Low-loss circuit board

Abstract

The utility model discloses a low-loss circuit board, which relates to the technical field of circuit boards and comprises a circuit board body, a plurality of electronic components are fixedly mounted at the upper end of the circuit board body, a plurality of pins are fixedly mounted at the lower end of the circuit board body, and a shielding mechanism is arranged on the electronic components and comprises a shielding cover. A connecting piece is fixedly installed in the shielding cover, a plurality of cooling fins are fixedly installed at the upper end of the connecting piece, and a first heat-conducting fin is movably installed at the lower end of the connecting piece. A plurality of radiating fins are fixedly mounted on the shielding case, first heat-conducting fins are arranged at the lower ends of the radiating fins and are in contact with the electronic component, and the first heat-conducting fins are movably mounted at the lower ends of the radiating fins through second heat-conducting fins, connecting screws and compression springs. The lower surface of the first heat-conducting fin is tightly attached to the upper surface of the electronic component, so that heat generated during operation of the electronic component can be effectively discharged through the second heat-conducting fin and the radiating fin.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a low-loss circuit board. Background Art

[0002] Circuit board, also known as circuit board or printed circuit board, is the core component of modern electronic equipment. It is a thin plate-like component used to support and connect electronic components. It is made by electronic printing technology. Circuit board is usually composed of insulating base plate and conductive circuit. The conductive circuit is formed on the insulating base plate through a special process to achieve electrical connection between electronic components.

[0003] Some electronic components on some circuit boards will be installed with shielding covers, which can effectively isolate and reduce electromagnetic interference, protect electronic components from the influence of external electromagnetic fields, thereby ensuring the stable operation of the circuit board and the accuracy of the circuit. It can effectively isolate and reduce electromagnetic interference between electronic components, ensure the stability and accuracy of the signal, and thus reduce the loss caused by electromagnetic interference. However, shielding covers are usually made of conductive materials, which often have good thermal conductivity, but at the same time may also hinder the natural convection and radiation of heat. When electronic components are working, heat is generated, and this heat needs to be dissipated to the surrounding environment through air convection and radiation. However, the presence of the shielding cover will restrict air circulation, reduce the heat exchange efficiency of natural convection, and also change the radiant heat transfer rate on the surface of the electronic device, resulting in reduced heat dissipation efficiency;

[0004] At the same time, due to the obstruction of the shielding cover, part of the surface of the electronic components may not be able to directly exchange heat with the external environment, causing heat to accumulate inside the components, increasing the internal thermal failure rate of the components and raising the temperature. Utility Model Content

[0005] The embodiment of the utility model provides a low-loss circuit board, aiming to solve the problem that due to the obstruction of the shielding cover, part of the surface of the electronic components of the existing circuit board may not be able to directly exchange heat with the external environment, resulting in heat accumulation inside the components, increasing the internal thermal failure rate of the components and raising the temperature.

[0006] An embodiment of the utility model provides a low-loss circuit board, including a circuit board body, a plurality of electronic components are fixedly mounted on the upper end of the circuit board body, a plurality of pins are fixedly mounted on the lower end of the circuit board body, wherein a shielding mechanism is provided on the plurality of electronic components, the shielding mechanism comprises a shielding cover, a connecting plate is fixedly mounted inside the shielding cover, a plurality of heat sinks are fixedly mounted on the upper end of the connecting plate, and a first heat conducting plate is movably mounted on the lower end of the connecting plate.

[0007] As a further optimization solution of the utility model, a conductive film is provided on the upper surface of the shielding cover, and the lower surface of the conductive film is mounted on the upper surface of the shielding cover by gluing.

[0008] As a further optimization solution of the utility model, a first installation slot is opened at the center of the shielding cover. The first installation slot can provide conditions for the installation of the connecting piece and ensure that the heat sink is placed above the shielding cover.

[0009] As a further optimization scheme of the utility model, a plurality of second installation slots are opened at the lower end of the shielding cover, a card is fixedly installed at the top of the second installation slot, and a flange is fixedly installed at the lower end of the card. With the help of the deformable card setting, the shielding cover can be mounted on the outside of the corresponding electronic component in cooperation with the flange.

[0010] As a further optimization scheme of the utility model, a limiting plate is fixedly installed at the lower end of the connecting plate, and the lower end of the heat sink passes through the connecting plate and the limiting plate to extend to a position below the limiting plate and is provided with a slot. The slot opened at the lower end of the heat sink can provide conditions for the movable installation of the first heat conducting plate.

[0011] As a further optimization solution of the utility model, a fixing seat is fixedly installed at the lower end of the limiting plate located between the two heat sinks, and a screw groove is opened in the fixing seat.

[0012] As a further optimization scheme of the utility model, a plurality of second heat conducting plates are fixedly mounted on the upper end of the first heat conducting plate, the plurality of second heat conducting plates are fixedly connected by a plurality of inserts, and the inserts penetrate the slots at the lower ends of the plurality of heat sinks.

[0013] As a further optimization scheme of the utility model, a connecting screw is installed in the insert between the two second thermal conductive plates, and the upper end of the connecting screw is threadedly connected in the corresponding screw groove. The connecting screw sleeve between the limiting plate and the insert is provided with a compression spring. The first thermal conductive plate is movably connected to the limiting plate through the second thermal conductive plate, the connecting screw and the limiting plate, so that the first thermal conductive plate can adapt to electronic components of different heights, so that the lower end of the first thermal conductive plate can fit tightly with the upper surface of the electronic component to ensure the thermal conductivity efficiency.

[0014] Compared with the prior art, in the utility model, a plurality of heat sinks are fixedly mounted on the shielding cover, and a first heat conductive sheet is in contact with the electronic components at the lower end of the heat sink, and the first heat conductive sheet is movably mounted on the lower end of the heat sink through a second heat conductive sheet, connecting screws and a compression spring. When the shielding cover is clamped on the outside of the electronic components, the lower surface of the first heat conductive sheet is tightly fitted with the upper surface of the electronic components, so that the heat generated during the operation of the electronic components can be effectively discharged through the second heat conductive sheet and the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the main structure of the utility model;

[0016] Figure 2 This is a structural exploded diagram of the shielding mechanism of the utility model;

[0017] Figure 3 This is a bottom view of the shielding cover of the utility model;

[0018] Figure 4 for Figure 3 The enlarged view of point A in the middle;

[0019] Figure 5 It is a schematic diagram of the connection mechanism between the heat sink, the connecting plate and the first heat conducting plate of the utility model;

[0020] Figure 6 for Figure 5 Enlarged view of point B in the middle.

[0021] Among them, 1. circuit board body; 2. electronic components; 3. pins; 4. shielding mechanism; 5. shielding cover; 6. connecting plate; 7. heat sink; 8. first thermal conductive plate; 9. first installation slot; 10. second installation slot; 11. card; 12. flange; 13. limit plate; 14. slot; 15. fixing seat; 16. screw groove; 17. second thermal conductive plate; 18. insert; 19. connecting screw; 20. compression spring; 21. conductive film. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0024] When used herein, it should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, components, parts or combinations thereof. At the same time, the terms used in this specification include any and all combinations of the relevant listed items.

[0025] like Figure 1-Figure 6As shown, the utility model provides a low-loss circuit board, including a circuit board body 1, a plurality of electronic components 2 are fixedly mounted on the upper end of the circuit board body 1, a plurality of pins 3 are fixedly mounted on the lower end of the circuit board body 1, wherein a shielding mechanism 4 is provided on the plurality of electronic components 2, the shielding mechanism 4 includes a shielding cover 5, a connecting piece 6 is fixedly mounted inside the shielding cover 5, a plurality of heat sinks 7 are fixedly mounted on the upper end of the connecting piece 6, and a first heat conducting sheet 8 is movably mounted on the lower end of the connecting piece 6.

[0026] like Figure 2-Figure 4 As shown, a conductive film 21 is provided on the upper surface of the shielding cover 5, and the lower surface of the conductive film 21 is mounted on the upper surface of the shielding cover 5 by gluing. A first mounting slot 9 is provided at the center of the shielding cover 5. The first mounting slot 9 can provide conditions for the installation of the connecting piece 6 and ensure that the heat sink 7 is placed above the shielding cover 5. A plurality of second mounting slots 10 are provided at the lower end of the shielding cover 5. A card 11 is fixedly installed at the top of the second mounting slot 10, and a flange 12 is fixedly installed at the lower end of the card 11. With the help of the deformable card 11, the shielding cover 5 can be mounted on the outer side of the corresponding electronic component 2 in cooperation with the flange 12.

[0027] like Figure 2-Figure 6 As shown, a limit plate 13 is fixedly installed at the lower end of the connecting plate 6, and the lower end of the heat sink 7 passes through the connecting plate 6 and the limit plate 13 to extend to the position below the limit plate 13 and is provided with a slot 14. The slot 14 provided at the lower end of the heat sink 7 can provide conditions for the movable installation of the first heat conductive sheet 8. A fixing seat 15 is fixedly installed at the lower end of the limit plate 13 located between the two heat sinks 7. A screw groove 16 is provided in the fixing seat 15. A plurality of second heat conductive sheets 17 are fixedly installed at the upper end of the first heat conductive sheet 8. The plurality of second heat conductive sheets 17 are fixedly connected by a plurality of inserts 18, and the inserts 18 penetrate through In the slots 14 at the lower ends of the multiple heat sinks 7, a connecting screw 19 is inserted and installed in the insert 18 between the two second heat conductive sheets 17, and the upper end of the connecting screw 19 is threadedly connected in the corresponding screw groove 16. The connecting screw 19 between the limiting sheet 13 and the insert 18 is provided with a compression spring 20. The first heat conductive sheet 8 is movably connected to the limiting sheet 13 through the second heat conductive sheet 17 and the connecting screw 19, so that the first heat conductive sheet 8 can adapt to electronic components 2 of different heights, so that the lower end of the first heat conductive sheet 8 can fit closely with the upper surface of the electronic component 2 to ensure the heat conduction efficiency.

[0028] It should be noted that the utility model is a low-loss circuit board. When installing the shielding cover 5, the shielding cover 5 can be inserted and installed on the outside of the corresponding electronic component 2, and the shielding cover 5 can be clamped on the outside of the electronic component 2 by using the multiple cards 11 at the lower end of the shielding cover 5 and the flange 12 at the lower end of the card 11. When the shielding cover 5 is pressed down and installed on the electronic component 2, the shielding cover 5 drives the multiple second heat conducting plates 17 to move downward through the connecting plate 6, the limiting plate 13 and the heat sink 7, and the second heat conducting plate 17 drives the first heat conducting plate 8 to fit the upper surface of the electronic component 2;

[0029] After the lower surface of the first heat conducting sheet 8 contacts the upper surface of the electronic component 2, as the shielding cover 5 continues to move downward, the shielding cover 5 drives the multiple heat sinks 7 to continue to move downward synchronously through the connecting sheet 6 and the limiting sheet 13. Therefore, the multiple heat sinks 7 use the multiple slots 14 at the lower end to move up and down on the corresponding plug-in sheet 18, and the limiting sheet 13 drives the connecting screw 19 to move downward in the through hole in the plug-in sheet 18. Then the limiting sheet 13 compresses the compression spring 20 on the outside of the connecting screw 19, so that after the shielding cover 5 is clamped on the outside of the electronic component 2, the force of the compression spring 20 is used to cooperate with the plug-in sheet 18 and the second heat conducting sheet 17, so that the lower surface of the first heat conducting sheet 8 is always in contact with the upper surface of the electronic component 2, so that the heat generated during the operation of the electronic component 2 can be discharged through the first heat conducting sheet 8, the second heat conducting sheet 17 and the heat sink 7.

[0030] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0031] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0032] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A low-loss circuit board, characterized in that: It comprises a circuit board body, a plurality of electronic components are fixedly mounted on the upper end of the circuit board body, a plurality of pins are fixedly mounted on the lower end of the circuit board body, and a plurality of the electronic components are provided with a shielding mechanism; The shielding mechanism comprises a shielding cover, a connecting piece is fixedly installed in the shielding cover, a plurality of heat sinks are fixedly installed on the upper end of the connecting piece, and a first heat conducting piece is movably installed on the lower end of the connecting piece.

2. A low-loss circuit board according to claim 1, characterized in that: The upper surface of the shielding cover is provided with a conductive film, and the lower surface of the conductive film is attached to the upper surface of the shielding cover by glue.

3. A low-loss circuit board according to claim 1, characterized in that: A first installation through slot is provided at the center of the shielding cover.

4. A low-loss circuit board according to claim 3, characterized in that: A plurality of second installation slots are formed at the lower end of the shielding cover, a card is fixedly installed at the top of the second installation slot, and a flange is fixedly installed at the lower end of the card.

5. A low-loss circuit board according to claim 4, characterized in that: A limiting plate is fixedly mounted on the lower end of the connecting plate, and the lower end of the heat sink passes through the connecting plate and the limiting plate and extends to a position below the limiting plate and is provided with a slot.

6. A low-loss circuit board according to claim 5, characterized in that: A fixing seat is fixedly installed at the lower end of the limiting plate between the two heat sinks, and a screw groove is opened in the fixing seat.

7. A low-loss circuit board according to claim 6, characterized in that: A plurality of second heat conducting plates are fixedly mounted on the upper end of the first heat conducting plate, and the plurality of second heat conducting plates are fixedly connected by a plurality of inserting plates, and the inserting plates penetrate through the slots at the lower ends of the plurality of heat sinks.

8. A low-loss circuit board according to claim 7, characterized in that: A connecting screw is inserted and installed in the inserting sheet between the two second heat conducting sheets, the upper end of the connecting screw is threadedly connected in the corresponding screw groove, and the connecting screw between the limiting sheet and the inserting sheet is sleeved with a compression spring.

Images