Electronic equipment

Abstract

The utility model provides an electronic device. The display substrate comprises a display part, a bending part and a binding part, a waterproof area is arranged on the back face of the display module, and the display part and the binding part are arranged corresponding to the waterproof area. The edge of the waterproof area is provided with waterproof glue, so that the back face of the display module is connected with the shell, and liquid inlet damage of the display substrate caused by a large amount of external water entering the waterproof area is prevented. The first anti-corrosion glue is arranged on the outer side face of the bent part, and liquid inlet corrosion of the bent part caused by entering of a small amount of corrosive liquid such as oil dirt, grease and sweat is prevented. And external water is allowed to pass through the first anti-corrosion glue and be in contact with the bending part, so that normal work of the display substrate is not influenced. The width of the waterproof glue is larger than that of the first anti-corrosion glue. The large-width waterproof glue close to the bending part is moved inwards to the position of the binding part, and the small-width first anti-corrosion glue is arranged on the outer side face of the bending part, so that the waterproof effect of the display part and the binding part and the anti-corrosion effect of the bending part are achieved, and the width of the frame at the bending part can be further narrowed.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices having a display module, and more particularly to an electronic device. Background Art

[0002] In electronic devices with display modules, if the frame width of the display module (i.e., the distance from the edge of the display area of ​​the display substrate to the edge of the cover plate) is reduced under the same overall size, the display module can provide a larger display area. However, the frame of the display module is usually limited by the process of the display module and the protection requirements of the entire device, and it is difficult to further narrow the frame width of the display module in the related art. Utility Model Content

[0003] An embodiment of the present application provides an electronic device that solves the problem that the border width of a display module in the related art is difficult to be further narrowed.

[0004] The embodiment of the present application adopts the following technical solution:

[0005] In a first aspect, an electronic device provided by an embodiment of the present application includes: a housing, a display module, a waterproof glue and a first anti-corrosion glue. The display module is arranged on the housing, and the display module includes a display substrate, a support layer and a cover plate. The display substrate includes a display part, a bending part and a binding part connected in sequence, and the display part and the binding part are respectively arranged on opposite sides of the support layer, and the bending part and one side of the support layer are arranged facing each other. The cover plate is arranged on the front of the display part, and the cover plate has a first end close to the bending part. The back of the display module has a waterproof area, and the display part and the binding part are both arranged corresponding to the waterproof area. The waterproof glue is arranged at the edge of the waterproof area, and the back of the display module and the housing are connected by the waterproof glue. The first anti-corrosion glue is arranged on the outer side of the bending part, and the width of the first anti-corrosion glue is smaller than the width of the waterproof glue.

[0006] The electronic device provided in the embodiment of the present application, the display substrate includes a display part, a bending part and a binding part, the back of the display module has a waterproof area, and the display part and the binding part are both arranged corresponding to the waterproof area. A waterproof glue is provided at the edge of the waterproof area to connect the back of the display module with the shell to prevent a large amount of external water from entering the waterproof area and causing liquid damage to the display substrate. A first anti-corrosion glue is provided on the outer side of the bending part to prevent a small amount of corrosive liquid such as oil, grease, sweat, etc. from entering and causing liquid corrosion of the bending part. Allowing external water to pass through the first anti-corrosion glue and contact the bending part will not affect the normal operation of the display substrate. The width of the waterproof glue is greater than the width of the first anti-corrosion glue. The electronic device of this embodiment moves the large-width waterproof glue close to the bending part inward to the binding part position, and sets a small-width first anti-corrosion glue on the outer side of the bending part to achieve waterproofing of the display part and the binding part and corrosion protection of the bending part, and the frame width at the bending part can be further narrowed.

[0007] In an optional implementation, when a flip-chip flexible screen packaging solution is adopted, the display substrate is a flip-chip flexible screen, a part of the flexible screen is used as the display part, one end of the flexible screen is bent to the back of the display part to form a bending part and a binding part, and a display driver chip can be arranged on the binding part to form a flip-chip flexible screen. The bending part can be located at one end of the display substrate in the length direction.

[0008] In an optional implementation, when a COF packaging solution is adopted, a flexible circuit board is connected to the edge of the display portion in the display substrate, and the flexible circuit board is bent to the back of the display portion to form a bending portion and a binding portion, and a display driver chip can be arranged on the binding portion, and the flexible circuit board with the display driver chip forms a COF. The bending portion can be located at one end of the display substrate in the length direction.

[0009] In an optional implementation, the electronic device is a mobile phone, and the housing includes a middle frame and a back plate. The display module is arranged on one side of the middle frame, and electronic components such as a battery, an earpiece, and a speaker can be arranged inside the middle frame. The back plate can be arranged on the side of the middle frame facing away from the display module, and the mobile phone is assembled. The middle frame and the back plate can be an assembled structure or an integrated structure.

[0010] In an optional implementation, the waterproof glue can be back glue or dispensing glue, which can easily realize reliable connection between the back of the display module and the housing. The anti-corrosion glue can be dispensing glue. The dispensing glue can be conveniently set on the outer side of the bending part and other predetermined positions.

[0011] In an optional implementation, the waterproof glue and the anti-corrosion glue can be epoxy resin, polyurethane, silicone, acrylate and modified colloids of the above resins.

[0012] In an optional implementation, the modulus of the waterproof glue and the anti-corrosion glue may range from 1 megapascal (MPa) to 2 gigapascals (GPa).

[0013] In an optional implementation, the curing process of the colloid can be ultraviolet (UV) curing, moisture curing, heat curing, a combination of UV and moisture dual curing, or a combination of UV and heat dual curing.

[0014] In an optional implementation, the first anti-corrosion adhesive is arranged along the extension direction of the bending portion. The extension direction of the bending portion is generally arc-shaped or U-shaped. The first anti-corrosion adhesive is arranged in a layered manner on the outer side of the bending portion to achieve corrosion protection of the bending portion.

[0015] In an optional implementation, the first anti-corrosion glue is disposed in the area between the housing and the back of the first end. A large amount of the first anti-corrosion glue is disposed near the bending portion of the housing, and the display module is mounted on the housing so that the first anti-corrosion glue is filled between the housing and the back of the first end, and the first anti-corrosion glue can cover the outer side of the bending portion, thereby achieving corrosion protection of the bending portion.

[0016] In an optional implementation, the outer side surface of the bending portion is provided with a protective glue for electrostatic protection, the protective glue is arranged along the extension direction of the bending portion, and the first anti-corrosion glue can be arranged on the outer side surface of the protective glue.

[0017] In an optional implementation, a polarizing layer is provided between the cover plate and the display part, and the first anti-corrosion adhesive is also provided on the side of the polarizing layer close to the bending part. The polarizing layer can reduce the reflection of ambient light and improve the display effect of the display module. The first anti-corrosion adhesive is provided on the side of the polarizing layer to prevent the corrosion of the bending part caused by the ingress of corrosive liquid, thereby improving the anti-corrosion effect of the first anti-corrosion adhesive on the bending part and making the connection between the first anti-corrosion adhesive and the display module more reliable.

[0018] In an optional implementation, the cover plate and the polarizing layer may be bonded together by optical adhesive to achieve reliable connection between the cover plate and the polarizing layer, and the light generated by the display substrate can be transmitted outward through the optical adhesive and the cover plate.

[0019] In an optional implementation, a second anti-corrosion glue is provided between the inner side of the bend and one side of the support layer. This effectively improves the anti-corrosion effect of the bend and effectively prevents the bend from being corroded by liquid after the corrosive liquid enters. The second anti-corrosion glue can be dispensed. The width of the second anti-corrosion glue is smaller than the width of the waterproof glue.

[0020] In an optional implementation, the second anti-corrosion glue may not be provided between the inner side surface of the bending portion and the side surface of the supporting layer.

[0021] In an optional implementation, a third anti-corrosion adhesive is provided on the outer peripheral surface of the display substrate except the outer side surface of the bending portion, the third anti-corrosion adhesive and the first anti-corrosion adhesive form a ring, the third anti-corrosion adhesive is located outside the waterproof adhesive, and the width of the third anti-corrosion adhesive is smaller than the width of the waterproof adhesive. The outer periphery of the display substrate except the bending portion is made corrosion-resistant to prevent the corrosive liquid from entering and causing liquid corrosion on the outer periphery of the display substrate. The frame width at positions other than the bending portion is relatively small.

[0022] In an optional implementation, the housing has an opening at an end position corresponding to the first anti-corrosion adhesive, the waterproof adhesive and the first anti-corrosion adhesive are connected by overlapping adhesive, and part of the overlapping adhesive is filled in the opening. The waterproof adhesive and the first anti-corrosion adhesive at different positions in the thickness direction of the cover plate are connected by overlapping adhesive, thereby improving the production yield of the bonding process.

[0023] In an optional implementation, the end position of the shell corresponding to the first anti-corrosion glue may not be provided with an opening, and a reliable connection between the waterproof glue and the first anti-corrosion glue is achieved through a high-precision bonding process.

[0024] In an optional implementation, the support layer includes a soft glue layer and a hard layer stacked on each other, the back of the display part is connected to the soft glue layer, the binding part is connected to the hard layer, the modulus range of the soft glue layer is 10 kilopascals (KPa) to 800 kilopascals, and the modulus range of the hard layer is 10 gigapascals (GPa) to 300 gigapascals. Under the same thickness of the support layer, the soft glue layer and the hard layer in the support layer of this embodiment meet the above-specified modulus range matching, and the support layer has a high buffering capacity. In the electronic device drop impact scenario, the overall connection strength of the display module is good, the display module is difficult to detach from the shell, reducing the risks of bright lines, black spots and peeling and delamination of the display module, and the display module has high reliability.

[0025] In an optional implementation, the thickness of the soft gel layer ranges from 50 μm to 250 μm, and the thickness of the hard layer ranges from 15 μm to 100 μm, thereby reducing the thickness and weight of the support layer.

[0026] In an optional implementation, the soft glue layer may include epoxy resin glue, polyurethane glue, organic silicone glue or acrylate glue.

[0027] In an optional implementation, the hard body layer may include a copper layer, a stainless steel layer, an aluminum layer, a steel layer, a carbon fiber layer, or a glass fiber layer.

[0028] In an optional implementation, a buffer layer may be provided between the soft rubber layer and the hard layer to enhance the buffering effect of the support layer. The buffer layer may be waterproof foam or the like.

[0029] In an optional implementation, the housing includes a support plate and a frame portion connected to the edge of the support plate, the support plate and the frame portion enclose a receiving groove, the display substrate and the support layer are arranged in the receiving groove, and the edge of the cover plate and the frame portion are arranged correspondingly; the back of the display module and the support plate are connected by waterproof glue. The cover plate is placed on the frame portion to provide better protection for the display substrate. The back of the display module and the support plate are connected by waterproof glue to achieve effective waterproofing of the display portion and the binding portion.

[0030] In an optional implementation, one end of the frame away from the support plate has a positioning groove, and the back edge of the cover plate is arranged at the positioning groove. The cover plate can be quickly positioned and assembled by placing the cover plate at the positioning groove of the frame.

[0031] In an optional implementation, the back side of the cover plate has a glue-free area between the outer edge of the cover plate and the first anti-corrosion glue, and the back edge of the cover plate is arranged in a positioning groove to facilitate positioning and installing the cover plate on the shell.

[0032] In an optional implementation, the outer peripheral surface of the cover plate includes a first inclined surface, and the first inclined surface and the back surface of the cover plate form an acute angle; the wall surface of the positioning groove includes a mating surface and a second inclined surface arranged adjacent to each other, and the mating surface and the second inclined surface form an acute angle; the mating surface and the back edge of the cover plate are arranged facing each other, and the first inclined surface and the second inclined surface are arranged facing each other. The cover plate is inserted obliquely and buckled in the housing frame part, so that the cover plate is limited on the housing, reducing the situation where the cover plate is separated from the housing in the impact scenario of the electronic device falling.

[0033] In an optional implementation, the outer peripheral surface of the cover plate includes a first vertical surface, and the first vertical surface and the back surface of the cover plate form an acute angle or a right angle; the wall surface of the positioning groove includes a matching surface and a second vertical surface arranged adjacent to each other, and the matching surface and the second vertical surface form an acute angle or a right angle; the matching surface and the back edge of the cover plate are arranged facing each other, and the first vertical surface and the second vertical surface are arranged facing each other. This facilitates the assembly of the cover plate at the positioning groove of the housing frame.

[0034] In an optional implementation, a connection glue is partially or completely provided between the back edge of the cover plate and the housing, the connection glue is located outside the waterproof glue, and the width of the connection glue is smaller than the width of the waterproof glue, so that the display module is reliably connected to the housing, and the display module is not easy to separate from the housing in the scenario where the electronic device falls and impacts.

[0035] In an optional implementation, the frame portion of the shell has a positioning groove, and connecting glue is provided between the back edge of the cover plate and the wall surface of the positioning groove, so that the cover plate is reliably connected to the frame portion of the shell.

[0036] In an optional implementation, the cover plate may be a 2D cover plate, a 2.5D cover plate, or a 3D cover plate.

[0037] In an optional implementation, the display substrate includes a display driver chip disposed on the binding portion, and the display driver chip is located in the waterproof area, effectively blocking a large amount of external water from entering the waterproof area, so that the display driver chip does not enter water and maintains normal operation.

[0038] In an optional implementation, the binding portion may be electrically connected to a circuit board, on which components such as an application processor and a power management chip may be arranged. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 (a) and (b) are partial cross-sectional views of electronic devices using 2.5D cover plates and 3D cover plates in the related art, respectively;

[0040] Figure 2 A partial cross-sectional view of another electronic device in the related art;

[0041] Figure 3 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0042] Figure 4 for Figure 3 A schematic diagram of the structure of an electronic device;

[0043] Figure 5 for Figure 3 A partial cross-sectional view along line AA;

[0044] Figure 6 A cross-sectional view of a display module in an electronic device provided in an embodiment of the present application;

[0045] Figure 7 A partial cross-sectional view of an electronic device provided in another embodiment of the present application;

[0046] Figure 8 A partial cross-sectional view of an electronic device provided by another embodiment of the present application;

[0047] Fig. 9 for Figure 3 A partial cross-sectional view along line BB;

[0048] Figures 10 to 15 They are partial cross-sectional views of electronic devices provided in other different embodiments of the present application. DETAILED DESCRIPTION

[0049] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation mode. On the contrary, the purpose of combining the implementation mode as an application introduction is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0050] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0051] It should be understood that in the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0052] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0053] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0054] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0055] See also Figure 1 (a) and (b) in Figure 1(a) and (b) are partial cross-sectional views of electronic devices using 2.5D cover plates and 3D cover plates in the related art, respectively. The electronic device 1 includes a housing 11, a display module 12 and a waterproof glue 16. The display module 12 is arranged on the housing 11. The display module 12 includes a display substrate 13, a support layer 14 and a cover plate 15. The display substrate 13 includes a display portion 13a, a bending portion 13b and a binding portion 13c connected in sequence. The display portion 13a and the binding portion 13c are respectively located on opposite sides of the support layer 14, and the bending portion 13b and a side surface of the support layer 14 are arranged facing each other. The back edges of the housing 11 and the cover plate 15 are connected by a circle of waterproof glue 16, and the width f11 of the waterproof glue 16 is about 0.6 mm to prevent external water from passing through the gap between the cover plate 15 and the housing 11 and entering the display substrate 13 after passing through the waterproof glue 16, thereby realizing the waterproofing of the display substrate 13. The distance a11 between the outer edge of the bend 13b and the edge of the display area AA of the display substrate 13 is about 1 mm. The distance b11 between the outer edge of the bend 13b and the edge of the cover plate 15 is about 0.7 mm. The frame width D11 of the display module 12 at the bend 13b is about 1.7 mm, which is difficult to be further narrowed. The frame width D11 refers to the distance from the edge of the display area AA of the display substrate 13 to the outer edge of the cover plate 15.

[0056] See also Figure 2 , Figure 2 It is a partial cross-sectional view of another electronic device in the related art. The electronic device 2 includes a housing 21, a display module 22, a waterproof glue 26 and a glue injection 27. The display module 22 is arranged on the housing 21. The display module 22 includes a display substrate 23, a support layer 24 and a cover plate 25. The display substrate 23 includes a display portion 23a, a bending portion 23b and a binding portion 23c connected in sequence. The display portion 23a and the binding portion 23c are respectively located on opposite sides of the support layer 24, and the bending portion 23b and a side surface of the support layer 24 are arranged facing each other. A waterproof glue 26 is provided on the inner bottom surface of the housing 21 near the bending portion 23b, and a glue injection 27 is provided in the area between the bending portion 23b, the back edge of the cover plate 25, the inner peripheral surface of the housing 21 and the waterproof glue 26 to prevent external water from passing through the gap between the cover plate 25 and the housing 21 and entering the display substrate 13 after passing through the glue injection 27, so as to realize the waterproofing of the display substrate 13. The distance a12 between the outer edge of the bent portion 23b and the edge of the display area AA of the display substrate 23 is about 1.2 mm. The distance b12 between the outer edge of the bent portion 23b and the edge of the cover plate 25 is about 0.5 mm. The frame width D12 of the display module 22 at the bent portion 23b is about 1.7 mm, which is difficult to be further narrowed. The frame width D12 refers to the distance from the edge of the display area AA of the display substrate 23 to the outer edge of the cover plate 25.

[0057] In order to conveniently describe the orientation of the electronic device in the following embodiments, the length direction of the electronic device is defined as the Y direction, the width direction is the X direction, and the thickness direction is the Z direction. The X direction, the Y direction, and the Z direction may be perpendicular to each other.

[0058] The embodiment of the present application provides an electronic device, which may be a mobile phone, a watch, a tablet computer, a personal computer, a laptop computer, a personal digital assistant, an e-book reader, a netbook, a personal digital assistant, an augmented reality (AR) device, a virtual reality (VR) device, a smart home terminal, an electronic device for a car, etc. The following description will be made by taking a mobile phone as an example.

[0059] See also Figures 3 to 6 The electronic device 100 provided in the embodiment of the present application includes: a housing 110, a display module 120, a waterproof glue 130 and a first anti-corrosion glue 141. The display module 120 is arranged on the housing 110, and the display module 120 includes a display substrate 121, a support layer 122 and a cover plate 123. The display substrate 121 includes a display part 1211, a bending part 1212 and a binding part 1213 connected in sequence, and the display part 1211 and the binding part 1213 are respectively arranged on opposite sides of the support layer 122, and the bending part 1212 and a side surface 122a of the support layer 122 are arranged facing each other. The cover plate 123 is arranged on the front side 1211a of the display part 1211, and the cover plate 123 has a first end 123a close to the bending part 1212. The back side 120a of the display module 120 has a waterproof area 120b, and the display part 1211 and the binding part 1213 are arranged corresponding to the waterproof area 120b. The waterproof glue 130 is disposed at the edge of the waterproof area 120b, and the back side 120a of the display module 120 and the housing 110 are connected by the waterproof glue 130. The first anti-corrosion glue 141 is disposed on the outer side 1212a of the bending portion 1212, and the width f1 of the first anti-corrosion glue 141 is smaller than the width s of the waterproof glue 130.

[0060] Among them, the display substrate 121 can be an organic light emitting diode (OLED) screen or the like. The display portion 1211 of the display substrate 121 is used to output light to display information such as images and text. The front side 1211a and the back side 1211b of the display portion 1211 are two opposite sides. The front side 1211a of the display portion 1211 is the light emitting side of the display portion 1211. The back side 1211b of the display portion 1211 is the side of the display portion 1211 that is away from the cover plate 123. The display substrate 121 can adopt a chip on plastic (COP) packaging solution or a chip on film (COF) packaging solution.

[0061] When using the COP packaging solution, refer to Figure 5 The display substrate 121 is a flip-chip flexible screen (e.g., a flexible screen made of OLED material), a part of the flexible screen is used as the display part 1211, one end of the flexible screen is bent to the back of the display part 1211 to form a bending part 1212 and a binding part 1213, and a display driver chip can be arranged on the binding part 1213 to form a flip-chip flexible screen. The bending part 1212 can be located at one end of the display substrate 121 in the length direction (Y direction).

[0062] When the COF packaging solution is adopted, the edge of the display portion 1211 in the display substrate 121 is connected with a flexible circuit board, which is bent to the back of the display portion 1211 to form a bending portion 1212 and a binding portion 1213. A display driver chip can be arranged on the binding portion 1213, and the flexible circuit board with the display driver chip forms a COF. The bending portion 1212 can be located at one end of the length direction of the display substrate 121.

[0063] The back side 120a of the display module 120 is the back side of the overall structure formed by assembling the display substrate 121, the support layer 122 and the cover plate 123, and is the side that cannot be touched by a regular user during normal use. The outer side surface 1212a of the bending portion 1212 is the surface of the outer convex side of the bending portion 1212, and is the side of the bending portion 1212 away from the axis of the bending portion 1212.

[0064] The cover plate 123 is light-transmissive and allows the output light of the display substrate 121 to pass through. The cover plate 123 has a certain hardness requirement and protects the display substrate 121. The front side 123c and the back side 123d of the cover plate 123 are two opposite sides of the cover plate 123. The front side 123c of the cover plate 123 is the side that a regular user can touch during normal use, and the back side 123d of the cover plate 123 is the side that a regular user cannot touch during normal use.

[0065] The waterproof glue 130 is used to achieve waterproofing of the waterproof area 120b to prevent a large amount of external water from entering and causing damage to internal devices. The waterproofing can be a waterproof grade of IPX8, which means that the top of the electronic device 100 is 1.5 meters away from the water surface for 1 hour, and the performance of the electronic device 100 is not affected and water does not enter.

[0066] The anti-corrosion glue (such as the first anti-corrosion glue 141, the second anti-corrosion glue 142 and the third anti-corrosion glue 143 mentioned later) is used to achieve anti-corrosion of the predetermined area to prevent the ingress of a small amount of corrosive liquids such as oil, grease, sweat, etc., which may cause liquid corrosion of the internal components. The anti-corrosion can be waterproof grade IPX3 or IPX4, IPX3 needs to meet the requirements of the water spray test, and IPX4 needs to meet the requirements of the water splash test.

[0067] The waterproof grade of the waterproof glue 130 is higher than that of the anti-corrosion glue, and accordingly, the width s of the waterproof glue 130 is greater than the width (f1, f2, f3) of the anti-corrosion glue. The width s of the waterproof glue 130 is the distance between the outer peripheral surface and the inner peripheral surface of the waterproof glue 130. The width (f1, f2, f3) of the anti-corrosion glue is the distance between two relative surfaces of the anti-corrosion glue in a predetermined direction. For example, the width f1 of the first anti-corrosion glue 141 is the minimum distance between two relative surfaces of the first anti-corrosion glue 141 in a predetermined direction (Y direction), and the predetermined direction is perpendicular to the axis of the bending portion 1212 and the thickness direction (Z direction) of the cover plate 123, respectively.

[0068] The electronic device 100 provided in the embodiment of the present application, the display substrate 121 includes a display part 1211, a bending part 1212 and a binding part 1213, and the back side 120a of the display module 120 has a waterproof area 120b, and the display part 1211 and the binding part 1213 are both arranged corresponding to the waterproof area 120b. A waterproof glue 130 is provided at the edge of the waterproof area 120b, so that the back side 120a of the display module 120 is connected to the housing 110, and a large amount of external water is prevented from entering the waterproof area 120b and causing liquid damage to the display substrate 121. The outer side surface 1212a of the bending part 1212 is provided with a first anti-corrosion glue 141 to prevent a small amount of corrosive liquid such as oil, grease, sweat, etc. from entering and causing liquid corrosion of the bending part 1212. Allowing external water to pass through the first anti-corrosion glue 141 and contact the bending part 1212 will not affect the normal operation of the display substrate 121. The width s of the waterproof glue 130 is greater than the width f1 of the first anti-corrosion glue 141. Compared to Figure 1 The related art shown in the figure shows that the module 12 is provided with a wide waterproof glue 16 near the bending portion 13b, and Figure 2 The related art shows that the module 22 is provided with a wide waterproof glue 26 and a glue potting 27 at the bending portion 23b. In this embodiment, the electronic device 100 moves the wide waterproof glue 130 near the bending portion 1212 inward ( Figure 5 Move right) to the binding portion 1213, and set a first anti-corrosion glue 141 with a small width f1 on the outer side surface 1212a of the bending portion 1212 to achieve waterproofing of the display portion 1211 and the binding portion 1213 and corrosion protection of the bending portion 1212. The frame width D1 at the bending portion 1212 can be further narrowed.

[0069] For example, the electronic device 100 is a mobile phone, and the housing 110 includes a middle frame and a back plate. The display module 120 is arranged on one side of the middle frame, and electronic components such as a battery, an earpiece, and a speaker can be arranged inside the middle frame. The back plate can be arranged on the side of the middle frame facing away from the display module 120, and the mobile phone is assembled. The middle frame and the back plate can be an assembled structure or an integrated structure.

[0070] The display substrate 121 includes an active area (AA) and a non-display area NA located at the periphery of the active area AA. The border width a1 refers to the distance from the edge of the active area AA of the display substrate 121 to the outer edge of the display substrate 121. The frame (i.e., black border) width D1 refers to the distance from the edge of the active area AA of the display substrate 121 to the outer edge of the cover plate 123, that is, the sum of the border width a1 and the distance b1 from the outer edge of the display substrate 121 to the outer edge of the cover plate 123.

[0071] Exemplarily, in this embodiment, the bending portion 1212 of the display substrate 121 is located at the lower frame of the electronic device 100, and the outer side surface 1212a of the bending portion 1212 is provided with a first anti-corrosion glue 141, and the width f1 of the first anti-corrosion glue 141 can be 0.05 mm to 0.2 mm. The border width a1 of the lower frame of the electronic device 100 (i.e., the frame corresponding to the bending portion 1212 of the display substrate 121) can be 1.26 mm, and the distance b1 from the outer edge of the display substrate 121 (i.e., the outer edge of the bending portion 1212) to the outer edge of the cover plate 123 can be 0.2 mm, and the frame width D1 is 1.46 mm. Compared to Figure 1 , Figure 2 The bottom frame width of the electronic device in the related art is shown, and the bottom frame width D1 of the electronic device 100 in the embodiment of the present application can be made narrower by 0.2 mm to 0.3 mm.

[0072] It should be noted that with the improvement of display module manufacturing technology, the border width and frame width will become smaller and smaller, and the specific width size is not limited in this application.

[0073] When the waterproof glue 130 and the anti-corrosion glue are provided, the waterproof glue 130 may be back glue or dispensing glue, which can conveniently realize a reliable connection between the back surface 120a of the display module 120 and the housing 110. The anti-corrosion glue (such as the first anti-corrosion glue 141, the second anti-corrosion glue 142 and the third anti-corrosion glue 143 mentioned later) may be dispensing glue. The dispensing glue can be conveniently provided on the outer side surface 1212a of the bending portion 1212 and other predetermined positions.

[0074] The waterproof glue 130 and the anti-corrosion glue can be epoxy resin, polyurethane, silicone, acrylate and modified colloids of the above resins.

[0075] The modulus of the waterproof glue 130 and the anti-corrosion glue may range from 1 MPa to 2 GPa. For example, the modulus of the waterproof glue 130 (anti-corrosion glue) may be 1 MPa, 5 MPa, 10 MPa, 50 MPa, 100 MPa, 200 MPa, 500 MPa, 1 GPa, 1.5 GPa, 2 GPa, etc.

[0076] The curing process of the colloid can be ultraviolet (UV) curing, moisture curing, heat curing, a combination of UV and moisture dual curing, or a combination of UV and heat dual curing, which can be set as required.

[0077] There are multiple optional implementations when setting the first anti-corrosion glue 141. Two implementations are given as examples below.

[0078] The first implementation method of the first anti-corrosion adhesive 141: Figure 5 , the first anti-corrosion glue 141 is arranged along the extension direction of the bending portion 1212. The extension direction of the bending portion 1212 is generally arc-shaped or U-shaped. The first anti-corrosion glue 141 is arranged in a layered manner on the outer side surface 1212a of the bending portion 1212, which can achieve corrosion protection of the bending portion 1212, allowing external water to pass through the first anti-corrosion glue 141 and contact the bending portion 1212 without affecting the normal operation of the display substrate 121.

[0079] Second implementation method of the first anti-corrosion adhesive 141: Figure 7 , the first anti-corrosion glue 141 is arranged in the area between the housing 110 and the back side 123d of the first end 123a. A large amount of the first anti-corrosion glue 141 is arranged near the bending portion 1212 of the housing 110, and the display module 120 is installed on the housing 110, so that the space between the housing 110 and the back side 123d of the first end 123a is filled with the first anti-corrosion glue 141, and the first anti-corrosion glue 141 can cover the outer side surface 1212a of the bending portion 1212, so as to realize the anti-corrosion of the bending portion 1212, and allow external water to pass through the first anti-corrosion glue 141 and contact the bending portion 1212 without affecting the normal operation of the display substrate 121.

[0080] In some embodiments, see Figure 5 The outer side surface 1212a of the bending portion 1212 is provided with a protective glue 150 for electrostatic protection. The protective glue 150 is arranged along the extension direction of the bending portion 1212, and the first anti-corrosion glue 141 can be arranged on the outer side surface of the protective glue 150.

[0081] In some embodiments, see Figure 5 A polarizing layer 124 is disposed between the cover plate 123 and the display portion 1211 , and a first anti-corrosion adhesive 141 is also disposed on a side of the polarizing layer 124 close to the bending portion 1212 .

[0082] The polarizing layer 124 can reduce the reflection of ambient light and improve the display effect of the display module 120. The polarizing layer 124 can be a polarizer or other film layer that functions as a polarizer. The first anti-corrosion glue 141 is arranged on the side of the polarizing layer 124 to prevent the corrosive liquid from entering and causing liquid corrosion of the bending portion 1212, thereby improving the anti-corrosion effect of the first anti-corrosion glue 141 on the bending portion 1212, and making the connection between the first anti-corrosion glue 141 and the display module 120 more reliable.

[0083] The cover plate 123 and the polarizing layer 124 may be bonded together by the optical adhesive 125 to achieve reliable connection between the cover plate 123 and the polarizing layer 124 , so that the light generated by the display substrate 121 can be transmitted outward through the optical adhesive 125 and the cover plate 123 .

[0084] In order to improve the anti-corrosion effect of the bent portion 1212, in some embodiments, refer to Figure 8 A second anti-corrosion adhesive 142 is disposed between the inner side surface 1212 b of the bending portion 1212 and the side surface 122 a of the supporting layer 122 .

[0085] When assembling the display substrate 121 and the support layer 122, a second anti-corrosion glue 142 is disposed between the inner side 1212b of the bent portion 1212 and the support layer 122, which can effectively improve the anti-corrosion effect of the bent portion 1212 and effectively prevent the bent portion 1212 from being corroded by liquid after the corrosive liquid enters. The second anti-corrosion glue 142 can be dispensed. The width f2 of the second anti-corrosion glue 142 is less than the width s of the waterproof glue 130.

[0086] The width f2 of the second anti-corrosion glue 142 is the maximum distance of the second anti-corrosion glue 142 in the predetermined direction (Y direction), and is also the maximum distance between the inner side surface 1212b of the bending portion 1212 and the side surface 122a of the supporting layer 122 in the predetermined direction (Y direction). The predetermined direction is respectively perpendicular to the axis of the bending portion 1212 and the thickness direction (Z direction) of the cover plate 123.

[0087] In some other embodiments, the second anti-corrosion adhesive 142 may not be disposed between the inner side surface 1212 b of the bending portion 1212 and the side surface 122 a of the supporting layer 122 .

[0088] In order to improve the anti-corrosion effect of the display substrate 121 in areas other than the bent portion 1212, in some embodiments, refer to Figure 4 , Fig. 9 The outer peripheral surface 121a of the display substrate 121 except the outer side surface 1212a of the bending portion 1212 is provided with a third anti-corrosion glue 143. The third anti-corrosion glue 143 and the first anti-corrosion glue 141 form a ring. The third anti-corrosion glue 143 is located on the outside of the waterproof glue 130. The width f3 of the third anti-corrosion glue 143 is smaller than the width s of the waterproof glue 130.

[0089] The outer peripheral surface 121a of the display substrate 121 is the outer peripheral surface connected between the front side 121b and the back side 121c of the display substrate 121. The outer side surface 1212a of the bending portion 1212 is provided with a first anti-corrosion glue 141, and a third anti-corrosion glue 143 is provided on the outer peripheral surface 121a of the display substrate 121 except the outer side surface 1212a of the bending portion 1212, so that the third anti-corrosion glue 143 and the first anti-corrosion glue 141 form a ring shape, such as a rounded rectangle or other shapes. The outer periphery of the display substrate 121 except the bending portion 1212 is made anti-corrosion to prevent the corrosive liquid from entering and causing liquid corrosion of the outer periphery of the display substrate 121. The third anti-corrosion glue 143 can be dispensed.

[0090] The outer side of the waterproof glue 130 refers to the peripheral area of ​​the waterproof glue 130 on the plane where the display substrate 121 is located. The width f3 of the third anti-corrosion glue 143 is the maximum distance between the outer peripheral surface and the inner peripheral surface of the third anti-corrosion glue 143 in a predetermined direction, and the predetermined direction is perpendicular to the thickness direction (Z direction) of the cover plate 123. The width f3 of the third anti-corrosion glue 143 is smaller than the width s of the waterproof glue 130, so that the frame width D2 at positions other than the bending portion 1212 is relatively small.

[0091] Exemplarily, the left and right sides of the display substrate 121 (i.e., the left and right frames of the electronic device 100) are respectively provided with a third anti-corrosion glue 143, and the width f3 of the third anti-corrosion glue 143 can be 0.25 mm. The border width a2 of the left and right frames can be 0.8 mm, and the distance b2 from the outer edge of the display substrate 121 to the outer edge of the cover plate 123 can be 0.25 mm, and the frame width D2 of the left and right frames is 1.05 mm.

[0092] Exemplarily, the display substrate 121 is provided with a third anti-corrosion glue 143 on the side away from the bending portion 1212 (i.e., the upper frame position of the electronic device 100), and the width of the third anti-corrosion glue 143 can be 0.25 mm. The border width of the upper frame can be 0.65 mm, and the distance from the outer edge of the display substrate 121 to the outer edge of the cover plate 123 can be 0.25 mm, and the frame width of the upper frame is 0.9 mm.

[0093] In order to ensure reliable connection between the waterproof glue 130 and the first anti-corrosion glue 141, in some embodiments, refer to Figure 4 The shell 110 has an opening 1111 at the end position corresponding to the first anti-corrosion glue 141 , the waterproof glue 130 and the first anti-corrosion glue 141 are connected by the overlapping glue 160 , and part of the overlapping glue 160 is filled in the opening 1111 .

[0094] An opening 1111 is provided on the housing 110 at a position close to the waterproof glue 130 and the first anti-corrosion glue 141. After the waterproof glue 130 and the first anti-corrosion glue 141 are provided, the overlapping glue 160 is filled into the opening 1111 from the side of the housing 110 away from the display substrate 121, so that the waterproof glue 130 and the first anti-corrosion glue 141 at different positions in the thickness direction (Z direction) of the cover plate 123 are connected by the overlapping glue 160, thereby improving the production yield of the bonding process. The overlapping glue 160 can be a point glue.

[0095] In other embodiments, the end position of the shell 110 corresponding to the first anti-corrosion glue 141 may not have the opening 1111, and a reliable connection between the waterproof glue 130 and the first anti-corrosion glue 141 can be achieved through a high-precision bonding process.

[0096] See also Figure 1 In (a) and (b), the supporting layer 14 in the related art display module 12 includes a textured adhesive (embo) layer 14a, a foam layer 14b, a polyimide layer 14c and a copper foil layer 14d stacked in sequence. The composite of the multiple layers of materials makes the overall thickness larger, the weight larger, and the buffering capacity poorer. The textured adhesive layer 14a and the back of the display part 13a are connected by a back adhesive 17, and the copper foil layer 14d and the housing 11 are connected by a back adhesive 18. In the drop impact scenario of the electronic device 1, the cover plate 15 and the display part 13a tend to fall out of the housing 11, and the foam layer 14b has poor strength and is easy to delaminate, resulting in a low pulling force of the foam layer 14b on the display part 13a and the cover plate 15, and the cover plate 15 and the display part 13a move significantly, so that the display module 12 has the risk of bright lines, black spots and peeling and delamination.

[0097] In some embodiments, see Figure 5 The supporting layer 122 includes a soft glue layer 1221 and a hard layer 1222 stacked on each other. The back side 1211b of the display part 1211 is connected to the soft glue layer 1221. The binding part 1213 is connected to the hard layer 1222. The modulus range of the soft glue layer 1221 is 10 kilopascals (KPa) to 800 kilopascals, and the modulus range of the hard layer 1222 is 10 gigapascals (GPa) to 300 gigapascals.

[0098] Compared to Figure 1 The related art shows that the supporting layer 14 of the module 12 has the same thickness of the supporting layer. The soft rubber layer 1221 and the hard layer 1222 in the supporting layer 122 of this embodiment meet the modulus range matching specified above, and the supporting layer 122 has a higher buffering capacity.

[0099] In this embodiment, the back side 120a of the display module 120 is connected to the shell 110 via a waterproof glue 130, and the hard layer 1222 is connected to the back side 1211b of the display unit 1211 via a soft glue layer 1221. In a drop impact scenario of the electronic device 100, the overall connection strength of the display module 120 is good, and the display module 120 is difficult to separate from the shell 110, thereby reducing the risks of bright lines, black spots, peeling and delamination of the display module 120, and the display module 120 has high reliability.

[0100] After comparison with the drop ball test, the cushioning capacity of the soft-hard two-layer stacking structure of this embodiment is better than the cushioning capacity of the different stacking structures of soft-soft-hard, soft-soft-hard-hard, soft-hard-soft, hard-soft-hard, and hard-soft-soft-hard. The drop ball test is to place the test product on the test table, and let a steel ball of a predetermined weight fall freely on the test product from a predetermined drop height to impact the test product and check the appearance and performance of the test product.

[0101] In some embodiments, see Figure 5 The thickness of the soft gel layer 1221 ranges from 50 μm to 250 μm. The thickness of the hard layer 1222 ranges from 15 μm to 100 μm. The specific size is set as required. The thickness and weight of the support layer 122 can be reduced.

[0102] If the thickness of the soft glue layer 1221 is too small (e.g., less than 50 μm), the ability of the soft glue layer 1221 to absorb internal impact is reduced, resulting in a lower buffering capacity of the support layer 122. If the thickness of the soft glue layer 1221 is too large (e.g., greater than 250 μm), the thickness of the support layer 122 group is relatively thick, which is not conducive to thinning the electronic device 100.

[0103] If the thickness of the hard layer 1222 is too small (e.g., less than 15 μm), the hardness of the hard layer 1222 is insufficient to resist impact and extrusion, resulting in a low anti-punching ability of the support layer 122. If the thickness of the hard layer 1222 is too large (e.g., greater than 100 μm), the support layer 122 is too thick, which is not conducive to weight reduction of the electronic device 100.

[0104] For example, the thickness of the soft layer 1221 may be 50 μm, 80 μm, 100 μm, 150 μm, 200 μm, 250 μm, etc. The thickness of the hard layer 1222 may be 15 μm, 20 μm, 30 μm, 50 μm, 60 μm, 80 μm, 90 μm, 100 μm, etc.

[0105] When the soft adhesive layer 1221 is provided, the soft adhesive layer 1221 may include epoxy resin adhesive, polyurethane adhesive, organic silicone adhesive or acrylate adhesive, which can be selected as required.

[0106] When the hard layer 1222 is provided, the hard layer 1222 may include a copper layer, a stainless steel layer, an aluminum layer, a steel layer, a carbon fiber layer or a glass fiber layer, which can be selected as required.

[0107] In some embodiments, see Fig.10 A buffer layer 1223 may be provided between the soft gel layer 1221 and the hard layer 1222. Providing the buffer layer 1223 between the soft gel layer 1221 and the hard layer 1222 can enhance the buffering effect of the support layer 122. The buffer layer 1223 may be waterproof foam or the like.

[0108] When setting the housing 110, refer to Figure 4 , Figure 5 The shell 110 includes a support plate 111 and a frame portion 112 connected to the edge of the support plate 111, the support plate 111 and the frame portion 112 form a receiving groove 113, the display substrate 121 and the support layer 122 are arranged in the receiving groove 113, and the edge of the cover plate 123 and the frame portion 112 are arranged correspondingly; the back side 120a of the display module 120 and the support plate 111 are connected by a waterproof glue 130.

[0109] The housing 110 adopts the structure of the support plate 111 and the frame 112, which is convenient for placing the display substrate 121 and the support layer 122 in the receiving groove 113 surrounded by the support plate 111 and the frame 112, and the cover plate 123 is covered on the frame 112 to form a better protection for the display substrate 121 and improve the reliability of the device. The back 120a of the display module 120 and the support plate 111 are connected by waterproof glue 130 to achieve effective waterproofing of the display part 1211 and the binding part 1213. The support plate 111 and the frame 112 can be an assembled structure or an integrally formed structure.

[0110] In order to facilitate the positioning and assembly of the cover plate 123 on the housing 110, in some embodiments, refer to Figure 5 The frame 112 has a positioning groove 1121 at one end away from the support plate 111, and the edge of the back side 123d of the cover 123 is arranged at the positioning groove 1121. When the cover 123 is installed on the housing 110, the cover 123 is placed at the positioning groove 1121 of the frame 112, so that the cover 123 can be quickly positioned and assembled.

[0111] Exemplarily, the back side 123d of the cover plate 123 has a glue-free area between the outer edge of the cover plate 123 and the first anti-corrosion glue 141 , and the edge of the back side 123d of the cover plate 123 is arranged in the positioning groove 1121 to facilitate the positioning and installation of the cover plate 123 on the shell 110 .

[0112] There are multiple optional implementations when the cover plate 123 is assembled in the positioning groove 1121 of the housing 110. Two implementations are exemplarily given below.

[0113] A first implementation method of assembling the cover plate 123 in the positioning groove 1121 of the housing 110: Figure 5 The outer peripheral surface 123b of the cover plate 123 includes a first inclined surface 1231, and an acute angle is formed between the first inclined surface 1231 and the back side 123d of the cover plate 123; the wall surface of the positioning groove 1121 includes an adjacent matching surface 1121a and a second inclined surface 1121b, and an acute angle is formed between the matching surface 1121a and the second inclined surface 1121b; the matching surface 1121a and the back side 123d of the cover plate 123 are arranged facing each other at their edges, and the first inclined surface 1231 and the second inclined surface 1121b are arranged facing each other.

[0114] The outer peripheral surface 123b of the cover plate 123 refers to the side surface between the front side 123c and the back side 123d of the cover plate 123. The first inclined surface 1231 of the outer peripheral surface of the cover plate 123 is matched with the second inclined surface 1121b of the positioning groove 1121 of the frame portion 112 of the housing 110, so that the cover plate 123 is obliquely inserted and buckled on the frame portion 112 of the housing 110, so that the cover plate 123 is limited on the housing 110, and the situation that the cover plate 123 is separated from the housing 110 in the impact scenario of the electronic device 100 falling is reduced.

[0115] A second implementation method of assembling the cover plate 123 in the positioning groove 1121 of the housing 110: Fig.11 The outer peripheral surface 123b of the cover plate 123 includes a first vertical surface 1232, and an acute angle or a right angle is formed between the first vertical surface 1232 and the back surface 123d of the cover plate 123; the wall surface of the positioning groove 1121 includes an adjacent matching surface 1121a and a second vertical surface 1121c, and an acute angle or a right angle is formed between the matching surface 1121a and the second vertical surface 1121c; the edges of the matching surface 1121a and the back surface 123d of the cover plate 123 are arranged facing each other, and the first vertical surface 1232 and the second vertical surface 1121c are arranged facing each other.

[0116] The outer peripheral surface 123b of the cover plate 123 refers to the side surface between the front side 123c and the back side 123d of the cover plate 123. The first vertical surface 1232 of the outer peripheral surface of the cover plate 123 and the second vertical surface 1121c of the positioning groove 1121 of the frame portion 112 of the housing 110 are matched to facilitate the assembly of the cover plate 123 at the positioning groove 1121 of the frame portion 112 of the housing 110.

[0117] In order to improve the connection reliability between the display module 120 and the housing 110, in some embodiments, refer to Fig. 9 , Fig.12 A connecting glue 170 is partially or completely provided between the edge of the back side 123d of the cover plate 123 and the shell 110 . The connecting glue 170 is located on the outside of the waterproof glue 130 . The width j of the connecting glue 170 is smaller than the width s of the waterproof glue 130 .

[0118] A connecting glue 170 with a small width j is provided between the edge of the cover plate 123 and the housing 110, so that the display module 120 is reliably connected to the housing 110, and the display module 120 is not easily separated from the housing 110 in the scenario where the electronic device 100 falls and impacts. The connecting glue 170 has no waterproof effect, and a large amount of external water can pass through the connecting glue 170. The outside of the waterproof glue 130 refers to the peripheral area of ​​the waterproof glue 130 on the plane where the display substrate 121 is located. The width j of the connecting glue 170 is the distance between the outer peripheral surface and the inner peripheral surface of the connecting glue 170. The width j of the connecting glue 170 is smaller than the width s of the waterproof glue 130, so that the frame width D2 of the display module 120 except for the bending portion 1212 is relatively small.

[0119] Exemplarily, the frame portion 112 of the shell 110 has a positioning groove 1121 , and a connecting glue 170 is provided between the edge of the back side 123 d of the cover plate 123 and the wall surface of the positioning groove 1121 , so that the cover plate 123 is reliably connected to the frame portion 112 of the shell 110 .

[0120] When the cover plate 123 is provided, the cover plate 123 may be a 2D cover plate, a 2.5D cover plate or a 3D cover plate.

[0121] The 2D cover plate is a purely flat structure without any curved design. When the 2D cover plate is used, a flat display substrate 121 is configured so that the flat display substrate 121 is attached to the bottom surface of the 2D cover plate.

[0122] See also Figure 5 The 2.5D cover plate is a structure with a flat middle and curved edges. When the 2.5D cover plate is used, a flat display substrate 121 is configured so that the flat display substrate 121 is attached to the bottom surface of the 2.5D cover plate.

[0123] See also Figures 13 to 15 The 3D cover plate is a structure with arc design in the middle and at the edges. When the 3D cover plate is used, a flexible display substrate 121 is configured so that the flexible display substrate 121 is attached to the bottom surface of the 3D cover plate.

[0124] exist Fig.13 In the illustrated embodiment, the back side 120a of the display module 120 has a waterproof area 120b, the waterproof glue 130 is arranged at the edge of the waterproof area 120b, the first anti-corrosion glue 141 is arranged on the outer side surface 1212a of the bending portion 1212, and the width f1 of the first anti-corrosion glue 141 is smaller than the width s of the waterproof glue 130.

[0125] exist Fig.14In the illustrated embodiment, the back side 120a of the display module 120 has a waterproof area 120b, the waterproof glue 130 is disposed at the edge of the waterproof area 120b, the first anti-corrosion glue 141 is disposed on the outer side 1212a of the bent portion 1212, and the width f1 of the first anti-corrosion glue 141 is smaller than the width s of the waterproof glue 130. A second anti-corrosion glue 142 is disposed between the inner side 1212b of the bent portion 1212 and one side 122a of the support layer 122. The width f2 of the second anti-corrosion glue 142 is smaller than the width s of the waterproof glue 130.

[0126] exist Fig.15 In the illustrated embodiment, the back side 120a of the display module 120 has a waterproof area 120b, the waterproof glue 130 is arranged at the edge of the waterproof area 120b, the first anti-corrosion glue 141 is arranged at the outer side 1212a of the bent portion 1212, and the width f1 of the first anti-corrosion glue 141 is smaller than the width s of the waterproof glue 130. A connecting glue 170 is partially or completely arranged between the edge of the back side 123d of the cover plate 123 and the housing 110, and the width j of the connecting glue 170 is smaller than the width s of the waterproof glue 130.

[0127] In some embodiments, the display substrate 121 includes a display driver integrated circuit (DDIC) disposed on the binding portion 1213, and the display driver chip is located in the waterproof area 120b. Placing the display driver chip in the waterproof area 120b can effectively block a large amount of external water from entering the waterproof area 120b, so that the display driver chip does not enter water and maintains normal operation.

[0128] In some embodiments, the binding portion 1213 may be electrically connected to a circuit board (such as a flexible circuit board). The circuit board may be provided with devices such as an application processor and a power management chip. The application processor provides display data to the display driver chip and the display unit 1211, and the power management chip provides operating voltage to the display driver chip and the display unit 1211.

[0129] Finally, it should be noted that the above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: Shell, display module, waterproof glue and first anti-corrosion glue; The display module is arranged on the housing, and the display module comprises a display substrate, a support layer and a cover plate; The display substrate comprises a display portion, a bending portion and a binding portion connected in sequence, the display portion and the binding portion are respectively arranged on two opposite sides of the support layer, and the bending portion and a side surface of the support layer are arranged facing each other; The cover plate is arranged on the front side of the display portion, and the cover plate has a first end portion close to the bending portion; The back of the display module has a waterproof area, and the display part and the binding part are both arranged corresponding to the waterproof area; The waterproof glue is arranged at the edge of the waterproof area, and the back of the display module and the housing are connected by the waterproof glue; The first anti-corrosion glue is arranged on the outer side surface of the bending portion, and the width of the first anti-corrosion glue is smaller than the width of the waterproof glue.

2. The electronic device according to claim 1, characterized in that: The first anti-corrosion adhesive is arranged along the extension direction of the bending portion; Alternatively, the first anti-corrosion adhesive is disposed in a region between the shell and a back surface of the first end portion.

3. The electronic device according to claim 1, characterized in that: A polarizing layer is arranged between the cover plate and the display part, and the first anti-corrosion adhesive is also arranged on the side of the polarizing layer close to the bending part.

4. The electronic device according to claim 1, characterized in that: A second anti-corrosion glue is provided between the inner side surface of the bending portion and one side surface of the supporting layer; And / or, a third anti-corrosion glue is provided on the outer peripheral surface of the display substrate except the outer side surface of the bending portion, the third anti-corrosion glue and the first anti-corrosion glue form a ring, the third anti-corrosion glue is located on the outside of the waterproof glue, and the width of the third anti-corrosion glue is smaller than the width of the waterproof glue.

5. The electronic device according to claim 1, characterized in that: The shell has an opening at an end position corresponding to the first anti-corrosion glue, the waterproof glue and the first anti-corrosion glue are connected by overlapping glue, and part of the overlapping glue is filled in the opening.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The support layer includes a soft glue layer and a hard layer stacked together, the back of the display part is connected to the soft glue layer, the binding part is connected to the hard layer, the modulus range of the soft glue layer is 10 kPa to 800 kPa, and the modulus range of the hard layer is 10 GPa to 300 GPa.

7. The electronic device according to claim 6, characterized in that: The soft adhesive layer includes epoxy resin adhesive, polyurethane adhesive, organic silicone adhesive or acrylate adhesive; And / or, the hard layer includes a copper layer, an aluminum layer, a steel layer, a carbon fiber layer or a glass fiber layer; And / or, a buffer layer is provided between the soft glue layer and the hard layer.

8. The electronic device according to any one of claims 1 to 5, characterized in that: The shell includes a support plate and a frame portion connected to the edge of the support plate, the support plate and the frame portion form a receiving groove, the display substrate and the support layer are arranged in the receiving groove, and the edge of the cover plate and the frame portion are correspondingly arranged; the back side of the display module and the support plate are connected by the waterproof glue.

9. The electronic device according to claim 8, characterized in that: One end of the frame portion away from the support plate has a positioning groove, and the back edge of the cover plate is arranged at the positioning groove.

10. The electronic device according to claim 9, characterized in that: The outer peripheral surface of the cover plate includes a first inclined surface, and the first inclined surface and the back surface of the cover plate form an acute angle; the wall surface of the positioning groove includes a matching surface and a second inclined surface arranged adjacent to each other, and the matching surface and the second inclined surface form an acute angle; the matching surface and the back edge of the cover plate are arranged facing each other, and the first inclined surface and the second inclined surface are arranged facing each other; Or, the outer peripheral surface of the cover plate includes a first vertical surface, and the first vertical surface and the back side of the cover plate form an acute angle or a right angle; the wall surface of the positioning groove includes an adjacent mating surface and a second vertical surface, and the mating surface and the second vertical surface form an acute angle or a right angle; the mating surface and the back side edge of the cover plate are arranged facing each other, and the first vertical surface and the second vertical surface are arranged facing each other.

11. The electronic device according to any one of claims 1 to 5, characterized in that: A connecting glue is partially or fully provided between the back edge of the cover plate and the shell, the connecting glue is located outside the waterproof glue, and the width of the connecting glue is smaller than the width of the waterproof glue.

12. The electronic device according to any one of claims 1 to 5, characterized in that: The cover plate is a 2D cover plate, a 2.5D cover plate or a 3D cover plate.

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