Optical device packaging module and optical communication device

Abstract

The utility model discloses an optical device packaging module and an optical communication device, and belongs to the technical field of optical communication. The optical device packaging module comprises an optical device and a printed circuit board, wherein the optical device comprises an optical device main body, and at least one of a transmitting end and a receiving end connected to the optical device main body; each of the transmitting end and the receiving end is provided with a plurality of pins, the pins are connected with the optical device main body through first end parts, and the pins are directly or indirectly connected with the printed circuit board through second end parts; at least one part of the plurality of pins is a bent pin with a bent structure, and the distance between the bent pin and the first end part of the adjacent pin is smaller than the distance between the second end parts of the adjacent pins. When the pins are in welded connection with the printed circuit board based on the second end portions of the pins, welding spots formed by the second end portions of the pins and the printed circuit board are distributed on the printed circuit board in a dispersed mode, and therefore the short circuit risk caused by tin connection of the welding spots is effectively reduced or even avoided.

Description

Technical Field

[0001] The embodiments of the utility model relate to the field of optical communication technology, and in particular to an optical device packaging module and an optical communication device. Background Art

[0002] BOSA On Board (BOB) means that the Bi-Direction Optical Sub-Assembly (BOSA) is soldered on a printed circuit board (PCB). Unlike the traditional BOSA, which is packaged in an optical module and then plugged into the interface of the PCB, BOB involves soldering between the pins of the optical device and the circuit board.

[0003] With the upgrade of Ethernet Passive Optical Network (EPON) / Gigabit Passive Optical Network (GPON) to 10GPON / 10GEPON, and the upgrade of 10GPON / 10GEPON to 50GPON / 50GEPON, as well as the increase in the functional requirements of optical devices, the number of pins of optical devices has also increased. When a large number of pins are soldered to a circuit board, the solder joints are easily short-circuited due to the dense pins of the optical devices. Utility Model Content

[0004] The embodiments of the utility model provide an optical device packaging module and an optical communication device, which can solve the technical problems existing in the related technologies. Specifically, the technical solution is as follows:

[0005] On the one hand, an optical device packaging module is provided, which includes: an optical device and a printed circuit board, wherein the optical device includes: an optical device body, and at least one of a transmitting end and a receiving end connected to the optical device body; the transmitting end and the receiving end each have a plurality of pins, the pins are connected to the optical device body via a first end, and the pins are directly or indirectly connected to the printed circuit board via a second end; at least a portion of the plurality of pins are bent pins with a bending structure, and the spacing between the bent pins and the first ends of adjacent pins is smaller than the spacing between the second ends.

[0006] In the optical device packaging module provided by the embodiment of the utility model, at least a part of the multiple pins included in the optical device are bent pins, and the bending structure of the bent pins is designed so that the spacing between the bent pins and the second ends of the adjacent pins is increased relative to the spacing between the first ends of the two. When the pins are connected to the printed circuit board by welding based on the second ends of the pins, the solder joints formed by the second ends of the pins and the printed circuit board are distributed more dispersedly on the printed circuit board, thereby effectively reducing or even avoiding the risk of short circuits caused by solder joints.

[0007] It can be seen that the optical device packaging module provided by the embodiment of the utility model is suitable for the multi-pin solution of optical devices and can solve the problem of solder joint short circuit caused by the increase in the number of pins, making the optical device packaging module more adaptable. For example, it can be applied to 10GPON / 10GEPON, 50GPON / 50GEPON, and many other scenarios with more functional requirements for optical devices.

[0008] In some possible implementations, the bending structure is a single-bending structure or a multiple-bending structure, as long as the second end of the bent pin can be placed at a desired position on the printed circuit board to achieve the purpose of dispersing solder joints.

[0009] In some possible implementations, the bent pin passes through the printed circuit board and is welded to a side of the printed circuit board that is away from the optical device body through the second end.

[0010] In some possible implementations, the plurality of pins further include a straight pin, the straight pin passes through the printed circuit board and is welded to a side of the printed circuit board away from the optical device body through a second end; the second end of the bent pin is welded to a side of the printed circuit board facing the optical device body. By forming solder joints on both sides of the printed circuit board, the purpose of dispersing solder joints and reducing or avoiding the risk of solder joint tinning can also be achieved.

[0011] In some possible implementations, the receiving end includes: a receiving end body and a plurality of pins, at least a portion of the plurality of pins being the bent pins; the receiving end body is connected to the optical device body through a first side, and the receiving end body is connected to the plurality of pins through at least one of a second side and a third side; wherein the second side of the receiving end body is arranged opposite to the first side of the receiving end body, and the third side of the receiving end body is located between the first side and the second side of the receiving end body. By making the receiving end body connected to the plurality of pins based on at least one of the second side and the third side at different positions thereof, the purpose of pin dispersion can be achieved, thereby achieving solder joint dispersion and reducing or avoiding the risk of solder joint bridging.

[0012] In some possible implementations, the bent pin is a non-high-speed signal pin, thereby preventing the high-speed signal from being adversely affected by the bent structure when being transmitted through the bent pin.

[0013] In some possible implementations, the optical device packaging module also includes: a support structure, which is located between the optical device and the printed circuit board to support the optical device, which can not only improve the position stability of the optical device, but also prevent the pins of the receiving end from being squeezed and deformed.

[0014] In some possible implementations, the optical device includes: the transmitting end and the receiving end located on different sides of the optical device body; the optical device also includes: a flexible electrical connector, multiple pins of the transmitting end are welded to the flexible electrical connector, and the flexible electrical connector is also welded to the printed circuit board; multiple pins of the receiving end are respectively welded to the printed circuit board, and at least a portion of the multiple pins of the receiving end are the bent pins.

[0015] In some possible implementations, the optical device includes: the transmitting end and the receiving end located on different sides of the optical device body; the multiple pins of the transmitting end are respectively soldered and connected to the printed circuit board, and at least a portion of the multiple pins of the transmitting end are the bent pins; the multiple pins of the receiving end are respectively soldered and connected to the printed circuit board, and at least a portion of the multiple pins of the receiving end are the bent pins.

[0016] In some possible implementations, the transmitter includes: a transmitter body and a plurality of pins, at least a portion of the plurality of pins being the bent pins; the transmitter body is connected to the optical device body through a first side, and the transmitter body is connected to the plurality of pins through at least one of a second side and a third side; wherein the second side of the transmitter body is arranged opposite to the first side of the transmitter body, and the third side of the transmitter body is located between the first side and the second side of the transmitter body.

[0017] In some possible implementations, the optical device is one of the following types of optical devices: a single-transmitter and single-receiver optical device, a multi-transmitter and multi-receiver optical device, a transceiver-in-one optical device, a multi-receiver-in-one optical device, and a multi-transmitter-in-one optical device.

[0018] On the other hand, an optical communication device is provided, comprising: an optical device packaging module and an optical path terminal, wherein the optical device packaging module is as described above, and the optical device packaging module is connected to the optical path terminal via an optical connector of the optical device.

[0019] The optical communication device provided by the embodiment of the utility model has all the advantages of any of the above-mentioned optical device packaging modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic structural diagram of a first exemplary optical device packaging module provided by an embodiment of the utility model;

[0021] Figure 2 for Figure 1 A top view of the optical device packaging module shown;

[0022] Figure 3 for Figure 1 A bottom view of the optical device packaging module shown;

[0023] Figure 4 A schematic structural diagram of a second exemplary optical device packaging module provided by an embodiment of the utility model;

[0024] Figure 5 A schematic diagram of the structure of an exemplary receiving end provided in an embodiment of the utility model;

[0025] Figure 6 A schematic diagram of the structure of an exemplary transmitting end provided in an embodiment of the utility model;

[0026] Figure 7 A schematic structural diagram of a third exemplary optical device packaging module provided by an embodiment of the utility model;

[0027] Figure 8 A schematic structural diagram of a fourth exemplary optical device packaging module provided by an embodiment of the utility model;

[0028] Fig. 9 A schematic structural diagram of a fifth exemplary optical device packaging module provided by an embodiment of the utility model;

[0029] Fig.10 A schematic structural diagram of a sixth exemplary optical device packaging module provided by an embodiment of the utility model;

[0030] Fig.11 A schematic structural diagram of a seventh exemplary optical device packaging module provided in an embodiment of the utility model.

[0031] The reference numerals represent:

[0032] 001. Optical devices;

[0033] 11. Optical device body;

[0034] 12. Transmitter; 120. Transmitter body;

[0035] 13. Receiving end; 130. Receiving end body;

[0036] 10, tube pin; 100, bending structure; 101, bent tube pin; 102, straight tube pin;

[0037] 14. Support structure;

[0038] 15. Flexible electrical connector;

[0039] 16. Optical connector;

[0040] 002. Printed circuit board. DETAILED DESCRIPTION

[0041] In the description of the embodiments of the present invention, the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front" and "back" are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present invention and simplifying the description. They do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operated in a specific direction. When the product is placed in different postures, the direction may change and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0042] It should be noted that the optical device 001 involved in the embodiment of the utility model can be an optoelectronic device based on optical fiber communication, including but not limited to: Bi-Direction Optical Sub-Assembly (BOSA), Transmitting Optical Sub-Assembly (TOSA), Receiving Optical Sub-Assembly (ROSA), etc. Taking the optical device 001 as BOSA as an example, it includes but is not limited to: single-fiber bidirectional optical device, single-fiber three-way optical device, etc. On this basis, the "optical device body 11" involved in the embodiment of the utility model refers to the main body remaining after the optical device 001 removes its transmitting end 12 and / or receiving end 13.

[0043] The transmitting end 12 and the receiving end 13 involved in the embodiment of the utility model can both adopt an independent packaging structure. For example, the transmitting end 12 and the receiving end 13 can both adopt a transistor outline (TO) package, which includes a base, a cap, an optoelectronic chip, a pin, etc. The optoelectronic chip is packaged in the inner cavity formed by the base and the cap, and the pin is connected to the base and exposed to the outside. For example, the independently packaged transmitting end 12 can be fixedly connected to the optical device body 11 by glue or welding. The transmitting end 12 includes a base, a cap, an optoelectronic chip related to optical signal transmission such as a laser, and an optoelectronic chip related to optical signal transmission such as a laser is packaged inside. The receiving end 13 can be fixedly connected to the optical device body 11 by glue or welding, and an optoelectronic chip that receives optical signals such as a photodetector is packaged inside the receiving end 13. On this basis, the transmitting end body 120 refers to the main body part remaining after the transmitting end 12 removes its pins, and the receiving end body 130 refers to the main body part remaining after the receiving end 13 removes its pins.

[0044] The "printed circuit board 002" involved in the embodiment of the utility model can be a hard circuit board. Compared with the flexible circuit board, the printed circuit board involved in the embodiment of the utility model is not bendable, so that the optical device can be stably supported. The "welding connection between the pin and the printed circuit board" involved in the embodiment of the utility model can be a wave soldering process.

[0045] In response to the technical problem in the related art that the pins (also called leads) of optical devices are too dense, which may easily lead to solder joints shorting, the embodiment of the utility model provides an optical device packaging module, which bends at least part of the pins in the optical device so that the solder joints corresponding to the pins can be dispersed, thereby achieving the purpose of reducing or avoiding the risk of short circuit caused by solder joints.

[0046] As attached Figure 1 As shown, the optical device packaging module provided by the embodiment of the utility model includes: an optical device 001 and a printed circuit board 002, and the optical device 001 includes: an optical device body 11, and at least one of a transmitting end 12 and a receiving end 13 connected to the optical device body 11. Among them, the transmitting end 12 and the receiving end 13 each have a plurality of pins 10, and the pins 10 are connected to the optical device body 11 through a first end, and the pins 10 are directly or indirectly connected to the printed circuit board 002 through a second end. In particular, at least a part of the plurality of pins 10 is a bent pin 101 having a bending structure 100, and the spacing H1 between the bent pin 101 and the first end of the adjacent pin 10 is smaller than the spacing H2 between the second ends.

[0047] It should be noted that the "adjacent pins 10" mentioned above refer to the pins 10 adjacent to the bent pins 101. The pins 10 adjacent to the bent pins 101 can be bent pins 101 or straight pins 102 (i.e., they do not have a bending structure 100 and are usually linear, such as the currently common straight-insert pins).

[0048] In the above-mentioned embodiment of the utility model, "the pin 10 is directly or indirectly connected to the printed circuit board 002 through the second end", means that the pin 10 can be directly connected to the printed circuit board 002 through its second end by welding, or the second end of the pin 10 can also be indirectly connected to the printed circuit board 002 through other electrical connectors. In the embodiment of the utility model, at least a part of the pins 10 directly connected to the printed circuit board 002 can be bent pins 101 to achieve the purpose of dispersing the solder joints between the pins 10 and the printed circuit board 002.

[0049] In the related art, a plurality of straight pins 102 are usually used and spaced apart in parallel with each other, so that the spacing H1 between the first ends of any two adjacent straight pins 102 is usually equal to the spacing H2 between their second ends. This makes it possible for the distribution of solder joints formed by the second ends of the straight pins 102 and the printed circuit board 002 to be densely distributed when the pins are densely distributed, which can easily lead to solder short circuits.

[0050] In the optical device packaging module provided by the embodiment of the utility model, at least a part of the multiple pins 10 included in the optical device 001 are bent pins 101. The design of the bending structure 100 of the bent pin 101 increases the spacing H2 between the bent pin 101 and the second end of the adjacent pin 10 relative to the spacing H1 between the first ends of the two. When the pin 10 is connected to the printed circuit board 002 by welding based on its second end, the solder joints formed by the second end of the pin 10 and the printed circuit board 002 are distributed more dispersedly on the printed circuit board 002, thereby effectively reducing or even avoiding the risk of short circuit caused by solder joints. That is, without increasing (or maintaining) the size of the optical device packaging module, solder joints between solder joints can be reduced or even avoided when soldering is performed based on the wave soldering process.

[0051] Figure 2 for Figure 1 The top view of the optical device packaging module shown, Figure 3 for Figure 1 The bottom view of the optical device packaging module shown is composed of Figure 2 and Figure 3 It can be seen that, based on the bending structure 100 of the bent pin 101 , the distance between the bent pin 101 and the adjacent straight pin 102 is increased, thereby achieving the purpose of dispersing the solder joints.

[0052] It can be seen that the optical device packaging module provided by the embodiment of the utility model is suitable for the multi-pin solution of the optical device 001 and can solve the problem of solder joint short circuit caused by the increase in the number of pins, making the optical device packaging module more adaptable. For example, it can be applied to 10GPON / 10GEPON, 50GPON / 50GEPON, and many other scenarios with more functional requirements of the optical device 001.

[0053] In the embodiment of the utility model, some or all of the multiple pins 10 of the receiving end 13 of the optical device 001 can be bent pins 101; some or all of the multiple pins 10 of the transmitting end 12 of the optical device 001 can be bent pins 101; some or all of the multiple pins 10 of both the receiving end 13 and the transmitting end 12 of the optical device 001 can be bent pins 101.

[0054] As attached Figure 1 As shown, the bending structure 100 on the bent pin 101 can be formed between the first end and the second end of the pin 10, so as not to affect the quick and reliable connection of the bent pin 101 with the optical device body 11 and the printed circuit board 002 based on its ends.

[0055] In the embodiment of the utility model, the bending structure 100 of the bent tube pin 101 can be in a curved bending form, can also be in a fold line bending form, and can also include a curved bending portion and a fold line bending portion at the same time.

[0056] In the embodiment of the utility model, the bending structure 100 on the pin 10 can be a single bending structure or a multiple bending structure, as long as the second end of the bent pin 101 can be placed at the desired position on the printed circuit board 002 to achieve the purpose of dispersing the solder joints.

[0057] For a single bending structure, it can be formed by bending once, for example, this includes but is not limited to: a single arc bending structure, an L-shaped bending structure, a quasi-L-shaped bending structure, etc. For a multiple bending structure, it is formed by bending twice or more, for example, this includes but is not limited to: a multi-arc bending structure (for example, an S-shaped bending structure, a quasi-S-shaped bending structure, etc.), a Z-shaped bending structure, a quasi-Z-shaped bending structure, an M-shaped bending structure, etc. The structural form of the above bending structure 100 is only used as an example, and the embodiment of the utility model does not specifically limit it here, as long as it is ensured that the bending structure 100 can increase the spacing between the bent tube pin 101 and the second end of the adjacent tube pin 10.

[0058] In combination with the various types of bending structures 100 mentioned above, the assembly method between the bent pin 101 and the printed circuit board 002 is described below as an example.

[0059] In some embodiments, as shown in Figure 1 As shown, the bent pin 101 passes through the printed circuit board 002 and is soldered to a side of the printed circuit board 002 that is away from the optical device body 11 through the second end portion.

[0060] For this type of implementation, all pins 10 in the optical device 001 can be bent pins 101, or some of the pins 10 in the optical device 001 can be bent pins 101, and the remaining pins 10 can be straight pins 102. For example, those pins 10 in the optical device 001 used to transmit high-speed signals (communication rate ≥ 1Gbps) can be straight pins 102 to avoid signal loss.

[0061] When the optical device 10 includes a straight pin 102, as shown in the attached Figure 1 As shown, the bent pin 101 and the straight pin 102 can both penetrate the printed circuit board 002 and be welded to the side of the printed circuit board 002 away from the optical device body 11 through the second end.

[0062] It can be understood that the printed circuit board 002 has holes corresponding to the pins 10, the pins 10 are inserted into the corresponding holes on the printed circuit board 002, and the second end of the pin 10 is located in the area on the side of the printed circuit board 002 away from the optical device body 11. On this basis, the second end of the pin 10 can be soldered and connected to the side of the printed circuit board 002 away from the optical device body 11 by using a wave soldering process. Since the pins 10 soldered to the printed circuit board 002 contain at least a portion of bent pins 101, the solder joints on the printed circuit board 002 can be dispersed, reducing or avoiding the risk of solder joints.

[0063] In the embodiment of the utility model, the portion of the pin 10 that passes through the printed circuit board 002 can be called a pin plug-in portion, and the pin plug-in portion can be vertically inserted into the printed circuit board 002 (i.e., the angle between the pin plug-in portion and the printed circuit board 002 is 90°), or the pin plug-in portion can be obliquely inserted into the printed circuit board 002 (i.e., the angle between the pin plug-in portion and the printed circuit board 002 is greater than or equal to 45° and less than 90°). In particular, the bent pin 101 can be inserted into the printed circuit board 002 vertically or at a small angle, so as to facilitate easier operation in a small space.

[0064] Figure 1 The example shows that some of the pins 10 in the receiving end 13 are bent pins 101, and the remaining pins 10 are straight pins 102. Figure 1As shown, the bent pins 101 and the straight pins 102 in the receiving end 13 are vertically inserted into the printed circuit board 002. The spacing between the solder joints corresponding to the bent pins 101 and the adjacent straight pins 102 is increased, reducing or avoiding the risk of solder joints. In addition, some straight pins 102 are retained in the receiving end 13 so that they are not provided with the bending structure 100, which not only ensures that the communication rate of the straight pins 102 is higher, but also reduces the bending operation of the pins 10 contained in the optical device 001, thereby simplifying the manufacturing process of the optical device 001 and reducing the cost.

[0065] In other embodiments, as shown in the attached Figure 4 As shown, the multiple pins 10 contained in the optical device 001 include not only bent pins 101 but also straight pins 102; the bent pins 101 have a bending structure 100, and the second end of the bent pin 101 is welded and connected to the side of the printed circuit board 002 facing the optical device body 11; the straight pins 102 do not have the bending structure 100, the straight pins 102 pass through the printed circuit board 002 and are welded and connected to the side of the printed circuit board 002 facing away from the optical device body 11 through the second end.

[0066] For this type of implementation, there is no need to set a hole corresponding to the bent tube pin 101 on the printed circuit board 002. The second end of the bent tube pin 101 can be abutted or attached to the side surface of the printed circuit board 002 facing the optical device body 11. On this basis, the second end of the bent tube pin 101 is welded to the side of the printed circuit board 002 facing the optical device body 11, so that the solder joint corresponding to the bent tube pin 101 is formed on the side of the printed circuit board 002 facing the optical device body 11.

[0067] For the straight pin 102, a hole corresponding to the straight pin 102 is provided on the printed circuit board 002, and the straight pin 102 is vertically inserted into the hole on the printed circuit board 002, and the straight pin 102 is welded to the surface of the side of the printed circuit board 002 away from the optical device body 11 through its second end, so that a solder joint corresponding to the bent pin 101 is formed on the side of the printed circuit board 002 away from the optical device body 11.

[0068] In summary, for this embodiment, for the multiple pins 10 soldered to the printed circuit board 002, the solder joints are formed on the two side surfaces of the printed circuit board 002 (the spacing between the second end of the bent pin 101 and the adjacent straight pin 102 is bound to increase), which can also achieve the purpose of dispersing the solder joints and reducing or avoiding the risk of solder joint bridging.

[0069] In combination with any of the above-mentioned embodiments, in some further embodiments, as shown in the attached Figure 5 and attached Figure 7As shown, the receiving end 13 of the optical device 001 includes: a receiving end body 130 and a plurality of pins 10, at least a portion of the plurality of pins 10 being bent pins 101. The receiving end body 130 is connected to the optical device body 11 through a first side, and the receiving end body 130 is connected to the plurality of pins 10 through at least one of a second side and a third side; wherein the second side of the receiving end body 130 is arranged opposite to the first side of the receiving end body 130, and the third side of the receiving end body 130 is located between the first side and the second side of the receiving end body 130.

[0070] As attached Figure 7 As shown, the receiving end body 130 can be connected to multiple pins 10 through the second side and the third side respectively. By connecting the receiving end body 130 to multiple pins 10 based on at least one of the second side and the third side at different positions thereof, the purpose of pin dispersion can be achieved, thereby achieving solder joint dispersion and reducing or avoiding the risk of bridging.

[0071] Generally, the receiving end 13 of the optical device 001 has higher adaptability and fault tolerance to signals, and the receiving end 13 can be arranged between the optical device body 11 and the printed circuit board 002, such as Figure 7 As shown, the first side of the receiving end body 130 is the side thereof facing away from the printed circuit board 002 ( Figure 7 The receiving end body 130 is connected to the optical device body 11 through the first side, and the second side of the receiving end body 130 is the side facing the printed circuit board 002 ( Figure 7 The third side of the receiving end body 130 is located between the first side and the second side thereof ( Figure 7 on the left or right side of the image).

[0072] Figure 7 The example shows that the receiving end 13 includes both a bent pin 101 and a straight pin 102. Figure 7 As shown, the receiving end body 130 is connected to the straight pin 102 through the second side, and the second end of the straight pin 102 passes through the printed circuit board 002 and is welded thereto. Also, the receiving end body 130 is connected to the bent pin 101 through the third side (for example, the bent pin 101 is bent in an L-shape), and the second end of the bent pin 101 passes through the printed circuit board 002 and is welded to the side surface of the printed circuit board 002 that is away from the optical device body 11. Of course, it is not excluded that the second end of the bent pin 101 can also be welded to the side surface of the printed circuit board 002 that faces the optical device body 11.

[0073] In combination with any of the above-mentioned embodiments, in some further embodiments, the bent pin 101 involved in the embodiment of the utility model can be a non-high-speed signal pin, for example, the communication rate of the bent pin 101 is less than 1 Gbps, so as to avoid the adverse effects of the bent structure 100 on the high-speed signal when it is transmitted through the bent pin 101. Of course, it is not excluded that the bent pin 101 can also carry high-speed signals.

[0074] In combination with any of the above-mentioned embodiments, in some further embodiments, as shown in the attached Figure 1 As shown, the optical device packaging module provided by the embodiment of the utility model further includes a support structure 14 , and the support structure 14 is located between the optical device 001 and the printed circuit board 002 to support the optical device 001 .

[0075] One of the receiving end 13 and the transmitting end 12 can be arranged on the side of the optical device body 11 facing the printed circuit board 002. Taking the example of the receiving end 13 being arranged on the side of the optical device body 11 facing the printed circuit board 002, by setting a supporting structure 14 to support the optical device body 11 or the receiving end body 130, not only the position stability of the optical device 001 can be improved, but also the pin 10 of the receiving end 13 can be prevented from being squeezed and deformed.

[0076] For example, the support structure 14 may be an insulating spacer, which may be arranged independently of the optical device 001 and the printed circuit board 002, or may be pre-placed on the optical device 001 or the printed circuit board 002, for example, the insulating spacer is pre-connected to the optical device 001 or the printed circuit board 002. Alternatively, a surface mount component may be soldered to the printed circuit board 002 and used as the support structure 14.

[0077] In combination with any of the above-mentioned optical device packaging module solutions, some common optical device packaging module forms are described as examples below.

[0078] As attached Figure 1 , Attachment Figure 4 and attached Figure 7 As shown, the embodiment of the utility model provides such a type of optical device packaging module, the optical device 001 includes: a transmitting end 12 and a receiving end 13, the transmitting end 12 and the receiving end 13 are respectively located on different sides of the optical device body 11. The optical device 001 also includes: a flexible electrical connector 15, a plurality of pins 10 of the transmitting end 12 are welded and connected to the flexible electrical connector 15, and the flexible electrical connector 15 is also welded and connected to the printed circuit board 002. The plurality of pins 10 of the receiving end 13 are respectively welded and connected to the printed circuit board 002, and at least a part of the plurality of pins 10 of the receiving end 13 are bent pins 101.

[0079] The transmitting end 12 and the receiving end 13 of the optical device 001 are arranged independently. For example, the receiving end 13 is located on the side of the optical device body 11 facing the printed circuit board 002 , and the transmitting end 12 and the receiving end 13 are located on different sides of the optical device body 11 .

[0080] In this example, the plurality of pins 10 of the transmitting end 12 are connected to one end of the flexible electrical connector 15 via the second end portion, and the other end of the flexible electrical connector 15 is soldered to the surface of the printed circuit board 002 facing the optical device body 11 .

[0081] Exemplarily, the flexible electrical connector 15 may be a flexible printed circuit board, which is flexible and bendable to a certain extent, so as to facilitate electrical connection between the transmitting end 12 and the printed circuit board 002, thereby realizing signal transmission.

[0082] The plurality of pins 10 of the receiving end 13 are respectively connected to the printed circuit board 002 by welding, which includes: the pins 10 are connected to the surface of the printed circuit board 002 away from the optical device body 11 by welding (see Figure 1 ), and may also include a solder connection between the pin 10 and the surface of the printed circuit board 002 facing the optical device body 11 (see Figure 4 ).

[0083] In this example, at least a portion of the plurality of pins 10 of the receiving end 13 are bent pins 101, and another portion of the pins 10 are straight pins 102 (see Figure 1 ), or, the plurality of pins 10 of the receiving end 13 may all be bent pins 101 (not shown in the figure). The bending structure 100 of the bent pin 101 may be a single bending structure (see Figure 4 ), or it can be a multiple bending structure (see Figure 1 ), for example, it can be a Z-shaped bending structure, an S-shaped bending structure, etc.

[0084] In this example, multiple pins 10 of the receiving end 13 can be connected to the second side of the receiving end body 130, or some of the pins 10 can be connected to the second side of the receiving end body 130 and another part of the pins 10 can be connected to the third side of the receiving end body 130.

[0085] Since the receiving end 13 includes the bent pin 101 , the distance between the second end of the bent pin 101 and the second end of the adjacent pin 10 is increased, so that the solder joints are dispersed and the risk of solder joints is reduced.

[0086] For this example, the corresponding solder joints of the multiple pins 10 of the receiving end 13 on the printed circuit board 002 are dispersedly arranged, so that the receiving end 13 and the transmitting end 12 can be set to not only one but also multiple, or the receiving end 13 can also be a multiple receiving-in-one form, and the transmitting end 12 can also be a multiple transmitting-in-one form. Therefore, the optical device packaging module provided by the embodiment of the utility model has stronger adaptability to different types of optical devices 001.

[0087] As another example, Figure 8 and attached Fig. 9 As shown, the embodiment of the utility model provides such a type of optical device packaging module, the optical device 001 includes: a transmitting end 12 and a receiving end 13, the transmitting end 12 and the receiving end 13 are respectively located on different sides of the optical device body 11; a plurality of pins 10 of the transmitting end 12 are respectively welded and connected to the printed circuit board 002, and at least a part of the plurality of pins 10 of the transmitting end 12 are bent pins 101. A plurality of pins 10 of the receiving end 13 are respectively welded and connected to the printed circuit board 002, and at least a part of the plurality of pins 10 of the receiving end 13 are bent pins 101.

[0088] The transmitting end 12 and the receiving end 13 of the optical device 001 are arranged independently. For example, the receiving end 13 is located on the side of the optical device body 11 facing the printed circuit board 002 , and the transmitting end 12 and the receiving end 13 are located on different sides of the optical device body 11 .

[0089] The plurality of pins 10 of the transmitting end 12 are respectively connected to the printed circuit board 002 by welding, which includes: the pins 10 are connected to the surface of the printed circuit board 002 away from the optical device body 11 by welding (see Figure 8 or Fig. 9 ), and may also include a solder connection between the pin 10 and a surface of the printed circuit board 002 facing the optical device body 11 (not shown in the figure).

[0090] In this example, at least a portion of the plurality of pins 10 of the transmitting end 12 are bent pins 101, and another portion of the pins 10 are straight pins 102 (see Fig. 9 Alternatively, the plurality of pins 10 of the transmitting end 12 may be bent pins 101 (see Figure 8 The bending structure 100 of the bent pin 101 may be a single bending structure (see Fig. 9 ), or it may be a multiple bending structure 100 (see Figure 8 The bent pin 101 located on the far left of the transmitting end 12 shown in the figure may be, for example, a Z-shaped bending structure, an S-shaped bending structure, etc.

[0091] The plurality of pins 10 of the receiving end 13 are respectively connected to the printed circuit board 002 by welding, which includes: the pins 10 are connected to the surface of the printed circuit board 002 away from the optical device body 11 by welding (see Figure 8 or Fig. 9 ), and may also include a solder connection between the pin 10 and a surface of the printed circuit board 002 facing the optical device body 11 (not shown in the figure).

[0092] In this example, at least a portion of the plurality of pins 10 of the receiving end 13 are bent pins 101, and another portion of the pins 10 are straight pins 102 (see Figure 8 or Fig. 9 ), or, the multiple pins 10 of the receiving end 13 may all be bent pins 101 (not shown in the figure). The bending structure 100 of the bent pin 101 may be a single bending structure or a multiple bending structure, for example, a Z-shaped bending structure, an S-shaped bending structure, etc.

[0093] In this example, multiple pins 10 of the receiving end 13 can be connected to the second side of the receiving end body 130, or some of the pins 10 can be connected to the second side of the receiving end body 130 and another part of the pins 10 can be connected to the third side of the receiving end body 130.

[0094] It can be seen that the corresponding solder joints of the multiple pins 10 of the transmitting end 12 and the receiving end 13 on the printed circuit board 002 are dispersedly arranged, so that the receiving end 13 and the transmitting end 12 can be set to not only one but also multiple, or the receiving end 13 can also be a multiple receiving-in-one form, and the transmitting end 12 can also be a multiple transmitting-in-one form. Therefore, the optical device packaging module provided by the embodiment of the utility model has stronger adaptability to different types of optical devices 001.

[0095] For the case where the pin 10 of the transmitting end 12 is soldered to the printed circuit board 002, as shown in the attached Figure 6 As shown, the transmitter 12 includes: a transmitter body 120 and a plurality of pins 10, at least a portion of the plurality of pins 10 are bent pins 101, the transmitter body 120 is connected to the optical device body 11 through a first side, and the transmitter body 120 is connected to the plurality of pins 10 through at least one of a second side and a third side; wherein the second side of the transmitter body 120 is arranged opposite to the first side of the transmitter body 120, and the third side of the transmitter body 120 is located between the first side and the second side of the transmitter body 120.

[0096] As attached Figure 8As shown, it illustrates that the transmitter body 120 is connected to a plurality of pins 10 through its second side, and these pins 10 can all be bent pins 101, and the second end of the bent pin 101 passes through the printed circuit board 002 and is welded thereto, so that the solder joints corresponding to the respective bent pins 101 are dispersed, reducing the risk of solder joint bridging.

[0097] Alternatively, you can Fig. 9 As shown, the transmitter body 120 is connected to a plurality of pins 10 through its second side and third side respectively, the pin 10 connected to the third side of the transmitter body 120 can be a straight pin 102, and the pin 10 connected to the second side of the transmitter body 120 can be a bent pin 101, and the second end of the bent pin 101 passes through the printed circuit board 002 and is welded thereto, so that the solder joints corresponding to the bent pin 101 and the straight pin 102 are dispersed, reducing the risk of solder joint tinning.

[0098] The straight pin 102 can be directly inserted into the printed circuit board 002 without bending, which simplifies the operation. In addition, by locating multiple pins 10 on different sides of the transmitter body 120, the pins 10 are dispersed, and the solder joints corresponding to the pins 10 are dispersed, reducing or avoiding the risk of solder joints.

[0099] In summary, the embodiment of the utility model provides an optical device packaging module, for multiple pins 10 directly soldered between the optical device 001 and the printed circuit board 002, at least some of which are bent pins 10, so that the distance between the bent pin 10 and the second end of the pin 10 adjacent to it is reduced, thereby achieving the purpose of dispersing solder joints based on the use of a bending structure 100, making it more adaptable to different application scenarios.

[0100] In the embodiment of the utility model, the optical device 001 is one of the following optical device types: a single-transmitting and single-receiving optical device, a multi-transmitting and multi-receiving optical device, a transmitting-receiving combined optical device, a multi-receiving combined optical device, and a multi-transmitting-combined optical device.

[0101] For a single-transmitting single-receiving optical device, it means that the optical device includes a transmitting end 12 and a receiving end 13. For a multi-transmitting multi-receiving optical device, it means that the optical device includes multiple independent transmitting ends 12 and multiple receiving ends 13. For a transceiver-in-one optical device, it means that the transmitting end 12 and the receiving end 13 in the optical device are integrated and packaged to form an integrated transceiver end. For example, it not only packages a laser but also a photodetector, so it can both receive and transmit optical signals. For a multi-receiving-in-one optical device, it means that the receiving end 13 in the optical device is an integrated packaging structure, which contains a photodetector that can receive optical signals of at least one wavelength and related supporting chips. For a multi-transmitting-in-one optical device, it means that the transmitting end 12 in the optical device is an integrated packaging structure, which contains a photodetector that can emit optical signals of at least one wavelength and related supporting chips.

[0102] For example, Fig.10 The example shows that the optical device in the optical device packaging module can be a transceiver-in-one optical device, a multiple-receiver-in-one optical device, or a multiple-transmitter-in-one optical device. Fig.11 The example shows that the optical device in the optical device packaging module is a multi-transmitting and multi-receiving optical device. For example, multiple transmitting ends 12 are independently arranged on different sides of the optical device body 11, and multiple receiving ends 13 can be integrated and arranged in a multi-receiving-in-one form. Of course, it is not excluded that the multiple receiving ends 13 can also be independently arranged.

[0103] The optical device packaging module provided in the embodiment of the utility model can be understood as a BOB packaging module, which can be applied to the passive optical network (Passive Optical Network, PON) optical communication field, such as the optical network terminal (Optical Network Terminal, ONT) side, optical line terminal (Optical Line Terminal, OLT) side, data center, 5G and other fields.

[0104] On the other hand, an embodiment of the utility model further provides an optical communication device, which includes: an optical device packaging module and an optical path terminal, wherein the optical device packaging module is as described above, and the optical device packaging module is connected to the optical path terminal through the optical connector 16 of the optical device 001.

[0105] The optical communication device provided by the embodiment of the utility model has all the advantages of any of the above-mentioned optical device packaging modules. Among them, the optical connector 16 is connected to the optical device body 11, which can also be called an optical connection port, which allows the optical signal of the receiving end 13 to enter the optical device body 11 and allows the optical signal of the transmitting end 12 to leave the optical device body 11.

[0106] The above description is only for the purpose of facilitating the technical solution of the present invention to be understood by those skilled in the art, and is not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An optical device packaging module, characterized in that: The optical device packaging module comprises: an optical device (001) and a printed circuit board (002); the optical device (001) comprises: an optical device body (11), and at least one of a transmitting end (12) and a receiving end (13) connected to the optical device body (11); The transmitting end (12) and the receiving end (13) each have a plurality of pins (10), the pins (10) are connected to the optical device body (11) via a first end, and the pins (10) are directly or indirectly connected to the printed circuit board (002) via a second end; At least a portion of the plurality of pins (10) are bent pins (101) having a bending structure (100), and a spacing H1 between the first end of the bent pin (101) and an adjacent pin (10) is smaller than a spacing H2 between the second ends.

2. The optical device packaging module according to claim 1, characterized in that: The bending structure (100) is a single bending structure or a multiple bending structure.

3. The optical device packaging module according to claim 1, characterized in that: The bent pin (101) passes through the printed circuit board (002) and is welded to a side of the printed circuit board (002) that is away from the optical device body (11) via a second end portion.

4. The optical device packaging module according to claim 1, characterized in that: The plurality of pins (10) further include a straight pin (102), wherein the straight pin (102) passes through the printed circuit board (002) and is soldered to a side of the printed circuit board (002) away from the optical device body (11) via a second end portion. The second end of the bent pin (101) is welded and connected to a side of the printed circuit board (002) facing the optical device body (11).

5. The optical device packaging module according to claim 1, characterized in that: The receiving end (13) comprises: a receiving end body (130) and a plurality of pins (10), at least a portion of the plurality of pins (10) being the bent pins (101); The receiving end body (130) is connected to the optical device body (11) through a first side, and the receiving end body (130) is connected to the plurality of pins (10) through at least one of a second side and a third side; The second side of the receiving end body (130) is arranged opposite to the first side of the receiving end body (130), and the third side of the receiving end body (130) is located between the first side and the second side of the receiving end body (130).

6. The optical device packaging module according to claim 1, characterized in that: The bent pin (101) is a non-high-speed signal pin.

7. The optical device packaging module according to claim 1, characterized in that: The optical device packaging module further comprises: a support structure (14), wherein the support structure (14) is located between the optical device (001) and the printed circuit board (002) to support the optical device (001).

8. The optical device packaging module according to any one of claims 1 to 7, characterized in that: The optical device (001) comprises: the transmitting end (12) and the receiving end (13) located on different sides of the optical device body (11); The optical device (001) further comprises: a flexible electrical connector (15), a plurality of pins (10) of the transmitting end (12) being connected to the flexible electrical connector (15) by welding, and the flexible electrical connector (15) being also connected to the printed circuit board (002) by welding; The multiple pins (10) of the receiving end (13) are respectively connected to the printed circuit board (002) by welding, and at least a portion of the multiple pins (10) of the receiving end (13) are the bent pins (101).

9. The optical device packaging module according to any one of claims 1 to 7, characterized in that: The optical device (001) comprises: the transmitting end (12) and the receiving end (13) located on different sides of the optical device body (11); The plurality of pins (10) of the transmitting end (12) are respectively connected to the printed circuit board (002) by welding, and at least a portion of the plurality of pins (10) of the transmitting end (12) are the bent pins (101); The multiple pins (10) of the receiving end (13) are respectively connected to the printed circuit board (002) by welding, and at least a portion of the multiple pins (10) of the receiving end (13) are the bent pins (101).

10. The optical device packaging module according to claim 9, characterized in that: The transmitting end (12) comprises: a transmitting end body (120) and a plurality of pins (10), at least a portion of the plurality of pins (10) being the bent pins (101); The transmitting end body (120) is connected to the optical device body (11) through a first side, and the transmitting end body (120) is connected to the plurality of pins (10) through at least one of a second side and a third side; The second side of the transmitter body (120) is arranged opposite to the first side of the transmitter body (120), and the third side of the transmitter body (120) is located between the first side and the second side of the transmitter body (120).

11. The optical device packaging module according to any one of claims 1 to 7, characterized in that: The optical device (001) is one of the following optical device types: a single-transmitting and single-receiving optical device, a multi-transmitting and multi-receiving optical device, a transmitting-receiving combined optical device, a multi-receiving combined optical device, and a multi-transmitting-combined optical device.

12. An optical communication device, characterized in that: The optical communication device comprises: an optical device packaging module and an optical path terminal, wherein the optical device packaging module is as described in any one of claims 1 to 11, and the optical device packaging module is connected to the optical path terminal via an optical connector of the optical device (001).

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