Air conditioner driving device and air conditioner
By setting component components on both sides of the circuit board of the air conditioner drive device and using refrigeration components and thermal conductors in the heat dissipation components, the problem of poor heat dissipation effect of components in the air conditioner drive device is solved, and efficient heat dissipation and space saving effects are achieved.
Patent Information
- Application Number
- CN202420240011.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-31
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-01-31
AI Technical Summary
Due to different arrangements of components in the air-conditioning drive device, the heat dissipation effect is poor, especially components with higher power are difficult to dissipate heat in time, affecting the normal operation of the components.
An air conditioning driving device is designed, by setting the first component and the second component on both sides of the circuit board, and using refrigeration components and thermal conductors in the heat dissipation components, components with large heat dissipation power are concentrated to improve heat dissipation efficiency.
It realizes efficient heat dissipation of components in the air-conditioning drive device, reduces wiring harness connection, reduces the external dimensions of the circuit board, saves the internal space of the air-conditioner, and improves the environmental applicability of the air-conditioner.
Smart Images

Figure CN222634752U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of air conditioning, in particular to an air conditioning driving device and also to an air conditioner. Background Art
[0002] This section merely provides background information related to the present disclosure and is not necessarily prior art.
[0003] There are multiple components in the air-conditioning drive device. Since the components are arranged in different positions and connected by wiring harnesses, the multiple components can only rely on air cooling to dissipate heat. For components with higher power, the heat on the components cannot be dissipated in time, and even the normal operation of the components is affected. Utility Model Content
[0004] The purpose of the utility model is to solve the technical problem of poor heat dissipation effect of various components in the air-conditioning driving device. This purpose is achieved through the following technical solutions:
[0005] The first aspect of the utility model provides an air conditioner driving device, the air conditioner driving device comprising:
[0006] A circuit board, wherein a first component assembly is disposed on one side of the circuit board, and a second component assembly is disposed on the other side of the circuit board, and the power of the first component assembly is greater than the power of the second component assembly;
[0007] The heat dissipation assembly comprises a refrigeration assembly and a heat conducting member, the refrigeration assembly is connected to the heat conducting member, and the first component assembly is thermally connected to the heat conducting member.
[0008] In the air-conditioning driving device of the utility model, the first component assembly and the second component assembly are arranged on both sides of the circuit board, and the various components that are dispersed are concentrated on the circuit board, so that there is no need for too many wiring harnesses between multiple components in the air conditioner. A heat dissipation component is also provided in the air-conditioning driving device to concentrate the heat dissipation of the first component assembly with larger power. The heat generated by the first component assembly is promptly taken away by the refrigeration component in the heat dissipation component, which has the advantage of high heat dissipation efficiency.
[0009] The components are arranged on both sides of the circuit board of the air conditioner driving device of the utility model, which reduces the external dimensions of the circuit board, makes the volume of the air conditioner driving device smaller, and saves the internal space of the air conditioner.
[0010] In addition, the air conditioner driving device according to the utility model may also have the following additional technical features:
[0011] In some embodiments of the present invention, the circuit board is provided with a first connection area and a second connection area, and the first connection area is spaced apart from the second connection area;
[0012] The first component assembly is electrically connected to the circuit board at a first connection region, and the second component assembly is electrically connected to the circuit board at the second connection region.
[0013] In some embodiments of the present invention, the first component assembly and the second component assembly are both soldered to the circuit board.
[0014] In some embodiments of the present invention, the heat dissipation component is disposed close to a middle area of the circuit board.
[0015] In some embodiments of the present invention, the first component assembly or the second component assembly is arranged close to an edge area of the circuit board.
[0016] In some embodiments of the present invention, the first component assembly is fixed to the heat dissipation assembly.
[0017] In some embodiments of the present invention, the first component assembly includes at least one insulated gate bipolar transistor and at least one diode, and the second component assembly includes at least one inductor and at least one capacitor.
[0018] In some embodiments of the present invention, the number of the insulated gate bipolar transistors is N1, the number of the diodes is N2, and the number of the inductor devices is N3, wherein the values of N1, N2 and N3 are the same.
[0019] In some embodiments of the present invention, the first component assembly further includes a rectifier assembly, and the rectifier assembly, the insulated gate bipolar transistor and the diode are arranged along an extension direction of the heat dissipation assembly.
[0020] In some embodiments of the present invention, the heat conducting member further includes a first heat conducting member and a second heat conducting member, the refrigeration assembly is located between the first heat conducting member and the second heat conducting member, and the first heat conducting member and the second heat conducting member are both arranged in close contact with the refrigeration assembly.
[0021] A second aspect of the utility model provides an air conditioner, which includes an air conditioner driving device as described in any one of the above items. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Various other advantages and benefits will become apparent to those skilled in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only used for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:
[0023] Figure 1 The schematic diagram of the structure of the circuit board according to the embodiment of the utility model is schematically shown;
[0024] Figure 2 The structure diagram of the first component assembly and the second component assembly according to the embodiment of the utility model is schematically shown;
[0025] Figure 3 The structure diagram of the air conditioner driving device for horizontal arrangement according to the embodiment of the utility model is schematically shown;
[0026] Figure 4 The schematic diagram of the structure of a vertically arranged air-conditioning driving device according to an embodiment of the utility model is schematically shown.
[0027] The reference numerals are as follows:
[0028] 101a, a first rectifier device; 101b, a second rectifier device;
[0029] 102a, a first switch tube; 102b, a second switch tube; 102c, a third switch tube;
[0030] 103a, a first diode; 103b, a second diode; 103c, a third diode;
[0031] 104. A first inverter;
[0032] 105a, a first inductor; 105b, a second inductor; 105c, a third inductor;
[0033] 106a, a first capacitive device; 106b, a second capacitive device; 106c, a third capacitive device; 106d, a fourth capacitive device;
[0034] 107. Finned heat sink;
[0035] 108. A second inverter;
[0036] 109. Fasteners;
[0037] 100. Common mode inductor;
[0038] 10. Circuit board;
[0039] 11. Shell; 12a. First heat-conducting member; 12b. Second heat-conducting member; 13. Refrigerant pipe assembly; 14. Sheet metal member; 15. Connecting member;
[0040] 21. First connection area; 22. Second connection area; 23. Third connection area. DETAILED DESCRIPTION
[0041] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0042] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive and therefore specify the existence of stated features, steps, operations, elements and / or devices, but do not exclude the existence or addition of one or more other features, steps, operations, elements, devices, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.
[0043] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, devices, regions, layers and / or sections, these elements, devices, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, device, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, device, region, layer or section discussed below can be referred to as the second element, device, region, layer or section without departing from the teaching of the example embodiments.
[0044] For ease of description, spatially relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature as shown in the figures, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "over", etc. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figure is flipped, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both above and below orientations. The device can be oriented otherwise (rotated 90 degrees or in other orientations) and the spatially relative descriptors used in the text are interpreted accordingly.
[0045] Combination Figure 1 , Figure 2 and Figure 3 The air conditioner driving device of the utility model includes a circuit board 10 and a heat dissipation assembly. A first component assembly is arranged on one side of the circuit board 10, and a second component assembly is arranged on the other side of the circuit board 10. The first component assembly includes at least one insulated gate bipolar transistor and at least one diode, and the second component assembly includes at least one inductor and at least one capacitor. The power of the first component assembly is greater than the power of the second component.
[0046] Among them, the insulated gate bipolar transistor, the diode, the inductor device and the capacitor device constitute the power factor correction component.
[0047] More specifically, the first component assembly includes a first rectifier 101a, a second rectifier 101b, a first switch tube 102a, a second switch tube 102b, a third switch tube 102c, and a first diode 103a, a second diode 103b, a third diode 103c, and a first inverter 104; the second component assembly includes a first inductor 105a, a second inductor 105b, a third inductor 105c, and a first capacitor 106a, a second capacitor 106b, a third capacitor 106c, and a fourth capacitor 106d. The air-conditioning driving device of this embodiment integrates multiple switch tubes, multiple diodes, two rectifiers, an inverter, and multiple capacitors, multiple inductors, and multiple capacitors on both sides of the circuit board 10. Compared with the dispersed arrangement of multiple different components, the air-conditioning driving device of this embodiment reduces the external dimensions of the circuit board 10, can make the volume of the air-conditioning driving device smaller, and save the internal space of the air conditioner.
[0048] The air conditioning driving device of this embodiment concentrates components with relatively high power and high heat generation in a first component assembly, so that the power of the first component assembly is greater than the power of the second component assembly, which is beneficial for concentrated heat dissipation of one or more components with relatively high power.
[0049] Among them, the heat dissipation component can be arranged on one side of the first component assembly of the circuit board 10, and the first component assembly is close to the heat dissipation component to dissipate heat for the first component assembly. The heat dissipation component of the air-conditioning driving device in this embodiment can adopt liquid cooling; when the first component assembly or the second component assembly dissipates less heat during operation, air cooling or natural heat dissipation can also be adopted.
[0050] In other embodiments, the heat dissipation component may be provided on one side of the circuit board 10 located at the second component assembly, and the second component assembly may be placed against the heat dissipation component to dissipate heat for the second component assembly, thereby dissipating heat for the first component assembly and the second component assembly at the same time.
[0051] In one of the embodiments, in an air-conditioning driving device, a refrigeration assembly and a heat conductor are arranged in the heat dissipation assembly, and the heat conductor is respectively connected to the first component assembly and the refrigeration assembly. The heat generated by the operation of the first component assembly is conducted to the refrigeration assembly through the heat conductor, wherein the refrigeration assembly includes a refrigerant pipe assembly, and a refrigerant medium for conducting heat is arranged in the refrigerant pipe assembly.
[0052] The heat generated by the first component assembly is taken away by the refrigerant medium in the refrigerant pipe assembly 13 of the refrigeration assembly.
[0053] Similarly, when the above-mentioned heat dissipation assembly is arranged on one side of the circuit board 10 located at the second component assembly, and the heat conductor is respectively connected to the second component assembly and the refrigeration assembly, the heat generated by the operation of the second component assembly is conducted to the refrigeration assembly through the heat conductor, and the refrigerant medium in the refrigerant pipe assembly 13 in the refrigeration assembly takes away the heat generated by the second component assembly.
[0054] In order to facilitate heat dissipation of the first component assembly and the second component assembly, the first component assembly and the second component assembly may be placed against the heat conducting member.
[0055] In one of the embodiments, the refrigeration component includes a refrigerant pipe assembly 13. The refrigerant in the refrigerant pipe assembly 13 carries away the heat generated by the first component assembly or the second component assembly during circulation. In order to further improve the heat dissipation efficiency, the refrigerant can also form a circulating circulation loop in the refrigerant pipe assembly 13, so as to continuously dissipate heat for the first component assembly or the second component assembly.
[0056] The air-conditioning driving device in this embodiment takes away the heat generated by the first component assembly and the second component assembly by setting a refrigerant pipe assembly 13 in the heat dissipation assembly. Compared with the existing air-cooling heat dissipation method, the refrigerant pipe assembly 13 can take the heat out of the air-conditioning driving device and has the characteristic of high heat dissipation efficiency.
[0057] In one embodiment of the utility model, only the first component assembly can be placed against the heat conductive part of the heat dissipation assembly, and the heat dissipation assembly dissipates heat for the first component assembly, and the second component assembly adopts air cooling or natural heat dissipation, or a plurality of fins for heat dissipation can be arranged in the second component assembly; the second component assembly can also be placed against the heat conductive part of the heat dissipation assembly, and the heat dissipation assembly dissipates heat for the second component assembly; and a plurality of fins for heat dissipation can also be arranged in the first component assembly.
[0058] The air-conditioning driving device of the utility model divides a plurality of different components into a first component assembly and a second component assembly, which are respectively arranged on both sides of a circuit board 10. Different types of components can be arranged in zones. For example, components that generate a lot of heat during operation can be concentrated on one side of the circuit board 10, or arranged in a specific area of the circuit board 10. The heat dissipation assembly can be used to dissipate heat from a plurality of components in a specific area, thereby taking away more heat in a concentrated manner, which is beneficial to improving the heat dissipation efficiency of the air-conditioning radiator.
[0059] The air-conditioning driving device of the utility model arranges the first component assembly and the second component assembly of different powers on both sides of the circuit board 10 respectively, which can effectively utilize the limited space of the circuit board 10, and is conducive to setting more components on one circuit board 10. It should be noted that the air-conditioning driving device of the utility model centrally sets a plurality of high-power components, which causes more heat to be concentrated in one area of the circuit board. By adopting the refrigerant pipe assembly 13 and the heat conductor, more heat in one area of the circuit board can be dissipated in time, reducing the influence of high temperature on the normal operation of the components.
[0060] When the air-conditioning driving device of the utility model is arranged in the air-conditioning driving device, the components in the air-conditioning driving device are concentratedly arranged and the overall volume is small, which saves the effective space in the air-conditioning and is conducive to the reasonable arrangement of different parts in the air-conditioning, such as increasing the effective area of the heat exchanger, and reducing the volume of the air-conditioning chassis, so as to appropriately reduce the external dimensions of the air-conditioning and reduce the space occupied by the air-conditioning.
[0061] Combination Figure 1In one embodiment of the utility model, the circuit board 10 is provided with a first connection area 21, and the first component assembly is electrically connected to the circuit board 10 in the first connection area 21. The circuit board 10 is also provided with a second connection area 22, and the second component assembly is electrically connected to the circuit board 10 in the second connection area 22. The first component assembly and the second component assembly are respectively arranged in different areas, which can reduce the mutual influence between the first component assembly and the second component assembly. In the air-conditioning driving device in this embodiment, the first connection area 21 and the second connection area 22 can be arranged on the same side of the circuit board 10 and are arranged at intervals. The first connection area 21 and the second connection area 22 can also be arranged on both sides of the circuit board 10 to reduce the interference of the first component assembly on the second component assembly, or the interference of the second component assembly on the first component assembly.
[0062] In one embodiment of the present invention, the first component assembly and the second component assembly are both welded to the circuit board 10. More specifically, the first component assembly and the second component assembly are connected to the circuit board 10 by copper foil welding. The welding method is used to ensure that the first component assembly and the second component assembly have a high connection strength with the circuit board 10. Therefore, the air-conditioning driving device in this embodiment reduces the wiring harness connection between the first component assembly and the circuit board 10 and between the second component assembly and the circuit board 10, while fixing the first component assembly and the second component assembly to the circuit board 10 in a more secure manner, which is also beneficial to the modular design within the air-conditioning driving device, and is convenient for later maintenance and replacement.
[0063] In some embodiments of the utility model, the first connection area 21 and the second connection area 22 on the circuit board 10 are located on the same side of the circuit board 10. Setting the first connection area 21 and the second connection area 22 on the same side can shorten the routing distance on the circuit board 10 and prevent the weakening or distortion of the electrical control signal between the first component assembly and the second component assembly. The air-conditioning driving device in this embodiment respectively arranges the first component assembly and the second component assembly on both sides of the circuit board 10. At the same time, the first connection area and the second connection area are located on the same side of the circuit board, which can prevent the first component assembly and the second component assembly from being affected by other components or causing interference to other devices.
[0064] The first connection area and the second connection area are located on the same side of the circuit board and are close to each other, which can also reduce the attenuation of the signal during the transmission process between the first component assembly and the second component assembly.
[0065] In some embodiments of the present invention, the heat dissipation component is arranged near the middle area of the circuit board 10. The heat dissipation component can support the circuit board 10 to prevent the circuit board 10 from being deformed during the installation and welding processes, because the heat dissipation component is arranged in the middle area of the circuit board 10 to act as a reinforcing rib.
[0066] Specifically, combined Figure 1 , Figure 2 and Figure 3 The heat dissipation component is extended along the middle area of the circuit board 10, which can reduce the warping and deformation of the circuit board 10. The extension path of the circuit board 10 can be arranged according to actual needs. For example, the heat dissipation component is extended along the diagonal direction of the circuit board 10. The heat dissipation component can also be arranged in an arc shape according to the external dimensions of the circuit board 10. The heat dissipation component can also be arranged in multiple parts, with the multiple parts being arranged at an angle, or two adjacent parts being in a broken line shape.
[0067] In some embodiments of the utility model, the heat dissipation component of the air-conditioning driving device includes a refrigerant pipe assembly 13 and a heat conductor. When the first component assembly is attached to the heat conductor, the refrigerant medium in the refrigerant pipe assembly 13 can take away the heat generated by the first component assembly, and the first component assembly can also be fixed on the heat conductor to improve the stability and connection strength of the first component assembly. More specifically, the first component assembly can be fixed on the heat conductor by a fastener 109.
[0068] Similarly, the second component assembly can be placed against the heat conductor, and the refrigerant medium in the refrigerant pipe assembly 13 can take away the heat generated by the second component assembly, thereby fixing the second component assembly on the heat conductor to improve the stability and connection strength of the second component assembly. The second component assembly and the heat conductor can be connected via fasteners 109.
[0069] Combination Figure 3 In one embodiment of the utility model, the heat conductive member further includes a first heat conductive member 12a and a second heat conductive member 12b, the refrigerant pipe assembly 13 is located between the first heat conductive member 12a and the second heat conductive member 12b, and the first heat conductive member 12a and the second heat conductive member 12b are both arranged in close contact with the refrigerant pipe assembly 13.
[0070] like Figure 3 and Figure 4 As shown, the first heat conductive member 12a and the second heat conductive member 12b together form a cavity suitable for the refrigerant pipe assembly 13 to pass through, wherein the first heat conductive member 12a and the second heat conductive member 12b at least partially surround the refrigerant pipe assembly 13.
[0071] The first component assembly may be disposed on the first heat conducting member and connected and fixed by a fastener 109 .
[0072] Thermally conductive material can also be applied between the refrigerant tube assembly 13 and the first heat conductor 12a and between the refrigerant tube assembly 13 and the second heat conductor 12b. The space between the first heat conductor 12a and the refrigerant tube assembly 13 is filled with thermally conductive material, and the space between the second heat conductor 12b and the refrigerant tube assembly 13 is filled with thermally conductive material. This improves the thermal conductivity between the first heat conductor and the refrigerant tube assembly 13 and between the second heat conductor and the refrigerant tube assembly 13, so that the heat generated by the first component assembly and the second component assembly is promptly conducted to the refrigerant tube assembly 13 and carried away by the refrigerant medium in the refrigerant tube assembly 13.
[0073] A single U-tube or a double U-tube may be provided in the refrigerant tube assembly 13 to increase the flow path of the refrigerant medium and improve the heat dissipation effect.
[0074] like Figure 3 and Figure 4 As shown, the air conditioner driving device of the utility model further includes a housing 11, a circuit board 10 is disposed in the housing 11, a heat dissipation component is connected to the housing 11, and the housing 11 supports the heat dissipation component.
[0075] According to actual needs, the housing 11 can be set to be open, and the housing has an opening for installation and maintenance.
[0076] The housing may also be configured to be closed, and the closed housing may protect the circuit board 10 and the first component assembly and the second component assembly.
[0077] In one embodiment, the air conditioner driving device provided by the utility model can be placed vertically or horizontally, such as Figure 3 and Figure 4 As shown, the air conditioning driving device further includes a connecting member 15 , which is connected to the first heat conducting member or the second heat conducting member, and the air conditioning driving device is connected to the air conditioner via the connecting member 15 .
[0078] like Figure 3 As shown, the connecting member 15 can surround a portion of the heat-conducting member, and the other end of the connecting member 15 is connected to a fixing device in the air conditioner through a supporting foot. This arrangement is suitable for a horizontally arranged air-conditioning driving device.
[0079] like Figure 4 As shown, the support member may also be provided with a sheet metal member 14, one side of the sheet metal member 14 is fixedly connected to the housing, and the other side of the sheet metal member 14 is used to be connected to a fixing device in the air conditioner.
[0080] In one embodiment of the utility model, the first component assembly or the second component assembly is arranged near the edge area of the circuit board 10. The air-conditioning driving device in this embodiment is suitable for components with higher power. The inductor device or the capacitor device is arranged at the edge area of the circuit board 10, which is far away from other components to reduce interference with the electric control signal.
[0081] In an embodiment of the present invention, the number of insulated gate bipolar transistors is N1, the number of diodes is N2, and the number of inductor devices is N3, wherein the values of N1, N2 and N3 are the same.
[0082] like Figure 1 As shown, the first component assembly includes a first rectifier device 101a, a second rectifier device 101b, a first switch tube 102a, a second switch tube 102b, a third switch tube 102c, and a first diode 103a, a second diode 103b, a third diode 103c, and a first inverter 104, which are arranged in a straight line. The number of rectifier devices in this embodiment is greater than or equal to 1, and the number of groups of switch tubes and diodes in the power factor correction device is greater than or equal to 2. In this embodiment, the number of groups of switch tubes and diodes is 3.
[0083] The second component assembly includes a first inductor 105a, a second inductor 105b, a third inductor 105c, a first capacitor 106a, a second capacitor 106b, a third capacitor 106c, a fourth capacitor 106d, and a common-mode inductor 100; the inductor and the capacitor are located on the same side of the connection position between the power device and the circuit board 10. The number of inductors in this embodiment is 3, the number of switch tubes and diode groups is consistent, and the number of capacitors is set according to actual needs.
[0084] like Figure 2 As shown, the first rectifier device 101a, the second rectifier device 101b, the first switch tube 102a, the second switch tube 102b, the third switch tube 102c, and the first diode 103a, the second diode 103b, the third diode 103c, and the first inverter 104 are arranged on one side of the circuit board 10, and the first inductor device 105a, the second inductor device 105b, the third inductor device 105c, and the first capacitor device 106a, the second capacitor device 106b, the third capacitor device 106c, and the fourth capacitor device 106d are arranged on the other side of the circuit board 10.
[0085] In some embodiments of the present invention, the first component group further includes a rectifier component group and a first power component group, and the weak current components, the rectifier component and the first power component are arranged in the first connection area 21 along the extension direction of the heat dissipation component, wherein the first power component includes a first inverter 104, Figure 1The weak current components, the rectifier assembly and the first power assembly are shown to be arranged in a straight line.
[0086] In some embodiments of the utility model, the circuit board 10 also includes a third connection area 23, which is spaced apart from the first connection area 21; the second component assembly also includes a second power component, which is electrically connected to the circuit board 10 in the third connection area 23, and the second power component includes a second inverter 108 and a fin heat sink 107 arranged on the second inverter 108.
[0087] In the above-mentioned different embodiments given in the present invention, the "one side" and "the other side" of the circuit board are explained as follows: one side and the other side of the circuit board refer to different surfaces on the circuit board. When the "one side" of the circuit board is the front side of the circuit board, the "other side" of the circuit board is the back side of the circuit board. For example, the first component assembly is arranged on the front side of the circuit board, and the second component assembly is arranged on the back side of the circuit board.
[0088] A second aspect of the utility model provides an air conditioner, which includes an air conditioner driving device as described in any one of the above items.
[0089] The air conditioner provided by the utility model has an air conditioner driving device with strong heat dissipation capability, which improves the environmental applicability of the air conditioner. Even if the air conditioner is in a high temperature environment, it can still dissipate heat well for the first component assembly therein and take away the heat concentratedly generated by the first component assembly in time.
[0090] In order to further improve the heat dissipation capacity of the air-conditioning drive device of the utility model, the air-conditioning drive device can also be arranged in the air-conditioning outdoor unit and located on the air flow path, and the air flow formed by the heat exchange of the air-conditioning outdoor unit can be used to take away the heat generated by the air-conditioning drive device.
[0091] A good temperature environment can also be formed in the air-conditioning indoor unit of the air conditioner during the movement of the air-conditioning indoor unit, thereby ensuring that the air-conditioning driving device is in a suitable temperature range, and at the same time the flowing air flow takes away the heat generated by the air-conditioning driving device.
[0092] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. An air conditioner driving device, characterized in that: The air conditioning driving device comprises: A circuit board, wherein a first component assembly is disposed on one side of the circuit board, and a second component assembly is disposed on the other side of the circuit board, and the power of the first component assembly is greater than the power of the second component assembly; The heat dissipation assembly comprises a refrigeration assembly and a heat conducting member, the refrigeration assembly is connected to the heat conducting member, and the first component assembly is thermally connected to the heat conducting member.
2. The air conditioner driving device according to claim 1, characterized in that: The circuit board is provided with a first connection area and a second connection area, and the first connection area is spaced apart from the second connection area; The first component assembly is electrically connected to the circuit board at a first connection region, and the second component assembly is electrically connected to the circuit board at the second connection region.
3. The air conditioner driving device according to claim 1, characterized in that: The first component assembly and the second component assembly are both soldered to the circuit board.
4. The air conditioner driving device according to claim 1, characterized in that: The heat dissipation component is arranged close to the middle area of the circuit board.
5. The air conditioner driving device according to claim 4, characterized in that: The first component assembly or the second component assembly is arranged close to an edge area of the circuit board.
6. The air conditioner driving device according to claim 1, characterized in that: The first component assembly is fixed to the heat dissipation assembly.
7. The air conditioner driving device according to any one of claims 1 to 6, characterized in that: The first component assembly includes at least one insulated gate bipolar transistor and at least one diode, and the second component assembly includes at least one inductor and at least one capacitor.
8. The air conditioner driving device according to claim 7, characterized in that: The number of the insulated gate bipolar transistors is N1, the number of the diodes is N2, and the number of the inductor devices is N3, wherein the values of N1, N2 and N3 are the same.
9. The air conditioner driving device according to claim 7, characterized in that: The first component assembly further includes a rectifier assembly, and the rectifier assembly, the insulated gate bipolar transistor and the diode are arranged along an extension direction of the heat dissipation assembly.
10. The air conditioner driving device according to claim 1, characterized in that: The heat conducting member further comprises a first heat conducting member and a second heat conducting member, the refrigeration assembly is located between the first heat conducting member and the second heat conducting member, and the first heat conducting member and the second heat conducting member are both arranged in close contact with the refrigeration assembly.
11. An air conditioner, characterized in that: The air conditioner comprises the air conditioner driving device according to any one of claims 1-10.