Display module and electronic equipment

Abstract

The utility model discloses a display module and electronic equipment, and belongs to the technical field of display screen manufacturing. The display module comprises a panel area, a panel switching area, a display driving chip and a shielding layer. The panel area is provided with a display area, and the side opposite to the display area is the backlight side of the panel area. The panel switching area is electrically connected with the panel area and is bent to the backlight side of the panel area; the panel switching area comprises a connecting area stacked on the backlight side of the panel area. The display driving chip is electrically connected to the surface, back to the panel area, of the connecting area, a shielding layer is distributed on the side, back to the connecting area, of the display driving chip, and the shielding layer covers the display driving chip. When the display module is applied to the electronic equipment as a display component, the interference of a display driving chip on signal receiving and transmitting of the electronic equipment can be reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of display screen manufacturing, and in particular relates to a display module and an electronic device. Background Art

[0002] Display modules, as display components of electronic devices such as mobile phones, have been widely used in various electronic devices. The design of narrow bezels and ultra-thin modules is becoming more and more popular among terminal manufacturers and consumers. The design of narrow bezels will make the display driver chip closer to the side frame of the electronic device.

[0003] As the display driver chip gets closer to the side frame of the electronic device, the display driver chip will interfere with the signal transmission and reception of the entire electronic device when it is working. Signal transmission and reception performance is one of the main performances of electronic devices, and it is necessary to reduce the interference caused by the display driver chip to the signal transmission and reception of electronic devices as much as possible.

[0004] Based on this, how to reduce the interference caused by display driver chips to the signal reception and transmission of electronic devices is a technical problem that needs to be solved at present. Utility Model Content

[0005] The present application provides a display module and an electronic device, which can reduce the interference to signal reception and transmission caused by the operation of a display driver chip in a narrow frame design, thereby improving the signal reception and transmission performance of the electronic device.

[0006] In a first aspect, an embodiment of the present application provides a display module. The display module includes a panel area, a panel transfer area, and a display driver chip. The panel area has a display area, and the side opposite to the display area is the backlight side of the panel area. The panel transfer area is electrically connected to the panel area and bent to the backlight side of the panel area; the panel transfer area includes a connection area stacked on the backlight side of the panel area. It can be understood that the panel transfer area also includes a bending area, and the connection area is connected to the panel area via the bending area. The display driver chip is electrically connected to the surface of the connection area facing away from the panel area, and a shielding layer is distributed on the side of the display driver chip facing away from the connection area, and the shielding layer covers the display driver chip.

[0007] In the display module, because the shielding layer is distributed on the side of the display driver chip facing away from the connection area and covers the display driver chip, the electromagnetic waves radiated outward by the display driver chip during operation are shielded by the shielding layer, including the electromagnetic waves radiated by the display driver chip to the outside of the bending area of ​​the panel transfer area. It can be understood that when the display module is used as a display component in an electronic device, the display driver chip is close to the side frame of the electronic device at the outside of the bending area of ​​the panel transfer area. Since the shielding layer shields the electromagnetic waves radiated by the display driver chip to the outside of the bending area of ​​the panel transfer area, the interference of the display driver chip to the antenna at that position and / or the surrounding area can be reduced, thereby improving the signal receiving and transmitting performance of the whole signal of the electronic device.

[0008] Since the display module still sets the display driver chip on the connection area bent to the backlight side of the panel area, without reserving an area in the panel area for connecting the display driver chip, the display module improves the signal receiving and transmitting performance of the electronic device while retaining the narrow frame design.

[0009] In some other designs of the present application, the panel transition area also includes a bending area. The bending area is located at the side of the connection area and the panel area; the connection area is electrically connected to the panel area via the bending area. The shielding layer also extends to the side toward which the outer surface of the bending area faces, and covers at least part of the outer surface of the bending area, and the outer surface of the bending area is the surface of the bending area facing away from the connection area and the panel area.

[0010] In this design, the shielding layer extends from the side of the display driver chip facing away from the connection area to the side facing the outer surface of the bending area, and covers at least part of the outer surface of the bending area. It can be seen that the shielding layer in this design covers a wider area and forms a larger shielding area, thereby better shielding the electromagnetic waves radiated outward from the display driver chip and the devices inside the panel transfer area (such as the panel area), especially the electromagnetic waves radiated outward through the peripheral area and the bending area.

[0011] In the related art, a bending zone protective glue needs to be set in the bending zone to reduce the risk of deformation and damage of the bending zone due to external force and to disperse the bending stress of the bending zone itself. This design method can use a shielding layer extending to the bending zone to replace the bending zone protective glue to reduce the risk of deformation and damage of the bending zone due to external force and to disperse the bending stress of the bending zone. Compared with the design method of separately setting the shielding layer and the bending zone protective glue, the shielding layer of the integrated structure in this design method is easier to process, and the auxiliary process is also more convenient.

[0012] In some other designs of the present application, the panel area also includes a peripheral area, which surrounds the display area; the shielding layer also extends to a side of the peripheral area facing away from the connection area, and covers at least a portion of the surface of the peripheral area facing away from the connection area.

[0013] In this design, the shielding layer extends from the side of the display driver chip facing away from the connection area to the side of the peripheral area facing away from the connection area, and covers at least part of the surface of the peripheral area facing away from the connection area. It can be seen that compared with the previous design, the shielding layer in this design covers a wider area and forms a larger shielding area, thereby better shielding the electromagnetic waves radiated outward from the display driver chip and the devices inside the panel transfer area (such as the panel area), especially the electromagnetic waves radiated outward through the peripheral area and the bending area.

[0014] In the related art, the peripheral area is also susceptible to deformation and damage due to external squeezing, and the peripheral area occupies a smaller area and will also bear greater bending stress. Therefore, extending the bending structure to the peripheral area can reduce the risk of deformation and damage of the peripheral area due to external squeezing and disperse the bending stress of the peripheral area.

[0015] In some other designs of the present application, the display module further includes an FPC; the FPC includes an electrical connection area electrically connected to a surface of the connection area facing away from the panel area. The shielding layer also extends to a side of the electrical connection area of ​​the FPC facing away from the connection area and covers the electrical connection area of ​​the FPC.

[0016] It should be noted that compared with other positions of the display module, the electrical connection area of ​​the FPC is relatively weak in liquid ingress protection due to the lack of encapsulation glue, and there is a risk of liquid ingress. Based on this, in this design, by extending the shielding layer to cover the electrical connection area of ​​the FPC, the risk of liquid ingress in the electrical connection area of ​​the FPC can be reduced, thereby improving the reliability and corrosion resistance of the display module.

[0017] Optionally, in order to further reduce the risk of liquid ingress into the electrical connection area of ​​the FPC, the shielding layer is not limited to covering the electrical connection area of ​​the FPC, but may continue to extend around the electrical connection area of ​​the FPC to cover a wider area on the FPC including the electrical connection area, thereby further reducing the risk of liquid ingress into the electrical connection area of ​​the FPC.

[0018] In some embodiments of the present application, a stress dispersion structure is provided in the stress region of the shielding layer.

[0019] The stress zone of the shielding layer refers to the area on the shielding layer where the stress value is greater than a preset threshold. The preset threshold can be set as needed. In combination with the aforementioned embodiment, the stress zone of the shielding layer includes but is not limited to the area of ​​the shielding layer facing the bending zone. For example, the stress zone of the shielding layer may also include the area of ​​the shielding layer facing the peripheral zone, etc. It can be understood that the area of ​​the shielding layer facing the bending zone needs to bend along with the bending zone. When the shielding layer is deformed due to bending, an interacting internal force will be generated inside to resist the external bending force. This internal force is called bending stress. The area of ​​the shielding layer facing the peripheral zone is small, and stress will also occur due to the bending of the area of ​​the shielding layer facing the bending zone.

[0020] By providing a stress dispersion structure on the shielding layer, the structure of the shielding layer can be effectively changed, the distribution of the bending stress of the shielding layer can be affected, the bending stress concentration phenomenon can be dispersed and reduced, and the distribution of the bending stress on the shielding layer can be more uniform. This uniform distribution can not only reduce the risk of damage to the shielding layer itself or performance degradation due to bending stress concentration, but also reduce the force of the bending stress on the inner structural layer such as the bending area and the peripheral area, thereby reducing the risk of damage to the inner structural layer or performance degradation due to bending stress concentration.

[0021] It can be understood that the number of the stress dispersion structures can be one or more.

[0022] Optionally, the stress dispersion structure includes a bending hole or a bending groove arranged on the stress area. Since the shielding layer is thin, the bending hole is easier to process than the bending groove. It should be noted that the different stress dispersion structures on the shielding layer can all be bending holes or bending grooves, or some can be bending holes and some can be bending grooves.

[0023] Exemplarily, the cross-sectional shape of the bending hole and the bending groove is circular, rectangular or diamond-shaped.

[0024] Specifically, the shielding layer includes an insulating adhesive layer and a metal layer, and the metal layer is bonded to a side of the display driving chip facing away from the connection area through the insulating adhesive layer.

[0025] Because the shielding layer needs to be bent, the insulating rubber layer and the metal layer have bendable properties. For example, the insulating rubber layer can be, but is not limited to, a structure made of insulating soft rubber materials such as mesh glue and silicone, and the metal layer can be a thin sheet structure made of metal materials. In addition, in order to have the shielding property of electromagnetic waves, the metal layer can be a structure made of materials with shielding properties such as copper, copper alloy, etc., such as copper skin. In addition, the shielding layer is provided with a metal layer, which can also play a role in heat dissipation.

[0026] In some embodiments of the present application, the display module includes a display panel; the display panel is bent to form a panel transfer area and a panel area.

[0027] This embodiment provides a display module that electrically connects a display driver chip to a flexible display panel, that is, a display module using a COP packaging solution, and the COP packaging solution requires that the display module is a flexible display panel. In the COP packaging solution, because the display driver chip is electrically connected to the display panel, there is no need to reserve an area in the panel area for connecting the display driver chip, so that a narrow frame design can be achieved. Obviously, when a display module using a COF packaging solution is applied to an electronic device as a display component of an electronic device, due to its narrow frame design, there may also be a problem that the display driver chip is too close to the side frame of the electronic device. Based on this, the display module in this embodiment can also achieve the effect of shielding electromagnetic waves by setting a shielding layer while retaining the design of a narrow frame.

[0028] In some other embodiments of the present application, the panel transfer area is a flexible additional substrate, which is connected to a surface of the peripheral area of ​​the panel area facing away from the connection area and is bent to the backlight side of the panel area.

[0029] This embodiment provides another display module that electrically connects a display driver chip on a flexible additional substrate, that is, a display module using a COF packaging solution. In the COF packaging solution, since the display driver chip is electrically connected to the flexible additional substrate, there is no need to reserve an area in the panel area for connecting the display driver chip, thereby achieving a narrow frame design. Obviously, when the display module using the COF packaging solution is applied to an electronic device as a display component of an electronic device, due to its narrow frame design, there may also be a problem that the display driver chip is too close to the side frame of the electronic device. Based on this, the display module in this embodiment can also achieve the effect of shielding electromagnetic waves by setting a shielding layer while retaining the design of a narrow frame. The COF packaging solution does not require the display panel to be a flexible substrate, and the display panel can be a rigid substrate. This embodiment provides a wider application scenario for the setting of a shielding layer.

[0030] In a second aspect, an embodiment of the present application provides an electronic device. The electronic device comprises a display module as described in any embodiment of the first aspect and a housing for carrying the display module. The housing comprises a side frame, and the display module is mounted on the housing and surrounded by the side frame.

[0031] It can be understood that, unless otherwise described, the beneficial effects that can be achieved by the electronic device provided by any embodiment of the second aspect can refer to the beneficial effects of any embodiment of the display module provided by the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A front schematic diagram of a screen provided in an embodiment of the present application;

[0033] Figure 2 A schematic diagram of the structure of a display module using COG, COF and COP packaging solutions provided in an embodiment of the present application;

[0034] Figure 3 A schematic diagram of electromagnetic wave radiation of a DDIC of a display module in an electronic device provided in an embodiment of the present application;

[0035] Figure 4 A three-dimensional diagram of an electronic device provided in an embodiment of the present application;

[0036] Figure 5 for Figure 4 A schematic diagram of the structure of the electronic device shown;

[0037] Figure 6 A front view schematic diagram of a display module provided by an embodiment of the present application when the panel transfer area is not bent;

[0038] Figure 7 for Figure 6 A side schematic diagram of the display module shown;

[0039] Figure 8 A side view of a display module provided in an embodiment of the present application;

[0040] Fig. 9 A side view schematic diagram of another display module provided in an embodiment of the present application;

[0041] Fig.10 It is a side view schematic diagram of a display module in the related art;

[0042] Fig.11 A schematic plan view of a shielding layer in a flattened state provided in an embodiment of the present application;

[0043] Fig.12 A side view schematic diagram of another display module provided in an embodiment of the present application;

[0044] Fig.13 A side view schematic diagram of another display module provided in an embodiment of the present application;

[0045] Fig.14 A side view schematic diagram of another display module provided in an embodiment of the present application;

[0046] Fig.15 A schematic diagram of a first process implementation scheme for the shielding layer provided in an embodiment of the present application;

[0047] Fig.16 A schematic diagram of a second process implementation scheme for the shielding layer provided in an embodiment of the present application. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0049] The technical term "electrical connection" involved in the embodiments of the present application refers to connecting electrical components by conductive materials such as wires to achieve the transmission and interconnection of current between electrical components.

[0050] In the embodiments of the present application, the words "exemplarily" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0051] In the embodiments of the present application, the technical terms containing "area", in addition to clearly expressing that the technical terms belong to the surface of a certain structure, "area" should not be understood as a surface, but should be understood as a partial structure occupying a spatial position of the structure.

[0052] for example, Figure 1 In the example, the front of the screen includes the screen display area AA and the screen non-display area NA, then the screen display area AA and the screen non-display area NA are respectively understood as a part of the area on the front of the screen. Figure 7 In the figure, the panel area 1141 includes the display area 1141a and the peripheral area 1141b, and the display area 1141a and the peripheral area 1141b are respectively understood as structures of the panel area 1141 along the thickness direction.

[0053] The embodiments of the present application are described below with reference to the accompanying drawings.

[0054] For example, Figure 1 As shown, Figure 1 This is a schematic diagram of the front side of a screen provided in an embodiment of the present application. It can be understood that the front side of the screen is the side where the display surface of the screen is located.

[0055] From the front perspective of the screen, the front of the screen includes a screen display area AA and a screen non-display area NA. In the figure, the black filled area indicates the screen non-display area NA, and the white filled area indicates the screen display area AA.

[0056] The screen display area AA is commonly referred to as the visible area of ​​the screen, which is the part that users can directly see and interact with. In this area, images, videos, text and other information can be displayed, and users can complete various tasks by operating these displayed contents. The size and resolution of the display area are important parameters of the screen, which determine the amount of information that can be displayed on the screen and its clarity.

[0057] The non-display area NA of the screen is the part of the front of the screen except the display area AA of the screen. This part usually does not directly display any content and is usually used for packaging to protect the display area AA from the external environment and ensure the normal operation of the display screen. From the perspective of the front of the screen, the non-display area NA of the screen appears as a "black border".

[0058] With the development of technology and the improvement of design, the non-display area NA of the screen is gradually shrinking in pursuit of a narrower border width (commonly known as a narrow border). Figure 1 , the border width of the screen can be understood as the width of the non-display area NA of the screen (that is, the size in the arrangement direction of the non-display area NA and the display area AA of the screen). By reducing the width of the screen border, a narrow border design can be achieved. It should be noted that the design of a narrow border can increase the screen-to-body ratio of the screen. The screen-to-body ratio refers to the ratio of the area of ​​the screen display area AA to the area of ​​the entire front of the screen. The higher the screen-to-body ratio, the smaller the non-display area NA of the screen, and the stronger the visual immersion of the user.

[0059] At present, there are three packaging solutions for screens, namely chip on glass (COG), chip on plastic (COP), and chip on film (COF). Currently, COF and COP are the two main packaging solutions used to reduce the screen border width, thereby achieving a narrow border design. Among them, COF can reduce the screen border width compared to COG, and COP can further reduce the screen border width compared to COF.

[0060] For example, Figure 2 As shown, Figure 2 The schematic diagram of the structure of the display module (i.e., screen) using COG, COF, and COP packaging solutions provided in the embodiment of the present application. The Z-axis direction in the figure is the thickness direction of the display module, and the X-axis direction is the length direction or width direction of the display module.

[0061] Figure 2 The display module in (a) adopts the COG packaging solution, that is, the display driver chip (Display Driver IC, referred to as "DDIC") 01 is connected to the rigid substrate 02a (such as a glass substrate) of the display panel 02 (also called panel) using electrical connection technology such as Au-Sn eutectic hot pressing technology or anisotropic conductive film (ACF) hot pressing technology. In the COG packaging solution, the rigid substrate 02a is used as a chip carrier to electrically connect DDIC01 to the flexible printed circuit (Flexible Printed Circuit, FPC) 03 connected to the rigid substrate 02a. Because the rigid substrate 02a cannot be bent, an area for fixing DDIC01 and FPC03 must be reserved at the edge of the rigid substrate 02a.

[0062] Figure 2The display module in (b) adopts the COF packaging solution, that is, the DDIC01 is connected to the soft additional circuit board 03a by using the electrical connection technology such as Au-Sn eutectic hot pressing technology or ACF hot pressing technology. It can be understood that the soft additional circuit board 03a and the FPC03 can be different parts of the same structure. Figure 2 (b) in the figure shows this situation; it can also be an additional structure. In the COF packaging solution, the soft additional circuit board 03a serves as a chip carrier, and DDIC01 is electrically connected to FPC03 through the soft additional circuit board 03a connected to the rigid substrate 02b. Because the soft additional circuit board 03a can be bent, DDIC01 connected to the soft additional circuit board 03a can be bent to the backlight side of the display panel 02 together with the soft additional circuit board 03a, corresponding to the bottom of the display panel 02 shown in the figure. Compared with the COG packaging solution, an area for connecting FPC03 needs to be reserved on the rigid substrate 02b, but there is no need to reserve the area required for connecting DDIC01, so that the border width benefit brought by the area required for connecting DDIC01 can be obtained, realizing a narrow border design.

[0063] Figure 2 The display module in (c) adopts the COP packaging solution, that is, the electrical connection technology such as Au-Sn eutectic hot pressing technology or ACF hot pressing technology is used to connect DDIC01 to the flexible display panel 02 (such as the flexible substrate 02c of the flexible display panel 02c). In the COP packaging solution, the flexible display panel 02 serves as a chip carrier to electrically connect DDIC01 to the FPC03 connected to the flexible display panel 02. Because the flexible display panel 02 can be bent, the DDIC01 and FPC03 connected to the flexible display panel 02 can be bent together with the flexible display panel 02 to the bottom of the main body of the flexible display panel 02 (except the area that needs to be bent). Compared with the COG packaging solution, the main body of the flexible display panel 02 does not need to reserve the area required for connecting DDIC01 and FPC03, so that the border width benefit brought by the area required for connecting DDIC01 and FPC03 can be obtained, and a narrow border design can be achieved. Compared with the COF packaging solution, in the COP packaging solution, the main body of the flexible display panel 02 does not need to reserve the area required for connecting to FPC03, thereby obtaining the benefit of the border width brought by the area required for connecting to FPC03, further reducing the border width on the bent side.

[0064] When the display module is used as a display component of electronic devices such as mobile phones and other electronic devices, the narrow frame design will make the DDIC01 of the display module closer to the side frame of the electronic device. Please continue to refer to Figure 2The positions of the dotted lines A1, A2, and A3 in the figure can be roughly understood as the positions of the side frames of the electronic device. As can be seen from the figure, DDIC01 in the COP packaging solution is closer to the side frame of the electronic device than DDIC01 in the COF packaging solution, and DDIC01 in the COF packaging solution is closer to the side frame of the electronic device than DDIC01 in the COG packaging solution.

[0065] It is understandable that DDIC01 will radiate electromagnetic waves when working. For example, Figure 3 As shown, Figure 3 A schematic diagram of electromagnetic wave radiation of a DDIC of a display module in an electronic device provided in an embodiment of the present application.

[0066] Figure 3 In the figure, the X-axis direction is the width direction or length direction of the electronic device, and the Z-axis direction is the thickness direction of the electronic device. It should be noted that the coordinate system setting of the electronic device can be flexibly set according to actual needs.

[0067] The dotted line with an arrow in the figure illustrates the electromagnetic waves generated by DDIC01 when it is working. The dotted line along the X-axis direction in the figure can be understood as the position of the side frame of the electronic device. Antennas are usually arranged at and / or around this position for receiving and sending signals of the entire electronic device.

[0068] As can be seen from the figure, when DDIC01 is too close to the position of the side frame indicated by the dotted line along the X-axis direction (i.e., the distance between the two is less than a certain value), the electromagnetic waves generated by DDIC01 when working will radiate to the side frame and surroundings of the electronic device, thereby interfering with the side frame of the electronic device and / or the antennas arranged around it, that is, interfering with the transmission and reception of the entire signal of the electronic device. Moreover, the closer DDIC01 is to the dotted line, i.e., the position of the side frame, the greater the interference of the electromagnetic waves it generates to the antenna.

[0069] In principle, the distance between the side frame of the electronic device and DDIC01 should be greater than a certain size to avoid interference of electromagnetic waves generated by DDIC01 when it is working on the signal transmission and reception of the whole device. However, in COF and COP packaging solutions, especially in Figure 3 In the illustrated COP packaging solution, the increase in frame width will compress this distance, making DDIC01 close to the side frame of the electronic device, thereby interfering with the signal transmission and reception of the entire electronic device. Signal transmission and reception performance is one of the main performances of electronic devices, and it is necessary to reduce the interference caused by DDIC01 to the signal transmission and reception of the entire electronic device as much as possible.

[0070] Based on this, an embodiment of the present application provides a display module, which is applied to an electronic device with a display function. The display module uses a shielding layer to cover the DDIC of the display module to shield the electromagnetic waves generated by the DDIC, thereby reducing or even isolating the interference caused by the electromagnetic waves generated by the DDIC to the side frame of the electronic device and / or the antennas arranged around it, thereby improving the overall signal receiving and transmitting performance of the electronic device.

[0071] It should be noted that the electronic device to which the display module provided in the embodiment of the present application is applied may be a mobile phone, a tablet computer, a desktop, a laptop, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a personal digital assistant (PDA), an augmented reality (AR) or a virtual reality (VR) device, etc. The embodiment of the present application does not impose any special restrictions on the specific form of the electronic device. The embodiment of the present application is described by taking the electronic device as a mobile phone as an example.

[0072] For example, please refer to Figure 4 and Figure 5 , Figure 4 A three-dimensional diagram of an electronic device provided in an embodiment of the present application, Figure 5 for Figure 4 Schematic diagram of the structural breakdown of the electronic device shown.

[0073] In this embodiment, the electronic device 1 is a mobile phone, including a display module 100, a housing 200, and a front camera module 300. It can be understood that Figure 4 and Figure 5 Only some components of the electronic device 1 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 4 and Figure 5 Furthermore, in other embodiments of the present application, the electronic device 1 may include more or fewer components than those shown in the figure, or combine some components, or separate some components, or arrange the components differently.

[0074] The display module 100 is used to display images, videos and other display contents. For a mobile phone, the display module 100 has a light-transmitting area 100a for light to enter. Figure 5 The front camera module 300 shown implements the shooting function.

[0075] The housing 200 is used to carry the display module 100 and protect the internal electronic components of the electronic device 1 , such as a battery, a mainboard, etc. Figure 4 and Figure 5 In the electronic device 1 shown, the housing 200 includes a back cover 210 and a middle frame 220 .

[0076] The back cover 210 is also called the battery cover, which is located on the backlight side of the display module 100 and is stacked with the display module 100. It can be understood that the light-emitting side of the display module 100 is the side to which the screen display area of ​​the display module 100 faces, and the side opposite to the light-emitting side of the display module 100 is the backlight side of the display module 100. In order to facilitate the following description, an XYZ coordinate system is established, and the width direction of the electronic device 1 is defined as the X-axis direction, the length direction of the electronic device 1 is defined as the Y-axis direction, and the thickness direction of the electronic device 1 is defined as the Z-axis direction. It can be understood that the stacking direction of the display module 100 and the back cover 210 in the electronic device 1 is the Z-axis direction. The plane where the display module 100 or the back cover 210 is located is the XY plane. It should be noted that the coordinate system setting of the electronic device 1 can be flexibly set according to actual needs.

[0077] like Figure 5 As shown, a camera decorative cover 211 is provided on the back cover 210 for protecting and decorating the rear camera module. The camera decorative cover 211 may be made of a transparent material so that light can enter the rear camera module from the camera decorative cover 211, thereby realizing the rear camera function. It should be noted that the rear camera module is fixed in the accommodation space of the electronic device 1, such as fixed on the middle plate 222 of the middle frame 220, and the light incident surface faces the camera decorative cover 211 installed on the back cover 210. Due to the orientation, the rear camera module is not shown in the figure.

[0078] like Figure 5 As shown, the middle frame 220 includes a side frame 221, which is located on the side of the back cover 210 facing the display module 100 and fixed to the back cover 210. Exemplarily, the side frame 221 can be fixedly connected to the back cover 210 by adhesive; the side frame 221 can also be an integrally formed structure with the back cover 210, that is, the side frame 221 and the back cover 210 are an integral structure. The display module 100, the back cover 210 and the side frame 221 together enclose a storage space for the electronic device 1, so that the motherboard, battery, camera module 300 and other components of the electronic device 1 can be placed through the storage space, and at the same time, the components located in the storage space are sealed and protected.

[0079] like Figure 5As shown, the middle frame 220 may also include a middle plate 222. The middle plate 222 is stacked between the back cover 210 and the display module 100, and is fixed to the inner surface of the side frame 221. Exemplarily, the middle plate 222 can be fixed to the side frame 221 by welding; the middle plate 222 can also be an integrally formed structure with the side frame 221. The middle plate 222 is used as the structural "skeleton" of the electronic device 1, and is used to install functional components of the electronic device 1 such as the main board, the camera module 300, etc. The camera module 300 can be fixed and supported on the middle plate 222 by means of threaded connection, clamping, welding, etc. In some other embodiments, the camera module 300 can be fixed to other structures of the electronic device 1 by means of threaded connection, clamping, welding, etc., for example, the camera module 300 can be fixed to the back cover 210.

[0080] It should be noted that the antenna of the electronic device 1 may be arranged on the side frame 221 and / or around the side frame 221 for transmitting and receiving signals of the entire electronic device 1. The area around the side frame 221 here may be the position of the middle plate 222 close to the side frame 221, the position of the back cover 210 close to the side frame 221, etc. For example, the embodiment of the present application takes the example of the antenna of the electronic device 1 being arranged on the bottom side 221a of the side frame 221 as an example.

[0081] The front camera module 300 is used for taking front-facing photos / videos, such as shooting in selfie scenes such as "portrait mode".

[0082] Understandably, Figure 4 and Figure 5 In the mobile phone shown, the display module 100 has a touch function, that is, it is used to implement a touch detection function. In this case, the display module 100 is also called a touch display module 100. Of course, in other embodiments, when the electronic device 1 is in other product forms, the display module 100 may not have a touch function, and the embodiment of the present application does not specifically limit this.

[0083] Combine the following Figures 6 to 16 ,right Figure 4 and Figure 5 The structure of the display module 100 is illustrated in detail.

[0084] For example, please refer to Figure 6 , Figure 6 The front view of a display module 100 provided in an embodiment of the present application is in a state where the panel transfer area 1142 is not bent. The display module 100 includes a main body area 110, a panel transfer area 1142, a DDIC 120, an FPC 130, and a board-to-board (BTB) connector 140.

[0085] Understandably, Figure 6Only some components of the display module 100 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 6 Furthermore, in other embodiments of the present application, the display module 100 may include more or fewer components than shown in the figure, or combine some components, or separate some components, or arrange the components differently.

[0086] The front side of the main body area 110 has a screen display area AA and a screen non-display area NA. The definition of the screen display area AA and the screen non-display area NA can refer to Figure 1 It can be understood that the side facing the screen display area AA is the light emitting side of the main body area 110 , and the side opposite to the light emitting side of the main body area 110 is the backlight side of the main body area 110 .

[0087] The panel transfer area 1142 is a carrier of the DDIC 120 in the display module 100 , and is used to be electrically connected to the DDIC 120 and the FPC 130 , thereby achieving electrical connection between the main area 110 and the DDIC 120 , and between the DDIC 120 and the FPC 130 .

[0088] Specifically, the first end of the panel transfer area 1142 is electrically connected to the main body area 110. In this embodiment, the first end of the panel transfer area 1142 is electrically connected to the bottom edge of the main body area 110; the second end of the panel transfer area 1142 is electrically connected to the FPC 130, and the DDIC 120 is electrically connected between the first end and the second end of the panel transfer area 1142. In this way, the DDIC 120 can be electrically connected to the main body area 110 through the area of ​​the panel transfer area 1142 located between the DDIC 120 and the main body area 110; the FPC 130 can be electrically connected to the DDIC 120 through the area of ​​the panel transfer area 1142 located between the FPC 130 and the DDIC 120. It can be understood that in other embodiments, the position where the panel transfer area 1142 is electrically connected to the main body area 110, and the positions where the FPC 130 and the DDIC 120 are electrically connected to the panel transfer area 1142 respectively can be different, and the embodiment of the present application does not limit this.

[0089] Optionally, the electrical connection method may include but is not limited to bonding, laser welding, hotbar welding (also known as pulse hot pressure welding or hot pressure melting tin welding), etc. In the display industry, bonding is a method of thermally bonding two devices together using ACF (Anisotropic Conductive Film) and the like. Hotbar welding is a welding method that uses high temperature and pressure to melt and connect metal materials together.

[0090] DDIC120 is one of the main control elements of the main area 110. It is electrically connected to the main area 110 and sends driving signals and data to the main area 110 in the form of electrical signals. It controls the display of the main area 110, such as brightness and color, so that image information such as letters and pictures can be presented on the main area 110.

[0091] FPC130 is Figure 5 The signal transmission line between the mainboard and the display module 100 of the electronic device 1 shown is used to snap on the mainboard through the BTB connector 140 to achieve electrical connection with the mainboard. Its main function is to transmit the display drive instruction sent by the mainboard to the display module 100 in the form of an electrical signal, and drive the display module 100 to display content according to the display drive instruction. Inside the display module 100, the FPC130 transmits the display drive instruction sent by the mainboard to the DDIC120, and the DDIC120 generates a drive signal and data according to the display drive instruction to achieve display control of the main area 110. For the sake of convenience, the area where the FPC130 is electrically connected to the panel transfer area 1142 is referred to as the electrical connection area 131 of the FPC130.

[0092] In this embodiment, the panel transfer area 1142 has a bendable property and can be bent from the main body area 110 to the backlight side of the main body area 110 .

[0093] For example, please refer to Figure 7 , Figure 7 for Figure 6 A side view of the display module 100 is shown. It can be understood that Figure 7 The side surface of the display module 100 shown in the figure can be understood as Figure 6 The side is observed from the perspective of the X-axis direction. It should be noted that the side is cut off by the cutoff line in the figure, and only part of the side area is shown. Based on this, Figure 7 In the figure, a label line with an arrow marked only at one end but not at the other end (such as a label line used to mark the screen display area AA) is used to indicate that the structure marked by it is not fully displayed due to truncation.

[0094] Figure 7 In the figure, the main area 110 can be understood as the area to the left of the auxiliary dividing line M shown in the figure. Figure 7The panel transfer area 1142 can be bent to the backlight side of the main area 110 in the direction indicated by the dotted arrow. In this way, the DDIC 120 and the FPC 130 can be bent to the backlight side of the main area 110 together with the panel transfer area 1142, so that the border width on the side where the bottom edge of the main area 110 is located can be reduced to achieve the effect of a "narrow chin", and the screen-to-body ratio can be increased to enhance the display effect. It can be understood that in some other embodiments, when the panel transfer area 1142 is connected to other edges of the main area 110, the border width of the main area 110 on the side where the other edges are located can be reduced, and the embodiments of the present application do not specifically limit this.

[0095] It is understandable that in the COP packaging solution and the COF packaging solution, Figure 6 and Figure 7 The implementation methods of the panel transfer area 1142 shown are different. The implementation methods of the panel transfer area 1142 in the COP packaging solution and the COF packaging solution are described below.

[0096] First, the display module 100 adopts the COP packaging solution as an example for description.

[0097] For example, please refer to Figure 8 , Figure 8 This is a side view of a display module 100 provided in an embodiment of the present application. It can be understood that Figure 8 Adaptability can be understood as Figure 7 The panel transfer area 1142 is shown as a side view when it is bent to the backlight side of the main body area 110. For easy distinction, Figure 8 Different structures are filled with different filling patterns. In addition, when marking some areas, the range of the area is divided by a dotted line with dots, and the divided area is the area on the structural layer where the dots on the dotted line are located. For example, the structural layer where the dots of the dotted line used to divide the panel area 1141 and the panel transfer area 1142 are located is the display panel 114, so the panel area 1141 and the panel transfer area 1142 are the areas of the display panel 114.

[0098] like Figure 8 As shown, the display module 100 includes a cover plate 111, an optical adhesive layer 112, a polarizer 113, and a display panel 114 stacked in sequence in the opposite direction of the Z-axis direction. It should be noted that the technical term "stacked" in the embodiment of the present application refers to the area where the orthographic projections of two stacked structures in the stacking direction have an overlapping area. Each component is described below.

[0099] The cover plate 111, also called the outer screen, plays the role of protecting the display panel 114 and preventing dust. The cover plate 111 is a transparent structure, such as a glass cover plate, but not limited to a glass cover plate, so that the light of the display panel 114 can pass through, thereby showing its display content to the user.

[0100] The optical adhesive layer 112 is stacked between the cover plate 111 and the polarizer 113, and is respectively bonded to the cover plate 111 and the polarizer 113 on both sides. The optical adhesive layer 112 is made of transparent adhesive, such as solid optical clear adhesive (OCA).

[0101] The polarizer (POL) 113 is disposed on the side of the display panel 114 facing the cover plate 111, and its main function is to allow light in a specific direction to pass through, thereby eliminating reflection and glare on the display panel 114 and improving the contrast and clarity of the image.

[0102] The display panel 114 (panel), which may also be referred to as an inner screen, is a structure for realizing display in the display module 100. The display panel 114 may also be referred to as a display screen 114, and may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MIL-E) display screen, a micro organic light-emitting diode (MIL-E) display screen, a micro organic light-emitting diode (MIL-E) display screen, a quantum dot light-emitting diode (QLED) display screen, a liquid crystal display (LCD), etc. The embodiment of the present application is described by taking an OLED display screen, i.e., an OLED panel, as an example.

[0103] In the case where the display panel 114 is an OLED panel, illustratively, the display panel 114 may include a substrate, a driving circuit layer, a light-emitting layer and other display-related structural layers stacked in sequence along the Z-axis direction. It should be noted that: Figure 8 The middle display panel 114 is exemplified as a single structural layer, and the specific structural layers it includes are not shown.

[0104] exist Figure 8In the illustrated embodiment, the substrate of the display panel 114 is a flexible substrate, so that the display panel 114 has a bendable property. For example, the material of the flexible substrate may be, but is not limited to, polyethylene terephthalate (PET), polyimide (PI), and the like.

[0105] By utilizing the bendable characteristic of the display panel 114, the bottom edge of the display panel 114 can be bent to form a panel transition area 1142. Figure 8 In the illustrated embodiment, the panel transfer area 1142 electrically connected to the DDIC 120 and the FPC 130 is provided by the flexible display panel 114 . The flexible display panel 114 serves as a carrier of the DDIC 120 and belongs to a COP packaging solution.

[0106] Specifically, the display panel 114 includes a panel area 1141 and a panel transfer area 1142. It can be understood that Figure 8 In the figure, the panel transition area 1142 is the bottom edge of the display panel 114 bent toward the side facing away from the cover plate 111 ; the panel area 1141 is the other area on the display panel 114 that is not bent toward the side facing away from the cover plate 111 .

[0107] The panel area 1141 is stacked on one side of the cover plate 111 in the Z-axis direction. It can be understood that the side of the panel area 1141 facing the cover plate 111 is the light-emitting side of the panel area 1141, and the side of the panel area 1141 away from the cover plate 111 is the backlight side of the panel area 1141. The panel area 1141 includes a display area 1141a and a peripheral area 1141b.

[0108] The display area 1141a is an area in the display panel 114 for direct display. It can be understood that the side facing away from the light-emitting surface of the display area 1141a (i.e., the surface of the display area 1141a used for display, i.e., the surface of the display area 1141a facing the cover plate 111) is the backlight side of the panel area 1141; the side facing the light-emitting surface of the display area 1141a is the light-emitting side of the panel area 1141. Exemplarily, the display area 1141a may include structural layers related to display, such as a flexible substrate, a driving circuit layer, and a light-emitting layer stacked in sequence along the Z-axis direction. Figure 8 The middle display area 1141a is illustrated as a structural layer, and the specific structural layers it includes are not shown.

[0109] The peripheral area 1141b is arranged around the display area 1141a, and no picture is displayed in this area. In an actual product, since it is necessary to encapsulate the periphery of the display area 1141a of the display panel 114 through an encapsulation structure such as a frame sealant or an encapsulation film layer, and to lead out the metal traces in the display area 1141a to facilitate electrical connection with the peripheral metal traces, etc., the peripheral area 1141b may include an area occupied by the encapsulation structure and / or a lead-out area for the metal traces in the display area 1141a. Exemplarily, the peripheral area 1141b may lead out the metal traces in the display area 1141a in the form of being laid on the surface of a flexible substrate, that is, the peripheral area 1141b may include a flexible substrate and metal traces laid on the surface of the flexible substrate.

[0110] Understandably, Figure 6 The screen display area AA on the front of the display module 100 shown can be understood as the area directly opposite to the display area 1141a, and the screen non-display area NA on the front of the display module 100 can be understood as the area between the edge of the screen display area AA and the edge of the front of the display module 100, including but not limited to the area directly opposite to the peripheral area 1141b. For example, the screen non-display area NA also includes the area occupied by the bending area 1142a in the Y-axis direction due to the bending.

[0111] The panel transition area 1142 includes a bending area 1142a and a connecting area 1142b. The connecting area 1142b is located on the backlight side of the panel area 1141 and is stacked with the panel area 1141. The bending area 1142a is located on the side of the connecting area 1142b and the panel area 1141, and the connecting area 1142b is connected to the panel area 1141 through the bending area 1142a.

[0112] It can be understood that the side of the connection area 1142b and the panel area 1141 refers to one side in the extension direction of the connection area 1142b and the panel area 1141. The extension direction of the connection area 1142b and the extension direction of the panel area 1141 are the directions in which the planes of the connection area 1142b and the panel area 1141 facing each other extend, and the extension direction may be perpendicular to the stacking direction of the connection area 1142b and the panel area 1141 ( Figure 8 The Z axis direction is in the middle), Figure 8 The middle extension direction is the Y-axis direction which is perpendicular to the Z-axis direction.

[0113] From another perspective, for the connection area 1142b, its extension direction refers to the direction from one end of the connection area 1142b connected to the bending area 1142a to the other end. Figure 8 The extension direction is the Y-axis direction; for the panel area 1141, the extension direction refers to the direction from one end of the panel area 1141 connected to the bending area 1142a to the other end. Figure 8The middle extension direction is the Y-axis direction.

[0114] The connection area 1142b is electrically connected to the DDIC 120 and the FPC 130 respectively. Figure 8 As shown, DDIC120 is electrically connected to the surface of the connection area 1142b facing away from the panel area 1141; the electrical connection area 131 of FPC130 is electrically connected to the surface of the connection area 1142b facing away from the panel area 1141. In this way, DDIC120 can be electrically connected to the panel area 1141 through the area of ​​the panel transfer area 1142 located between DDIC120 and the panel area 1141, so as to send driving signals and data to the panel area 1141, and control the display of the panel area 1141, such as the control of brightness and color, so that image information such as letters and pictures can be presented on the panel area 1141; FPC130 can be electrically connected to DDIC120 through the area of ​​the panel transfer area 1142 located between the electrical connection area 131 of FPC130 and DDIC120, so as to transmit the display driving instructions sent by the mainboard to DDIC120. Optionally, as Figure 8 As shown, the electrical connection areas 131 of the DDIC 120 and the FPC 130 are arranged in the Y-axis direction, and the electrical connection area 131 of the FPC 130 is farther away from the bending area 1142 a .

[0115] Alternatively, if Figure 8 As shown, the bending area 1142a and the connection area 1142b can be formed by bending the flexible substrate of the display panel 114 and the metal traces laid on the surface thereof to the backlight side of the panel area 1141. In this case, the display area 1141a is distributed with a partial area of ​​the flexible substrate, a driving circuit layer, and a light-emitting layer stacked in sequence along the Z-axis direction, while the peripheral area 1141b, the bending area 1142a, and the connection area 1142b are distributed with the remaining area of ​​the flexible substrate and the metal traces laid on the surface thereof.

[0116] It can be understood that by bending the flexible substrate of the display panel 114, the metal traces laid on the surface of the flexible substrate are bent together, so that the metal traces laid on the surface of the flexible substrate in the peripheral area 1141b can be led along the bending area 1142a to the connection area 1142b on the backlight side of the panel area 1141. The DDIC 120 is electrically connected to the metal traces led to the connection area 1142b, so that the electrical connection between the DDIC 120 and the panel area 1141 can be achieved, so that the driving signal and data can be sent to the panel area 1141; the FPC 130 is electrically connected to the metal traces led to the connection area 1142b, and the electrical connection between the FPC 130 and the DDIC 120 can be achieved through the metal traces in the connection area 1142b, so that the display driving instruction can be transmitted to the DDIC 120, so as to control the DDIC 120 to send the driving signal and data to the panel area 1141 to drive the panel area 1141 to display.

[0117] In addition, please continue to refer to Figure 8 , the display module 100 may further include a first back film layer 115 and a second back film layer 150. The first back film layer 115 and the second back film layer 150 are stacked between the panel area 1141 and the connection area 1142b. The first back film layer 115 is attached to the backlight side of the panel area 1141; the second back film layer 150 is attached to the side of the connection area 1142b close to the panel area 1141. The first back film layer 115 and the second back film layer 150 can be used to separate the panel area 1141 and the connection area 1142b, and can also be used to fix the panel area 1141 and the connection area 1142b to ensure that the bending occurs in the bending area 1142a.

[0118] The first back film layer 115 and the second back film layer 150 are both back films (Back Film, BF), which can be made of materials such as polyethylene terephthalate (PET), and can be attached by adhesive materials such as grid glue. PET material has the advantages of low elastic modulus and not easy to expand when heated. Therefore, the first back film layer 115 and the second back film layer 150 made of PET material will not deform due to changes in ambient temperature, reducing the possibility of the first back film layer 115 and the second back film layer 150 being peeled off from the film layer connected to it, thereby improving the yield and reliability of the display module 100. In addition, grid glue has the advantages of easy bonding and exhaust. Using grid glue for bonding can avoid the generation of bubbles, bulging and other undesirable phenomena during bonding.

[0119] Please continue to refer to Figure 8 In some embodiments of the present application, the display module 100 may further include a support layer 116. The support layer 116 is located on the side to which the inner surface of the bending area 1142a faces (the inner surface of the bending area 1142a is concave), and is stacked between the first back film layer 115 and the second back film layer 150, playing the role of supporting, padding and buffering.

[0120] Exemplarily, the support layer 116 may be a SCF (Super Clean Foam) composite layer, which has a better buffering effect. Exemplarily, the SCF composite layer may include a bonding layer, a foam layer, a polyimide layer and a heat dissipation layer stacked in sequence. The two sides of the foam layer are respectively bonded to the bonding layer and the metal layer, the bonding layer is bonded to the second back film layer 150, and the heat dissipation layer is bonded to the first back film layer 115 by glue. The bonding layer may be a mesh glue (Embo), which has the function of fitting and exhausting, and is flexible and will not affect the flexible design of the display module. The foam layer may be foam, which can play a buffering role as well as a shading role. The material of the heat dissipation layer may be a metal selected from copper and aluminum or an alloy structure thereof, and the heat dissipation layer can play a heat dissipation role.

[0121] Please continue to refer to Figure 8 In some embodiments of the present application, the display module 100 may further include a foam adhesive layer 117. The foam adhesive layer 117 is stacked between the support layer 116 and the second back film layer 150, and its two sides are respectively bonded to the support layer 116 and the second back film layer 150, playing a role of fixing and buffering.

[0122] In addition, please continue to refer to Figure 8 The display module 100 further includes a shielding layer 160, which is a structure having shielding properties against electromagnetic waves. Exemplarily, the shielding layer 160 may include a laminated insulating adhesive layer 161 and a metal layer 162. The metal layer 162 is bonded to the surface of the insulating adhesive layer 161. The surface of the insulating adhesive layer 161 facing away from the metal layer 162 is used to attach the metal layer 162 to the structure to be shielded. For example, Figure 8 In the embodiment, the metal layer 162 is attached to the peripheral area 1141 b , the bending area 1142 a , the DDIC 120 , and the electrical connection area 131 of the FPC 130 through the insulating adhesive layer 161 .

[0123] Because the shielding layer 160 needs to be bent, the insulating rubber layer 161 and the metal layer 162 have bendable properties. For example, the insulating rubber layer 161 can be made of, but not limited to, insulating soft rubber materials such as mesh glue and silicone. The metal layer 162 can be a thin sheet structure made of metal material. In addition, in order to have the shielding property of electromagnetic waves, the metal layer 162 can be made of materials with shielding properties such as copper and copper alloys, such as copper skin. It should be noted that when the metal layer 162 is made of materials with shielding properties such as copper and copper alloys, the shielding layer 160 has a certain corrosion resistance. In addition, the shielding layer 160 is provided with the metal layer 162, which can also play a heat dissipation role.

[0124] Figure 8In the display module 100 shown, the shielding layer 160 extends from the side of the peripheral area 1141b facing away from the connection area 1142b (hereinafter referred to as the outer side of the peripheral area 1141b) through the side facing the outer surface of the bending area 1142a (the outer surface of the bending area 1142a is the surface of the bending area 1142a facing away from the connection area 1142b and the panel area 1141, which is convex) (hereinafter referred to as the outer side of the bending area 1142a) to the side of the electrical connection area 131 of the FPC 130 facing away from the connection area 1142b (hereinafter referred to as the outer side of the electrical connection area 131 of the FPC 130). In other words, the shielding layer 160 is not only distributed on the side of the DDIC 120 facing away from the connection area 1142b (hereinafter referred to as the outer side of the DDIC 120), but also distributed to the front side of the peripheral area 1141b, the outer side of the bending area 1142a, and the outer side of the electrical connection area 131 of the FPC 130.

[0125] In addition, the shielding layer 160 covers the electrical connection area 131 of DDIC120 and FPC130, at least a portion of the surface of the connection area 1142b facing away from the panel area 1141 (hereinafter referred to as the lower surface of the connection area 1142b) not occupied by DDIC120 and FPC130, at least a portion of the surface of the peripheral area 1141b facing away from the connection area 1142b (hereinafter referred to as the upper surface of the connection area 1142b), and at least a portion of the outer surface of the bending area 1142a.

[0126] The so-called "covering" means that the obstruction will cover the obstruction so that the surface of the obstruction cannot be seen. It can be understood that, in the case where the shielding layer 160 is not provided, the remaining surface of DDIC120 except the surface in contact with the connection area 1142b is exposed to the outside, and the electrical connection area 131 of FPC130 except the surface in contact with the connection area 1142b and the surface connected to other areas of FPC130 is exposed to the outside. Based on this, the shielding layer 160 covers the electrical connection area 131 of DDIC120 and FPC130, so that the exposed surface of the electrical connection area 131 of DDIC120 and FPC130 cannot be seen from the outside of the shielding layer 160 away from DDIC120 and FPC130.

[0127] Figure 8 In the figure, the shielding layer 160 extends to the area around the connection area 1142b of DDIC120 and the area around the electrical connection area 131 of FPC130, so that the exposed side surfaces of DDIC120 and the electrical connection area 131 of FPC130 (except the surface facing away from the connection area 1142b among the exposed surfaces) cannot be seen.

[0128] Please refer to Figure 6 , for ease of understanding, Figure 6The transparent gray color indicates the shielding layer 160. In the figure, region D1 is the region of the shielding layer 160 facing the peripheral region 1141b, region D2 is the region of the shielding layer 160 facing the bending region 1142a, and region D3 is the region of the shielding layer 160 facing the connecting region 1142b and the FPC 130.

[0129] Depend on Figure 6 It can be seen that the shielding layer 160 covers the entire area of ​​the peripheral area 1141b through area D1, covers the entire area of ​​the bending area 1142a through area D2, and covers the electrical connection area 131 of the DDIC 120 and FPC 130 and the entire area of ​​the lower surface of the connection area 1142b not occupied by the DDIC 120 and FPC 130 through area D3. It can be seen that the area D3 of the shielding layer 160 extends around the electrical connection area 131 of the DDIC 120 and FPC 130, so that the electrical connection area 131 of the DDIC 120 and FPC 130 is covered.

[0130] It is understandable that, in some other embodiments, the area D1 of the shielding layer 160 may also cover part of the peripheral area 1141b; the area D2 may also cover part of the bending area 1142a; and the area D3 may also cover the electrical connection area 131 of the DDIC 120 and the FPC 130 by extending beyond the periphery of the electrical connection area 131 of the DDIC 120 and the FPC 130. For example, the area D3 may also be bent from the outer side of the electrical connection area 131 of the DDIC 120 and the FPC 130 to the side to which the side surface thereof faces.

[0131] It is also understandable that Figure 8 In the illustrated embodiment, the DDIC 120, the electrical connection area 131 of the FPC 130, at least a portion of the peripheral area 1141b, and at least a portion of the outer surface of the bending area 1142a are covered by the entire shielding layer 160. In some other embodiments, the shielding layer 160 may cover the DDIC 120, the electrical connection area 131 of the FPC 130, at least a portion of the peripheral area 1141b, and at least a portion of the outer surface of the bending area 1142a in blocks, which is not limited in the embodiment of the present application.

[0132] when Figure 8 When the display module 100 is used as a display component in an electronic device, the side frame of the electronic device is located outside the bending area 1142a of the display module 100. For ease of understanding, the side frame 221 of the electronic device is illustrated in the figure by a dotted frame along the Z-axis direction. The side frame 221 and / or the surroundings are usually provided with antennas for transmitting and receiving signals of the entire electronic device. Figure 8In the display module 100 shown, while retaining the narrow frame design, by setting a shielding layer 160 to cover the DDIC 120, the electromagnetic waves radiated by the DDIC 120 to the outside of the bending area 1142a can be shielded (indicated by "×" in the figure), thereby reducing or even isolating the interference caused by the electromagnetic waves generated by the DDIC 120 to the side frame 221 of the electronic device and / or the antennas arranged around it, thereby improving the overall signal receiving and sending performance of the electronic device. Conversely, it can be understood that the shielding layer 160 can also shield the electromagnetic waves of the side frame 221 of the electronic device and / or the antennas arranged around it, thereby reducing or even isolating the interference caused by them to the DDIC 120, thereby improving the display effect of the display module 100.

[0133] In addition, due to Figure 8 The shielding layer 160 shown covers the outer side of the entire panel transfer area 1142 and the outer side of the peripheral area 1141b, thereby forming a larger shielding area, thereby better shielding the electromagnetic waves radiated from DDIC120 and devices on the inner side of the panel transfer area 1142 (such as the panel area 1141) to the outside of the panel transfer area 1142 (including but not limited to the side frame 221 located on the outside of the panel transfer area 1142), as well as electromagnetic waves from the outside of the panel transfer area 1142.

[0134] For example, the shielding layer 160 can also shield the electromagnetic waves radiated from the DDIC 120 to the outside of the DDIC 120 (indicated by “×” in the figure). Figure 5 It can be understood that the outer side of DDIC120 is provided with components such as the mainboard and battery of the electronic device. Therefore, the shielding layer 160 can reduce or even isolate the interference caused by the electromagnetic waves generated by DDIC120 to the mainboard, battery and other components of the electronic device located outside the connection area 1142b, thereby improving the processing performance, charging and discharging performance, etc. of the electronic device. Conversely, the shielding layer 160 can also shield the electromagnetic waves generated by these components, thereby reducing or even isolating the interference caused by them to DDIC120, thereby improving the display effect of the display module 100.

[0135] In addition, it can be understood that in other embodiments, the shielding layer 160 may also extend from the outside of the DDIC120 to the outside of the bending zone 1142a, and cover at least part of the outer surface of the DDIC120 and the bending zone 1142a, without extending to the peripheral zone 1141b and not covering the upper surface of the peripheral zone 1141b. The embodiments of the present application are not limited to this.

[0136] In other embodiments, Fig. 9As shown, the shielding layer 160 may not cover the electrical connection area 131 of the FPC 130, and this is not limited in the present embodiment. It should be noted that compared with other positions of the display module 100, the electrical connection area 131 of the FPC 130 is relatively weak in terms of liquid ingress protection due to the lack of encapsulation glue, and there is a risk of liquid ingress. Based on this, Figure 8 The display module 100 shown can reduce the risk of liquid entering the electrical connection area 131 of the FPC 130 by extending the shielding layer 160 to cover the electrical connection area 131 of the FPC 130 , thereby improving the reliability of the display module 100 and improving the corrosion resistance.

[0137] In some embodiments of the present application, in order to further reduce the risk of liquid intrusion into the electrical connection area 131 of the FPC 130, please refer to Figure 6 and Figure 8 The shielding layer 160 is not limited to covering the electrical connection area 131 of the FPC 130 , but may continue to extend around the electrical connection area 131 to cover a wider area on the FPC 130 including the electrical connection area 131 , thereby further reducing the risk of liquid intrusion into the electrical connection area 131 of the FPC 130 .

[0138] For related technologies, please refer to Fig.10 , Fig.10 The display module 100 is provided with a bending area protective glue 170, which extends from the outside of the peripheral area 1141b through the outside of the bending area 1142a to the outside of the connecting area 1142b, and is used to protect the peripheral area 1141b, the bending area 1142a and the connecting area 1142b, so as to reduce the risk of deformation and damage caused by external force and disperse its own bending stress. Figure 8 The display module 100 shown in FIG. Figure 8 In the display module 100 shown, the shielding layer 160 can also replace the bending area protective glue 170 to protect the peripheral area 1141b, the bending area 1142a and the connecting area 1142b.

[0139] In order to improve the bending stress of the shielding layer 160, please continue to refer to Figure 8 The shielding layer 160 is provided with a stress dispersion structure. The stress dispersion structure is distributed in the stress area of ​​the shielding layer 160. The stress area of ​​the shielding layer 160 refers to an area on the shielding layer 160 where the stress value is greater than a preset threshold. The preset threshold can be set as needed.

[0140] Understandably, Figure 8In the figure, the stress area of ​​the shielding layer 160 may include but is not limited to the area of ​​the shielding layer 160 facing the bending area 1142a. Considering that the area of ​​the shielding layer 160 facing the peripheral area 1141b occupies a smaller area and will also bear a larger bending stress, the stress dispersion structure may also be distributed in this area, that is, the stress area of ​​the shielding layer 160 may also include the area of ​​the shielding layer 160 facing the peripheral area 1141b.

[0141] Optionally, the number of the stress dispersion structures may be one or more, and a single stress dispersion structure may be a bending hole or a bending groove arranged in the stress zone. Fig.11 The area of ​​the shielding layer 160 facing the bending area 1142a and the area of ​​the shielding layer 160 facing the peripheral area 1141b are taken as examples for explanation as the stress area of ​​the shielding layer 160, and the specific implementation of the bending groove can be understood by reference.

[0142] For example, please refer to Fig.11 , Fig.11 The schematic diagram of the shielding layer 160 provided in the embodiment of the present application in a flattened state. In the figure, area D1 is the shielding layer 160 facing the Figure 8 The peripheral area 1141b in the region D2 is the region directly facing the shielding layer 160. Figure 8 The bending area 1142a in the middle is the area where the shielding layer 160 is directly facing. Figure 8 The connecting area 1142b in the shielding layer 160 and the area of ​​the FPC 130. It can be understood that the area D1 and the area D2 are stress areas of the shielding layer 160.

[0143] Fig.11 The case where the bending hole 163 is provided in both the region D1 and the region D2 is shown. It is understandable that in other embodiments, the bending hole 163 may also be provided in one of the regions D1 and D2 of the shielding layer 160, for example, the bending hole 163 is provided only in the region D2, and the embodiment of the present application is not limited to this.

[0144] The embodiment of the present application does not specifically limit the cross-sectional shape of the bending hole 163. The cross-sectional shape of the bending hole 163 may be, but is not limited to Fig.11 The circular hole shown in (a) Fig.11 The diamond-shaped holes shown in (b) Fig.11 In other embodiments, the shape of the bending hole 163 provided on the shielding layer 160 can be one or a combination of two or more, which can be set according to actual conditions.

[0145] In addition, the embodiment of the present application does not specifically limit the number of the bending holes 163. The number of the bending holes 163 can be one or more and can be set according to actual conditions. In addition, the embodiment of the present application does not specifically limit the arrangement of the bending holes 163. For example, the plurality of bending holes 163 can be arranged in a plurality of Fig.11 (a) and Fig.11 The array distribution shown in (b) in FIG. 1 (i.e., multiple rows of distribution, the holes in each row are evenly spaced, and the holes between rows are aligned), or Fig.11 The staggered distribution shown in (c) in FIG. 1 (i.e., distributed in multiple rows, the holes in each row are distributed at equal intervals, and the holes between rows are staggered) can be set according to actual conditions. In addition, the embodiment of the present application does not specifically limit the size of the bending hole 163, which can be set according to actual conditions.

[0146] It can be understood that the above setting is based on actual conditions, and the bending hole 163 can be set according to the stress test results obtained through a stress simulation experiment or a stress test experiment on the shielding layer 160 to improve the bending stress of the shielding layer 160.

[0147] It should be noted that Fig.11 In the embodiment shown, when the shielding layer 160 is deformed due to bending, an internal force that interacts with each other will be generated inside to resist the external bending force. This internal force is called bending stress. By opening the bending hole 163 on the shielding layer 160, the structure of the shielding layer 160 can be effectively changed, the distribution of the bending stress of the shielding layer 160 can be affected, and the concentration of the bending stress can be dispersed and reduced, so that the distribution of the bending stress on the shielding layer 160 is more uniform. This uniform distribution can not only reduce the risk of damage to the shielding layer 160 itself or performance degradation due to the concentration of bending stress, but also reduce the impact of the bending stress on the inner structural layers such as Figure 8 The forces in the peripheral area 1141b and the bending area 1142a are reduced, thereby reducing the risk of damage to the inner structural layer or performance degradation due to bending stress concentration.

[0148] Understandably, Figure 8 The display module 100 shown schematically only shows some components included in the electronic device 1. In other embodiments of the present application, the display module 100 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently, which is not specifically limited in the embodiments of the present application. In addition, it should be noted that Figure 7 The display panel 114 is divided into regions, but in a specific implementation, there is no clear dividing line between the regions.

[0149] The present application also provides Fig.12 The display module 100 shown in FIG. Fig.12 The display module shown also adopts the COP packaging solution.

[0150] For example, please refer to Fig.12 , Fig.12 A side view of another display module 100 provided in an embodiment of the present application. Fig.12 The side faces shown can be adapted for reference Figure 8 The perspective shown is understood.

[0151] Different from Figure 8 The display module 100 shown in FIG. Fig.12 In the display module 100 shown, the shielding layer 160 is no longer distributed outside the peripheral area 1141b and the bending area 1142a, and the shielding layer 160 extends from the outside of the DDIC 120 to the outside of the electrical connection area 131 of the FPC 130. In other words, the shielding layer 160 is distributed outside the DDIC 120 and the electrical connection area 131 of the FPC 130. In addition, the shielding layer 160 covers at least a portion of the lower surface of the DDIC 120, the electrical connection area 131 of the FPC 130, and the connection area 1142b that is not occupied by the DDIC 120 and the FPC 130, such as the entire area.

[0152] In some embodiments, the shielding layer 160 may extend around the electrical connection area 131 of the DDIC 120 and the FPC 130 so that the DDIC 120 and the electrical connection area 131 of the FPC 130 are covered. The specific implementation may be adaptively referred to in the embodiment of the present invention. Figure 8 In other embodiments, the shielding layer 160 may also cover the DDIC 120 and the electrical connection area 131 of the FPC 130 in other ways. Fig.12 As shown, the shielding layer 160 may also be bent from the outer side of the DDIC 120 to the side to which the side surface thereof faces, so as to cover the DDIC 120 .

[0153] It is understandable, therefore Fig.12The display module 100 shown can also shield the electromagnetic waves radiated by DDIC120 to the outside of the bending area 1142a through the shielding layer 160 while retaining the narrow frame design, thereby reducing or even isolating the interference of the electromagnetic waves generated by DDIC120 on the side frame 221 of the electronic device and / or the antennas arranged around it, thereby improving the overall signal receiving and transmitting performance of the electronic device. Conversely, it can be understood that the shielding layer 160 can also shield the electromagnetic waves of the side frame 221 of the electronic device and / or the antennas arranged around it, thereby reducing or even isolating the interference caused to DDIC120, thereby improving the display effect of the display module 100. In addition, the shielding layer 160 can also shield the electromagnetic waves radiated by DDIC120 to the outside of DDIC120 and reduce the risk of liquid intrusion into the electrical connection area 131 of FPC130. For specific analysis, please refer to the Figure 8 The relevant instructions will not be repeated here.

[0154] Optionally, please continue to refer to Fig.12 , the display module 100 can retain Fig.10 The bending area protective glue 170 shown is attached to the outer side of the peripheral area 1141b, the outer side of the bending area 1142a, and the outer side of a part of the connecting area 1142b, and is used to protect the peripheral area 1141b, the bending area 1142a, and a part of the connecting area 1142b. Of course, in other embodiments, the bending area protective glue 170 may not be provided, and the embodiment of the present application is not limited to this.

[0155] It is understandable that, under the premise of no contradiction or conflict, the above Figure 8 The deformation, improvement and related description based on the display module 100 in FIG. Fig.12 The display module 100 is shown as an example and will not be described in detail herein.

[0156] Figures 8 to 12 In the display module 100 shown, the COP packaging solution is used as an example for explanation. Fig.13 , a display module 100 adopting a COF packaging solution is described.

[0157] For example, please refer to Fig.13 , Fig.13 A side view of another display module 100 provided in an embodiment of the present application. Fig.13 The side faces shown can be adapted for reference Figure 8 The perspective shown is understood.

[0158] Different from Figure 8In the display module 100 shown, the panel area 1141 is provided by the display panel 114 , but the panel transition area 1142 is not formed by bending the display panel 114 , but is provided by the flexible additional substrate 132 .

[0159] As the name implies, the flexible additional substrate 132 is made of a flexible material so as to have a bendable property. Optionally, the flexible additional substrate 132 can be a different part of a structure with the FPC 130; or it can be made of a separate flexible material ( Fig.13 That is, this situation is shown), and the embodiments of the present application are not limited to this.

[0160] The flexible additional substrate 132 is electrically connected to the upper surface of the peripheral area 1141b, and then bent to the backlight side of the panel area 1141, forming a bending area 1142a and a connection area 1142b stacked on the backlight side of the panel area 1141. In this case, the DDIC 120 and the FPC 130 are fixed on the flexible additional substrate 132, which belongs to the COF packaging solution.

[0161] It is understandable that when the display module 100 using the COF packaging solution is used as a display component of an electronic device, there may also be a problem that the DDIC 120 is too close to the side frame 221 of the electronic device. Based on this, Fig.13 The display module 100 shown in the figure can also achieve the effect of shielding electromagnetic waves by setting the shielding layer 160. For details, please refer to Figure 8 Description of the effect.

[0162] It is also understandable that Fig.13 In the display module 100 shown, since the flexible additional substrate 132 is fixed in the peripheral area 1141b, it needs to occupy the area of ​​the peripheral area 1141b. Compared with the COP solution, the frame width of the side where the bending area 1142a is located is reduced by a smaller size, but because it is connected to the panel area 1141 through the additional flexible additional substrate 132 and bent to the backlight side of the panel area 1141, the display panel 114 is not required to be a flexible substrate, and the display panel 114 can be a rigid substrate. This embodiment provides a wider application scenario for the setting of the shielding layer 160.

[0163] It should be noted that, under the premise of no contradiction or conflict, the display module 100 is compared with Figure 8 The deformation, improvement and related description of the display module 100 in Fig.13 The display module 100 shown is implemented, and the specific implementation and implementation effects can be understood by reference, and will not be repeated here.

[0164] exist Figures 8 to 13 In the case where the display module 100 is a touch display module, Figures 8 to 13The display module 100 shown does not show components related to realizing the touch function. For example, the display module 100 also includes a touch panel and a touch display chip.

[0165] Among them, the touch panel is a structure for realizing touch detection in the display module 100. Exemplarily, the touch panel includes a touch sensing layer and a touch driving circuit. The touch sensing layer is responsible for sensing the user's touch operation to generate a corresponding touch electrical signal to the touch driving circuit. Optionally, the touch sensing layer can be in the form of a capacitive touch sensor and a resistive touch sensor. The touch driving circuit is responsible for receiving the touch electrical signal from the touch sensing layer and processing the touch electrical signal. The processing process may include signal amplification, filtering, decoding, etc. to ensure that the signal can be accurately and stably transmitted to the touch driving chip.

[0166] The touch driving chip is a structure in the touch display module 100 that identifies the position and mode of a touch operation according to a signal fed back by the touch panel.

[0167] In order to facilitate understanding of the positional relationship of the components related to the touch function in the display module 100, Figure 8 and Fig.14 The position setting of the touch-related structural layers is described, and other embodiments may be implemented with reference to this.

[0168] In some embodiments, please refer to Figure 8 , the touch panel and the display panel 114 can be integrated into one component. Specifically, the touch driving circuit and the touch sensing layer of the touch panel can be stacked on the flexible substrate of the display panel 114. In this case, Figure 8 The display panel 114 shown may be referred to as a touch display panel 114 .

[0169] In other embodiments, please refer to Fig.14 The touch panel 118 and the display panel 114 may be two independent components, and the touch panel 118 is disposed between the polarizer 113 and the panel area 1141 .

[0170] It should be noted that although the entire structure of the touch panel 118 shown in the figure is disposed between the polarizer 113 and the panel area 1141. In actual products, the position of the touch driving circuit of the touch panel 118 may vary depending on factors such as design, touch technology requirements and manufacturing costs, for example, it may be disposed on the backlight side of the panel area 1141.

[0171] Optionally, in Figure 8 and Fig.14 In the display module 100 shown, the touch driver chip and the DDIC 120 may be the same chip. Figure 8 and Fig.14This illustrates this situation; in other embodiments, the touch driver chip and DDIC 120 may also be separate chips, and the embodiments of the present application do not specifically limit this.

[0172] When the touch driver chip and DDIC120 are the same chip, that is, DDIC120 is reused, DDIC120 is the touch driver chip, and its location can be referred to Figure 8 Description of the position of DDIC120. In this case, the touch driver chip can reuse FPC130 to transmit signals with the mainboard. Of course, in other embodiments, the touch driver chip can also use other FPCs in the connection area 1142b to transmit signals with the mainboard, which is not limited in the present embodiment.

[0173] When the touch driver chip is a separate chip, that is, DDIC120 is not reused, the touch driver chip can be set in areas such as FPC130 or connection area 1142b, and signal transmission between the touch driver chip and the mainboard and signal transmission between the touch driver chip and the touch display panel can be achieved by reusing FPC130 or other FPCs.

[0174] Below Fig.12 The display module 100 shown is based on Fig.15 and Fig.16 The process implementation scheme of the shielding layer 160 is described. The display module 100 shown in other embodiments can be implemented with reference.

[0175] For example, please refer to Fig.15 , Fig.15 A schematic diagram of a first process implementation scheme for the shielding layer 160 provided in an embodiment of the present application.

[0176] Before the display panel 114 is bent, the display panel 114 is in a flat state. In this state, the polarizer 113, DDIC 120 and FPC 130 are laid on the corresponding areas of the display panel 114 (which can be combined with Fig.12 understand).

[0177] After the polarizer 113 is laid, the optical adhesive layer 112 can be laid on the upper surface of the polarizer 113. It should be noted that the optical adhesive layer 112 is usually supplied in the form of being attached to the surface of a heavy release film 180 (also called a heavy film). When it is necessary to lay the optical adhesive layer 112, firstly, the optical adhesive layer 112 attached to the surface of the heavy release film 180 can be faced downward and pasted on the upper surface of the polarizer 113, and then the heavy release film 180 on the upper surface of the optical adhesive layer 112 can be peeled off to expose the upper surface of the optical adhesive layer 112, thereby achieving the laying of the optical adhesive layer 112. After that, Fig.12The cover plate 111 is laid on the upper surface of the optical adhesive layer 112 and bonded to the optical adhesive layer 112 .

[0178] After the DDIC 120 and the FPC 130 are laid, the shielding layer 160 may be laid on the upper surface of the DDIC 120 and the FPC 130. Fig.15 In the first process implementation scheme of the shielding layer 160 shown, the shielding layer 160 can be attached to the surface of the heavy release film 180 to which the optical adhesive layer 112 is attached, and the shielding layer 160 can be laid while the optical adhesive layer 112 is laid on the upper surface of the polarizer 113. Afterwards, by peeling off the heavy release film 180 to expose the upper surface of the optical adhesive layer 112, the shielding layer 160 is also exposed, thereby realizing the processing of the shielding layer 160. It should be noted that when the shielding layer 160 is attached to the heavy release film 180, the metal layer 162 of the shielding layer 160 is bonded to the heavy release film 180. It can be understood that according to Fig.15 The edge of the display panel 114 is bent in the direction indicated by the dotted arrow, and the shielding layer 160 is also placed on the backlight side of the display area 1141a, thereby presenting Fig.12 Status shown.

[0179] For example, please refer to Fig.16 , Fig.16 A schematic diagram of a second process implementation scheme for the shielding layer 160 provided in an embodiment of the present application.

[0180] Different from Fig.15 The first process implementation scheme of the shielding layer 160 shown in FIG. Fig.16 In the second process implementation scheme of the shielding layer 160 shown in FIG. 1 , the shielding layer 160 is attached separately. Specifically, before the display panel 114 is bent, the display panel 114 is in a flat state. In this state, the polarizer 113, the DDIC 120 and the FPC 130 are laid on the corresponding areas of the display panel 114 (which can be combined with the Fig.12 After that, the shielding layer 160 can be laid on the display panel 114 corresponding to Fig.12 The shielding layer 160 is disposed on the display panel 114, and the insulating adhesive layer 161 of the shielding layer 160 is closer to the display panel 114 and adheres to the display panel 114, while the metal layer 162 is further away from the display panel 114.

[0181] Understandably, according to Fig.16 The edge of the display panel 114 is bent in the direction indicated by the dotted arrow, and the shielding layer 160 is also placed on the backlight side of the display area 1141a, thereby presenting Fig.12It is understandable that Fig.16 In the embodiment, the optical adhesive layer 112 may be laid before or after the shielding layer 160, which is not limited in this embodiment.

[0182] Finally, it should be noted that in the description of this specification, specific features, structures, etc. can be combined in any one or more embodiments or examples in a suitable manner. In addition, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application is described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A display module, characterized in that: The display module comprises: The panel area includes a display area, and the side opposite to the light emitting surface of the display area is the backlight side of the panel area; A panel transfer area; the panel transfer area is connected to the panel area and bent to the backlight side of the panel area; the panel transfer area includes a connection area stacked on the backlight side of the panel area; A display driver chip; the display driver chip is electrically connected to a surface of the connection area facing away from the panel area, a shielding layer is distributed on a side of the display driver chip facing away from the connection area, and the shielding layer covers the display driver chip.

2. The display module according to claim 1, characterized in that: The panel transfer area further includes a bending area; the bending area is located at the side of the connection area and the panel area; the connection area is connected to the panel area via the bending area; The shielding layer also extends to the side toward which the outer surface of the bending zone faces and covers at least a portion of the outer surface of the bending zone. The outer surface of the bending zone is the surface of the bending zone facing away from the connecting zone and the panel zone.

3. The display module according to claim 1, characterized in that: The panel area also includes a peripheral area, and the peripheral area surrounds the display area; The shielding layer further extends to a side of the peripheral region facing away from the connecting region, and covers at least a portion of a surface of the peripheral region facing away from the connecting region.

4. The display module according to claim 1, characterized in that: The display module further includes an FPC; the FPC includes an electrical connection area electrically connected to a surface of the connection area facing away from the panel area; The shielding layer also extends to a side of the electrical connection area of ​​the FPC that is away from the connection area, and covers the electrical connection area of ​​the FPC.

5. The display module according to claim 1, characterized in that: The stress area of ​​the shielding layer is provided with a stress dispersion structure shielding layer.

6. The display module according to claim 5, characterized in that: The stress dispersion structure includes a bending hole or a bending groove arranged on the stress area.

7. The display module according to claim 6, characterized in that: The cross-sectional shape of the bending hole or the bending groove is circular, rectangular or rhombus-shaped.

8. The display module according to any one of claims 1 to 7, characterized in that: The shielding layer includes an insulating adhesive layer and a metal layer, and the metal layer is bonded to a side of the display driving chip facing away from the connection area through the insulating adhesive layer.

9. The display module according to any one of claims 1 to 7, characterized in that: The display module includes a display panel; the display panel is bent to form the panel transfer area and the panel area.

10. The display module according to any one of claims 1 to 7, characterized in that: The panel transfer area is a flexible additional substrate; The flexible additional substrate is connected to a surface of the peripheral area of ​​the panel area facing away from the connection area, and is bent to the backlight side of the panel area.

11. An electronic device, characterized in that: include: A housing, the housing comprising a side frame; The display module according to any one of claims 1 to 10, wherein the display module is mounted on the housing and surrounded by the side frame.

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