Water-cooling heat dissipation device

By designing multiple cooling water channels and heat dissipation parts in the water-cooled heat dissipation device, the problem of poor heat dissipation effect in the prior art is solved, rapid and effective heat dissipation of high-temperature gases are achieved, and surrounding devices are protected.

CN222634860UActive Publication Date: 2025-03-18ZHONGGUO SEMICON (HEFEI) CO LTD
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Patent Information

Application Number
CN202420633531.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-29
Publication Date
2025-03-18
Estimated Expiration
2034-03-29

AI Technical Summary

Technical Problem

The heat dissipation device in the prior art has poor heat dissipation effect and cannot quickly and effectively dissipate heat to the ejected high-temperature gas, resulting in damage to the surrounding devices.

Method used

A water-cooled heat dissipation device is designed, through multiple cooling water channels and heat dissipation parts, and cooling water flows through the heat dissipation parts through the cooling pipes to achieve efficient heat exchange.

Benefits of technology

It realizes rapid and effective heat dissipation of high-temperature gases, greatly improves the heat dissipation effect, and protects surrounding devices from high-temperature damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a water-cooling heat dissipation device. The water-cooling heat dissipation device comprises a first pipeline, a cooling pipeline and a heat dissipation piece. A partition plate is arranged in the first pipeline and is suitable for dividing the first pipeline into a water inlet area and a water outlet area, the water inlet area is suitable for introducing cooling water, and the water outlet area is suitable for discharging cooled water. The number of the cooling pipelines is multiple, one end of each cooling pipeline communicates with the first pipeline, and the other ends of the cooling pipelines communicate with one another. Cooling water in the water inlet area enters the cooling pipeline, and cooled water in the cooling pipeline is discharged through the water outlet area. A gap is formed between every two adjacent cooling pipelines, the heat dissipation pieces are installed in the gaps, and the heat dissipation pieces can absorb heat of high-temperature gas at the furnace mouth in time. And meanwhile, the cooling liquid in the cooling pipelines on the two sides of each heat dissipation piece can quickly exchange heat with the high-temperature heat dissipation piece, so that high-temperature gas is quickly dissipated, and the situation that surrounding devices are damaged by the high-temperature gas is avoided.
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Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a water-cooled heat dissipation device. Background Art

[0002] PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment refers to plasma enhanced chemical vapor deposition equipment, which is commonly used in the production process of solar photovoltaics. The temperature in the cavity during the production process is very high. When the cavity valve is opened during the production process, high-temperature gas will be ejected. The temperature of the high-temperature gas can reach 500°C, and a large amount of high-temperature gas will burn surrounding devices. Therefore, it is necessary to install a heat sink at the furnace mouth of the production equipment so that the emitted gas can be quickly cooled down through the heat sink to protect other devices. However, the heat sink in the prior art has a poor heat dissipation effect, so even if a heat sink is installed, the ejected high-temperature gas cannot be quickly and effectively cooled down, and it will still cause damage to surrounding devices. Utility Model Content

[0003] In order to solve the problem that the heat dissipation device in the prior art has poor heat dissipation effect and cannot quickly and effectively dissipate the ejected high-temperature gas, causing damage to surrounding devices, the utility model provides a water-cooled heat dissipation device, which can quickly and effectively dissipate the high-temperature gas through the cooperation of multiple cooling water channels and heat dissipation parts, thereby greatly improving its heat dissipation effect.

[0004] To achieve the above purpose, the technical solution adopted by the utility model is: a water-cooled heat dissipation device, including a pipe one, a cooling pipe and a heat sink, a partition is provided in the pipe one, the partition is suitable for dividing the pipe one into a water inlet area and a water outlet area, the water inlet area is suitable for introducing cooling water, and the water outlet area is suitable for discharging cooled water; there are multiple cooling pipes, and the multiple cooling pipes are arranged in sequence from top to bottom, one end of each of the cooling pipes is respectively connected to the pipe one, and the other end of each of the cooling pipes is connected to each other, so that the cooling water in the water inlet area can enter the cooling pipe, and the cooled water in the cooling pipe is discharged through the water outlet area; a gap is provided between two adjacent cooling pipes, and the heat sink is installed in the gap, the heat sink is used to absorb external heat, and the cooling water in the cooling pipe can dissipate the heat absorbed by the heat sink.

[0005] As a further improvement of the above scheme, the water-cooling heat dissipation device also includes a pipe two, which is arranged on a side of the cooling pipe away from the pipe one, and one end of each cooling pipe away from the pipe one is connected to each other through the pipe two, and the pipe one, the multiple cooling pipes and the pipe two form a cooling circuit.

[0006] As a further improvement of the above scheme, the cooling pipe includes multiple cooling pipes one and multiple cooling pipes two, and the multiple cooling pipes two are arranged on one side of the multiple cooling pipes one, and each cooling pipe one is respectively provided with a water inlet one and a water outlet one, and the multiple water inlets one are respectively connected to the water inlet area, and the multiple water outlets one are respectively connected to the pipe two, and the cooling pipe one is suitable for transporting the cooling water of the water inlet area to the pipe two, and each cooling pipe two is respectively provided with a water inlet two and a water outlet two, and the multiple water inlets two are respectively connected to the pipe two, and the multiple water outlets two are respectively connected to the water outlet area, and the cold zone pipe two is suitable for transporting the water of the pipe two to the water outlet area.

[0007] As a further improvement of the above solution, the number of the cooling pipes one is the same as the number of the cooling pipes two.

[0008] As a further improvement of the above solution, the cooling pipe is a rectangular structure.

[0009] As a further improvement of the above scheme, a water inlet pipe and a water outlet pipe are provided on the pipeline one, the water inlet pipe is connected to the water inlet area, the water outlet pipe is connected to the water outlet area, and the diameters of the water inlet pipe and the water outlet pipe are both smaller than the diameter of the pipeline one.

[0010] As a further improvement of the above solution, the heat sink is formed by connecting a plurality of heat sinks in sequence.

[0011] As a further improvement of the above solution, the heat sink is in a "J"-shaped structure.

[0012] As a further improvement of the above solution, the water-cooled heat dissipation device also includes two support plates, which are respectively arranged at the upper and lower ends of the cooling pipe, one end of the support plate is connected to the pipe one, and the other end of the support plate is connected to the pipe two.

[0013] As a further improvement of the above solution, the support plate is a hollow structure.

[0014] Furthermore, each of the support plates is provided with a plurality of mounting holes, and the plurality of mounting holes are arranged at intervals on the support plates.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] (1) The utility model provides a heat sink between two adjacent cooling pipes, so that each heat sink can absorb the heat of the high-temperature gas at the furnace mouth in a timely manner. At the same time, the coolant in the cooling pipes on both sides of the heat sink can also quickly exchange heat with the high-temperature heat sink, thereby achieving the purpose of quickly dissipating the heat of the high-temperature gas, achieving rapid and effective cooling, and avoiding the situation where the high-temperature gas causes damage to surrounding devices.

[0017] (2) By providing multiple heat sinks, the contact area between the heat sink and the high-temperature gas at the furnace mouth can be increased, thereby achieving rapid heat absorption of the high-temperature gas. At the same time, with the cooling pipes on both sides, the heat on the heat sink can be dissipated, greatly improving its heat dissipation effect.

[0018] (3) The utility model can increase the contact area between the heat sink and the high-temperature gas per unit area by configuring the heat sink to be a "J"-shaped structure, thereby improving the efficiency of the heat sink in absorbing the high-temperature gas. At the same time, the upper end of the heat sink with the "J"-shaped structure can contact the upper cooling pipe, and the lower end can also contact the lower cooling pipe, so that the heat absorbed by it can be quickly transferred to the cooling pipe. The cooling pipe takes away the heat through the coolant, thereby achieving the purpose of heat dissipation of the heat sink. After heat dissipation, the heat sink can reabsorb the high-temperature gas at the furnace mouth, thereby achieving the purpose of circulating heat dissipation.

[0019] (4) The utility model forms a cooling circuit by connecting one end of a plurality of cooling pipes to pipe one and connecting the other ends of the plurality of cooling pipes to pipe two, which can effectively simplify the structure of the entire water-cooling heat dissipation device and reduce its overall mass.

[0020] (5) The utility model provides a partition in the pipe 1, and the partition can separate the pipe 1 into a water inlet area and a water outlet area, so that the pipe 1 can be used as both a water inlet area and a water outlet area, which greatly simplifies the structure of the entire water cooling device.

[0021] (6) The utility model provides a support plate with a hollow structure, which can reduce the overall weight of the entire water-cooling heat sink during the actual installation process and can also install the water-cooling heat sink through the support plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a cross-sectional view of the water-cooling heat dissipation device provided by the utility model in a three-dimensional state.

[0023] Figure 2 This is a cross-sectional view of the water-cooling heat dissipation device provided by the utility model in a front view state.

[0024] Figure 3 This is a top view of the water cooling device provided by the utility model.

[0025] Figure 4 For this utility model Figure 3 Cross-sectional view along AA.

[0026] Figure 5 For this utility model Figure 1 An enlarged schematic diagram of the partial structure of the water-cooling heat dissipation device at one end of the pipe.

[0027] In the figure: 1. Pipeline 1; 11. Partition; 12. Water inlet area; 13. Water outlet area; 14. Water inlet pipe; 15. Water outlet pipe; 2. Cooling pipeline; 21. Gap; 22. Cooling pipeline 1; 221. Water inlet 1; 222. Water outlet 1; 23. Cooling pipeline 2; 231. Water inlet 2; 232. Water outlet 2; 3. Heat sink; 4. Pipeline 2; 5. Support plate; 51. Mounting hole. DETAILED DESCRIPTION

[0028] The present invention is further described below in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0029] In the description of the present utility model, it should be noted that for directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating directions and positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific protection scope of the present utility model. The terms "first", "second" and the like in the specification and claims of the present utility model are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. The terms "including" and "having" in the specification and claims of the present utility model and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device including a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0030] Reference Figure 1-5 As shown, an embodiment of the utility model provides a water-cooling heat dissipation device, including a pipe 1, a cooling pipe 2 and a heat dissipation element 3.

[0031] like Figure 4As shown, a partition 11 is provided in the pipe 1, and the partition 11 is suitable for dividing the pipe 1 into a water inlet area 12 and a water outlet area 13. The water inlet area 12 is suitable for passing cooling water, and the water outlet area 13 is suitable for discharging the cooled water. By providing the partition 11 in the pipe 1, the water inlet area 12 and the water outlet area 13 can be formed in the pipe 1, so that the structure of the entire water-cooled heat dissipation device can be simplified while the cooling water can be transported to the cooling pipe 2 through the water inlet area 12, and the cooled water in the cooling pipe 2 can be discharged through the water outlet area 13, thereby achieving the purpose of circulating cooling.

[0032] like Figure 4 As shown, a water inlet pipe 14 and a water outlet pipe 15 are provided on the pipe 1, and the water inlet pipe 14 is connected to the water inlet area 12, and the water inlet pipe 14 can transport cooling water to the water inlet area 12. The water outlet pipe 15 is connected to the water outlet area 13, and the cooled cooling water can be discharged from the water cooling device through the water outlet pipe 15, thereby forming a circulating cooling. The diameter of the water inlet pipe 14 and the diameter of the water outlet pipe 15 are both smaller than the diameter of the pipe 1. The water inlet pipe 14 and the water outlet pipe 15 are respectively used to connect with other components of the external water flow system to realize the control of the discharge and discharge of cooling water.

[0033] Preferably, in the present invention, the water inlet pipe 14 and the water outlet pipe 15 are arranged on the same side, which can reduce the installation area of ​​the water pipe and reduce the heat dissipation cost.

[0034] In some embodiments, a filter is provided in the water inlet pipe 14, and the filter is used to filter the cooling water to prevent impurities from clogging the water-cooling heat dissipation device.

[0035] There are multiple cooling pipes 2, and the multiple cooling pipes 2 are arranged in sequence from top to bottom. The purpose of setting multiple cooling pipes 2 is that the multiple cooling pipes 2 can increase the contact area between the cooling water and the high-temperature gas absorbed by the heat sink 3, so that the cooling water can quickly exchange heat with the high-temperature gas, achieve rapid cooling and heat dissipation, and greatly improve its heat dissipation effect. One end of each cooling pipe 2 is connected to pipe 1, and the other end of each cooling pipe 2 is connected to each other. In this embodiment, a water-cooled heat dissipation device can be formed by pipe 1 and multiple cooling pipes 2, so that the entire water-cooled heat dissipation device has a simple structure and a good heat dissipation effect. The cooling water in the water inlet area 12 is allowed to enter the cooling pipe 2, and the cooled water in the cooling pipe 2 is discharged through the water outlet area 13.

[0036] The cooling pipe 2 is a rectangular structure. The rectangular structure design can increase the contact area between the heat sink 3 and the cooling pipe 2, making it easier for the heat sink 3 to be quickly installed on the cooling pipe 2, thereby achieving heat exchange between the heat absorbed by the heat sink 3 and the cooling water in the cooling pipe 2, thereby achieving heat dissipation on the heat sink 3.

[0037] In one of the embodiments, the connection method between the heat sink 3 and the cooling pipe 2 is: first, the heat sink 3 is densely arranged on the gap, and after the brazing material is applied to the place where the heat sink 3 contacts the cooling pipe 2, the heat sink 3 and the cooling pipe 2 are closely contacted by brazing, thereby increasing the contact area between the heat sink 3 and the cooling pipe 2, and also increasing the contact time between the hot air and the heat sink 3, so that the time for the hot air to flow out of the heat sink 3 is reduced.

[0038] A gap 21 is provided between two adjacent cooling pipes 2, and a heat sink 3 is installed in the gap 21. By installing a heat sink 3 on each gap 21, after the heat sink 3 absorbs the high-temperature gas at the furnace mouth, the cooling pipes 2 on both sides can quickly dissipate the heat absorbed by the heat sink 3, so that the heat sink 3 can continue to absorb the high-temperature gas at the furnace mouth. Through the above-mentioned cycle operation, heat dissipation can be achieved quickly and effectively, and the heat dissipation efficiency can be improved. In the actual operation process, if the flow rate of the cooling water in the cooling pipe 2 is increased, the cooling pipe 2 will take away more temperature on the heat sink 3, thereby quickly taking away the heat of the high-temperature gas flowing into the heat sink 3 from the furnace mouth, so that the temperature of the gas dissipated from the furnace mouth can be quickly reduced. By arranging cooling pipes 2 on both sides of the heat sink 3, its heat dissipation speed can be greatly improved. The heat sink 3 is used to absorb external heat, and the cooling water in the cooling pipe 2 can dissipate the heat absorbed by the heat sink 3. Through the cooperation of the heat sink 3 and the cooling pipe 2, the high-temperature gas ejected from the furnace mouth can be effectively dissipated, and the purpose of protecting the surrounding devices is achieved.

[0039] The heat sink 3 is formed by connecting a plurality of heat sinks in sequence. The heat sink is in a "J"-shaped structure. The "J"-shaped structure can increase the contact area between the heat sink and the cooling pipe 2, speed up the heat exchange speed between the heat sink and the cooling pipe 2, and thus improve the heat dissipation efficiency.

[0040] The heat sink 3 is made of metal. In the utility model, the metal heat sink has fast heat conduction and the water flows quickly to take away the heat, so that the hot air can be quickly cooled down. In addition, in the high-density metal heat sink, the hot air and the metal heat sink are in frictional contact with each other, which can increase the contact time between the hot air and the metal heat sink, thereby taking away more heat. The water-cooled heat sink has a simple structure, strong applicability, good working stability, high reliability, and can meet the application conditions of rapid cooling of high-temperature corrosive gases.

[0041] In some embodiments, the heat sink 3 and the cooling pipe 2 may be connected by welding.

[0042] In another embodiment, the water-cooled heat dissipation device further includes a pipe 2 4, which is disposed on a side of the cooling pipe 2 away from the pipe 1 1, and the ends of the cooling pipes 2 away from the pipe 1 1 are interconnected through the pipe 2 4, and the pipe 1 1, the plurality of cooling pipes 2 and the pipe 2 4 form a cooling loop. The pipe 2 4 is provided to collect the water of the cooling pipes 2, so that the cooling water in the cooling loop can flow smoothly, accelerate its flow rate, and improve its heat dissipation rate. In the actual design process, the pipe diameter of the pipe 1 and the pipe diameter of the pipe 2 4 are both larger than the pipe diameter of the cooling pipe 2, so that the water in the water inlet area 12 in the pipe 1 can flow into the plurality of cooling pipes 2, and the water in the plurality of cooling pipes 2 can quickly enter the pipe 2 4, greatly improving the flow rate of the cooling water in the entire cooling loop and improving its cooling effect.

[0043] like Figure 4-5 As shown, the cooling pipeline 2 includes a plurality of cooling pipelines 1 22 and a plurality of cooling pipelines 23, and the plurality of cooling pipelines 23 are all arranged on one side of the plurality of cooling pipelines 1 22. Each cooling pipeline 1 22 is respectively provided with a water inlet 1 221 and a water outlet 1 222, and the plurality of water inlets 1 221 are respectively connected to the water inlet area 12, and the plurality of water outlets 1 222 are respectively connected to the pipeline 2 4, and the cooling pipeline 1 22 is suitable for conveying the cooling water in the water inlet area 12 to the pipeline 2 4. By providing a plurality of water inlets 1 221 and a plurality of water outlets 1 222, the speed at which the cooling water in the pipeline 1 enters the cooling pipeline 1 22 can be accelerated, and the heat exchange speed between the cooling pipeline 1 22 and the heat sink 3 on the gap 21 thereof can be accelerated, thereby improving the cooling efficiency. Each cooling pipe 23 is provided with a water inlet 231 and a water outlet 232. The plurality of water inlets 231 are connected to the pipe 24, and the plurality of water outlets 232 are connected to the water outlet area 13. The cold zone pipe 24 is suitable for conveying water from the pipe 24 to the water outlet area 13. By providing a plurality of water inlets 221 and a plurality of water outlets 222, the speed at which the cooling water in the pipe 24 enters the cooling pipe 23 can be accelerated, the heat exchange speed between the cooling pipe 23 and the heat sink 3 on the gap 21 can be accelerated, and the cooling efficiency can be improved.

[0044] like Figure 4 As shown, the number of cooling pipe 1 22 is the same as the number of cooling pipe 2 23. It is convenient for the cooling water entering cooling pipe 1 22 through pipe 1 to be discharged through cooling pipe 2 23 in time, thereby ensuring the flow speed of cooling water in cooling pipe 1 22 and cooling pipe 2 23 and improving cooling efficiency.

[0045] like Figure 1As shown, the water-cooling heat sink further comprises two support plates 5, which are respectively arranged at the upper and lower ends of the cooling pipe 2, one end of the support plate 5 is connected to the pipe 1, and the other end of the support plate 5 is connected to the pipe 2 4. The support plate 5 can support the entire water-cooling heat sink and install the water-cooling heat sink through the support plate 5.

[0046] like Figure 4 As shown, the support plate 5 is a hollow structure, which can reduce the weight of the entire water-cooling heat dissipation device.

[0047] like Figure 4 As shown, each support plate 5 is provided with a plurality of mounting holes 51, and the plurality of mounting holes 51 are arranged at intervals on the support plate 5. In actual operation, the water cooling device can be installed to a desired position through the mounting holes 51.

[0048] Among them, the surfaces of all parts on the entire water-cooling heat sink in the utility model have been specially treated, so that the water-cooling heat sink can be acid-resistant, alkali-resistant, corrosion-resistant, and can withstand a high temperature of 500°C. The specific processing process is as follows: first polish and clean each part, then heat the part substrate to a specified temperature range in a vacuum device, and deposit a layer of nickel-based composite film on the substrate surface through ion bombardment, so that each part can be acid-resistant, alkali-resistant, corrosion-resistant, and can withstand a high temperature of 500°C.

[0049] During the above-mentioned parts processing process, the temperature range of the part substrate being heated in the vacuum equipment is 200°C to 300°C.

[0050] In one embodiment, the composite film deposited on the surface of the component substrate is Ni-Co / SiC.

[0051] The above describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and the specification only describe the principles of the utility model. The utility model may be subject to various changes and improvements without departing from the spirit and scope of the utility model. These changes and improvements fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A water cooling device, characterized in that: It includes: A pipeline (1), wherein a partition (11) is provided in the pipeline (1), and the partition (11) is suitable for dividing the pipeline (1) into a water inlet area (12) and a water outlet area (13); the water inlet area (12) is suitable for introducing cooling water, and the water outlet area (13) is suitable for discharging cooled water; A cooling pipe (2), wherein the number of the cooling pipes (2) is plural, and the plural cooling pipes (2) are arranged in sequence; one end of each cooling pipe (2) is respectively connected to the pipe one (1), and the other ends of each cooling pipe (2) are connected to each other; cooling water from the water inlet area (12) is allowed to enter the cooling pipe (2), and the cooled water in the cooling pipe (2) is discharged through the water outlet area (13); a gap (21) is provided between two adjacent cooling pipes (2); A heat sink (3) is installed in the gap (21), and the heat sink (3) is used to absorb external heat, so that the cooling water in the cooling pipe (2) can dissipate the heat absorbed by the heat sink (3).

2. The water cooling device according to claim 1, characterized in that: It also includes a second pipe (4), which is arranged on a side of the cooling pipe (2) away from the first pipe (1), and one end of each cooling pipe (2) away from the first pipe (1) is connected to each other through the second pipe (4); the first pipe (1), the plurality of cooling pipes (2) and the second pipe (4) form a cooling circuit.

3. The water cooling device according to claim 2, characterized in that: The cooling pipeline (2) comprises a plurality of cooling pipelines one (22) and a plurality of cooling pipelines two (23), wherein the plurality of cooling pipelines two (23) are arranged on one side of the plurality of cooling pipelines one (22); a water inlet one (221) and a water outlet one (222) are respectively arranged at both ends of each cooling pipeline one (22), wherein the plurality of water inlet one (221) are respectively connected to the water inlet area (12), and the plurality of water outlet one (222) are respectively connected to the pipeline two (4), wherein the cooling pipelines one (22) and the cooling pipelines two (23) are respectively connected to the cooling pipelines two (4). Pipeline one (22) is suitable for conveying cooling water from the water inlet area (12) to pipe two (4); each cooling pipe two (23) is provided with a water inlet two (231) and a water outlet two (232) at both ends, a plurality of the water inlets two (231) are respectively connected to pipe two (4), a plurality of the water outlets two (232) are respectively connected to the water outlet area (13), and cooling pipe two (23) is suitable for conveying water from pipe two (4) to the water outlet area (13).

4. The water cooling device according to claim 3, characterized in that: The number of the cooling pipe one (22) is the same as the number of the cooling pipe two (23).

5. The water cooling device according to claim 1, characterized in that: The cooling pipe (2) is a rectangular structure.

6. The water cooling device according to claim 1, characterized in that: The pipeline one (1) is provided with a water inlet pipe (14) and a water outlet pipe (15), the water inlet pipe (14) is connected to the water inlet area (12), and the water outlet pipe (15) is connected to the water outlet area (13), and the diameters of the water inlet pipe (14) and the water outlet pipe (15) are both smaller than the diameter of the pipeline one (1).

7. The water cooling device according to claim 1, characterized in that: The heat sink (3) is formed by connecting a plurality of heat sinks in sequence.

8. The water cooling device according to claim 7, characterized in that: The heat sink is in a "J"-shaped structure.

9. The water cooling device according to claim 2, characterized in that: The water-cooling heat dissipation device further comprises two support plates (5), the two support plates (5) being respectively arranged at the upper and lower ends of the cooling pipe (2), one end of the support plate (5) being connected to the pipe one (1), and the other end of the support plate (5) being connected to the pipe two (4).

10. The water cooling device according to claim 9, characterized in that: The support plate (5) is a hollow structure; and / or each of the support plates (5) is provided with a plurality of mounting holes (51), and the plurality of mounting holes (51) are arranged at intervals on the support plate (5).