Device mounting structure of flexible circuit board

By dividing the flexible components into multiple parts and performing softening treatment, the problem that soft circuit boards in the prior art can only be bent at one time is solved, multiple folding and storage are realized, and the equipment assembly process is simplified.

CN222621281UActive Publication Date: 2025-03-14TRULY SEMICON
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Patent Information

Application Number
CN202421180809.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-27
Publication Date
2025-03-14
Estimated Expiration
2034-05-27

AI Technical Summary

Technical Problem

In the prior art, the flexible circuit board of the display module can only be bent once due to its long length, making it difficult to fit into the application equipment.

Method used

By dividing the flexible assembly into three parts, a first FPC board, a second FPC board and a third FPC board are formed, and the connecting portion between the two FPC boards is softened, so that it can be bent multiple times.

Benefits of technology

It realizes multiple reasonable folding and storage of soft circuit boards, reduces storage space, and more conveniently installs into application equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a device mounting structure of a flexible circuit board. The device installation structure of the flexible circuit board comprises a display module and a flexible assembly, the flexible assembly comprises a first FPC board, a second FPC board and a third FPC board, the first FPC board is arranged on the display module, the second FPC board is arranged on the first FPC board, the third FPC board is arranged on the second FPC board, the first FPC board is provided with a first element placement area, the second FPC board is provided with a second element placement area, and the first element placement area is provided with a first element placement area. The third FPC board is provided with a third element placing area. The first element placing area, the second element placing area and the third element placing area are parallel to one another in pairs. According to the scheme provided by the invention, the flexible circuit board can be reasonably folded and stored, so that the flexible circuit board can be more conveniently mounted in applied equipment.
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Description

Technical Field

[0001] The utility model relates to the technical field of display screens, in particular to a device mounting structure of a flexible circuit board. Background Art

[0002] At present, as the applied equipment becomes more and more sophisticated, the spatial structure and assembly requirements of display modules are becoming more stringent.

[0003] In the related art, the flexible circuit board of the display screen module usually integrates multiple components and has a relatively long overall length, which results in the flexible circuit board being able to be bent only once, making it difficult to install the display screen module into the applied equipment. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a device installation structure for a flexible circuit board, which can reasonably fold and store the flexible circuit board, so as to be more convenient to install in the applied equipment.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] In a first aspect, the present application provides a device mounting structure for a flexible circuit board, comprising: a display module; a flexible component, comprising a first FPC board, a second FPC board and a third FPC board, wherein the first FPC board is arranged on the display module, the second FPC board is arranged on the first FPC board, and the third FPC board is arranged on the second FPC board, a first component placement area is provided on the first FPC board, a second component placement area is provided on the second FPC board, and a third component placement area is provided on the third FPC board, and the first component placement area, the second component placement area and the third component placement area are parallel to each other.

[0007] The flexible component further includes a first bending portion, and the first bending portion is disposed on the first FPC board.

[0008] The flexible component further includes a second bending portion, and the second bending portion is disposed on the second FPC board.

[0009] The flexible component further includes a third bending portion, and the third bending portion is disposed on the third FPC board.

[0010] The first bending portion and the second bending portion are parallel to each other.

[0011] It also includes a backlight FPC board, which is arranged on the first FPC board.

[0012] It also includes a binding position, which is arranged on the display module, and the first FPC board is connected to the binding position.

[0013] It also includes a backlight circuit, which is arranged in the first component placement area.

[0014] It also includes a boost circuit, which is arranged in the second component placement area.

[0015] It also includes a connector, which is arranged in the third component placement area.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The present application divides the entire flexible component into three parts, forming a first FPC board, a second FPC board and a third FPC board, and the connecting portion between the two FPC boards is softened so that multiple bending can be performed. After bending, the first component placement area, the second component placement area and the third component placement area can be stacked in the application device, thereby reducing the storage space. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 It is a structural schematic diagram of a device installation structure of a flexible circuit board in one embodiment of the utility model;

[0020] Figure 2 It is a structural schematic diagram of another implementation of the device mounting structure of the flexible circuit board in one embodiment of the utility model;

[0021] Figure 3 It is a structural schematic diagram of another implementation of the component mounting structure of the flexible circuit board in one embodiment of the utility model. DETAILED DESCRIPTION

[0022] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0023] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0024] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] The flexible circuit board of the display module usually integrates multiple components and has a relatively long overall length, which means that the flexible circuit board can only be bent once, making it difficult to install the display module into the applied equipment.

[0026] In view of the above problems, an embodiment of the present application provides a device mounting structure for a flexible circuit board, which can reasonably fold and store the flexible circuit board, thereby making it more convenient to install it into the applied equipment.

[0027] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0028] See also Figure 1 A device mounting structure of a flexible circuit board includes: a display module 100 and a flexible component 200, the flexible component 200 includes a first FPC board 210, a second FPC board 220 and a third FPC board 230, the first FPC board 210 is arranged on the display module 100, the second FPC board 220 is arranged on the first FPC board 210, the third FPC board 230 is arranged on the second FPC board 220, a first component placement area is opened on the first FPC board 210, a second component placement area is opened on the second FPC board 220, a third component placement area is opened on the third FPC board 230, and the first component placement area, the second component placement area and the third component placement area are parallel to each other.

[0029] Specifically, it also includes a backlight circuit 300, which is disposed in the first component placement area.

[0030] Specifically, it also includes a boost circuit 400, which is arranged in the second component placement area.

[0031] Specifically, it also includes a connector 500, which is arranged in the third component placement area.

[0032] It should be noted that the first FPC board 210, the second FPC board 220 and the third FPC board 230 are all flexible circuit boards, and the connecting parts between them are softened to facilitate folding. Furthermore, the first component placement area is used to place the backlight circuit 300, the second component placement area is used to place the boost circuit 400, and the third component area is used to place the connector 500. In this way, the present application divides and arranges the devices with different functions, and then there is space to achieve multiple folding, thereby reducing the storage space and more conveniently assembling in the application equipment.

[0033] See also Figure 1 In one embodiment, the flexible component 200 further includes a first bending portion 240, and the first bending portion 240 is disposed on the first FPC board 210. Specifically, the flexible component 200 further includes a second bending portion 250, and the second bending portion 250 is disposed on the second FPC board 220. Specifically, the flexible component 200 further includes a third bending portion 260, and the third bending portion 260 is disposed on the third FPC board 230. Specifically, the first bending portion 240 and the second bending portion 250 are parallel to each other.

[0034] It should be noted that the first bending portion 240 is the bending area of ​​the first FPC board 210, the second bending portion 250 is the bending area of ​​the second FPC board 220, and the third bending portion 260 is the bending area of ​​the third FPC board 230. The first bending portion 240, the second bending portion 250 and the third bending portion 260 are parallel to each other to ensure that they do not occupy more space after bending.

[0035] See also Figure 1 In one embodiment, the device mounting structure of the flexible circuit board further includes a backlight FPC board 600 , and the backlight FPC board 600 is disposed on the first FPC board 210 .

[0036] It should be noted that the backlight FPC board 600 is welded on the first FPC board 210 .

[0037] See also Figure 1 In one embodiment, the device mounting structure of the flexible circuit board further includes a binding position 700 , the binding position 700 is disposed on the display module 100 , and the first FPC board 210 is connected to the binding position 700 .

[0038] It should be noted that the binding position 700 is used to bind with the first FPC board 210 .

[0039] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application can be adjusted in order, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0040] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A device mounting structure for a flexible circuit board, characterized in that: include: Display module; A flexible component includes a first FPC board, a second FPC board and a third FPC board, wherein the first FPC board is arranged on the display module, the second FPC board is arranged on the first FPC board, and the third FPC board is arranged on the second FPC board. A first component placement area is provided on the first FPC board, a second component placement area is provided on the second FPC board, and a third component placement area is provided on the third FPC board. The first component placement area, the second component placement area and the third component placement area are parallel to each other.

2. The device mounting structure of the flexible circuit board according to claim 1, characterized in that: The flexible component further includes a first bending portion, and the first bending portion is disposed on the first FPC board.

3. The device mounting structure of the flexible circuit board according to claim 2, characterized in that: The flexible component further includes a second bending portion, and the second bending portion is disposed on the second FPC board.

4. The device mounting structure of the flexible circuit board according to claim 3, characterized in that: The flexible component further includes a third bending portion, and the third bending portion is disposed on the third FPC board.

5. The device mounting structure of the flexible circuit board according to claim 4, characterized in that: The first bending portion and the second bending portion are parallel to each other.

6. The device mounting structure of the flexible circuit board according to claim 1, characterized in that: It also includes a backlight FPC board, which is arranged on the first FPC board.

7. The device mounting structure of the flexible circuit board according to claim 1, characterized in that: It also includes a binding position, which is arranged on the display module, and the first FPC board is connected to the binding position.

8. The device mounting structure of the flexible circuit board according to claim 1, characterized in that: It also includes a backlight circuit, which is arranged in the first component placement area.

9. The device mounting structure of the flexible circuit board according to claim 1, characterized in that: It also includes a boost circuit, which is arranged in the second component placement area.

10. The device mounting structure of the flexible circuit board according to claim 1, characterized in that: It also includes a connector, which is arranged in the third component placement area.