Liquid cooling cabinet and liquid cooling system

Abstract

The utility model belongs to the technical field of data processing center equipment, and particularly relates to a liquid cooling cabinet. The utility model also relates to a liquid cooling system comprising the liquid cooling cabinet. The liquid cooling cabinet comprises an immersion box body and a heat dissipation assembly connected to the outer side wall of the immersion box body, an inner cavity partition plate is arranged in the immersion box body, and the inner cavity partition plate divides the immersion box body into an immersion part used for arranging a server and a heat dissipation part arranged on the outer side of the immersion part. The heat dissipation part is formed by surrounding the outer surface of the inner cavity partition plate and the inner surface of the immersion box body, and the immersion part is a space which is separated by the inner cavity partition plate, located in the center of the immersion box body and used for arranging a server; and the bottoms and the tops of the immersion part and the heat dissipation part are communicated with each other. Due to the existence of the inner cavity partition plate, the heat dissipation part and the immersion part are separated, and pump-free circulation is carried out through spontaneous movement of the heat conduction liquid at different temperatures due to density changes.

Description

Technical Field

[0001] The utility model belongs to the technical field of data processing center equipment, and specifically relates to a liquid cooling cabinet. The utility model also relates to a liquid cooling system including the liquid cooling cabinet. Background Art

[0002] Data processing centers are facilities used to centrally process, store, manage and protect data. These centers are responsible for collecting and integrating large amounts of data from different sources, processing and computing them efficiently to support the business needs of enterprises or organizations. They are also regarded as the "brains" of information technology, supporting the operation of various applications and helping enterprises and organizations achieve data-driven decision-making. Servers are the core components of data processing centers and are used to store and retrieve data. In the existing technology, multiple servers are usually connected to form a server cluster to provide high availability and scalability to meet the growing data needs.

[0003] Overheating of the server will cause the server to shut down or run slowly. In large data centers, in order to save space and improve efficiency, server equipment is often stacked closely, and server hardware generates a lot of heat during operation. In the prior art, multiple servers are usually installed in a standardized cabinet at the same time, and then the entire cabinet is provided with sufficient cooling, ventilation and humidity control to keep the server in the required working state.

[0004] Data center cooling technologies include air cooling, water cooling, natural cooling, and liquid cooling, among which liquid cooling technology uses liquid as a heat conduction medium to exchange heat through direct or indirect contact between the coolant and the server's heat-generating components, thereby achieving effective heat transfer and providing heat dissipation for the server. The prior art already has an immersion liquid cooling system, which refers to a technology that immerses the entire device in a non-conductive insulating liquid for cooling, including a liquid cooling cabinet and a server disposed in the liquid cooling cabinet. Compared with traditional air cooling, immersion liquid cooling technology has the advantages of high heat dissipation efficiency, low noise, and convenience for dense layout, and has been widely used in high-density computing data centers.

[0005] In the prior art, the immersion servers are directly stacked in the liquid cooling cabinet. The fluid in the cabinet is connected to the circulation pump, heat exchanger, refrigeration pipeline, and refrigeration equipment through pipelines. The circulation pump acts on the fluid to make the fluid circulate passively in the pipeline to transport heat and maintain the overall low temperature in the liquid cooling cabinet. However, this liquid cooling cabinet involves many pipelines and equipment, and the cost is relatively high. It relies on the circulation pump to transport the fluid without flow channel design, and turbulence is prone to occur inside the cabinet, resulting in energy waste. Utility Model Content

[0006] In order to solve the above technical problems, it is necessary to provide a liquid cooling cabinet designed with flow channels to enable the heat transfer medium to circulate in an orderly manner.

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0008] A liquid cooling cabinet comprises an immersion box, a heat dissipation component connected to the outer wall of the immersion box, an inner cavity partition is arranged inside the immersion box, the inner cavity partition divides the immersion box into an immersion part for arranging a server and a heat dissipation part arranged outside the immersion part, the heat dissipation part is formed by surrounding the outer surface of the inner cavity partition and the inner surface of the immersion box, the immersion part is a space separated by the inner cavity partition and located in the core of the immersion box for arranging the server; the bottom and top of the immersion part and the heat dissipation part are connected.

[0009] When the liquid cooling cabinet provided by the utility model is in use, the server is arranged in the immersion part, and the immersion box is filled with heat-conducting liquid. After the heating element in the server is heated, the heat is transferred to the heat-conducting liquid. The heated heat-conducting liquid floats up and enters the heat-dissipating part from the top where the immersion part and the heat-dissipating part are connected. Since the heat-dissipating part is formed by the outer surface of the inner cavity partition and the inner surface of the immersion box, the heat in the heat-conducting liquid in the heat-dissipating part will be taken away by the heat-dissipating component arranged on the outer wall of the immersion box. After the heat-conducting liquid contacts the side wall of the immersion box and is cooled by the heat-dissipating component, the temperature drops and the density increases. The heat-conducting liquid with a lower temperature sinks to the bottom of the heat-dissipating part and enters the immersion part from the bottom where the immersion part and the heat-dissipating part are connected. Due to the existence of the inner cavity partition, the heat-dissipating part and the immersion part are separated, and the heat-dissipating part is circulated without a pump by the spontaneous movement of the heat-conducting liquid due to the density change at different temperatures, so that the heat transfer medium circulates in an orderly manner inside the immersion box.

[0010] Preferably, the inner cavity partition is arranged on the bottom surface of the immersion box, the top of the inner cavity partition is in a free state, a through hole is opened at the bottom of the inner cavity partition, and the bottom of the immersion part and the heat dissipation part are connected through the through hole arranged at the bottom of the inner cavity partition. In this structure, the inner cavity partition can be a straight plate, the top of the immersion part and the heat dissipation part are connected at the top of the inner cavity partition in a free state, and the bottom of the immersion part and the heat dissipation part are connected through the through hole arranged at the bottom of the inner cavity partition.

[0011] Preferably, the heat dissipation assembly includes an air duct sealing plate connected to the immersion box, heat dissipation fins arranged on the outer side wall of the immersion box, and a fan for pumping air from the heat dissipation fins to the outside of the air duct sealing plate. The air duct sealing plate is connected to the immersion box to form an air duct, and the fan pumps air from the heat dissipation fins to the outside of the air duct sealing plate through the air duct, and the fan, the heat dissipation fins and the air duct cooperate to cool down.

[0012] Preferably, the air duct sealing plate includes a front cover plate facing the heat dissipation fins and a left plate and a right plate clamping the immersion box in the middle, the upper end surface and the lower end surface of the front cover plate are in contact with the free ends of the heat dissipation fins, and the top and bottom surfaces of the immersion box are not covered by the air duct sealing plate. In this structure, the air duct sealing plate is assembled with the immersion box to form an air duct; the top and bottom surfaces of the immersion box are not covered with the air duct sealing plate, and can directly exchange heat with the outside world, which is beneficial to the heat dissipation of the immersion box as a whole.

[0013] A liquid cooling system includes a server and the liquid cooling cabinet as described above; the server is arranged in the immersion part, and the bottom and top surfaces of the server are provided with through holes for heat transfer liquid to pass through, and the height of the bottom surface of the server is higher than the setting height of the through holes. Since it includes the liquid cooling cabinet as described above, the liquid cooling system has all the beneficial effects brought by the liquid cooling cabinet, which will not be described one by one here.

[0014] Preferably, the heat dissipation component also includes a liquid-cooled radiator, which includes a heat exchanger arranged between the fan and the heat dissipation fins, a liquid-cooled plate attached to the high-power chip inside the server for heat exchange, the heat exchanger and the liquid-cooled plate are both provided with flow channels and are connected through pipelines, and a circulation pump is provided on the pipeline to circulate the liquid between the liquid-cooled plate and the heat exchanger. In the case of relatively large power consumption, it is necessary to locally strengthen the heat dissipation capacity of the high-power chip inside the server. On the basis of the overall immersion liquid cooling of the server, this structure adds a liquid-cooled plate on the high-power chip, and the liquid is circulated inside the liquid-cooled plate and the heat exchanger through the circulation pump, and the heat is transported from the high-power chip to the heat exchanger, and then the heat is sent to the outside through the fan, thereby enhancing the heat dissipation capacity of the high-power chip. The heat exchanger and the heat dissipation fins share the fan to improve the overall operating efficiency. Furthermore, since a closed circulation system is formed between the liquid cooling plate and the heat exchanger, the heat transfer medium inside the liquid cooling cabinet does not interfere with each other, and the heat transfer medium inside the liquid cooling plate does not come into direct contact with electronic components, a heat transfer medium with higher heat transfer efficiency, such as water, can be used.

[0015] Preferably, a total of several groups of servers are provided, each server is provided with a liquid inlet connected to the internal liquid cooling plate of the server on the outer wall on one side of the immersion box, and a liquid outlet connected to the internal liquid cooling plate of the server is provided on the outer wall on the other side of the immersion box. The liquid inlets of all servers are connected in parallel with the heat exchanger through a first branch pipe, and the liquid outlets of all servers are connected in parallel with the heat exchanger through a second branch pipe.

[0016] Preferably, all the liquid inlets are arranged at the upper part of the immersion box and at the same level, and all the liquid outlets are arranged at the upper part of the immersion box and at the same level. In this structure, the liquid inlet and the liquid outlet are arranged at the upper part of the immersion box, which is convenient for connection above the liquid level of the immersion box; the liquid inlet / liquid outlet are arranged at the same level to adopt a branch pipe with a simple structure and avoid the influence of liquid level difference.

[0017] Preferably, each server is provided with a plurality of liquid cooling plates inside, and the plurality of liquid cooling plates are connected in series via pipelines.

[0018] Preferably, the heat exchanger is arranged above the circulation pump. The circulation pump and the heat exchanger are arranged up and down to save space in a reasonable layout, and the heat exchanger is arranged higher to cool and settle the heat transfer liquid in the immersion box. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other purposes, features and advantages of the present invention will become more apparent through a more specific description of the preferred embodiments of the present invention shown in the accompanying drawings. The same reference numerals in all the accompanying drawings indicate the same parts, and the drawings are not intentionally scaled to the actual size, but the focus is on illustrating the subject matter of the present invention.

[0020] Figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of a liquid cooling system (the air duct sealing plate is not shown);

[0021] Figure 2 A top view of a preferred embodiment of a liquid cooling system;

[0022] Figure 3 A front view of a preferred embodiment of a liquid cooling system;

[0023] Figure 4 for Figure 3 Cross-sectional view of the AA section;

[0024] Figure 5 for Figure 3 Cross-sectional view of the middle BB section;

[0025] Figure 6 A schematic diagram of the internal structure of a single server connected to one side of a cold plate;

[0026] Figure 7 Schematic diagram of the structure of the inner cavity partition.

[0027] In the figure: immersion box 1, heat dissipation component 2, heat dissipation fins 21, air duct sealing plate 22, fan 23, heat exchanger 24, liquid cooling plate 25, circulation pump 26, first branch pipe 27, second branch pipe 28, inner cavity partition 3, through hole 31, server 4. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0029] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element and integrated therewith, or there may be an intermediate element at the same time. The terms "installed", "one end", "the other end" and similar expressions used herein are only for the purpose of illustrating the present invention.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used in the specification herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0031] refer to Figure 1-7 A liquid cooling cabinet comprises an immersion box 1, a heat dissipation assembly 2 connected to the outer wall of the immersion box 1, an inner cavity partition 3 is arranged inside the immersion box 1, the inner cavity partition 3 divides the immersion box 1 into an immersion part for arranging a server 4 and a heat dissipation part arranged outside the immersion part, the heat dissipation part is formed by the outer surface of the inner cavity partition 3 and the inner surface of the immersion box 1, the immersion part is a space separated by the inner cavity partition 3 and located in the center of the immersion box 1 for arranging the server 4; the bottom and top of the immersion part and the heat dissipation part are connected.

[0032] When the liquid cooling cabinet provided by the utility model is in use, the server 4 is arranged in the immersion part, and the immersion box 1 is filled with heat-conducting liquid. After the heating element in the server 4 is heated, the heat is transferred to the heat-conducting liquid. The heated heat-conducting liquid floats up and enters the heat-dissipating part from the top where the immersion part and the heat-dissipating part are connected. Since the heat-dissipating part is formed by the outer surface of the inner cavity partition 3 and the inner surface of the immersion box 1, the heat in the heat-conducting liquid in the heat-dissipating part will be taken away by the heat-dissipating component 2 arranged on the outer wall of the immersion box 1. After the heat-conducting liquid contacts the side wall of the immersion box 1 and is cooled by the heat-dissipating component 2, the temperature drops and the density increases. The heat-conducting liquid with a lower temperature sinks to the bottom of the heat-dissipating part and enters the immersion part from the bottom where the immersion part and the heat-dissipating part are connected. Due to the presence of the inner cavity partition 3, the heat-dissipating part and the immersion part are separated, and the heat-dissipating part is circulated without a pump by the spontaneous movement of the heat-conducting liquid due to the density change at different temperatures, so that the heat transfer medium circulates in an orderly manner inside the immersion box, thereby improving the operation efficiency. The heat dissipation assembly 2 in the preferred embodiment includes an air duct sealing plate 22 which is combined with the immersion box 1 to form an air duct, a heat dissipation fin 21 and a dry cooler arranged on the immersion box 1, and the dry cooler is composed of a fan 23 and a heat exchanger 24. In other embodiments, the heat dissipation assembly 2 may also include any other type of radiator that can take away heat from the surface of the immersion box 1. The inner cavity partition 3 in the preferred embodiment is made of a heat insulating material. The inner cavity partition 3 in the preferred embodiment is a straight plate that surrounds the U-shaped plate and is arranged on the bottom surface of the immersion box 1. A hole is punched in the lower part of the plate body so that the bottom of the immersion part and the heat dissipation part are connected. In other embodiments, the inner cavity partition 3 may also be connected to the side wall or top surface of the immersion box 1, and the shape may also be a corner plate or a curved plate, etc., which can separate the immersion part and the heat dissipation part.

[0033] refer to Figure 5 In a preferred embodiment, the inner cavity partition 3 is arranged on the bottom surface of the immersion box 1, the top of the inner cavity partition 3 is in a free state, a through hole 31 is opened at the bottom of the inner cavity partition 3, and the bottom of the immersion part and the heat dissipation part are connected through the through hole 31 arranged at the bottom of the inner cavity partition 3. In this structure, the inner cavity partition 3 can be a straight plate, the top of the immersion part and the heat dissipation part are connected at the top of the inner cavity partition 3 in a free state, and the bottom of the immersion part and the heat dissipation part are connected through the through hole 31 arranged at the bottom of the inner cavity partition 3.

[0034] refer to Figure 1 , Figure 2 and Figure 5In a preferred embodiment, the heat dissipation assembly 2 includes an air duct sealing plate 22 connected to the immersion box 1, a heat dissipation fin 21 arranged on the outer wall of the immersion box 1, and a fan 23 for pumping air from the heat dissipation fin 21 to the outside of the air duct sealing plate 22. The air duct sealing plate 22 is connected to the immersion box 1 to form an air duct, and the fan 23 pumps air from the heat dissipation fin 21 to the outside of the air duct sealing plate 22 through the air duct, and cools the air through the cooperation of the fan 23, the heat dissipation fin 21 and the air duct. The air duct sealing plate 22 in the preferred embodiment surrounds the three side walls of the immersion box 1, and can also be set in other positions and shapes in other embodiments, as long as it can assist the fan 23 in pumping air out of the heat dissipation fin 21.

[0035] refer to Figure 2 and Figure 4 In a preferred embodiment, the air duct sealing plate 22 includes a front cover plate facing the heat dissipation fins 21 and a left plate and a right plate clamping the immersion box 1 in the middle, the upper end surface and the lower end surface of the front cover plate abut against the free ends of the heat dissipation fins 21, and the top and bottom surfaces of the immersion box 1 are not covered by the air duct sealing plate 22. In this structure, the air duct sealing plate 22 is assembled with the immersion box 1 to form an air duct; the top and bottom surfaces of the immersion box 1 and the two ends of the heat dissipation fins 21 are not covered with the air duct sealing plate 22, and can directly exchange heat with the outside world, which is beneficial to the heat dissipation of the immersion box 1 as a whole.

[0036] A liquid cooling system includes a server 4 and the liquid cooling cabinet as described above; the server 4 is arranged in the immersion part, and the bottom and top surfaces of the server 4 are provided with through holes for the passage of heat-conducting liquid, and the height of the bottom surface of the server 4 is higher than the setting height of the through hole 31. Since it includes the above-mentioned liquid cooling cabinet, the liquid cooling system has all the beneficial effects brought by the liquid cooling cabinet, which will not be described one by one here. In a preferred embodiment, a supporting mesh plate is provided on the inner cavity partition 3 above the through hole 31, and the server 4 is placed on the supporting mesh plate. In other embodiments, the casing of the server 4 can also be connected to the plate body of the inner cavity partition 3.

[0037] refer to Figure 1 , Figure 5 and Figure 6In a preferred embodiment, the heat dissipation assembly 2 further includes a liquid cooling radiator, which includes a heat exchanger 24 disposed between the fan 23 and the heat dissipation fins 21, and a liquid cooling plate 25 attached to the high-power chip inside the server 4 for heat exchange. The heat exchanger 24 and the liquid cooling plate 25 are both provided with flow channels and are connected through a pipeline. A circulating pump 26 is provided on the pipeline to allow liquid to circulate between the liquid cooling plate 25 and the heat exchanger 24. In the case of relatively large power consumption, it is necessary to locally enhance the heat dissipation capacity of the high-power chip inside the server 4. On the basis of the overall immersion liquid cooling heat dissipation of the server 4, the structure adds a liquid cooling plate 25 on the high-power chip, and the circulating pump 26 allows the liquid to circulate inside the liquid cooling plate 25 and the heat exchanger 24, and the heat is transported from the high-power chip to the heat exchanger 24, and then the heat is sent to the outside through the fan 23, thereby enhancing the heat dissipation capacity of the high-power chip. The heat exchanger 24 and the heat dissipation fins 21 share the fan 23 to improve the overall operation efficiency. And because the liquid cooling plate 25 and the heat exchanger 24 form a closed circulation system, they do not interfere with the heat transfer medium inside the liquid cooling cabinet, and the heat transfer medium inside the liquid cooling plate 25 does not come into direct contact with the electronic components, so a heat transfer medium with higher heat transfer efficiency, such as water, can be used. In the preferred embodiment, the immersion box 1 adopts a passive heat dissipation method, which reduces the required pipes and equipment compared to the general immersion liquid cooling system in the prior art, and improves the simplicity and reliability of the system; compared with the general air cooling system in the prior art, the cooling capacity is stronger and more targeted, and can be applied to scenes with higher external ambient temperatures, with lower requirements for external infrastructure, and can better adapt to harsh environments. In the preferred embodiment, the heat transfer medium inside the liquid cooling plate 25 and the heat exchanger 25 is water, and the heat transfer medium inside the immersion box is a fluorinated liquid. In other embodiments, any other combination can also be adopted, which has a wide range of applicable scenarios and a variety of options.

[0038] refer to Figure 1In a preferred embodiment, a total of several groups of servers 4 are provided. Each server 4 is provided with a corresponding liquid inlet on the outer wall of one side of the immersion box 1, which is connected to the liquid cooling plate 25 inside the server 4. A corresponding liquid outlet is provided on the outer wall of the other side of the immersion box 1, which is connected to the liquid cooling plate 25 inside the server 4. The liquid inlets of all servers 4 are connected in parallel with the heat exchanger 24 through the first branch pipe 27, and the liquid outlets of all servers 4 are connected in parallel with the heat exchanger 24 through the second branch pipe 28. In the preferred embodiment, the first branch pipe 27 and the second branch pipe 28 are in a square shape as a whole, connected with the pipeline directly, and hidden in the side plate space of the air duct sealing plate 22. The liquid inlet and the liquid outlet in the preferred embodiment are arranged at the upper part of the immersion box 1, and can also be arranged at other positions in other embodiments. The first branch pipe 27 and the second branch pipe 28 in the preferred embodiment match the shapes of the immersion box 1 and the air duct sealing plate 22, with high space utilization and neat and orderly layout.

[0039] refer to Figure 1 In a preferred embodiment, all the liquid inlets are arranged at the upper part of the immersion box 1 and are located at the same horizontal height, and all the liquid outlets are arranged at the upper part of the immersion box 1 and are located at the same horizontal height. In this structure, the liquid inlet and the liquid outlet are arranged at the upper part of the immersion box 1, which is convenient for connection above the liquid level of the immersion box 1; the liquid inlet / liquid outlet are arranged at the same horizontal height to adopt a branch pipe with a simple structure and avoid the influence of the liquid level difference. The liquid outlet position in the preferred embodiment is higher than the top of the inner cavity partition 3, and the pipeline extends from the server 4 and then passes through the immersion box 1 from the side.

[0040] refer to Figure 6 In a preferred embodiment, each server 4 is provided with a plurality of liquid cooling plates 25, which are connected in series through pipelines. In a preferred embodiment, a liquid inlet pipe and a liquid outlet pipe are respectively provided on both sides of the liquid cooling plate 25, and are quickly connected with the pipeline.

[0041] refer to Figure 1 In a preferred embodiment, the heat exchanger 24 is arranged above the circulating pump 26. The circulating pump 26 and the heat exchanger 24 are arranged up and down to save space in a reasonable layout. The heat exchanger 24 is arranged higher to cool and settle the heat transfer liquid in the immersion box 1.

[0042] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] In the description of this specification, the description with reference to the terms "preferred embodiment", "further embodiment", "other embodiments" or "specific example" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0044] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A liquid cooling cabinet, characterized in that: The invention comprises an immersion box (1), a heat dissipation assembly (2) connected to the outer wall of the immersion box (1), an inner cavity partition (3) being arranged inside the immersion box (1), the inner cavity partition (3) dividing the immersion box (1) into an immersion part for arranging a server (4) and a heat dissipation part arranged outside the immersion part, the heat dissipation part being formed by surrounding the outer surface of the inner cavity partition (3) and the inner surface of the immersion box (1), the immersion part being a space separated by the inner cavity partition (3) and located at the core of the immersion box (1) for arranging the server (4); the bottom and the top of the immersion part and the heat dissipation part are connected.

2. The liquid cooling cabinet according to claim 1, characterized in that: The inner cavity partition (3) is arranged on the bottom surface of the immersion box (1), the top end of the inner cavity partition (3) is in a free state, a through hole (31) is opened at the bottom of the inner cavity partition (3), and the bottoms of the immersion part and the heat dissipation part are connected through the through hole (31) arranged at the bottom of the inner cavity partition (3).

3. A liquid cooling cabinet according to claim 2, characterized in that: The heat dissipation assembly (2) comprises an air duct sealing plate (22) connected to the immersion box (1), heat dissipation fins (21) arranged on the outer wall of the immersion box (1), and a fan (23) for pumping air from the heat dissipation fins (21) to the outside of the air duct sealing plate (22).

4. The liquid cooling cabinet according to claim 3, characterized in that: The air duct sealing plate (22) comprises a front cover plate facing the heat dissipation fins (21) and a left plate and a right plate clamping the immersion box (1) in the middle, the upper end surface and the lower end surface of the front cover plate abut against the free ends of the heat dissipation fins (21), and the top surface and the bottom surface of the immersion box (1) are not covered by the air duct sealing plate (22).

5. A liquid cooling system, comprising a server (4), characterized in that: It also includes a liquid cooling cabinet as described in any one of claims 2 to 4; the server (4) is arranged in the immersion part, and the bottom and top surfaces of the server (4) are provided with through holes for heat-conducting liquid to pass through, and the height of the bottom surface of the server (4) is higher than the setting height of the through hole (31).

6. A liquid cooling system, comprising a server (4), characterized in that: It also includes a liquid cooling cabinet as claimed in claim 3 or 4, wherein the server (4) is arranged in the immersion part, and the bottom surface and the top surface of the server (4) are provided with through holes for heat-conducting liquid to pass through, and the height of the bottom surface of the server (4) is higher than the setting height of the through hole (31); the heat dissipation component (2) also includes a liquid cooling radiator, the liquid cooling radiator includes a heat exchanger (24) arranged between the fan (23) and the heat dissipation fins (21), and a liquid cooling plate (25) attached to the high-power chip inside the server (4) for heat exchange, the heat exchanger (24) and the liquid cooling plate (25) are both provided with flow channels inside and are connected through pipelines, and a circulating pump (26) is provided on the pipeline to circulate the liquid between the liquid cooling plate (25) and the heat exchanger (24).

7. A liquid cooling system according to claim 6, characterized in that: A total of several groups of servers (4) are provided. Each server (4) is provided with a liquid inlet connected to the internal liquid cooling plate (25) of the server (4) on the outer wall of one side of the immersion box (1), and a liquid outlet connected to the internal liquid cooling plate (25) of the server (4) is provided on the outer wall of the other side of the immersion box (1). The liquid inlets of all servers (4) are connected in parallel through a first branch pipe (27) and are connected to the heat exchanger (24). The liquid outlets of all servers (4) are connected in parallel through a second branch pipe (28) and are connected to the heat exchanger (24).

8. A liquid cooling system according to claim 7, characterized in that: All the liquid inlets are arranged at the upper part of the immersion box (1) and are located at the same horizontal height, and all the liquid outlets are arranged at the upper part of the immersion box (1) and are located at the same horizontal height.

9. A liquid cooling system according to any one of claims 6 to 8, characterized in that: Each server (4) is provided with a plurality of liquid cooling plates (25) inside, and the plurality of liquid cooling plates (25) are connected in series in sequence through pipelines.

10. A liquid cooling system according to any one of claims 6 to 8, characterized in that: The heat exchanger (24) is arranged above the circulation pump (26).

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