A kind of cathode waterway improvement device based on magnetron sputtering

Abstract

The utility model relates to a kind of cathode waterway improved device based on magnetron sputtering, including cathode shell, cover and cooling box, cover is installed in the top of cathode shell, the inside fixed mounting of cathode shell is partition, the lower portion of partition is provided with circulating cooling pipe, the both ends of circulating cooling pipe are all set up in the side of cathode shell, and the both ends of circulating cooling pipe are all fixedly connected with cooling box side, the lower portion of cathode shell is installed with the heat dissipation component capable of improving cooling effect, and heat dissipation component includes fixedly installed in the lower portion of cathode shell Radiator fan.The utility model is through the cooperation of heat dissipation component and circulating cooling pipe, further reduce cathode component temperature, avoid target material deformation due to high temperature, magnetic property attenuation, improve coating quality, solved the existing device generally only through waterway single heat dissipation, not formed multidimensional collaborative cooling system, only through pipe wall and heat contact type heat exchange, heat exchange mode is single, and the problem of poor heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of magnetron sputtering coating technology, and in particular to an improved cathode water circuit device based on magnetron sputtering. Background Technology

[0002] In the field of magnetron sputtering coating technology, the cathode assembly (including the target material) is the core working component. During sputtering, it generates a large amount of heat due to bombardment by high-energy particles. If this heat cannot be dissipated in time, it will not only cause the target material to overheat and deform, and its magnetic properties to weaken, but it will also cause the substrate temperature to rise, leading to defects such as film cracking, decreased adhesion, and poor thickness uniformity, seriously affecting the coating quality and the service life of the equipment.

[0003] Existing devices generally only use water channels for heat dissipation, without forming a multi-dimensional collaborative cooling system. They can only exchange heat through contact with the pipe walls, resulting in a single heat exchange method and poor heat dissipation effect. When the heat generation rate of the target material increases due to the increase in sputtering power, the single water channel cannot quickly absorb the redundant heat, causing thermal deformation on the surface of the target material. Utility Model Content

[0004] In view of the existing technology, the existing devices generally only use water channels for heat dissipation, without forming a multi-dimensional collaborative cooling system. They can only exchange heat with the tube wall through contact, resulting in a single heat exchange method and poor heat dissipation effect. When the heat generation rate of the target material increases due to the increase in sputtering power, the single water channel cannot quickly absorb the redundant heat, causing thermal deformation on the surface of the target material. This utility model provides an improved cathode water channel device based on magnetron sputtering.

[0005] The technical solution adopted in this utility model is as follows: an improved cathode water circuit device based on magnetron sputtering, comprising a cathode shell, a cover plate, and a cooling box. The cover plate is installed above the cathode shell. A partition plate is fixedly installed inside the cathode shell. A circulating cooling pipe is arranged below the partition plate. Both ends of the circulating cooling pipe penetrate one side of the cathode shell and are fixedly connected to one side of the cooling box. A heat dissipation component that can improve the cooling effect is installed below the cathode shell. The heat dissipation component includes a cooling fan fixedly installed below the cathode shell. The cathode shell serves as the main frame of the device and works with the cover plate to achieve a seal, preventing external impurities from entering and affecting the internal components. The partition plate separates the cooling area from the target installation area, ensuring efficient heat transfer between the circulating cooling pipe and the target through the partition plate, while preventing direct contact between the coolant and the target, which could lead to contamination or short circuits, thus ensuring stable operation of the target. The heat dissipation component and the water circuit form a "dual cooling" mechanism, further reducing the temperature of the cathode component, preventing the target from deforming due to high temperature and attenuating its magnetic properties, and improving the coating quality.

[0006] Furthermore, the bottom of the cathode housing has multiple air inlets arranged in a linear array, and both sides of the cathode housing have multiple air outlets arranged in a linear array. The air outlets are sloped and higher on the side closer to the inside of the cathode housing. The air outlets are located below the partition. The linear array of air inlets at the bottom of the cathode housing ensures that the airflow generated by the cooling fan enters the housing evenly, avoiding insufficient airflow in certain areas. The air outlets on both sides are also arrayed and form a "bottom in, side out" airflow path with the air inlets, maximizing the contact area between the airflow and the circulating cooling pipes and the housing, improving heat exchange efficiency. The sloped design of the air outlets can prevent external dust and moisture from falling directly into the housing, reducing the accumulation of dirt on the outer wall of the circulating cooling pipes.

[0007] Furthermore, a filter screen is installed below the cooling fan, and mounting frames are fixedly installed on both sides of the cooling fan. A snap-fit ​​rod is slidably connected inside the mounting frame, and the snap-fit ​​rod extends through one side of the mounting frame. A sliding plate is fixedly installed on one side of the snap-fit ​​rod, and the sliding plate is slidably connected inside the mounting frame. A first spring is fixedly installed on one side of the sliding plate. Mounting rods are fixedly installed on both sides of the filter screen, and the mounting rods extend through the lower surface of the mounting frame and are slidably connected to the mounting frame. A slot is provided on one side of the mounting rod to fit the snap-fit ​​rod. The filter screen can intercept dust, fibers, and other impurities in the air entering the housing, preventing impurities from adhering to the outer wall of the circulating cooling pipe and affecting heat conduction efficiency, thus ensuring stable cooling performance. Simultaneously, the snap-fit ​​structure formed by the mounting frame, snap-fit ​​rod, and mounting rod allows for quick installation and removal of the filter screen.

[0008] Furthermore, a second spring is fixedly installed inside the mounting frame. A limit block is fixedly installed at one end of the second spring, and the limit block is perpendicular to the snap-fit ​​rod. The limit block moves to one side of the snap-fit ​​rod by the elastic force of the second spring to limit the snap-fit ​​rod and facilitate the next installation.

[0009] Furthermore, two temperature sensors are fixedly installed inside the cathode housing. One temperature sensor is located above the partition, and the other temperature sensor is located below the partition. This allows for simultaneous monitoring of the target material's operating temperature and the cooling zone temperature. This not only prevents the target material from being damaged by high temperatures or affecting the film quality, but also allows for the determination of whether the cooling efficiency of the circulating cooling pipe is normal by checking the temperature of the cooling zone, thus promptly detecting any cooling abnormalities.

[0010] Furthermore, a temperature display screen is installed on the outside of the cathode housing. The temperature display screen is electrically connected to the two temperature sensors, which display the detection data of the two temperature sensors in real time and intuitively, allowing operators to promptly identify and troubleshoot problems.

[0011] Furthermore, a circulating water pump is fixedly installed at one end of the circulating cooling pipe, and a flow control valve is fixedly installed at the other end of the circulating cooling pipe. The circulating water pump provides stable power to the coolant in the circulating cooling pipe, ensuring uniform coolant flow rate and avoiding uneven cooling caused by natural flow. The flow control valve can precisely adjust the coolant flow rate according to the heat generation requirements of the target material.

[0012] The beneficial effects of this utility model are:

[0013] 1. This utility model forms a "dual cooling" mechanism through heat dissipation components and water channels, further reducing the temperature of the cathode components, avoiding target material deformation and magnetic performance decay due to high temperature, improving coating quality, and solving the problem that existing devices generally only use water channels for single heat dissipation, without forming a multi-dimensional collaborative cooling system. They can only exchange heat with the heat through contact with the pipe wall, resulting in a single heat exchange method and poor heat dissipation effect. When the heat generation rate of the target material increases due to the increase in sputtering power, the single water channel cannot quickly absorb the redundant heat, causing thermal deformation on the surface of the target material.

[0014] 2. This utility model can intercept dust, fibers and other impurities in the air entering the shell through the filter screen, preventing impurities from adhering to the outer wall of the circulating cooling pipe and affecting the heat conduction efficiency, thus ensuring stable cooling effect. At the same time, the filter screen can be quickly installed and removed through the snap-fit ​​structure composed of the mounting frame, snap-fit ​​rod and mounting rod. Attached Figure Description

[0015] Figure 1 This is an overall drawing of the present invention;

[0016] Figure 2 This is a top view of the present invention;

[0017] Figure 3 This is a front cross-sectional view of the cathode housing of this utility model;

[0018] Figure 4 This is an exploded view of the filter screen of this utility model;

[0019] Figure 5 This is an enlarged structural view of point A of this utility model.

[0020] The components in the diagram are labeled as follows: 1. Cathode housing; 2. Cover plate; 3. Cooling box; 4. Baffle plate; 5. Circulating cooling pipe; 6. Heat dissipation assembly; 601. Cooling fan; 602. Air inlet; 603. Air outlet; 604. Filter screen; 605. Mounting frame; 606. Clip rod; 607. Sliding plate; 608. First spring; 609. Mounting rod; 610. Slot; 611. Second spring; 612. Limiting block; 7. Temperature sensor; 8. Temperature display screen; 9. Circulating water pump; 10. Flow control valve. Detailed Implementation

[0021] In the description of this utility model, it should be noted that the terms "front", "up", "down", "left", "right", "vertical", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] The following is in conjunction with the appendix Figures 1-5 The present invention will be further described below.

[0024] To address the problems existing in the background technology, this application proposes the following technical solution: an improved cathode water circuit device based on magnetron sputtering.

[0025] The specific technical solution includes a cathode housing 1, a cover plate 2, and a cooling box 3. The cover plate 2 is installed above the cathode housing 1. A partition plate 4 is fixedly installed inside the cathode housing 1. A circulating cooling pipe 5 is installed below the partition plate 4. Both ends of the circulating cooling pipe 5 pass through one side of the cathode housing 1 and are fixedly connected to one side of the cooling box 3. A heat dissipation component 6 that can improve the cooling effect is installed below the cathode housing 1. The heat dissipation component 6 includes a heat dissipation fan 601 fixedly installed below the cathode housing 1. The cathode housing 1 serves as the main frame of the device and works with the cover plate 2 to achieve a seal, preventing external impurities from entering and affecting the internal components. The partition plate 4 separates the cooling area from the target installation area, ensuring efficient heat transfer between the circulating cooling pipe 5 and the target through the partition plate. At the same time, it prevents the coolant from directly contacting the target, which could lead to contamination or short circuits, ensuring stable operation of the target. The heat dissipation component and the water circuit form a "dual cooling" mechanism, further reducing the temperature of the cathode component, preventing the target from deforming due to high temperature and attenuating its magnetic properties, and improving the coating quality.

[0026] Reference Figures 1 to 4As shown, the bottom of the cathode housing 1 has multiple air inlets 602 arranged in a linear array, and both sides of the cathode housing 1 have multiple air outlets 603 arranged in a linear array. The air outlets 603 are sloped, with the side closer to the inside of the cathode housing 1 being higher. The air outlets 603 are located below the partition plate 4. When the cooling fan 601 is started, it generates an upward airflow. The airflow enters the housing through the air inlets 602 at the bottom of the cathode housing 1 and flows through the area of ​​the circulating cooling pipe 5 below the partition plate 4. The airflow contacts the outer wall of the circulating cooling pipe 5 and the inner wall of the cathode housing 1, carrying away some heat. Then, the hot airflow is discharged from the air outlets 603 on both sides of the cathode housing 1. The air outlets 603 are sloped to prevent external impurities from falling in and to guide the hot airflow to be discharged smoothly.

[0027] Reference Figures 1 to 5 As shown, a filter 604 is installed below the cooling fan 601. Mounting frames 605 are fixedly installed on both sides of the cooling fan 601. A locking rod 606 is slidably connected inside the mounting frame 605, penetrating one side of the mounting frame 605. A sliding plate 607 is fixedly installed on one side of the locking rod 606, slidably connected inside the mounting frame 605. A first spring 608 is fixedly installed on one side of the sliding plate 607. Mounting rods 609 are fixedly installed on both sides of the filter 604, penetrating the lower surface of the mounting frame 605 and slidably connected to it. A slot 6 is provided on one side of the mounting rod 609 to fit the locking rod 606. 10. A second spring 611 is also fixedly installed inside the mounting frame 605. A limiting block 612 is fixedly installed at one end of the second spring 611, and the limiting block 612 is set perpendicular to the snap-fit ​​rod 606. The mounting rods 609 on both sides of the filter screen 604 are inserted into the holes on the lower surface of the mounting frame 605. When the snap-fit ​​groove 610 is aligned with the snap-fit ​​rod 606, the first spring 608 resets and pushes the snap-fit ​​rod 606 into the snap-fit ​​groove 610 to complete the fixing. When disassembling, the snap-fit ​​rod 606 is pulled out of the snap-fit ​​groove 610, and the filter screen 604 can be removed for cleaning. At the same time, the limiting block 612 moves to one side of the snap-fit ​​rod 606 by the elastic force of the second spring 611 to limit the snap-fit ​​rod 606 for easy installation next time.

[0028] Reference Figure 1 and Figure 3 As shown, two temperature sensors 7 are fixedly installed inside the cathode housing 1. One temperature sensor 7 is located above the partition 4, and the other temperature sensor 7 is located below the partition 4. A temperature display screen 8 is installed on the outside of the cathode housing 1. The temperature display screen 8 is electrically connected to the two temperature sensors 7. The two temperature sensors 7 monitor the temperature of key areas respectively: one is located above the partition 4, detecting the temperature near the target material; the other is located below the partition 4, detecting the temperature in the area of ​​the circulating cooling pipe 5. Both sensors transmit signals to the temperature display screen 8, displaying the temperature data in real time and providing a basis for adjusting the cooling system.

[0029] Reference Figures 1 to 3 As shown, a circulating water pump 9 is fixedly installed at one end of the circulating cooling pipe 5, and a flow control valve 10 is fixedly installed at the other end of the circulating cooling pipe 5. When the circulating water pump 9 is started, it pressurizes the low-temperature coolant in the cooling tank 3 and delivers it to the circulating cooling pipe 5. The coolant flows along the circulating cooling pipe 5 through the interior of the cathode housing 1. Because the circulating cooling pipe 5 is located below the partition 4, and the partition 4 is made of a high thermal conductivity material, when the target material above the partition 4 generates heat during magnetron sputtering, the heat is quickly conducted to the outer wall of the circulating cooling pipe 5 through the partition 4. By adjusting the opening of the flow control valve 10, the rate of coolant return can be controlled to ensure that the cooling intensity matches the heat generated by the target material.

[0030] To ensure that those skilled in the art can fully understand the technical solution, this application provides the following overall overview:

[0031] The circulating water pump 9 starts, pumping the low-temperature coolant in the cooling tank 3 into the circulating cooling pipe 5. The coolant flows along the pipe through the area below the internal partition 4 of the cathode housing 1. The flow control valve 10 is adjusted to the preset opening. The heat generated by the target material is conducted to the circulating cooling pipe 5 through the partition 4. The coolant absorbs heat and heats up, then flows back to the cooling tank 3 through the flow control valve 10 to cool down, forming a closed loop. The cooling fan 601 starts simultaneously. After being filtered by the filter screen 604, the outside air enters the cathode housing 1 through the air inlet 602, flows through the area of ​​the circulating cooling pipe 5 to carry away excess heat, and the hot air flows from both sides... The side air outlet 603 discharges air, and the temperature sensors 7 above and below the partition 4 detect the temperature in real time. The data is transmitted to the temperature display screen 8, allowing the operator to intuitively monitor the temperature status of the target material and the cooling area. When the filter screen 604 accumulates dust, pull the locking rod 606 to disengage it from the slot 610 of the mounting rod 609. After removing the filter screen 604 and cleaning it, insert the mounting rods 609 on both sides of the filter screen 604 into the holes on the lower surface of the mounting frame 605. When the slot 610 is aligned with the locking rod 606, the first spring 608 resets and pushes the locking rod 606 into the slot 610, thus completing the fixation.

[0032] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0033] Although embodiments of the present invention have been shown and described, the scope of the present invention will be defined by the appended claims and their equivalents for those skilled in the art.

Claims

1. An improved cathode water circuit device based on magnetron sputtering, characterized in that, The device includes a cathode housing (1), a cover plate (2), and a cooling box (3). The cover plate (2) is installed above the cathode housing (1). A partition plate (4) is fixedly installed inside the cathode housing (1). A circulating cooling pipe (5) is provided below the partition plate (4). Both ends of the circulating cooling pipe (5) are provided through one side of the cathode housing (1), and both ends of the circulating cooling pipe (5) are fixedly connected to one side of the cooling box (3). A heat dissipation assembly (6) that can improve the cooling effect is installed below the cathode housing (1). The heat dissipation assembly (6) includes a heat dissipation fan (601) fixedly installed below the cathode housing (1).

2. The cathode water circuit improvement device based on magnetron sputtering according to claim 1, characterized in that, The bottom of the cathode housing (1) is provided with a plurality of air inlets (602) arranged in a linear array. Both sides of the cathode housing (1) are provided with a plurality of air outlets (603) arranged in a linear array. The air outlets (603) are set at an angle and are higher on the side closer to the inside of the cathode housing (1). The air outlets (603) are located below the partition (4).

3. The improved cathode water circuit device based on magnetron sputtering according to claim 2, characterized in that, A filter screen (604) is installed below the cooling fan (601). Mounting frames (605) are fixedly installed on both sides of the cooling fan (601). A snap-fit ​​rod (606) is slidably connected inside the mounting frame (605). The snap-fit ​​rod (606) passes through one side surface of the mounting frame (605). A sliding plate (607) is fixedly installed on one side of the snap-fit ​​rod (606). The sliding plate (607) is slidably connected inside the mounting frame (605). A first spring (608) is fixedly installed on one side of the sliding plate (607). Mounting rods (609) are fixedly installed on both sides of the filter screen (604). The mounting rods (609) pass through the lower surface of the mounting frame (605) and are slidably connected to the mounting frame (605). A slot (610) that matches the snap-fit ​​rod (606) is opened on one side of the mounting rod (609).

4. The improved cathode water circuit device based on magnetron sputtering according to claim 3, characterized in that, A second spring (611) is also fixedly installed inside the mounting frame (605). A limit block (612) is fixedly installed at one end of the second spring (611), and the limit block (612) is perpendicular to the snap-fit ​​rod (606).

5. The improved cathode water circuit device based on magnetron sputtering according to claim 1, characterized in that, Two temperature sensors (7) are fixedly installed inside the cathode housing (1). One temperature sensor (7) is located above the partition (4), and the other temperature sensor (7) is located below the partition (4).

6. The improved cathode water circuit device based on magnetron sputtering according to claim 5, characterized in that, A temperature display screen (8) is mounted on the outside of the cathode housing (1), and the temperature display screen (8) is electrically connected to the two temperature sensors (7).

7. The improved cathode water circuit device based on magnetron sputtering according to claim 1, characterized in that, A circulating water pump (9) is fixedly installed at one end of the circulating cooling pipe (5), and a flow control valve (10) is fixedly installed at the other end of the circulating cooling pipe (5).

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