Optical fiber communication equipment and optical communication system for head-mounted equipment

Abstract

The utility model provides optical fiber communication equipment and an optical communication system for head-mounted equipment, relates to the field of optical communication, is used for communication between the head-mounted equipment and a host, and comprises a first communication device, a second communication device and an optical fiber, one end of the first communication device is connected with the head-mounted equipment, and one end of the second communication device is connected with the host. The beneficial effects of the utility model lie in that when the optical fiber is used for head-mounted equipment, higher transmission speed and lower delay are achieved through optical fiber communication; besides, the optical fiber is light and thin, the occupied space is saved, only one optical fiber is used, the wavelength division multiplexing technology is adopted for one optical fiber, data from the head-mounted device to the host and data from the host to the head-mounted device are transmitted, and the data in the two directions are distinguished through different wavelengths.

Description

Technical Field

[0001] The utility model relates to the field of optical communication, in particular to optical fiber communication equipment and an optical communication system for head-mounted equipment. Background Art

[0002] Head-mounted VR (virtual reality) glasses are wearable devices that can provide users with an immersive virtual reality experience. Such devices usually include high-resolution displays, stereo headphones, sensors (such as gyroscopes, accelerometers), and possible head tracking technology to ensure that the user's head movements are instantly reflected in the virtual environment, thus creating an immersive feeling.

[0003] There are two main ways to connect head-mounted VR devices to external devices: wireless WiFi connection and wired connection, such as HDMI, DisplayPort (DP), Type-C, etc.

[0004] Each of the above methods has certain drawbacks:

[0005] The communication speed of wireless WiFi is limited and the latency is large. Wired methods such as HDMI, DP and type-C are based on electrical communication connectors and wires, and the communication speed is higher than wireless WiFi. However, the communication rate of wired methods is still very limited and the latency is large. In addition, HDMI and DP require strict electromagnetic shielding and impedance matching in pursuit of high speed, and the connectors are large and bulky, which makes them unsuitable for head-mounted devices, and the transmission distance of wired communication is very limited. Utility Model Content

[0006] The utility model aims to provide an optical fiber communication device and an optical communication system for head-mounted equipment with high transmission rate and convenient long-distance transmission.

[0007] The utility model proposes an optical fiber communication device for a head-mounted device, which is used to connect the head-mounted device and a host, and includes a first communication device, a second communication device and an optical fiber; one end of the first communication device communicates with the head-mounted device, one end of the second communication device is connected to the host, and the other end of the first communication device is connected to the other end of the second communication device through the optical fiber; the first communication device includes an image processing unit, a first electronic component and a first photon component, the head-mounted device is connected to the first electronic component through the image processing unit, and the first electronic component is connected to the optical fiber through the first photon component; the second communication device includes a processor, a second electronic component and a second photon component, the host is connected to the second electronic component through the processor, and the second electronic component is connected to the optical fiber through the second photon component.

[0008] Preferably, the first electronic component and the second electronic component have the same structure, and the first photonic component and the second photonic component have the same structure.

[0009] Preferably, the first photonic component comprises a first electro-optic modulator, a first wavelength division multiplexer and a second photodetector, and the first electro-optic modulator and the second photodetector are respectively connected to the optical fiber through the first wavelength division multiplexer.

[0010] Preferably, the first electronic component includes a first sending unit and a first receiving unit, and both ends of the first sending unit and the first receiving unit are connected to the image processing unit and the first photonic component respectively.

[0011] Preferably, the first sending unit includes a first glue logic unit, a first serial sending unit, a first digital-to-analog converter, a first low-pass filter, a first operational amplifier, and a first phase-locked loop; the image processing unit is connected to the first electro-optical modulator via the first glue logic unit, the first serial sending unit, the first digital-to-analog converter, the first low-pass filter, and the first operational amplifier in sequence; and the two ends of the first phase-locked loop are respectively connected to the first serial sending unit and the first operational amplifier.

[0012] Preferably, the first receiving unit includes a third glue logic unit, a second serial receiving unit, a second analog-to-digital converter, a third low-pass filter, a third operational amplifier, and a third phase-locked loop; the image processing unit is connected to the second photodetector via the third glue logic unit, the second serial receiving unit, the second analog-to-digital converter, the third low-pass filter, and the third operational amplifier in sequence; and the two ends of the third phase-locked loop are respectively connected to the second serial receiving unit and the third operational amplifier.

[0013] Preferably, the second photonic component comprises a second electro-optic modulator, a first photodetector and a second wavelength division multiplexer, and the second electro-optic modulator and the first photodetector are respectively connected to the optical fiber via the second wavelength division multiplexer.

[0014] Preferably, the second electronic component includes a second sending unit and a second receiving unit, and both ends of the second sending unit and the second receiving unit are connected to the processor and the second photonic component respectively.

[0015] Preferably, the second sending unit includes a second glue logic unit, a second serial sending unit, a second digital-to-analog converter, a second low-pass filter, a second operational amplifier and a second phase-locked loop. The processor is connected to the second electro-optical modulator via the second glue logic unit, the second serial sending unit, the second digital-to-analog converter, the second low-pass filter and the second operational amplifier in sequence, and the two ends of the second phase-locked loop are respectively connected to the second serial sending unit and the second operational amplifier.

[0016] Preferably, the second receiving unit includes a fourth glue logic unit, a first serial receiving unit, a first analog-to-digital converter, a fourth low-pass filter, a fourth operational amplifier, and a fourth phase-locked loop. The processor is connected to the first photodetector via the fourth glue logic unit, the first serial receiving unit, the first analog-to-digital converter, the fourth low-pass filter, and the fourth operational amplifier in sequence, and the two ends of the fourth phase-locked loop are respectively connected to the first serial receiving unit and the fourth operational amplifier.

[0017] Preferably, a spot size converter is provided on one side of the receiving end of the first electro-optic modulator and the receiving end of the first wavelength division multiplexer.

[0018] Preferably, the optical fiber is a bendable single-mode optical fiber.

[0019] Preferably, the cladding diameter of the optical fiber may be 60-125 um.

[0020] Preferably, the core diameter of the optical fiber may be 3-10 um.

[0021] Preferably, the first electronic component and the first photonic component are integrated and packaged on a single chip through monolithic integration technology.

[0022] In some embodiments, an optical communication system is also proposed, including: a head-mounted device, a host, and an optical fiber communication device for the head-mounted device as described in the above embodiments, wherein the two ends of the optical fiber communication device for the head-mounted device are respectively connected to the head-mounted device and the host for communication between the head-mounted device and the host.

[0023] The beneficial effects of the utility model are: when used in a head-mounted device, optical fiber communication has a higher transmission speed and lower delay;

[0024] In addition, optical fiber is relatively light and thin, which saves space. Only one optical fiber is used, and wavelength division multiplexing technology is used to transmit data from the headset to the host and from the host to the headset. The data in the two directions are distinguished by different wavelengths.

[0025] The different modules used to process optical data are integrated to facilitate the sending and receiving of light waves respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is the structural diagram of the utility model;

[0027] Figure 2 This is a schematic diagram of the structure of the image processing unit of the utility model sent to the processor;

[0028] Figure 3 This is a schematic diagram of the structure of the processor sending to the image processing unit of the utility model;

[0029] Figure 4 This is a schematic diagram of the structure of the first communication device of the utility model;

[0030] Figure 5 This is a schematic diagram of the structure of the second communication device of the utility model.

[0031] Tag Name

[0032] 1. Head-mounted device; 2. Host; 3. First communication device; 31. Image processing unit; 32. First electronic component; 321. First sending unit; 3211. First glue logic unit; 3212. First serial sending unit; 3213. First digital-to-analog converter; 3214. First low-pass filter; 3215. First operational amplifier; 3216. First phase-locked loop; 322. First receiving unit; 3221. Third glue logic unit; 3222. Second serial receiving unit; 3223. Second analog-to-digital converter; 3224. Third low-pass filter; 3225. Third operational amplifier; 3226. Third phase-locked loop; 33. First photonic component; 331. First electro-optical modulator; 332. First wavelength division multiplexer; 333. First Two photodetectors; 4. Second communication device; 41. Processor; 42. Second electronic component; 421. Second sending unit; 4211. Second glue logic unit; 4212. Second serial sending unit; 4213. Second digital-to-analog converter; 4214. Second low-pass filter; 4215. Second operational amplifier; 4216. Second phase-locked loop; 422. Second receiving unit; 4221. Logic unit; 4222. First serial receiving unit; 4223. First analog-to-digital converter; 4224. Fourth low-pass filter; 4225. Fourth operational amplifier; 4226. Fourth phase-locked loop; 43. Second photonic component; 431. Second electro-optical modulator; 432. Second wavelength division multiplexer; 433. First photodetector; 5. Optical fiber. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0034] Combined with Figure 1-Figure 5 , an optical fiber 5 communication device for a head-mounted device 1, used for communication between the head-mounted device 1 and a host 2, comprising a first communication device 3, a second communication device 4 and an optical fiber 5; one end of the first communication device 3 is connected to the head-mounted device 1, one end of the second communication device 4 is connected to the host 2, and the other end of the first communication device 3 is connected to the other end of the second communication device 4 through the optical fiber 5; the first communication device 3 comprises an image processing unit 31, a first electronic component 32 and a first photonic component 33, the head-mounted device 1 is connected to the first electronic component 32 through the image processing unit 31, and the first electronic component 32 is connected to the optical fiber 5 through the first photonic component 33; the second communication device 4 comprises a processor 41, a second electronic component 42 and a second photonic component 43, the host 2 is connected to the second electronic component 42 through the processor 41, and the second electronic component 42 is connected to the optical fiber 5 through the second photonic component 43.

[0035] Specifically, bidirectional communication between the head mounted device 1 and the host 2 is achieved through the first communication device 3, the optical fiber 5, and the second communication device 4, the first photonic component 33 and the second photonic component 43 are used for processing light, and the first electronic component 32 and the second electronic component 42 are used for processing electrical signals;

[0036] When the head mounted device 1 communicates with the host 2, the electrical signal of the image processing unit 31 is converted into an electrical signal that can be processed by the first electronic component 32, and then the electrical signal is converted into an optical signal that can be transmitted by the optical fiber 5 through the first photon component 33, and then received by the second photon component 43 and converted into an electrical signal, which is processed by the second electronic component 42, and then processed by the processor 41 and sent to the host 2;

[0037] When communicating from the host 2 to the head mounted device 1, the electrical signal is transmitted to the second electronic component 42 through the processor 41, and the electrical signal is converted into an optical signal that can be transmitted by the optical fiber 5 through the second photonic component 43, and then received by the first photonic component 33 and converted into an electrical signal, which is processed by the first electronic component 32, and then processed by the image processing unit 31 and sent to the head mounted device 1;

[0038] In addition, the signal from the head mounted device 1 to the host 2 is different from the signal from the host 2 to the head mounted device 1. Specifically, the signal transmission from the head mounted device 1 to the host 2 can use wavelength 1, and the signal transmission from the host 2 to the head mounted device 1 can use wavelength 2.

[0039] As a further specific embodiment, the first electronic component 32 and the second electronic component 42 have the same structure, and the first photonic component 33 and the second photonic component 43 have the same structure.

[0040] As a further specific embodiment, Figure 2-4 The first photonic component 33 includes a first electro-optical modulator 331 , a first wavelength division multiplexer 332 and a second photodetector 333 , and the first electro-optical modulator 331 and the second photodetector 333 are respectively connected to the optical fiber 5 through the first wavelength division multiplexer 332 .

[0041] Specifically, the first electro-optic modulator 331 , the second photodetector 333 , and the first wavelength division multiplexer 332 are all integrated inside the chip and connected to the first electronic component 32 ;

[0042] The first electro-optical modulator 331 (mod): converts the electrical signal detected by the image processing unit 31 into an optical signal, so that it can be transmitted in the optical fiber 5; in some embodiments, it can be an MZ modulator, a micro-ring modulator, or a Micro-assisted MZ modulator, a Ge-Si absorption modulator;

[0043] The second photodetector 333 (PD): Figure 3 , Figure 4 , the optical signal emitted by the second electro-optical modulator 431 is transmitted through the optical fiber 5, passes through the first wavelength division multiplexer 332, is detected by the second photodetector 333, and the signal is converted into an electrical signal, and then the signal is processed by the first electronic component 32;

[0044] The first wavelength division multiplexer 332, namely the wavelength division (de)multiplexer (DeMUX): its purpose is to transmit bidirectional transmission through one optical fiber 5. In order to avoid using two optical fibers 5 for bidirectional transmission, at the transmitting end, the wavelength division multiplexer's combiner combines multiple optical signals from different light sources, each signal having a different wavelength, into a single light beam, and then transmits it through the same optical fiber 5. This process is like mixing light beams of multiple colors together, but each color (wavelength) of light carries different information. At the receiving end, the wavelength division multiplexer's demultiplexer separates the mixed optical signals according to the different wavelengths, and restores them to the original multiple optical signals, which are then processed by their respective receivers.

[0045] As a further specific embodiment, Figure 2 and 3 The first electronic component 32 includes a first sending unit 321 and a first receiving unit 322, and both ends of the first sending unit 321 and the first receiving unit 322 are connected to the image processing unit 31 and the first photonic component 33 respectively.

[0046] Specifically, the first electronic unit includes a first sending unit 321 and a first receiving unit 322 for processing sent and received electrical signals.

[0047] As a further specific embodiment, Figure 2 The first sending unit 321 includes a first glue logic unit 3211, a first serial sending unit 3212, a first digital-to-analog converter 3213, a first low-pass filter 3214, a first operational amplifier 3215, and a first phase-locked loop 3216. The image processing unit 31 is connected to the first electro-optical modulator 331 through the first glue logic unit 3211, the first serial sending unit 3212, the first digital-to-analog converter 3213, the first low-pass filter 3214, and the first operational amplifier 3215 in sequence. The two ends of the first phase-locked loop 3216 are respectively connected to the first serial sending unit 3212 and the first operational amplifier 3215.

[0048] Specifically, the first glue logic unit 3211 is used to connect to the upper image processing unit 31, the first serial sending unit 3212 is used to send the serial code, and then the digital signal is converted into an analog signal through the first digital-to-analog converter 3213, and then filtered through the first low-pass filter 3214 to filter out high-frequency noise, and then the signal is amplified by the first operational amplifier 3215, and then sent to the first electro-optical modulator 331, and is used to lock the clock phase through the action of the first phase-locked loop 3216.

[0049] As a further specific embodiment, Figure 2 The first receiving unit 322 includes a third glue logic unit 3221, a second serial receiving unit 3222, a second analog-to-digital converter 3223, a third low-pass filter 3224, a third operational amplifier 3225, and a third phase-locked loop 3226. The image processing unit 31 is connected to the second photodetector 333 through the third glue logic unit 3221, the second serial receiving unit 3222, the second analog-to-digital converter 3223, the third low-pass filter 3224, and the third operational amplifier 3225 in sequence. The two ends of the third phase-locked loop 3226 are respectively connected to the second serial receiving unit 3222 and the third operational amplifier 3225.

[0050] Specifically, the analog signal transmitted from the second photodetector 333 is received by the third operational amplifier 3225 for amplification, and then the high-frequency noise is filtered out by the third low-pass filter 3224, and then converted into a digital signal by the second analog-to-digital converter 3223, and after being received by the second serial receiving unit 3222, it is sent to the image processing unit 31 for processing through the third glue logic unit 3221, and is used to lock the clock phase through the action of the third phase-locked loop 3226.

[0051] In some specific embodiments, Figure 2 and Figure 5 The second photonic component 43 includes a second electro-optical modulator 431 , a first photodetector 433 and a second wavelength division multiplexer 432 . The second electro-optical modulator 431 and the first photodetector 433 are connected to the optical fiber 5 through the second wavelength division multiplexer 432 .

[0052] Specifically, the second electro-optic modulator 431, the first photodetector 433, and the second wavelength division multiplexer 432 are all integrated inside the chip and connected to the second electronic component 42;

[0053] The second electro-optical modulator 431 (mod) converts the electrical signal transmitted from the processor 41 into an optical signal so that it can be transmitted in the optical fiber 5; in some embodiments, it can be an MZ modulator, a microring modulator, or a Microring-assisted MZ modulator, or a Ge-Si absorption modulator;

[0054] First photodetector 433 (PD): Figure 3 , Figure 4 , the optical signal emitted by the second electro-optical modulator 431 is transmitted through the optical fiber 5, passes through the first wavelength division multiplexer 332, is detected by the second photodetector 333, and the signal is converted into an electrical signal, which is then connected to the second electronic component 42 for signal processing;

[0055] The second wavelength division multiplexer 432, namely the wavelength division (de)multiplexer (DeMUX): its purpose is to transmit bidirectional transmission through one optical fiber 5. In order to avoid using two optical fibers 5 for bidirectional transmission, at the transmitting end, the wavelength division multiplexer's combiner combines multiple optical signals from different light sources, each signal having a different wavelength, into a single light beam, and then transmits it through the same optical fiber 5. This process is like mixing light beams of multiple colors together, but each color (wavelength) of light carries different information. At the receiving end, the wavelength division multiplexer's demultiplexer separates the mixed optical signals according to the different wavelengths, and restores them to the original multiple optical signals, which are then processed by their respective receivers.

[0056] As a further specific embodiment, Figure 5 The second electronic component 42 includes a second sending unit 421 and a second receiving unit 422, and both ends of the second sending unit 421 and the second receiving unit 422 are connected to the processor 41 and the second photonic component 43 respectively.

[0057] Specifically, the first electronic unit includes a first sending unit 321 and a first receiving unit 322 for processing the sent and received electrical signals. The signal sent by the first sending unit 321 passes through the first photon component 33 and the second photon component 43, and is received by the second electronic component 42;

[0058] The signal sent by the second sending unit passes through the second photonic component and the first photonic component, and is received by the first electronic component.

[0059] As a further specific embodiment, Figure 3 The second sending unit 421 includes a second glue logic unit 4211, a second serial sending unit 4212, a second digital-to-analog converter 4213, a second low-pass filter 4214, a second operational amplifier 4215 and a second phase-locked loop 4216. The processor 41 is connected to the second electro-optical modulator 431 through the second glue logic unit 4211, the second serial sending unit 4212, the second digital-to-analog converter 4213, the second low-pass filter 4214 and the second operational amplifier 4215 in sequence, and the two ends of the second phase-locked loop 4216 are respectively connected to the second serial sending unit 4212 and the second operational amplifier 4215.

[0060] Specifically, the second glue logic unit 4211 is used to connect to the upper-level processor 41, the second serial sending unit 4212 is used to send the serial code, and then the digital signal is converted into an analog signal through the second digital-to-analog converter 4213, and then filtered through the second low-pass filter 4214 to filter out high-frequency noise, and then the signal is amplified by the second operational amplifier 4215, and then sent to the second electro-optical modulator 431, and is used to lock the clock phase through the action of the second phase-locked loop 4216.

[0061] As a further specific embodiment, Figure 2 The second receiving unit 422 includes a fourth glue logic unit 4221, a first serial receiving unit 4222, a first analog-to-digital converter 4223, a fourth low-pass filter 4224, a fourth operational amplifier 4225, and a fourth phase-locked loop 4226. The processor 41 is connected to the first photodetector 433 through the fourth glue logic unit 4221, the first serial receiving unit 4222, the first analog-to-digital converter 4223, the fourth low-pass filter 4224, and the fourth operational amplifier 4225 in sequence. The two ends of the fourth phase-locked loop 4226 are respectively connected to the first serial receiving unit 4222 and the fourth operational amplifier 4225.

[0062] Specifically, the analog signal transmitted from the first photodetector 433 is received by the fourth operational amplifier 4225 for amplification, and then the high-frequency noise is filtered out by the fourth low-pass filter 4224, and then converted into a digital signal by the first analog-to-digital converter 4223, and after being received by the first serial receiving unit 4222, it is sent to the processor 41 for processing through the fourth glue logic unit 4221, and is used to lock the clock phase through the fourth phase-locked loop 4226.

[0063] In some embodiments, a spot size converter (not shown in the figure) is disposed on one side of the receiving end of the first electro-optic modulator 331 and the receiving end of the second wavelength division multiplexer 432 .

[0064] In some embodiments, a spot size converter (not shown in the figure) is provided on one side of the receiving end of the second electro-optic modulator 431 and the receiving end of the first wavelength division multiplexer 332 .

[0065] Specifically, the integration of a spot size converter (SSC) on the chip aims to solve the problem of light coupling efficiency in micro-nano optoelectronic integrated devices, especially the efficient coupling between the chip and the external optical fiber 5. This technology changes the propagation mode of light at the interface of different media and reduces the light loss caused by mode mismatch, thereby improving the performance and efficiency of the entire photonic integrated circuit (PIC).

[0066] In some embodiments, the optical fiber 5 is a flexible single-mode optical fiber 5 with a small core diameter, which can support higher data transmission rates and longer transmission distances. Since light propagates in a single mode, mode dispersion is reduced, so that the signal distortion of the single-mode optical fiber 5 is extremely small, and it can support a transmission distance of up to hundreds of kilometers, which is very suitable for long-distance communication networks and has strong anti-interference ability: single-mode optical fiber 5 has almost no inter-mode dispersion and low sensitivity to external interference, which is suitable for application environments requiring high stability and bandwidth. Single-mode optical fiber 5 supports a larger bandwidth and can meet the needs of high-speed data transmission, such as rates of 10Gbps, 40Gbps or even above 100Gbps. Light source requirements: single-mode optical fiber 5 uses a CW laser as a light source. Compared with the vertical surface cavity array laser (VCSEL) light source used in multi-mode optical fiber, which has large dispersion, large crosstalk, and large loss, which will limit the transmission distance, the single-mode optical fiber 5 has better monochromaticity and can better match the narrow core diameter of the single-mode optical fiber 5 to ensure signal purity and transmission quality.

[0067] In some embodiments, the cladding diameter of the optical fiber is 60-125um, and in some embodiments it can be 80um or 125um.

[0068] In some embodiments, the core diameter of the optical fiber is 3-10 um, and in some embodiments it can be 9 um or 6.5 um.

[0069] In some embodiments, the first electronic component 32 and the first photonic component 33 are integrated on a single chip by using monolithic packaging technology.

[0070] In some embodiments, the second electronic component 42 and the second photonic component 43 are integrated on a single chip by using monolithic packaging technology.

[0071] Specifically, the volume, weight and power consumption of the system are greatly reduced, and the stability and reliability of the system are improved, so that the second photodetector 333 used in the first photonic component 32 and the first photodetector 433 used in the second photonic component 42 do not require an electrostatic protector (ESD), thereby overcoming the problem that the photonic chip and the electronic chip are easily damaged by electrostatics when they are two chips packaged in the traditional solution.

[0072] In some embodiments, an optical communication system is also proposed, including: a head-mounted device 1, a host 2, and an optical fiber 5 communication device for the head-mounted device 1 as described in the above embodiment, wherein the two ends of the optical fiber 5 communication device for the head-mounted device 1 are respectively connected to the head-mounted device 1 and the host 2 for communication between the head-mounted device 1 and the host 2.

[0073] Through the description of the above implementation methods, technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above functional modules is used as an example. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0074] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. An optical fiber communication device for a head-mounted device, used for communication between a head-mounted device (1) and a host (2), characterized in that: It comprises a first communication device (3), a second communication device (4) and an optical fiber (5), wherein the optical fiber (5) is a single-mode optical fiber; One end of the first communication device (3) is connected to the head mounted device (1), one end of the second communication device (4) is connected to the host (2), and the other end of the first communication device (3) is connected to the other end of the second communication device (4) via an optical fiber (5); The first communication device (3) comprises an image processing unit (31), a first electronic component (32) and a first photonic component (33); the head mounted device (1) is connected to the first electronic component (32) via the image processing unit (31); and the first electronic component (32) is connected to the optical fiber (5) via the first photonic component (33); The second communication device (4) comprises a processor (41), a second electronic component (42) and a second photonic component (43); the host (2) is connected to the second electronic component (42) via the processor (41); and the second electronic component (42) is connected to the optical fiber (5) via the second photonic component (43).

2. The device according to claim 1, characterized in that The first photonic component (33) comprises a first electro-optical modulator (331), a first wavelength division multiplexer (332) and a second photodetector (333); the first electro-optical modulator (331) and the second photodetector (333) are respectively connected to the optical fiber (5) via the first wavelength division multiplexer (332).

3. The device according to claim 1, characterized in that The first electronic component (32) comprises a first sending unit (321) and a first receiving unit (322), and both ends of the first sending unit (321) and the first receiving unit (322) are respectively connected to the image processing unit (31) and the first photonic component (33).

4. The device according to claim 3, characterized in that The first sending unit (321) includes a first glue logic unit (3211), a first serial sending unit (3212), a first digital-to-analog converter (3213), a first low-pass filter (3214), a first operational amplifier (3215), and a first phase-locked loop (3216); the image processing unit (31) is connected to the first electro-optical modulator (331) in sequence through the first glue logic unit (3211), the first serial sending unit (3212), the first digital-to-analog converter (3213), the first low-pass filter (3214), and the first operational amplifier (3215); and the two ends of the first phase-locked loop (3216) are respectively connected to the first serial sending unit (3212) and the first operational amplifier (3215).

5. The device according to claim 3, characterized in that The first receiving unit (322) includes a third glue logic unit (3221), a second serial receiving unit (3222), a second analog-to-digital converter (3223), a third low-pass filter (3224), a third operational amplifier (3225), and a third phase-locked loop (3226); the image processing unit (31) is connected to the second photodetector (333) in sequence through the third glue logic unit (3221), the second serial receiving unit (3222), the second analog-to-digital converter (3223), the third low-pass filter (3224), and the third operational amplifier (3225); and the two ends of the third phase-locked loop (3226) are respectively connected to the second serial receiving unit (3222) and the third operational amplifier (3225).

6. The device according to claim 1, characterized in that The second photonic component (43) comprises a second electro-optical modulator (431), a first photodetector (433) and a second wavelength division multiplexer (432); the second electro-optical modulator (431) and the first photodetector (433) are respectively connected to the optical fiber (5) via the second wavelength division multiplexer (432).

7. The device according to claim 1, characterized in that The second electronic component (42) comprises a second sending unit (421) and a second receiving unit (422), and both ends of the second sending unit (421) and the second receiving unit (422) are connected to the processor (41) and the second photonic component (43) respectively.

8. The device according to claim 7, characterized in that The second sending unit (421) includes a second glue logic unit (4211), a second serial sending unit (4212), a second digital-to-analog converter (4213), a second low-pass filter (4214), a second operational amplifier (4215) and a second phase-locked loop (4216); the processor (41) is connected to the second electro-optical modulator (431) in sequence through the second glue logic unit (4211), the second serial sending unit (4212), the second digital-to-analog converter (4213), the second low-pass filter (4214) and the second operational amplifier (4215); and the two ends of the second phase-locked loop (4216) are respectively connected to the second serial sending unit (4212) and the second operational amplifier (4215).

9. The device according to claim 7, characterized in that The second receiving unit (422) includes a fourth glue logic unit (4221), a first serial receiving unit (4222), a first analog-to-digital converter (4223), a fourth low-pass filter (4224), a fourth operational amplifier (4225), and a fourth phase-locked loop (4226); the processor (41) is connected to the first photodetector (433) in sequence through the fourth glue logic unit (4221), the first serial receiving unit (4222), the first analog-to-digital converter (4223), the fourth low-pass filter (4224), and the fourth operational amplifier (4225); and the two ends of the fourth phase-locked loop (4226) are respectively connected to the first serial receiving unit (4222) and the fourth operational amplifier (4225).

10. The device according to claim 2, characterized in that A light spot size converter is provided on one side of the receiving end of the first electro-optic modulator (331) and the receiving end of the first wavelength division multiplexer (332).

11. The device according to claim 1, characterized in that The cladding diameter of the optical fiber (5) is 80 um.

12. The device according to claim 1, characterized in that The first electronic component (32) and the first photonic component (33) are integrated and packaged on a single chip through monolithic integration technology.

13. An optical communication system, characterized in that: include: A head mounted device (1), a host (2) and an optical fiber communication device for a head mounted device as claimed in any one of claims 1 to 12, wherein both ends of the optical fiber communication device for a head mounted device are respectively connected to the head mounted device (1) and the host (2) for communication between the head mounted device (1) and the host (2).

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