Non-surface metal magnetization easy-to-assemble microstrip isolator

Abstract

The utility model discloses a non-surface metal magnetization easy-to-assemble microstrip isolator, which comprises a microstrip circuit (2) fixed on the upper surface of a ferrite substrate (1), a main circuit (21), a compensating circuit (22), a signal metal conduction band (23), a high-frequency impedance line (24), a matching circuit (25) and an open-circuit line (26) which are connected with one another, and soft gold is plated on the surfaces of the circuits. A signal metal conduction band (23) of the third port (2c) is connected with an open-circuit line (26) right facing the third port (2c) through a thin-film resistor (5). The ceramic substrate (3) is glued in the circular groove magnetization area (1a) on the lower surface of the ferrite substrate (1) through epoxy resin glue, and the permanent magnet (4) is connected to the ceramic substrate (3) through epoxy resin glue. The utility model has the advantages of few assembly steps, simplified number of parts, high reliability and small volume, reduces the space proportion of the communication module in the whole machine, and is suitable for surface mounting and microcircuit integration.

Description

Technical Field

[0001] The utility model relates to the technical field of microstrip lines in the field of microwave communications, in particular to a non-surface metal magnetized easy-to-assemble microstrip isolator. Background Art

[0002] With the mature application of microwave technology and the rapid advancement of technology, in order to comply with the mainstream call for a strong country in science and technology, the entire microwave electronic system urgently needs to break through technical barriers, which also puts higher requirements on the electrical performance and production capacity of microstrip line isolators.

[0003] The existing microstrip isolators can basically no longer meet the needs of many system patch installations. Specifically, the existing isolators cannot be greatly compressed when mounted in the entire system, the differences in linear expansion coefficients between components also affect the reliability during installation and fixation, and the ferrite substrate is easily cracked during welding, which seriously affects the reliability development of the entire electronic system's micro-integration. Utility Model Content

[0004] The purpose of the utility model is to solve the problems of low circuit diversity, large size, poor heat dissipation and reliability, and great debugging difficulty of existing microstrip isolators, and to provide a non-surface metal magnetized easy-to-assemble microstrip isolator, which can greatly compress the internal height of the entire system, realize a thin-film design, improve the heat dissipation capacity of the isolator, reduce the risk of cracking of the ferrite substrate due to welding, improve product reliability, provide diverse circuits, and reduce the difficulty of debugging.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A non-surface metal magnetization easy-to-assemble microstrip isolator comprises a ferrite substrate, a microstrip circuit, a ceramic substrate, a permanent magnet and a thin film resistor which cooperate with each other.

[0007] The microstrip circuit is fixed on the upper surface of the ferrite substrate, and includes a main circuit, a compensation circuit, a signal metal conduction strip, a high-frequency impedance line, a matching circuit and an open-ended line connected to each other. The surface of the microstrip circuit is plated with soft gold. The main circuit is a hexagonal structure, and three compensation circuits and three signal metal conduction strips are respectively arranged at intervals on the six sides of the hexagon. The input and output port circuits where the signal metal conduction strips are located are sequentially provided with a first port, a second port and a third port. The signal metal conduction strip of the third port is connected to the open-ended line facing the third port through a thin film resistor. A group of matching circuits are arranged around each signal metal conduction strip, and a high-frequency impedance line is arranged on each signal metal conduction strip.

[0008] The lower surface of the ferrite substrate is provided with a circular slot magnetization area, the ceramic substrate is glued in the circular slot magnetization area by epoxy resin glue, and the permanent magnet is fixed on the ceramic substrate by epoxy resin glue.

[0009] Furthermore, the thin film resistor is a thin film load with a planar structure, which is deposited between the gold-plated open-circuit line on the third port and the signal metal conduction band of the Y-type circuit on the same port by magnetron sputtering.

[0010] Furthermore, the microstrip circuit is mounted on the upper surface of a ferrite substrate by vacuum sputtering. The ferrite substrate is a rectangular structure of a nickel-zinc material. The upper surface of the ferrite substrate is polished, and the lower surface is plated with copper and soft gold.

[0011] Furthermore, the width of the open line is 0.2 mm to 0.5 mm, and the length is 2 to 4 mm.

[0012] Furthermore, the compensation circuit is three non-enclosed concave circuits, including a first compensation circuit, a second compensation circuit and a third compensation circuit, all of which are connected to the main circuit at intervals.

[0013] Furthermore, the signal metal conductive strip includes a first signal metal conductive strip, a second signal metal conductive strip and a third signal metal conductive strip, the line width of which is set to 0.3 mm to 0.5 mm, and the three signal metal conductive strips are respectively arranged on three end surfaces of the ferrite substrate.

[0014] Furthermore, the high-frequency impedance line includes a first high-frequency impedance line, a second high-frequency impedance line and a third high-frequency impedance line, and the line widths thereof are set to be 0.8-1.2 mm.

[0015] Furthermore, the matching circuit is a rectangular structure, which includes a first matching circuit, a second matching circuit and a third matching circuit, which are respectively arranged at adjacent positions of the corresponding signal metal conductive strips and connected to the signal metal conductive strips through rare metals with good ductility.

[0016] Furthermore, the central axis of the circular slot magnetization area of ​​the ferrite substrate and the central axis of the permanent magnet coincide with the central axis of the magnetization area of ​​the main circuit.

[0017] Furthermore, the permanent magnet is a samarium cobalt permanent magnet.

[0018] Compared with the prior art, the advantages of the technical solution of the utility model are specifically:

[0019] (1) The utility model implements the magnetization of the substrate bottom by digging a groove, and places a ceramic substrate and a permanent magnet of a non-surface metal magnetized easy-to-assemble microstrip isolator into the bottom groove for mounting, which greatly compresses the overall height of the isolator and truly realizes the thin-film design of the device;

[0020] (2) The utility model reduces the number of conventional parts - the base, which not only improves the heat dissipation capacity of the isolator, but also reduces the risk of cracking of the ferrite substrate due to welding, improves the reliability of the product, and reduces the overall weight of the product;

[0021] (3) The design of the matching circuit of the utility model can connect the signal metal conduction band and the surrounding optional block circuit through rare metal with good ductility, providing a variety of circuits and reducing the difficulty of debugging. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is an exploded view of the structure of the non-surface metal magnetized easy-to-assemble microstrip isolator of the utility model;

[0023] Figure 2 The utility model is a non-surface metal magnetization easy-to-assemble microstrip isolator stereo Figure 1 ;

[0024] Figure 3 The utility model is a non-surface metal magnetization easy-to-assemble microstrip isolator stereo Figure 2 . DETAILED DESCRIPTION Example

[0025] In order to make the present invention more clear, a non-surface metal magnetization easy-to-assemble microstrip isolator of the present invention is further described below in conjunction with the accompanying drawings. The specific embodiments described here are only used to explain the present invention and are not used to limit the present invention.

[0026] See also Figure 1 A non-surface metal magnetization easy-to-assemble microstrip isolator comprises a ferrite substrate 1, a microstrip circuit 2, a ceramic substrate 3, a permanent magnet 4 and a thin film resistor 5 which cooperate with each other, and is characterized in that:

[0027] See also Figure 1 and Figure 2 The microstrip circuit 2 is fixed on the upper surface of the ferrite substrate 1, and includes a connected main circuit 21, a compensation circuit 22, a signal metal conductive strip 23, a high-frequency impedance line 24, a matching circuit 25 and an open line 26. The surface of the microstrip circuit 2 is plated with soft gold, and it is mounted on the upper surface of the ferrite substrate 1 by vacuum sputtering. The ferrite substrate 1 is a rectangular structure, and the upper surface of the ferrite substrate 1 is polished, and the lower surface is plated with copper and soft gold;

[0028] The main circuit 21 is a hexagonal structure, and three non-enclosed concave compensation circuits 22 and three signal metal conductive strips 23 are arranged at intervals on the six sides of the hexagon respectively. The input and output port circuits where the signal metal conductive strips 23 are located are provided with a first port 2a, a second port 2b and a third port 2c in sequence. The signal metal conductive strip 23 of the third port 2c is connected to an open line 26 facing the third port 2c through a thin film resistor 5. A group of matching circuits 25 are arranged around each signal metal conductive strip 23, and a high-frequency impedance line 24 is arranged on each signal metal conductive strip 23.

[0029] The thin film resistor 5 is a thin film load with a planar structure, and is deposited between the gold-plated open line 26 on the third port 2c and the signal metal conductive strip 23 of the Y-type circuit on the same port by magnetron sputtering;

[0030] See also Figures 1 to 3 A circular slot magnetization area 1a is provided on the lower surface of the ferrite substrate 1, and the ceramic substrate 3 is glued in the circular slot magnetization area 1a by epoxy resin glue. The permanent magnet 4 is fixed on the ceramic substrate 3 by epoxy resin glue. The central axis of the circular slot magnetization area of ​​the ferrite substrate 1 and the central axis of the permanent magnet 4 coincide with the central axis of the magnetization area of ​​the main circuit 21.

[0031] In this embodiment, the width of the open line 26 is 0.2mm~0.5mm, the length is 2.5~3.5mm, the line width of the signal metal conductive strip 23 is set to 0.3mm~0.5mm, and the three signal metal conductive strips 23 are respectively arranged on the three end surfaces of the ferrite substrate 1, and the line width of the high-frequency impedance line 24 is set to 0.8~1.2mm.

[0032] In this embodiment, the permanent magnet 4 is a samarium cobalt permanent magnet.

[0033] In this embodiment, the matching circuit 25 is a rectangular structure, which is disposed adjacent to the signal metal conductive strip 23 and connected to the signal metal conductive strip 23 via a rare metal with good ductility for adjusting performance.

[0034] In this embodiment, the material of the ferrite substrate 1 is nickel-zinc ferrite, which has a high density and is easy to improve the polishing finish of the ferrite surface; the microstrip circuit 2 is mounted on the upper surface of the ferrite substrate 1 through processes such as photolithography technology, electroplating and physical activation and decontamination, and all circuits are plated with soft gold; the thin film resistor 5 is deposited on the metal open line of the third port 2c of the microstrip circuit 2 through a magnetron sputtering process; the ceramic substrate 3 is fixed in the circular groove magnetization area 1a on the lower surface of the ferrite substrate 1 through epoxy resin glue, and the permanent magnet 4 is glued to the ceramic substrate 3 through epoxy resin, providing a constant magnetic field for the operation of the isolator.

[0035] When working, the permanent magnet 4 magnetizes the ferrite substrate 1 longitudinally, the edge of the ferrite substrate 1 is magnetized uniformly, and the grounding is good. In addition, due to the simplification of structural parts and the removal of welding process, the product reliability is improved. The upper surface of the ferrite substrate of the utility model is polished, and the surface oil and foreign particles are removed by chemical methods. Then, the surface is activated and adsorbed by physical methods to ensure the adhesion of the circuit film layer.

[0036] The non-surface metal magnetization easy-to-assemble microstrip isolator of the utility model is suitable for surface mounting technology and is connected to the microwave circuit through gold wire bonding technology. When the whole machine is installed, the base can be fixed by gluing or welding. The absorption load of the isolator is deposited on the matching line of the third-end circuit, and a thin film matching absorption form is adopted. This microstrip isolator is easy to install, has a streamlined structure, compressed height, reduced volume, and reduced weight.

[0037] In addition to the above embodiments, the present invention may also have other implementations. Any technical solution formed by equivalent replacement or equivalent transformation falls within the protection scope required by the present invention.

Claims

1. A non-surface metal magnetization easy-to-assemble microstrip isolator, comprising a ferrite substrate (1), a microstrip circuit (2), a ceramic substrate (3), a permanent magnet (4) and a thin film resistor (5) that cooperate with each other, characterized in that: The microstrip circuit (2) is fixed on the upper surface of the ferrite substrate (1), and comprises a main circuit (21), a compensation circuit (22), a signal metal conductive strip (23), a high-frequency impedance line (24), a matching circuit (25) and an open line (26) connected to each other. The surface of the microstrip circuit (2) is plated with soft gold. The main circuit (21) is a hexagonal structure, and the three compensation circuits (22) and the three signal metal conductive strips (23) are respectively arranged at intervals on the six sides of the hexagon. The input and output port circuits where the signal metal conductive strip (23) is located are provided with a first port (2a), a second port (2b) and a third port (2c) in sequence. The signal metal conductive strip (23) of the third port (2c) is connected to the open line (26) facing the third port (2c) through a thin film resistor (5). A group of matching circuits (25) are arranged around each signal metal conductive strip (23), and a high-frequency impedance line (24) is arranged on each signal metal conductive strip (23); The lower surface of the ferrite substrate (1) is provided with a circular slot magnetization area (1a), the ceramic substrate (3) is glued in the circular slot magnetization area (1a) by epoxy resin glue, and the permanent magnet (4) is further fixed on the ceramic substrate (3) by epoxy resin glue.

2. The non-surface metal magnetization easy-to-assemble microstrip isolator according to claim 1, characterized in that: The thin film resistor (5) is a thin film load with a planar structure, and is deposited between a gold-plated open line (26) on the third port (2c) and a signal metal conductive band (23) of a Y-type circuit on the same port by means of magnetron sputtering.

3. The non-surface metal magnetization easy-to-assemble microstrip isolator according to claim 1 or 2, characterized in that: The microstrip circuit (2) is mounted on the upper surface of a ferrite substrate (1) by vacuum sputtering; the ferrite substrate (1) is a rectangular structure made of nickel-zinc material; the upper surface of the ferrite substrate (1) is polished, and the lower surface is plated with copper and soft gold.

4. The non-surface metal magnetization easy-to-assemble microstrip isolator according to claim 1 or 2, characterized in that: The open line (26) has a width of 0.2 mm to 0.5 mm and a length of 2.5 mm to 3.5 mm.

5. The non-surface metal magnetization easy-to-assemble microstrip isolator according to claim 1 or 2, characterized in that: The compensation circuit (22) is three non-enclosed concave circuits, comprising a first compensation circuit (22a), a second compensation circuit (22b) and a third compensation circuit (22c), all of which are connected to the main circuit (21) at intervals.

6. The non-surface metal magnetization easy-to-assemble microstrip isolator according to claim 1 or 2, characterized in that: The signal metal conductive strip (23) comprises a first signal metal conductive strip (23a), a second signal metal conductive strip (23b) and a third signal metal conductive strip (23c), the line width of which is set to 0.3 mm to 0.5 mm, and the three signal metal conductive strips (23) are respectively arranged on three end surfaces of the ferrite substrate (1).

7. The non-surface metal magnetization easy-to-assemble microstrip isolator according to claim 1 or 2, characterized in that: The high-frequency impedance line (24) comprises a first high-frequency impedance line (24a), a second high-frequency impedance line (24b) and a third high-frequency impedance line (24c), and the line width is set to 0.8-1.2 mm.

8. The non-surface metal magnetization easy-to-assemble microstrip isolator according to claim 1 or 2, characterized in that: The matching circuit (25) is a rectangular structure, comprising a first matching circuit (25a), a second matching circuit (25b) and a third matching circuit (25c), which are respectively arranged at adjacent positions of corresponding signal metal conductive strips (23) and connected to the signal metal conductive strips (23) via a rare metal having ductility.

9. The non-surface metal magnetization easy-to-assemble microstrip isolator according to claim 1 or 2, characterized in that: The central axis of the circular slot magnetization area (1a) of the ferrite substrate (1) and the central axis of the permanent magnet (4) coincide with the central axis of the magnetization area of ​​the main circuit (21).

10. The non-surface metal magnetization easy-to-assemble microstrip isolator according to claim 1 or 2, characterized in that: The permanent magnet (4) is a samarium cobalt permanent magnet.

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