Stacked HDI circuit board

Abstract

The utility model relates to the related technical field of HD I circuit boards, in particular to a stack type HD I circuit board, which comprises a circuit board and a circuit board spot welding end, a mounting mechanism is mounted on the periphery of the circuit board, a fixing mechanism penetrates through the middle of the mounting mechanism, the circuit board spot welding end is fixedly connected to the middle of the circuit board, and the circuit board spot welding end is fixedly connected to the circuit board. According to the HD I circuit board, four corners of the HD I circuit board are installed on equipment used by the HD I circuit board through the fixing blocks and the inserting blocks, laser drilling and micro-hole drilling can be carried out on a high-density board on the HD I circuit board, peripheral positioning installation can be carried out, and the HD I circuit board can be installed on the equipment used by the HD I circuit board through the fixing blocks and the inserting blocks. The fixing block and the inserting block are suitable for coating other types of materials, the HD I circuit board is too small in size, the fixing block and the inserting block replace a glue mode for installation, the HD I circuit board is prevented from being disassembled and replaced through the fixing block and the inserting block, and the glue is prevented from being disassembled and damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of HDI circuit boards, in particular to a stacked HDI circuit board. Background Art

[0002] The feature sizes of HDI circuit board through holes and traces are smaller, resulting in higher wiring density and fewer layers. Micro-via patterns can be used more effectively, which will open more wiring channels and may lead to fewer layers. This is a practical way to design multiple large BGAs with a pitch less than 0.8mm, providing lower costs for high-density boards. Proper stack definition can improve signal and power integrity.

[0003] The laser drilling and micro-holes on the existing HDI circuit boards are high-density boards, which are not suitable for lamination with other types of materials. The HDI circuit boards are too small to be installed with glue, and the glue is difficult to remove later, so the HDI circuit boards can only be used once. Utility Model Content

[0004] The purpose of the utility model is to provide a stacked HDI circuit board to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: the stacked HDI circuit board comprises a circuit board and a spot welding end of the circuit board, a mounting mechanism is installed around the circuit board, and a fixing mechanism runs through the middle of the mounting mechanism, the spot welding end of the circuit board is fixedly connected to the middle of the circuit board, a membrane merging groove is opened at the bottom end of the circuit board, and a mounting panel is installed at the bottom end of the membrane merging groove.

[0006] Preferably, the circuit board and the mounting mechanism are movably connected, and the mounting mechanism and the fixing mechanism are threadedly connected.

[0007] Preferably, the circuit board is clamped on the mounting panel through a membrane merging groove.

[0008] Preferably, the mounting mechanism comprises a fixed block, an inserting block and a groove, the inserting block is fixed at the mounting portion of the fixed block, and the groove is provided at the movable portion of the inserting block.

[0009] Preferably, the fixing block and the inserting block are mounted around the circuit board by means of groove snap-fitting.

[0010] Preferably, the fixing mechanism comprises a sleeve plate, a deformable sleeve and a panel positioning sleeve, the deformable sleeve is movably mounted on the bottom end of the sleeve plate, and the panel positioning sleeve is arranged on the bottom end of the deformable sleeve.

[0011] Preferably, the circuit board and the mounting panel are mounted on the deformable sleeve and the panel positioning sleeve.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model provides a fixing block and an inserting block. The four corners of the HDI circuit board are installed on the device through the fixing block and the inserting block. The high-density board on the HDI circuit board can be laser-drilled and micro-holes can be positioned and installed all around, so that the fixing block and the inserting block are suitable for laminating other types of materials. The HDI circuit board is too small to be installed by the fixing block and the inserting block instead of glue, so that the HDI circuit board can be disassembled and replaced through the fixing block and the inserting block, and the damage caused by disassembly of the glue can be avoided.

[0014] 2. The utility model provides a deformable sleeve and a panel positioning sleeve, which can be fixed by glue or thread penetration, which is beneficial for the fixed block and the plug-in block to be fixed separately. The circuit board is installed on the fixed block and the plug-in block through the installation panel. When the deformable sleeve and the panel positioning sleeve can be fixed by glue or thread penetration, the glue is prevented from being directly fixed on the HDI circuit board. The HDI circuit board can also be installed by thread penetration through the deformable sleeve and the panel positioning sleeve, which is convenient for the disassembly and replacement of the HDI circuit board. The HDI circuit board can be installed in two ways according to the needs of the equipment, and the HDI circuit board can be reinforced twice for use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the front view structure of the utility model;

[0016] Figure 2 It is a structural schematic diagram of the installation mechanism of the utility model;

[0017] Figure 3 It is a structural schematic diagram of the fixing mechanism of the utility model.

[0018] In the figure: 1. Circuit board; 2. Installation mechanism; 3. Fixing mechanism; 4. Spot welding end of circuit board; 5. Membrane merging groove; 6. Installation panel; 7. Fixing block; 8. Insert block; 9. Groove; 10. Sleeve plate; 11. Deformable sleeve; 12. Panel positioning sleeve. DETAILED DESCRIPTION

[0019] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Embodiment 1

[0021] See also Figure 1-Figure 3 The utility model provides a technical solution, including a circuit board 1 and a circuit board spot welding end 4, a mounting mechanism 2 is installed around the circuit board 1, and a fixing mechanism 3 is passed through the middle of the mounting mechanism 2, the circuit board spot welding end 4 is fixedly connected to the middle of the circuit board 1, a membrane merging groove 5 is opened at the bottom of the circuit board 1, and a mounting panel 6 is installed at the bottom of the membrane merging groove 5, the circuit board 1 is installed on the use equipment by means of a thread through the mounting mechanism 2 and the fixing mechanism 3 assembly, the circuit board spot welding end 4 on the circuit board 1 can be installed separately, and the membrane merging groove 5 is opened at the bottom of the circuit board 1, so that the mounting panel 6 is installed around the circuit board 1 through the membrane merging groove 5, which is convenient for HD I circuit board distinguishes other materials and is separated, the circuit board 1 and the installation mechanism 2 are movably connected, and the installation mechanism 2 and the fixing mechanism 3 are threadedly connected, the installation mechanism 2 components are movably installed around the circuit board 1, and are used for the circuit board 1 to be fixedly installed separately, so that the fixing mechanism 3 components are threadedly penetrated inside the installation mechanism 2 for fixed installation, the circuit board 1 is clamped on the installation panel 6 through the membrane merging groove 5, and the installation panel 6 is installed around the circuit board 1 through the membrane merging groove 5, which is convenient for the HDI circuit board to distinguish other materials and be separated, so that the installation mechanism 2 and the fixing mechanism 3 components are penetrated around the installation panel 6 for fastening installation, which can replace the glue fixing method.

[0022] Embodiment 2

[0023] like Figure 2 and Figure 3As shown, the mounting mechanism 2 includes a fixed block 7, an insert block 8 and a groove 9. The mounting position of the fixed block 7 is fixed with the insert block 8, and the movable position of the insert block 8 is provided with a groove 9. The fixed block 7 and the insert block 8 are installed around the circuit board 1 through the groove 9. The groove 9 is provided around the circuit board 1. The fixed block 7 is inserted into the groove 9 through the insert block 8. The fixed block 7 and the insert block 8 are connected and installed around the circuit board 1. The circuit board 1 can be installed and positioned separately around the four corners. The four corners of the HDI circuit board are installed on its use equipment through the fixed block 7 and the insert block 8. The high-density board on the HDI circuit board can be laser drilled and micro-holes can be positioned around the four corners, which is convenient for the fixed block 7 and the insert block 8 to be applied to other types of materials for lamination. The HDI circuit board is too small to be replaced by the fixed block 7 and the insert block 8. The installation is carried out by glue. The fixing mechanism 3 includes a sleeve 10, a deformable sleeve 11 and a panel positioning sleeve 12. The bottom end of the sleeve 10 is movably installed with the deformable sleeve 11, and the bottom end of the deformable sleeve 11 is provided with a panel positioning sleeve 12. The circuit board 1 and the installation panel 6 are sleeved on the deformable sleeve 11 and the panel positioning sleeve 12. The deformable sleeve 11 and the panel positioning sleeve 12 can be directly sleeved on the fixing block 7 and the plug block 8. The deformable sleeve 11 and the panel positioning sleeve 12 can be fixed by glue or thread penetration, which is conducive to the separate fixation of the fixing block 7 and the plug block 8. The circuit board 1 is installed on the fixing block 7 and the plug block 8 through the installation panel 6. When the deformable sleeve 11 and the panel positioning sleeve 12 can be fixed by glue or thread penetration, the glue is avoided from being directly fixed on the HDI circuit board. The HDI circuit board can also be installed by thread penetration through the deformable sleeve 11 and the panel positioning sleeve 12, which is convenient for the disassembly and replacement of the HDI circuit board. The HDI circuit board can be installed in two ways according to the needs of the equipment, and the HDI circuit board can be reinforced twice for use.

[0024] In actual use, the installation panel 6 is installed around the circuit board 1 through the film merging groove 5, which is convenient for the HDI circuit board to distinguish other materials and separate them, so that the installation mechanism 2 and the fixing mechanism 3 components are passed through the installation panel 6 around the periphery for fastening and installation, which can replace the glue fixing method. The groove 9 is opened around the circuit board 1, and the fixing block 7 is inserted into the groove 9 through the plug block 8. The fixing block 7 and the plug block 8 are connected and installed around the circuit board 1, and the circuit board 1 can be installed and positioned separately around the four corners. The HDI circuit board is installed on its use equipment through the fixing block 7 and the plug block 8, and the HDI line The high-density board on the circuit board is laser drilled with holes and micro-holes for positioning and installation all around, which makes it convenient for the fixing block 7 and the plug-in block 8 to be coated with other types of materials. The deformable sleeve 11 and the panel positioning sleeve 12 can be directly mounted on the fixing block 7 and the plug-in block 8. The deformable sleeve 11 and the panel positioning sleeve 12 can be fixed by glue or threaded penetration, which is conducive to the separate fixation of the fixing block 7 and the plug-in block 8. The circuit board 1 is installed on the fixing block 7 and the plug-in block 8 through the installation panel 6. When the deformable sleeve 11 and the panel positioning sleeve 12 can be fixed by glue or threaded penetration, the glue is avoided from being directly fixed on the HD I circuit board.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A stacked HDI circuit board, characterized in that: The stacked HDI circuit board comprises a circuit board (1) and a circuit board spot welding end (4); a mounting mechanism (2) is mounted around the circuit board (1); a fixing mechanism (3) runs through the middle of the mounting mechanism (2); the circuit board spot welding end (4) is fixedly connected to the middle of the circuit board (1); a membrane merging groove (5) is provided at the bottom end of the circuit board (1); and a mounting panel (6) is mounted at the bottom end of the membrane merging groove (5).

2. A stacked HDI circuit board according to claim 1, characterized in that: The circuit board (1) and the mounting mechanism (2) are movably connected, and the mounting mechanism (2) and the fixing mechanism (3) are threadedly connected.

3. A stacked HDI circuit board according to claim 1, characterized in that: The circuit board (1) is clamped on the installation panel (6) via a membrane merging groove (5).

4. A stacked HDI circuit board according to claim 1, characterized in that: The mounting mechanism (2) comprises a fixed block (7), an insert block (8) and a groove (9); the insert block (8) is fixed at the mounting position on the fixed block (7), and the groove (9) is provided at the movable position on the insert block (8).

5. A stacked HDI circuit board according to claim 4, characterized in that: The fixing block (7) and the inserting block (8) are mounted around the circuit board (1) by means of a groove (9) for engagement.

6. A stacked HDI circuit board according to claim 1, characterized in that: The fixing mechanism (3) comprises a sleeve plate (10), a deformable sleeve (11) and a panel positioning sleeve (12); the deformable sleeve (11) is movably mounted at the bottom end of the sleeve plate (10); and the panel positioning sleeve (12) is arranged at the bottom end of the deformable sleeve (11).

7. A stacked HDI circuit board according to claim 6, characterized in that: The circuit board (1) and the installation panel (6) are sleeved on the deformable sleeve (11) and the panel positioning sleeve (12).

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