Carrier for PCB (Printed Circuit Board) to pass through furnace

By designing a PCB plate furnace carrier including a substrate and a magnetic cover plate, the problem of deformation of the PCB plate at high temperature is solved by using the coordination of the positioning pin and magnetic components, and the efficiency of automated production is improved.

CN222602704UActive Publication Date: 2025-03-11MITAC INFORMATION SYST (KUNSHAN) CO LTD
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Patent Information

Application Number
CN202420870006.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-25
Publication Date
2025-03-11
Estimated Expiration
2034-04-25

AI Technical Summary

Technical Problem

In the prior art, in order to prevent the PCB board from deforming at high temperature in the over-welding furnace, vehicle support is required. However, common methods such as manual sticking of high-temperature tape or increasing rotary buckle pressing have problems such as high cost, long time and inability to achieve automated production.

Method used

A PCB plate furnace carrier is designed, including a substrate and a magnetic cover plate. The substrate is provided with an installation groove, a first positioning pin, a second positioning pin, a mounting hole and a magnetic element. The magnetic cover plate is provided with a second positioning hole, which is matched and installed by the first positioning pin and the first positioning hole of the PCB plate. The second positioning pin is matched and installed with the second positioning hole of the magnetic cover plate. The magnetic cover plate is snapped onto the substrate and the PCB plate to realize the adsorption pressure of the PCB plate.

Benefits of technology

Effectively prevent PCB board from deforming at high temperatures, reduce labor costs, and improve automated production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of carriers, in particular to a PCB (Printed Circuit Board) furnace-passing carrier, which is suitable for a PCB with two first positioning holes and comprises a substrate and a magnetic cover plate, the substrate is provided with a mounting groove, two first positioning pins, two second positioning pins, a plurality of mounting holes and a plurality of magnetic elements, the first positioning pins are used for being matched with first positioning holes of the PCB for installation, the first positioning pins are located on the inner sides of one diagonal corner of the installation groove respectively, and the second positioning pins are located on the outer sides of the other diagonal corner of the installation groove respectively. The magnetic cover plate is provided with two second positioning holes, and the second positioning pins are used for being matched with the second positioning holes of the magnetic cover plate for installation. When the PCB is arranged in the mounting groove through the first positioning pin, the magnetic cover plate covers the PCB and the mounting groove through the second positioning pin, and the substrate is matched and adsorbed with the magnetic cover plate through the magnetic element, so that the magnetic cover plate is buckled on the substrate and the PCB.
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Description

Technical Field

[0001] The utility model relates to the technical field of carriers, in particular to a PCB board furnace carrier. Background Art

[0002] At present, surface mounting technology (SMT) can realize high-density, low-cost and automated production of electronic product assembly. However, in the prior art, in order to prevent the printed circuit board (PCB) from deforming due to high temperature in the reflow furnace, a carrier support is required. Common methods include manually pasting high-temperature tape between the carrier and the PCB board, adding a rotating buckle to the carrier to press the PCB board, etc., but the above methods all have various disadvantages that make it impossible to achieve the purpose of automated production. The former is because the high-temperature tape encounters high temperature, which makes its viscosity worse, and the latter is time-consuming due to high labor costs.

[0003] In view of this, there is an urgent need to provide a PCB board furnace carrier, which can solve the above problems. Summary of the invention

[0004] The utility model aims to provide a PCB board furnace carrier, which can prevent the PCB board from being deformed due to high temperature in a reflow furnace, has a simple structure and is easy to use.

[0005] In order to solve the above technical problems, the utility model provides a PCB board furnace carrier, which is suitable for a PCB board with two first positioning holes, and includes: a substrate and a magnetic cover. The substrate is rectangular, and the upper surface of the substrate is provided with an inwardly concave mounting groove, and the mounting groove is rectangular. The substrate is provided with two first positioning pins and two second positioning pins, and the first positioning pin is used to match and install with the first positioning hole of the PCB board, and the first positioning pin is respectively located on the inner side of an oblique corner of the mounting groove, and the second positioning pin is respectively located on the outer side of another oblique corner of the mounting groove. The substrate is provided with a plurality of mounting holes on the lower surface, and the substrate is also provided with a plurality of magnetic elements, and the mounting holes are used to match and install with the magnetic elements. The magnetic cover is used to cover the PCB board and the mounting groove, and the magnetic cover is provided with two second positioning holes, and the second positioning pin is used to match and install with the second positioning hole of the magnetic cover. Among them, when the PCB board is installed in the installation groove through the first positioning pin, the magnetic cover is covered on the PCB board and the installation groove through the second positioning pin, and the base plate is matched and adsorbed with the magnetic cover through the magnetic element, so that the magnetic cover is buckled on the base plate and the PCB board.

[0006] In particular, four first waiting areas are provided on the installation groove, and the first waiting areas also include a first rectangular hole and four trapezoidal holes adjacent to the first rectangular hole. Four second waiting areas are also provided on the PCB board, and the second waiting areas also include a second rectangular hole and four strip holes adjacent to the second rectangular hole. Four third waiting areas are also provided on the magnetic cover.

[0007] In particular, two guide members and two guide holes are provided on the substrate. The guide holes are provided adjacent to the second positioning pin and are provided at diagonally opposite corners. The guide holes are respectively located on the inner side of a diagonally opposite corner of the substrate. The guide holes are used for matching installation with the guide members.

[0008] Particularly, the guide hole is arranged in a circular shape.

[0009] In particular, the guide element is made of a rigid material.

[0010] Particularly, two grooves are provided on the base plate, the grooves are symmetrically arranged, one end of the groove is used to connect with the mounting groove, the other end of the groove is arc-shaped, and the groove is arranged adjacent to the guide hole.

[0011] In particular, the first waiting area, the second waiting area and the third waiting area are installed in a matching manner.

[0012] Compared with the prior art, the PCB board furnace carrier of the utility model is installed in the first positioning hole through the first positioning pin, so that the PCB board is installed on the installation groove, and the second positioning pin is installed in the second positioning hole through the second positioning pin, so that the magnetic cover plate is covered on the PCB board and the installation groove, and the magnetic element is matched with the magnetic cover plate for adsorption, so that the magnetic cover plate is buckled on the substrate and the PCB board, and then the PCB board is adsorbed and pressed to prevent the PCB board from being deformed by high temperature in the reflow furnace, thereby reducing labor costs and improving automated production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, in which:

[0014] Figure 1 This is a schematic diagram of the installation of a PCB board furnace carrier of the utility model;

[0015] Figure 2 This is a schematic diagram of the structural decomposition of the PCB board furnace carrier of the utility model;

[0016] Figure 3 Viewed from another angle Figure 1 A schematic diagram of the installation of the back side of the other side of the PCB board through the furnace carrier; and

[0017] Figure 4 Yes Description Figure 3 Schematic diagram of the structural decomposition of the back side of the other side of the PCB board furnace carrier. DETAILED DESCRIPTION

[0018] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Before the present invention is described in detail, it should be noted that similar components are represented by the same number in the following description.

[0019] See also Figure 1-4 As shown, as a preferred embodiment of the utility model, a PCB board furnace carrier 10 is disclosed, which is suitable for a PCB board 130 with two first positioning holes 131, to prevent the PCB board 130 from being deformed by high temperature in the reflow furnace, to ensure a simple structure, to facilitate automated production, and to reduce labor costs. The PCB board furnace carrier 10 includes a substrate 110 and a magnetic cover 140, the substrate 110 is used to carry the PCB board 130, the magnetic cover 140 is used to cover the substrate 110 and the PCB board 130, and to ensure that the PCB board 130 is located between the substrate 110 and the magnetic cover 140. The base plate 110 is provided with a mounting groove 120, two first positioning pins 121, two second positioning pins 111, a plurality of mounting holes 112 and a plurality of magnetic elements 113. The first positioning pin 121 is used to match and install with the first positioning hole 131 of the PCB board 130. The first positioning pin 121 is respectively located at the inner side of an oblique corner of the mounting groove 120, and the second positioning pin 111 is respectively located at the outer side of another oblique corner of the mounting groove 120. The mounting hole 112 is matched and installed and adsorbed with the magnetic element 113. The magnetic cover plate 140 is provided with two second positioning holes 141, and the second positioning pin 111 is used to match and install with the second positioning hole 141 of the magnetic cover plate 140. In detail, the first positioning pin 121 is plugged into the first positioning hole 131 so that the PCB board 130 is installed on the installation slot 120 of the substrate 110, and the second positioning pin 111 is plugged into the second positioning hole 141 so that the magnetic cover 140 covers the PCB board 130 and the installation slot 120, and then the substrate 110 is matched with the magnetic cover 140 by means of the magnetic element 113, so that the magnetic cover 140 is absorbed and buckled on the substrate 110 and the PCB board 130, but it is not limited to this.

[0020] In order to describe in detail the cooperation between the substrate 110 and the PCB board 130 of the PCB board furnace carrier 10 of the present invention, please refer to Figure 1 and Figure 2 . Figure 1 1 is a schematic diagram of the installation of a PCB board furnace carrier 10 according to an embodiment of the present utility model. Figure 2 It is a schematic diagram of the structure decomposition of the PCB board furnace carrier 10 according to one embodiment of the utility model. In one embodiment of the utility model, the substrate 110 is arranged in a rectangular shape, and the upper surface of the substrate 110 is provided with an inwardly concave mounting groove 120 for carrying the PCB board 130. The mounting groove 120 is arranged in a rectangular shape, and two first positioning pins 121 are arranged on the mounting groove 120, and the first positioning pins 121 are used to match and install with the first positioning holes 131 of the PCB board 130, and the first positioning pins 121 are respectively located at the inner side of the diagonally opposite corners of the mounting groove 120. The PCB board 130 is provided with a first positioning hole 131, and the first positioning hole 131 is matched with the first positioning pin 121 for installation. In detail, when the PCB board 130 is to be installed on the substrate 110, the PCB board 130 is first placed on the mounting groove 120 of the substrate 110, and it is necessary to ensure that the first positioning pin 121 is plugged into the first positioning hole 131, so that the PCB board 130 is installed on the mounting groove 120. In other words, the connection between the PCB board 130 and the base plate 110 is locked through the cooperation between the first positioning pin 121 and the first positioning hole 131 , but the present invention is not limited thereto.

[0021] By the way, in one embodiment of the utility model, the mounting groove 120 is further provided with four first waiting areas 122, and the first waiting area 122 further includes a first rectangular hole 123 and four trapezoidal holes 124 adjacent to the first rectangular hole 123. The PCB board 130 is further provided with four second waiting areas 132, and the second waiting areas 132 further include a second rectangular hole 133 and four strip holes 134 adjacent to the second rectangular hole 133. In detail, when the PCB board 130 is to be installed in the mounting groove 120, the second waiting area 132 is installed and arranged above the first waiting area 122. In other words, the second waiting area 132 is correspondingly covered on the first waiting area 122, but it is not limited thereto.

[0022] In order to describe in detail the cooperation between the PCB board 130 and the magnetic cover 140 of the PCB board furnace carrier 10 of the present invention, please refer to Figure 1 and Figure 2In one embodiment of the present invention, four third placement areas 142 are further provided on the magnetic cover 140. Specifically, when the magnetic cover 140 is covered on the PCB board 130, the third placement area 142 is installed and arranged above the second placement area 132. In other words, the third placement area 142 is correspondingly covered on the second placement area 132, so that the magnetic cover 140 is covered on the PCB board 130, but it is not limited thereto.

[0023] In order to describe in detail the cooperation between the base plate 110 and the magnetic cover plate 140 of the PCB board furnace carrier 10 of the present invention, please refer to Figure 1 and Figure 2 In one embodiment of the utility model, two second positioning pins 111 are provided on the substrate 110, and the second positioning pins 111 are respectively located outside the other oblique corner of the mounting groove 120, and two second positioning holes 141 are provided on the magnetic cover 140, and the second positioning pins 111 are used to match and install with the second positioning holes 141 of the magnetic cover 140. In detail, when the magnetic cover 140 is to be covered on the substrate 110, at this time, it is necessary to refer to the matching method between the substrate 110 and the PCB board 130 mentioned above to ensure that the PCB board 130 is located in the mounting groove 120 of the substrate 110. After the magnetic cover 140 is covered on the substrate 110, it is necessary to ensure that the second positioning pins 111 are plugged into the second positioning holes 141, so that the magnetic cover 140 is covered on the PCB board 130. Of course, the magnetic cover 140 is also covered on the mounting groove 120 of the substrate 110. In other words, the connection between the magnetic cover 140 and the base plate 110 is locked by the cooperation between the second positioning pin 111 and the second positioning hole 141 , but the present invention is not limited thereto.

[0024] In addition, in some embodiments of the present invention, in order to enable the PCB board 130 and the magnetic cover plate 140 to be installed on the substrate 110, it is necessary to provide pins or rivets on the substrate 110, and holes corresponding to the positions thereof are also provided on the PCB board 130 and the magnetic cover plate 140, so as to facilitate the insertion of the pins or rivets in the holes, but the invention is not limited thereto. Of course, the opposite arrangement may also be possible, that is, rivets or pins are provided on the PCB board 130 and the magnetic cover plate 140, and holes corresponding to the positions thereof are provided on the substrate 110, but the invention is not limited thereto. Among them, the first positioning pin 121 and the second positioning pin 111 belong to the same type of pin or rivet, just for the convenience of distinction, that is, the PCB board 130 is fixed on the mounting groove 120 through the first positioning pin 121, and the magnetic cover plate 140 is covered on the mounting groove 120 and the PCB board 130 through the second positioning pin 111.

[0025] Similarly, the first positioning hole 131 and the second positioning hole 141 are specifically distinguished for the convenience of explanation. Among them, in order to ensure that the PCB board 130 is fixed on the substrate 110, the first positioning pin 121 is located on the mounting slot 120 of the substrate 110, and the first positioning pin 121 cannot be set on the same side of the mounting slot 120. In order to prevent the PCB board 130 from falling from the mounting slot 120, the first positioning pin 121 needs to be set on the inner side of the diagonally opposite corner of the mounting slot 120. In short, the same side setting and the same orientation on both sides may cause the PCB board 130 to be tilted or fall on the substrate 110. Therefore, the upper left side of a mounting slot 120 corresponds to the lower right side of a mounting slot 120, and the lower left side of a mounting slot 120 corresponds to the upper right side of a mounting slot 120. Selecting one of the corresponding methods can ensure that the PCB board 130 is fixed on the substrate 110, that is, the upper left corresponds to the lower right, and the lower left corresponds to the upper right. Similarly, the second positioning pin 111 of the substrate 110 can also refer to the setting position of the first positioning pin 121 and operate similarly thereto, and no special description is given here. In other words, the installation slot 120 is set in a rectangular shape, and the rectangle has only two diagonal corners. The inner side of one of the diagonal corners is selected for the PCB board 130 to be fixed on the installation slot 120, and the outer side of the other diagonal corner is selected for the magnetic cover plate 140 to cover the PCB board 130 and the substrate 110, but it is not limited to this.

[0026] In order to describe in detail the cooperation between the substrate 110 and the magnetic element 113 of the PCB board furnace carrier 10 of the present invention, please refer to Figure 2 , Figure 3 and Figure 4 . Figure 3 According to an embodiment of the present invention, the Figure 1 The installation diagram of the back side of the PCB board through the furnace carrier 10 is shown in FIG. Figure 4 According to the utility model in one embodiment Figure 3A schematic diagram of the structural decomposition of the back side of the other side of the PCB board passing through the furnace carrier 10. In one embodiment of the utility model, the lower surface of the substrate 110 is also provided with a plurality of mounting holes 112 and a plurality of magnetic elements 113, and the mounting holes 112 are matched and installed with the magnetic elements 113. Among them, the magnetic element 113 can be a high temperature resistant magnet, but it is not limited to this. The material of the magnetic cover 140 itself can be a magnetic steel sheet, but it is not limited to this. Therefore, after the PCB board 130 is installed on the substrate 110, the magnetic cover 140 is covered on the substrate 110, and the magnetic cover 140 is pressed against the substrate 110 by means of the adsorption between the magnetic element 113 and the magnetic cover 140, so as to achieve the pressing of the magnetic cover 140 against the substrate 110, and then the PCB board 130 is adsorbed and pressed, so as to prevent the PCB board 130 from being deformed by the high temperature of the reflow furnace, but it is not limited to this. After the magnetic element 113 is installed in the mounting hole 112 of the substrate 110, the magnetic element 113 can be sealed on the mounting hole 112 by means of a high-viscosity sealant. Figure 3 High viscosity sealant also belongs to the conventional technology, so it is not specifically described here, but it is not limited to this.

[0027] In order to describe in detail the cooperation between the base plate 110 and the guide member 114 of the PCB board furnace carrier 10 of the present invention, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 . In one embodiment of the present invention, two guide members 114 and two guide holes 115 are further provided on the substrate 110. The guide holes 115 are provided adjacent to the second positioning pin 111, and the guide holes 115 are respectively located on the inner side of a diagonally opposite corner of the substrate 110, and the guide members 114 and the guide holes 115 are installed in a matching manner. In detail, in automated production, the guide members 114 can be used as a positioning member for the substrate 110, so as to facilitate positioning of the substrate 110, but not limited to this. In one embodiment of the present invention, the guide holes 115 are provided in a circular shape, and the guide member 114 is a rigid material, specifically a steel sleeve, so that the guide member 114 can be inserted and installed on the guide hole 115, but not limited to this.

[0028] In one embodiment of the present invention, two grooves 116 are further provided on the base plate 110. The grooves 116 are symmetrically arranged. One end of the groove 116 is used to connect with the mounting slot 120, and the other end of the groove 116 is arc-shaped. The groove 116 is arranged adjacent to the guide hole 115. In detail, the PCB board 130 can be easily taken out of the mounting slot 120 through the groove 116. It should be noted that before this, the first positioning pin 121 must be taken out of the first positioning hole 131, so that the PCB board 130 can be taken out of the mounting slot 120 through the groove 116, but this is not limited to this. Of course, when the magnetic cover 140 is covered on the PCB board 130 and the mounting slot 120, the magnetic cover 140 will also cover a portion of the groove 116. Please refer to Figure 1 , but it is not limited to this.

[0029] In addition, in some embodiments of the present invention, in order to facilitate instant viewing of relevant information of the magnetic cover 140 covered on the PCB board 130, two-dimensional code information covering the relevant information of this PCB board 130 can also be installed on the PCB board 130, and a display position for viewing the two-dimensional code information of the PCB board 130 is installed at a corresponding position on the magnetic cover 140, so that after the magnetic cover 140 is covered on the PCB board 130, the two-dimensional code information belonging to the relevant information of the PCB board 130 can be viewed through the display position, but it is not limited to this.

[0030] In some embodiments of the utility model, in order to facilitate instant viewing of relevant information of the magnetic cover 140 covered on the substrate 110, two-dimensional code information covering the relevant information of the substrate 110 can also be installed on the substrate 110, and a display position for viewing the two-dimensional code information of the substrate 110 is installed at a corresponding position on the magnetic cover 140, so that after the magnetic cover 140 is covered on the substrate 110, the two-dimensional code information belonging to the relevant information of the substrate 110 can be viewed in time. It should be noted that the positions of the two-dimensional code information displaying the relevant information on the substrate 110 and the PCB board 130 are located at different positions, but not limited to this.

[0031] In summary, the PCB board furnace carrier 10 of the utility model is installed in the first positioning hole 131 through the first positioning pin 121, so that the PCB board 130 is installed on the installation groove 120 of the substrate 110, and the second positioning pin 111 is installed in the second positioning hole 141, so that the magnetic cover 140 is covered on the PCB board 130 and the installation groove 120, and with the help of the matching adsorption of the magnetic element 113 and the magnetic cover 140, the magnetic cover 140 is buckled on the substrate 110 and the PCB board 130, and then the PCB board 130 is adsorbed and pressed to prevent the PCB board 130 from being deformed by the high temperature of the reflow furnace, thereby reducing labor costs and improving automated production efficiency.

[0032] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A PCB board furnace carrier, suitable for a PCB board with two first positioning holes, characterized in that: include: A substrate, the substrate is rectangular, an inwardly concave mounting groove is arranged on the upper surface of the substrate, the mounting groove is rectangular, the substrate is provided with two first positioning pins and two second positioning pins, the first positioning pins are used to match and install with the first positioning holes of the PCB board, the first positioning pins are respectively located at the inner side of one diagonally opposite corner of the mounting groove, and the second positioning pins are respectively located at the outer side of another diagonally opposite corner of the mounting groove, the substrate is provided with a plurality of mounting holes on the lower surface, and the substrate is also provided with a plurality of magnetic elements, and the mounting holes are used to match and install with the magnetic elements; and a magnetic cover plate, used for covering the PCB board and the mounting slot, the magnetic cover plate being provided with two second positioning holes, and the second positioning pin being used for matching and mounting with the second positioning hole of the magnetic cover plate; Among them, when the PCB board is installed in the installation groove through the first positioning pin, the magnetic cover is covered on the PCB board and the installation groove through the second positioning pin, and the base plate is matched and adsorbed with the magnetic cover through the magnetic element, so that the magnetic cover is buckled on the base plate and the PCB board.

2. The PCB board furnace carrier according to claim 1, characterized in that: Four first waiting areas are also provided on the mounting groove, and the first waiting area also includes a first rectangular hole and four trapezoidal holes arranged adjacent to the first rectangular hole. Four second waiting areas are also provided on the PCB board, and the second waiting area also includes a second rectangular hole and four strip holes arranged adjacent to the second rectangular hole. Four third waiting areas are also provided on the magnetic cover.

3. The PCB board furnace carrier according to claim 1, characterized in that: The base plate is also provided with two guide members and two guide holes. The guide holes are arranged adjacent to the second positioning pins and are respectively located at the inner side of a diagonally opposite corner of the base plate. The guide holes are used for matching installation with the guide members.

4. The PCB board furnace carrier according to claim 3, characterized in that: The guide hole is arranged in a circular shape.

5. The PCB board furnace carrier according to claim 3, characterized in that: The guide member is made of a rigid material.

6. The PCB board furnace carrier according to claim 3, characterized in that: The base plate is also provided with two grooves, which are symmetrically arranged, one end of which is used to connect with the mounting groove, the other end of which is arc-shaped, and the groove is arranged adjacent to the guide hole.

7. The PCB board furnace carrier according to claim 2, characterized in that: The first waiting area, the second waiting area and the third waiting area are all installed in a matching manner.