TOF module cover plate capable of avoiding glue overflow

Abstract

The TOF module cover plate capable of avoiding glue overflow at least comprises a cover plate body, the cover plate body comprises a top wall and a side wall, the top wall and the side wall define a mounting cavity with an open bottom, the top wall is provided with a through slotted hole, and one side, close to the mounting cavity, of the top wall is provided with a plurality of glue grooves formed by sinking inwards at intervals in the edge direction of the slotted hole. A plurality of glue overflowing grooves formed by inwards sinking one side, close to the mounting cavity, of the top wall are formed between any glue groove and the groove hole at intervals, and a first retaining wall is formed between each glue overflowing groove and the corresponding glue groove. The glue box has the advantages that the structure is simple, the glue containing capacity is improved in a limited space, and glue overflowing caused by siphonage is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, and in particular to a TOF module cover plate for preventing glue overflow. Background Art

[0002] The single-chip TOF package structure is a highly integrated micro-optical system that cleverly integrates multiple key components to achieve accurate time-of-flight measurements. At its core is a solid substrate that provides a stable foundation for the entire structure. On this substrate, a light receiving chip is precisely mounted, which is the "heart" of the entire system and is responsible for receiving and processing the reflected light signal. In order to ensure efficient signal transmission, the bonding wires are carefully arranged. They are like a neural network, closely connecting the light receiving chip with the rest of the system to ensure that the reflected light signal can be transmitted to the chip without loss. Above the chip, a layer of filter is covered, which filters out unwanted light and ensures that only reflected light of a specific wavelength can reach the light receiving chip, thereby improving the accuracy of the measurement. Finally, a solid cover is placed above the entire structure, which not only protects the internal structure from external interference, but also has a light hole designed. The position of this light hole has been carefully calculated to ensure that it can accurately receive the light reflected from the object. When the reflected light passes through the light hole, it will first be filtered by the filter, and then transmitted cleanly and clearly to the light receiving chip, thus completing the entire ranging process.

[0003] The cover plate and filter of the traditional single-chip TOF packaging structure are usually bonded together with glue. This connection method requires that the amount of glue must be precise enough to ensure the normal operation and good optical performance of the filter. The anti-overflow glue ability of the retaining wall on the cover plate is a key feature that determines whether it can effectively prevent glue from overflowing and protect the light-passing area from contamination. In theory, the wider the retaining wall, the stronger its blocking effect on glue, so the anti-overflow glue ability is positively correlated with the width of the retaining wall. However, in the actual design and manufacturing process, the surface area of ​​the cover plate is relatively limited due to volume limitations.

[0004] In order to ensure a firm bond between the cover plate and the filter, an appropriate amount of glue needs to be applied between the two. The glue is usually applied in the glue groove, and the size of the glue groove directly affects the contact area between the filter and the glue. In order to increase this contact area and thus improve the bonding strength, designers tend to increase the size of the glue groove. However, a direct consequence of this is that the width of the retaining wall will be reduced accordingly.

[0005] When the retaining wall is not wide enough, problems arise. Especially during the application or curing of glue, the glue may produce a siphon phenomenon due to the effect of surface tension. Under this phenomenon, the glue will flow along the junction of the retaining wall and the cover plate as if attracted, or even cross the retaining wall. Once the glue crosses the retaining wall, it will directly contact the light-transmitting area, causing pollution. This pollution will not only affect the appearance quality of the product, but may also have a negative impact on the optical performance of the product, such as reducing light transmittance and increasing scattering. Summary of the invention

[0006] The technical problem to be solved by the utility model is to provide a TOF module cover plate which has a simple structure, increases the amount of glue contained in a limited space, and avoids glue overflow due to the siphon phenomenon.

[0007] In order to solve the above technical problems, the utility model provides a technical solution, a TOF module cover plate for avoiding glue overflow, at least comprising a cover plate body, the cover plate body comprising a top wall and a side wall, the top wall and the side wall together forming an installation cavity with an open bottom, the top wall being provided with a through slot, a plurality of glue grooves formed by inward depressions are arranged at intervals along the edge direction of the slot on one side of the top wall close to the installation cavity, a plurality of overflow glue grooves formed by inward depressions of the top wall close to the installation cavity are arranged at intervals between any of the glue grooves and the slot, and a first retaining wall is formed between the overflow glue grooves and the glue grooves.

[0008] In a preferred embodiment, the glue overflow groove extends along an edge of the glue groove close to the slot hole, and the length of the glue overflow groove is greater than the length of the edge of the glue groove close to the slot hole.

[0009] In a preferred embodiment, the top wall is recessed inwardly at a position corresponding to the slot hole on one side of the installation cavity to form a groove, the slot hole is located in the groove, and a second retaining wall is formed between the groove and the glue overflow groove.

[0010] In a preferred embodiment, the glue grooves are symmetrically arranged on both sides of the slot hole, and the cross-section of the glue grooves is gradually tapered along the recessed direction.

[0011] In a preferred embodiment, the length of the glue overflow groove is greater than the edge length of the groove close to the glue overflow groove.

[0012] In a preferred embodiment, the cross section of the groove is tapered along the recessed direction.

[0013] In a preferred embodiment, the depression depth of the glue overflow groove is greater than or equal to the depression depth of the glue groove.

[0014] Compared with the prior art, the TOF module cover plate of the utility model which avoids glue overflow has the following beneficial effects:

[0015] (1) The utility model cleverly adds a glue overflow groove between the slot and the glue groove. This innovative design makes full use of the limited internal space and increases the storage capacity of the glue. Through this improvement, we have successfully avoided the problem of glue overflow caused by insufficient width of the retaining wall and the siphon effect, thereby eliminating the risk of contamination of the cover slot. At the same time, the design completely solves the problem of colloid contamination of the filter in the hole in terms of process, significantly improves the production yield, and thus achieves a reduction in production costs. It is worth mentioning that although this cover design has made breakthroughs in function and performance, its manufacturing cost, production difficulty and cycle are basically the same as those of traditional covers, without the need for additional cost or complexity.

[0016] (2) The overflow glue groove extends along the edge of the glue groove close to the slot hole and the length of the overflow glue groove is greater than the length of the edge of the glue groove close to the slot hole. Since the length of the overflow glue groove exceeds the edge of the glue groove close to the slot hole, it can provide more storage space when applying glue. During the glue application process, even if there is too much glue, it can be effectively contained in the overflow glue groove instead of directly overflowing to other parts of the cover. It helps to prevent glue from overflowing to areas that do not want to be covered by glue, such as light holes or other functional areas of the cover due to excessive application or dynamic effects during the application process (such as vibration, uneven application speed, etc.). BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of an embodiment of a TOF module cover plate for preventing glue overflow according to the utility model;

[0018] Figure 2 This is a schematic diagram of packaging step S1 of an embodiment of a TOF module cover plate for preventing glue overflow according to the utility model;

[0019] Figure 3 A schematic diagram of packaging step S2 of an embodiment of a TOF module cover plate for preventing glue overflow according to the utility model;

[0020] Figure 4 A schematic diagram of packaging step S3 of an embodiment of a TOF module cover plate for preventing glue overflow according to the utility model;

[0021] Figure 5 A schematic diagram of packaging step S4 of an embodiment of a TOF module cover plate for preventing glue overflow according to the utility model;

[0022] Figure 6 A schematic diagram of packaging step S5 of an embodiment of a TOF module cover plate for preventing glue overflow according to the utility model.

[0023] Description of reference numerals:

[0024] 1-cover body; 11-top wall; 111-slot hole; 112-glue groove; 113-glue overflow groove; 114-first retaining wall; 115-groove; 116-second retaining wall; 12-side wall; 13-installation cavity;

[0025] 2- Glue;

[0026] 3-Filter;

[0027] 4-Substrate;

[0028] 5- Bonding wire;

[0029] 6- Optical receiving chip. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0031] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, an integral connection, or a detachable connection; it can be the internal connection of two components; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] A TOF module cover plate for preventing glue overflow in this embodiment is as follows: Figure 1As shown, it includes a cover body 1, and the cover body includes a top wall 11 and a side wall 12. The top wall and the side wall together form an installation cavity 13 with an open bottom. The top wall is provided with a through slot 111, and the slot is used to receive light reflected from an object. A plurality of glue grooves 112 formed by inward depressions are arranged at intervals along the edge direction of the slot on one side of the top wall close to the installation cavity. The glue grooves are used to place glue for bonding the filter to the cover body. In this embodiment, the number of glue grooves 112 is 2 and they are symmetrically arranged on both sides of the slot 111. The symmetrically arranged glue grooves can provide more balanced and stable structural support, help reduce deformation or stress concentration caused by uneven force, and enhance the overall structural stability of the cover. The glue grooves are symmetrically distributed on both sides of the slot. When applying glue, the glue can be applied more evenly on both sides of the slot, ensuring the consistency and uniformity of the bonding surface and improving the bonding quality. The cross section of the glue groove is tapered along the concave direction, which can effectively prevent the glue from overflowing the glue groove due to excessive amount or flow during the application process, thereby reducing the risk of glue contaminating other areas of the cover plate.

[0034] A plurality of overflow glue grooves 113 formed by the top wall being recessed inwardly near the side of the installation cavity are arranged at intervals between any glue groove 112 and the slot hole 111, and a first retaining wall 114 is formed between the overflow glue groove and the glue groove. This helps to more accurately control the flow direction and range of the glue when applying the glue. The first retaining wall 114 can play a certain blocking and guiding role, so that the glue stays more accurately in the predetermined application area. In this embodiment, a number of overflow glue grooves 113 is arranged between any glue groove and the slot hole. Since the overflow glue groove can capture excess glue, it effectively reduces the risk of glue directly contacting and contaminating the slot hole. Moreover, the design of the overflow glue groove helps to prevent the glue from overflowing to the area that is not desired to be covered by the glue due to excessive application or dynamic effects (such as vibration, uneven application speed, etc.) during the application process. The overflow glue groove extends along the edge of the glue groove 112 near the slot hole, and the length of the overflow glue groove is greater than the length of the edge of the glue groove near the slot hole. Since the length of the overflow glue groove exceeds the edge of the glue groove near the slot hole, it can provide more storage space when applying glue. This means that during the glue application process, even if there is excess glue, it can be effectively contained in the overflow groove instead of overflowing directly onto other parts of the cover.

[0035] Furthermore, the depth of the depression of the overflow glue groove 113 is greater than or equal to the depth of the depression of the glue groove. The deeper depression of the overflow glue groove 113 means that it can accommodate more glue.

[0036] The top wall is concave inward at a position corresponding to the slot hole on one side of the installation cavity to form a groove 115, the slot hole is located in the groove, and a second retaining wall 116 is formed between the groove and the overflowing glue groove. The groove 115 ensures the air permeability in the installation cavity after the cover plate and the filter are adhered. The second retaining wall 116 serves as a second line of defense to prevent the glue from overflowing and contaminating the slot hole, and can play a certain blocking and guiding role, so that the glue stays more accurately in the predetermined application area.

[0037] Furthermore, the cross section of the groove 115 is set to be gradually reduced along the concave direction. This structure helps to enhance the overall stability and deformation resistance of the cover. When subjected to external force or stress, the gradually reduced groove can better disperse and transfer stress and reduce the risk of stress concentration. The length of the overflow groove 113 is greater than the edge length of the groove 115 close to the overflow groove.

[0038] The TOF module cover packaging process of this embodiment:

[0039] Step S1, prepare for dispensing, such as Figure 2 As shown, the TOF module cover is turned upside down to prepare for glue dispensing in the glue groove 112. The inverted cover body can ensure that the glue can be accurately dripped into the predetermined glue groove 112 without flowing to other parts of the cover body. This operation also facilitates the subsequent filter mounting work;

[0040] Step S2, add glue, such as Figure 3 As shown, a proper amount of glue 2 is dotted into the glue groove 112 by a die bonding machine. The amount of glue needs to be precisely controlled to ensure that the filter can be firmly fixed without overflowing due to excessive amount.

[0041] Step S3, attaching the filter, such as Figure 4 As shown, the filter 3 is mounted on the cover body 1, and the glue at the bottom is squeezed and overflows to the surroundings. Part of the glue flows over the first retaining wall 114 and flows into the overflow glue groove 113. The overflow glue groove accommodates excess glue to prevent the light-transmitting area from being contaminated, thereby ensuring the optical performance of the module.

[0042] Step S4, fixing the substrate and the cover plate, such as Figure 5 As shown, glue 2 is applied around the substrate 4 loaded with bonding wires 5 and light receiving chips 6 to fix the substrate and the cover body 1 .

[0043] Step S5, complete the packaging, such as Figure 6 As shown, the cover body 1 is turned over and mounted on the substrate 4 to complete the packaging.

[0044] In short, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A TOF module cover plate for preventing glue overflow, comprising at least a cover plate body (1), characterized in that: The cover plate body comprises a top wall (11) and a side wall (12), wherein the top wall and the side wall together form a mounting cavity (13) with an open bottom, the top wall is provided with a through slot hole (111), a plurality of glue grooves (112) formed by inward depression are arranged at intervals along the edge direction of the slot hole on a side of the top wall close to the mounting cavity, a plurality of overflow glue grooves (113) formed by inward depression of a side of the top wall close to the mounting cavity are arranged at intervals between any of the glue grooves and the slot hole, and a first retaining wall (114) is formed between the overflow glue groove and the glue groove.

2. A TOF module cover plate for preventing glue overflow according to claim 1, characterized in that: The glue overflow groove (113) extends along the edge of the glue groove (112) close to the slot hole, and the length of the glue overflow groove is greater than the length of the edge of the glue groove close to the slot hole.

3. A TOF module cover plate for preventing glue overflow according to claim 1 or 2, characterized in that: The top wall is recessed inwardly at a position corresponding to the slotted hole and close to one side of the installation cavity to form a groove (115), the slotted hole is located in the groove (115), and a second retaining wall (116) is formed between the groove and the glue overflow groove.

4. A TOF module cover plate for preventing glue overflow according to claim 3, characterized in that: The glue grooves (112) are symmetrically arranged on both sides of the slot hole, and the cross section of the glue grooves is gradually reduced along the concave direction.

5. A TOF module cover plate for preventing glue overflow according to claim 4, characterized in that: The length of the glue overflow groove (113) is greater than the length of the edge of the groove (115) close to the glue overflow groove.

6. A TOF module cover plate for preventing glue overflow according to claim 4 or 5, characterized in that: The cross section of the groove (115) is arranged to be gradually reduced along the recessed direction.

7. A TOF module cover plate for preventing glue overflow according to claim 6, characterized in that: The recessed depth of the glue overflow groove (113) is greater than or equal to the recessed depth of the glue groove (112).

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