Electromagnetic ultrasonic thickness gauge probe and thickness gauge
By using a multi-layered flexible printed circuit board as the magnetic field shielding layer in the ultrasonic thickness gauge probe, the problem of wrinkling and cracking of copper foil stacking is solved, and the magnetic field shielding effect and the stability of the probe are improved.
Patent Information
- Application Number
- CN202420614370.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-03-27
AI Technical Summary
In the excitation coil magnetic field shielding scheme of existing ultrasonic thickness gauge, copper foil is prone to wrinkle and cracking during assembly, affecting measurement accuracy and reliability.
A flexible printed circuit board (FPC) with a multi-layer structure is used as the magnetic field shielding layer, replacing the traditional copper foil stacking structure, integrating the magnetic field shielding layer, interface board and excitation coil on the flexible printed circuit board.
It improves the magnetic field shielding effect, reduces external electromagnetic interference, simplifies the assembly process, avoids the problem of easy wrinkling and cracking of copper foil, and improves the stability and durability of the probe.
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Figure CN222635442U_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of dimension measuring equipment, in particular to an electromagnetic ultrasonic thickness gauge and a thickness gauge. Background Art
[0002] Ultrasonic thickness gauge is an instrument that uses the principle of ultrasonic pulse reflection to measure the thickness of various materials. Ultrasonic thickness gauge is usually mainly composed of probe, signal transmitting and receiving circuit, signal processing circuit, display circuit, etc. The probe is an important part of ultrasonic thickness gauge, which is responsible for converting electrical energy into ultrasonic energy and converting ultrasonic energy reflected by the measured object into electrical energy. The structure and performance of the probe affect the measurement accuracy and reliability of the ultrasonic thickness gauge.
[0003] The magnetic field shielding solution of the excitation coil of the existing ultrasonic thickness gauge is generally achieved by stacking multiple layers of copper foil, but the copper foil is prone to wrinkling and cracking during assembly. Summary of the invention
[0004] In view of this, the embodiments of the present application provide an electromagnetic ultrasonic thickness gauge probe and a thickness gauge, which have good flexibility and are easy to assemble.
[0005] In order to achieve the above objectives, this application adopts the following technical solutions:
[0006] In a first aspect, an embodiment of the present application provides an electromagnetic ultrasonic thickness gauge probe, comprising:
[0007] A housing having a receiving cavity;
[0008] A magnet, embedded in the accommodating cavity;
[0009] A magnetic field shielding layer is located at the bottom of the magnet, and the magnetic field shielding layer includes a multi-layered flexible printed circuit board (Flexible Printed Circuit, FPC for short), and each of at least two layers of the multi-layered flexible printed circuit board has a copper cladding layer;
[0010] The excitation coil is located below the magnetic field shielding layer.
[0011] Optionally, it further comprises: an interface board, which is located above the magnet and is integrated with the magnetic field shielding layer into a flexible printed circuit board.
[0012] Optionally, the magnetic field shielding layer, the interface board and the excitation coil are integrated into a flexible printed circuit board.
[0013] Optionally, an insulating layer is provided between adjacent copper-clad layers.
[0014] Optionally, a coil connection point is further provided on the flexible printed circuit board, a coil coupling position is provided near the coil connection point, and the coil coupling position is integrated on the surface of the printed circuit board, or the coil coupling position is built into the interior of the flexible printed circuit board.
[0015] Optionally, a contour shape of the coil coupling position matches a contour shape of the magnetic field shielding layer.
[0016] Optionally, the interface board is electrically connected to the coil connection point via a cable, and a first cable shielding layer and a second cable shielding layer are affixed to both sides of the cable, the first cable shielding layer and the second cable shielding layer extend to cover the surface of the interface board, and the portion of the first cable shielding layer and the second cable shielding layer extending to cover the surface of the interface board is located on the upper part of the magnet.
[0017] Optionally, the interface board has conductive contacts, and the conductive contacts are exposed on the surface of the flexible printed circuit board.
[0018] Optionally, a reinforcing plate for supporting the interface board is further provided at the bottom of the flexible printed circuit board, at a position corresponding to the interface board.
[0019] Optionally, a magnetic field concentrator is provided in the accommodating cavity between the lower part of the coil magnetic field shielding layer and the excitation coil.
[0020] In a second aspect, an embodiment of the present application provides an electromagnetic ultrasonic thickness gauge, comprising: a thickness gauge host, the thickness gauge host having a probe connector;
[0021] In any one of the electromagnetic ultrasonic thickness gauge probes described in the first aspect, the interface board of the electromagnetic ultrasonic thickness gauge probe is connected to the probe connector.
[0022] The electromagnetic ultrasonic thickness gauge probe and thickness gauge provided in the embodiments of the present application form a magnetic field shielding layer through a multi-layer flexible printed circuit board, replacing the original shielding structure formed by stacking copper foils. Due to the high reliability, flexibility (bendability) and foldability of the flexible printed circuit board (commonly known as FPC), it is easy to assemble and not prone to wrinkling and cracking. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0024] Figure 1This is a schematic structural diagram of an embodiment of an electromagnetic ultrasonic thickness gauge probe of the present application;
[0025] Figure 2 for Figure 1 A schematic cross-sectional view of an embodiment of a component integrated in a flexible printed circuit board in an unfolded state;
[0026] Figure 3 for Figure 1 A front view of an embodiment of a component integrated in a flexible printed circuit board in an unfolded state;
[0027] Figure 4 for Figure 1 A schematic structural diagram of an embodiment of a component integrated in a flexible printed circuit board in a wound state;
[0028] Figure 5 for Figure 1 A schematic structural diagram of an embodiment in which a component integrated in a flexible printed circuit board is wound around a magnet. DETAILED DESCRIPTION
[0029] The embodiments of the present application are described in detail below with reference to the accompanying drawings.
[0030] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0031] As described in the background technology section, the magnetic field shielding structure of the existing ultrasonic thickness gauge probe is mostly formed in the form of stacked copper foils, but the copper foils are prone to wrinkling and cracking when assembled around the magnet.
[0032] Therefore, see Figures 1 to 5 As shown, the embodiment of the present application provides an electromagnetic ultrasonic thickness gauge probe, which is used to solve the problem that the copper foil is easily wrinkled and broken in the magnetic field shielding scheme of the existing ultrasonic thickness gauge excitation coil. The probe includes:
[0033] Shell 1: has a receiving cavity for protecting internal components.
[0034] Magnet 2: embedded in the accommodating cavity, responsible for generating a magnetic field to excite the object to be measured and receiving the reflected ultrasonic signal.
[0035] The magnetic field shielding layer 3 is located at the bottom of the magnet 2 and is used to shield external electromagnetic interference. The magnetic field shielding layer 3 includes a multi-layer structure of a flexible printed circuit board (FPC), and each of at least two layers of the multi-layer structure of the flexible printed circuit board has a copper cladding layer, which can effectively reduce magnetic field leakage and improve the shielding effect.
[0036] The excitation coil 4 is located below the magnetic field shielding layer 3 and is used to provide an excitation signal to generate ultrasonic waves and measure physical parameters of the object being measured, such as thickness.
[0037] The electromagnetic ultrasonic thickness gauge probe provided in the embodiment of the present application uses a flexible printed circuit board with a multi-layer structure as the magnetic field shielding layer 3, which effectively improves the magnetic field shielding effect and reduces the influence of external electromagnetic interference on the measurement.
[0038] Furthermore, a magnetic field shielding layer 3 is formed by a multi-layer structure of a flexible printed circuit board, replacing the original shielding structure formed by copper foil stacking. Due to the high reliability, flexibility (bendability) and foldability of the flexible printed circuit board (commonly known as FPC), it is easy to assemble and not prone to wrinkling and cracking, thereby avoiding the wrinkling and cracking problems that are prone to occur in the traditional copper foil stacking method, and improving the stability and durability of the probe.
[0039] In some embodiments, the probe further includes: an interface board 5, which is located above the magnet 2 and integrated into the flexible printed circuit board to achieve electrical connection with the tester host.
[0040] In this embodiment, by integrating the interface board 5 on the flexible printed circuit board, the assembly process of the probe is simplified, the number of assembled parts is reduced, and the production efficiency is improved. In addition, the integrated design of the interface board 5 can improve the overall working reliability of the probe.
[0041] The magnetic field shielding layer 3, the interface board 5 and the excitation coil 4 are all integrated into the flexible printed circuit board to form the core component of the probe, which simplifies the structural design of the probe, reduces the number of parts and components, and improves the overall stability and reliability.
[0042] In some embodiments, the magnetic field shielding layer 3, the interface board 5 and the excitation coil 4 are integrated into a flexible printed circuit board. Similar to the above embodiments, in the present application, the integration of the probe is further improved, which can greatly simplify the manufacturing and assembly process of the probe and improve the working reliability of the probe.
[0043] Specifically, an insulating layer is provided between adjacent copper clad layers. Thus, by providing an insulating layer between adjacent copper clad layers, the current between the shielding layers can be prevented from flowing directly, which helps to reduce common-mode interference. Among them, common-mode interference is caused by the coupling between the electromagnetic field and the shielding layer. If there is no insulation isolation between the shielding layers, the common-mode interference may propagate between the shielding layers, affecting the magnetic field shielding performance of the device. Therefore, by providing an insulating layer between the copper clad layers, the electromagnetic shielding effect can be effectively improved.
[0044] In some embodiments, the flexible printed circuit board is further provided with a coil connection point 12, and a coil coupling position 6 is provided near the coil connection point 12. The coil coupling position 6 is integrated on the surface of the printed circuit board, or the coil coupling position 6 is built into the flexible printed circuit board. The design of the coil coupling position 6 enables the excitation coil 4 to be firmly fixed at a predetermined position, thereby reducing measurement errors caused by vibration or impact.
[0045] In some embodiments, the contour shape of the coil coupling position 6 is adapted to the contour shape of the magnetic field shielding layer 3 to ensure better positional correspondence between the coil and the magnetic field shielding layer 3 .
[0046] In some embodiments, the interface board 5 is electrically connected to the coil connection point 7 through a cable, and a first cable shielding layer 8 and a second cable shielding layer 9 are attached to both sides of the cable, and the first cable shielding layer 8 and the second cable shielding layer 9 extend to cover the surface of the interface board 5, and the portion where the first cable shielding layer 8 and the second cable shielding layer 9 extend to cover the surface of the interface board 5 is located on the upper part of the magnet 2. In this way, the interference from the magnet 2 can be effectively reduced, and the stability of signal transmission can be improved.
[0047] The first cable shielding layer 8 and the second cable shielding layer 9 may also be formed by the copper cladding layer of the FPC.
[0048] Specifically, the interface board 5 has conductive contacts 51 , and the conductive contacts 51 are exposed on the surface of the flexible printed circuit board to facilitate connection with external electrical components.
[0049] In order to provide physical anti-collision protection for the interface board 5 , in some embodiments, a reinforcing plate 10 for supporting the interface board 5 is provided at the bottom of the flexible printed circuit board at a position corresponding to the interface board 5 .
[0050] A magnetic concentrator 11 is provided in the accommodating cavity, between the lower part of the coil magnetic field shielding layer 3 and the excitation coil 4. The magnetic concentrator 11 is a component used to enhance the alternating magnetic field of the excitation coil 4, and may be made of magnetic material or other types of materials to improve the output power of the excitation coil 4 and the excitation efficiency of the electromagnetic ultrasonic wave. The magnetic concentrator 11 is located in the space between the lower part of the coil magnetic field shielding part and the excitation coil 4, so as to facilitate the alignment and adjustment of the magnetic concentrator 11 and the excitation coil 4. The magnetic concentrator 11 may be a cylindrical, annular or other shaped structure to meet the requirements of different spaces and shapes.
[0051] Based on the technical concept of the aforementioned embodiment, the present invention also provides an electromagnetic ultrasonic thickness gauge according to an embodiment, comprising: a thickness gauge host, the thickness gauge host having a probe connector;
[0052] The electromagnetic ultrasonic thickness gauge probe described in any of the above embodiments, the interface board 5 of the electromagnetic ultrasonic thickness gauge probe is connected to the probe connector to realize the transmission and reception of ultrasonic test signals.
[0053] In summary, the electromagnetic ultrasonic thickness gauge probe and thickness gauge provided in the embodiments of the present application use a multi-layer FPC structure to form a magnetic field shielding layer 3, replacing the original shielding structure formed by stacked copper foils. Due to the high reliability, flexibility (bendability) and foldability of the FPC, it is easy to assemble and not prone to wrinkling and cracking.
[0054] Furthermore, by adopting a multi-layer FPC board to achieve electromagnetic shielding function, the copper clad layer structure of the FPC board achieves the same function of multi-layer copper foil, and is thinner; moreover, adjacent copper clad layers are insulated, and the effect is better than the multi-layer copper foil structure. Since the FPC has good flexibility and strong bendability, the problem of wrinkling and cracking in the copper foil winding assembly is solved.
[0055] It should be noted that, in this article, the terms "upper", "lower", etc., indicating the orientation or positional relationship, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. Relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise", or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such a process, method, article, or device. In the absence of more restrictions, the elements defined by the phrase "comprising a ..." do not exclude the existence of other identical elements in the process, method, article or device comprising the elements. For ordinary technicians in this field, it can be understood by specific circumstances.
[0056] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims
1. An electromagnetic ultrasonic thickness gauge probe, characterized in that: include: A housing having a receiving cavity; A magnet, embedded in the accommodating cavity; A magnetic field shielding layer is located at the bottom of the magnet, the magnetic field shielding layer comprises a flexible printed circuit board with a multi-layer structure, and each of at least two layers of the flexible printed circuit board with a multi-layer structure has a copper cladding layer; The excitation coil is located below the magnetic field shielding layer.
2. The electromagnetic ultrasonic thickness gauge probe according to claim 1, characterized in that: Also includes: The interface board is located above the magnet and is integrated with the magnetic field shielding layer on the flexible printed circuit board.
3. The electromagnetic ultrasonic thickness gauge probe according to claim 2, characterized in that: The magnetic field shielding layer, the interface board and the excitation coil are integrated into a flexible printed circuit board.
4. The electromagnetic ultrasonic thickness gauge probe according to claim 1, characterized in that: An insulating layer is provided between adjacent copper clad layers.
5. The electromagnetic ultrasonic thickness gauge probe according to claim 1, characterized in that: The flexible printed circuit board is also provided with a coil connection point, and a coil coupling position is provided near the coil connection point. The coil coupling position is integrated on the surface of the printed circuit board, or the coil coupling position is built into the flexible printed circuit board.
6. The electromagnetic ultrasonic thickness gauge probe according to claim 1, characterized in that: The contour shape of the coil coupling position is adapted to the contour shape of the magnetic field shielding layer.
7. The electromagnetic ultrasonic thickness gauge probe according to claim 2, characterized in that: The interface board is electrically connected to the coil connection point through a cable, and a first cable shielding layer and a second cable shielding layer are attached to both sides of the cable. The first cable shielding layer and the second cable shielding layer extend to cover the surface of the interface board, and the part of the first cable shielding layer and the second cable shielding layer extending to cover the surface of the interface board is located on the upper part of the magnet.
8. The electromagnetic ultrasonic thickness gauge probe according to claim 2, characterized in that: The interface board has conductive contacts, and the conductive contacts are exposed on the surface of the flexible printed circuit board.
9. The electromagnetic ultrasonic thickness gauge probe according to claim 2, characterized in that: A reinforcing plate for supporting the interface board is also provided at the bottom of the flexible printed circuit board, at a position corresponding to the interface board.
10. The electromagnetic ultrasonic thickness gauge probe according to claim 1, characterized in that: A magnetic field concentrator is provided in the accommodating cavity between the lower part of the coil magnetic field shielding layer and the excitation coil.
11. An electromagnetic ultrasonic thickness gauge, characterized in that: include: A thickness gauge host, wherein the thickness gauge host has a probe connector; The electromagnetic ultrasonic thickness gauge probe according to any one of claims 1 to 10, wherein the interface board of the electromagnetic ultrasonic thickness gauge probe is docked with the probe connector.
Citation Information
Cited By
Electromagnetic ultrasonic thickness gauge probe, assembling method and thickness gauge
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