section (170).

7. A CPU liquid cooling module for use in a server chassis according to claim 1, characterized in that: The top of the S-shaped groove (130) is open, and the liquid cooling component (110) further comprises an upper cover (210) and a lower cover (220), wherein the upper cover (210) and the lower cover (220) are respectively used to cover the two S-shaped grooves (130).

8. The CPU liquid cooling module used in a server chassis according to claim 1, characterized in that: The S-shaped groove (130) is winding and coiling on the liquid cooling body (120), and the top surface and the bottom surface of the liquid cooling body (120) are both provided with a first cavity, and a plurality of first partition bars (230) and second partition bars (240) are provided in the first cavity, one end of the first partition bar (230) is connected to the left side wall of the first cavity, and the free end of the first partition bar (230) extends to the right, one end of the second partition bar (240) is connected to the right side wall of the first cavity, and the free end of the second partition bar (240) extends to the left, the first partition bars (230) and the second partition bars (240) are alternately arranged along the front-to-back direction of the first cavity, and the first partition bars (230) and the second partition bars (240) are used to form the side walls of the S-shaped groove (130).

9. A CPU liquid cooling module for use in a server chassis according to claim 8, characterized in that: The side corners of the first cavity, the free end of the first partition bar (230), the connection between the first partition bar (230) and the left side wall of the first cavity, the free end of the second partition bar (240), and the connection between the second partition bar (240) and the right side wall of the first cavity are chamfered.

10. The CPU liquid cooling module used in a server chassis according to claim 1, characterized in that: The S-shaped channel (130) is provided with a plurality of channel ribs (250), and the channel ribs (250) are arranged along the flow guiding direction of the S-shaped channel (130).

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