Novel single-layer sintered diamond grinding tool

Abstract

The utility model relates to the field of grinding tools, in particular to a novel single-layer sintered diamond grinding tool which comprises a base body. The base body is of a cylindrical structure, a connecting groove is formed in one side of the base body, and a plurality of chip grooves are evenly formed in the side, close to the connecting groove, of the working side face of the base body at intervals. The outer side of the base body is wrapped with a metal layer, and the outer side of the metal layer is wrapped with a diamond abrasive material layer. The diamond grinding tool has the advantages that the metal layer and the diamond grinding material layer are sequentially arranged on the outer side of the base body, the chip grooves are formed, the holding force of the metal layer to the diamond grinding material layer can be enhanced, the embedding rate of the metal layer to the diamond grinding material layer is reduced, chip removal is facilitated, the service life of the grinding tool product is prolonged by 1-2 times, and the service life of the grinding tool product is prolonged by 1-2 times. Therefore, the metal layer has very strong holding force on the diamond abrasive material layer, high machining efficiency can be realized, and the diamond abrasive material has the characteristics of strong grinding force and good chip removal space.

Description

Technical Field

[0001] The utility model relates to the field of grinding tools, in particular to a novel single-layer sintered diamond grinding tool. Background Art

[0002] In recent years, with the rapid development of smart phones, computers, and wearable devices, the processing of various components required by these devices has also put forward higher requirements. Diamond grinding tools, as grinding tools, are responsible for the grinding of materials such as glass, ceramics, and sapphire. With the improvement of processing technology requirements, higher requirements are also put forward for the performance of grinding tools.

[0003] In the past, the grinding of materials such as glass, ceramics, and sapphire was achieved using electroplated diamond abrasives. Although electroplated products have natural advantages such as high dimensional accuracy and high surface flatness of the abrasive, the biggest disadvantage of electroplated products is that the electroplated coating holds the diamonds through mechanical inlay, and the coating has a relatively low holding force on the abrasive. To increase the coating holding force, the relative thickness of the coating must be increased, but at the same time, the leakage size of the abrasive will decrease, greatly reducing the discharge of grinding chips during the grinding process and greatly reducing the sharpness of the abrasive. Utility Model Content

[0004] In order to overcome the above-mentioned shortcomings, the utility model provides a technical solution that can solve the above-mentioned problems.

[0005] A novel single-layer sintered diamond grinding tool comprises a matrix;

[0006] The base body is cylindrical in structure, a connecting groove is provided on one side of the base body, and a plurality of chip removal grooves are evenly spaced on a side of the working side of the base body close to the connecting groove;

[0007] The outer side of the substrate is wrapped with a metal layer, and the outer side of the metal layer is wrapped with a diamond abrasive layer.

[0008] As a further solution of the utility model: the metal powder of the metal layer is nickel-based metal powder, and the metal powder of the metal layer is fixed and sintered on the outer side of the substrate by solder paste.

[0009] As a further solution of the utility model: the metal layer and the diamond abrasive layer are combined with each other by a certain crystal phase structure.

[0010] As a further solution of the utility model: the number of the chip removal grooves is 6.

[0011] As a further solution of the utility model: the edges of the base body are respectively formed with chamfers.

[0012] Compared with the prior art, the beneficial effect of the utility model is that by sequentially arranging a metal layer and a diamond abrasive layer on the outer side of the base and providing a plurality of chip removal grooves, the holding force of the metal layer on the diamond abrasive layer can be enhanced, the embedding rate of the metal layer in the diamond abrasive layer can be reduced, chip removal is convenient, and the service life of the abrasive product is increased by 1-2 times, so that the metal layer can achieve a very strong holding force on the diamond abrasive layer, high processing efficiency can be achieved, and it has the characteristics of strong grinding force and good chip removal space.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in this embodiment or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0015] Figure 1 It is a structural schematic diagram of the utility model.

[0016] Figure 2 It is a schematic diagram of the structure of the chip groove.

[0017] As shown in the figure: 1. base; 2. connecting groove; 3. chip groove; 4. metal layer; 6. diamond abrasive layer. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0021] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] See also Figure 1-2 , a novel single-layer sintered diamond grinding tool, comprising a substrate 1;

[0023] The base body 1 is cylindrical in structure, a connecting groove 2 is provided on one side of the base body 1, and a plurality of chip removal grooves 3 are evenly spaced apart on a side of the working side of the base body 1 close to the connecting groove 2;

[0024] The outer side of the substrate 1 is wrapped with a metal layer 4 , and the outer side of the metal layer 4 is wrapped with a diamond abrasive layer 5 .

[0025] It can enhance the holding force of the metal layer 4 on the diamond abrasive layer 5, reduce the embedding rate of the metal layer 4 on the diamond abrasive layer 5, facilitate chip removal, and increase the service life of the abrasive product by 1-2 times, so that the metal layer 4 can achieve a very strong holding force on the diamond abrasive layer 5, can achieve high processing efficiency, and has the characteristics of strong grinding force and good chip removal space.

[0026] As a further solution of the utility model: the metal powder of the metal layer 4 is nickel-based metal powder, and the metal powder of the metal layer 4 is fixed and sintered on the outer side of the substrate 1 through solder paste.

[0027] As a further solution of the utility model: the metal layer 4 and the diamond abrasive layer 5 are combined with each other by a certain crystal phase structure.

[0028] The nickel-based metal powder is chemically metallurgically bonded with the diamond in a high-temperature molten state, and mutually penetrates the surface of the diamond, thereby firmly achieving the holding force of the metal layer 4 on the diamond abrasive layer 5; compared with the holding force of mechanical encapsulation, the holding force of chemical metallurgical bonding is approximately equivalent to 2-3 times that of mechanical physical encapsulation;

[0029] In conventional electroplating products, the diamond encapsulation degree of the metal layer 4 reaches 65%-70%, and in single-layer sintered products, the encapsulation degree reaches 25%-30% to achieve good processing performance. The increase in the exposed size of the diamond will produce the following two advantages: 1. The chip removal space in the grinding process is increased, which is conducive to the timely discharge of the removed material, and is not easy to cause the grinding tool and workpiece burns caused by the blockage of grinding chips, and can obtain better workpiece surface processing quality; 2. The increase in the exposed size of the diamond can increase the effective grinding allowance of the diamond, and the service life will be increased by about 2 times under the same conditions; 3. The sharpness of the grinding tool with a high exposed size is also increased by more than 50%.

[0030] As a further solution of the present invention: the number of the chip removal grooves 3 is 6.

[0031] As a further solution of the utility model: the edges of the base body 1 are respectively formed with chamfers.

[0032] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "including a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0033] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A new type of single-layer sintered diamond grinding tool, characterized by: including a matrix; The base body is cylindrical in structure, a connecting groove is provided on one side of the base body, and a plurality of chip removal grooves are evenly spaced on a side of the working side of the base body close to the connecting groove; The outer side of the substrate is wrapped with a metal layer, and the outer side of the metal layer is wrapped with a diamond abrasive layer.

2. A novel single-layer sintered diamond grinding tool according to claim 1, characterized in that: The metal powder of the metal layer is nickel-based metal powder, and the metal powder of the metal layer is fixed and sintered on the outer side of the substrate through solder paste.

3. A novel single-layer sintered diamond grinding tool according to claim 1, characterized in that: The metal layer and the diamond abrasive layer are combined with each other by a certain crystal phase structure.

4. A novel single-layer sintered diamond grinding tool according to claim 1, characterized in that: The number of chip flutes is 6.

5. A novel single-layer sintered diamond grinding tool according to claim 1, characterized in that: The edges of the base body are respectively formed with chamfers.

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