Fire alarm and fire alarm system
By using passive thermoelectric chips and signal processors in fire alarms, the problem of low timeliness and reliability of fire alarms in the prior art is solved, especially in a power-free environment, which can work effectively, achieving higher timeliness and reliability of fire detection.
Patent Information
- Application Number
- CN202421187130.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-05-27
AI Technical Summary
When existing fire alarms depend on the diffusion of smoke or harmful gases during fire, they have low timeliness, and thermal induction technology is less suitable in a power-free environment, which affects its reliability.
Passive thermoelectric chips are used as temperature sensors, and the Seebeck effect is used to generate electrical signals spontaneously when the ambient temperature changes, and combined with the signal processor for signal processing and wireless transmission to achieve timely detection and alarm of fires.
It improves the timeliness and reliability of fire alarms, especially in power-free environments, and is suitable for remote areas, wild environments or temporary buildings and other scenarios.
Smart Images
Figure CN222636691U_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of fire safety technology, and more particularly to a fire alarm and a fire alarm system. Background Art
[0002] As an important device for preventing fires, the accuracy and reliability of fire alarms play a vital role in protecting people's lives and property. At present, fire alarms mainly use photoelectric sensing technology, thermal sensing technology and gas sensing technology to achieve fire early warning.
[0003] Photoelectric sensing technology determines the occurrence of fire by detecting the scattering or blocking of light by smoke, while gas sensing technology determines the possibility of fire by detecting smoke or harmful gas components in the air. However, these two technologies mainly rely on the generation and diffusion of smoke or harmful gases for detection, so there is a lag. In some cases, when a fire has occurred but the smoke or harmful gases have not yet spread to the vicinity of the detector, these two technologies may not be able to issue early warning signals in time, resulting in the timeliness of the fire warning being affected.
[0004] Although thermal sensing technology can detect the occurrence of fire by detecting temperature changes, current thermal sensing fire alarms require power to power the temperature sensor to achieve temperature detection. In some scenarios where it is inconvenient to provide power, such as remote areas, outdoor environments or temporary buildings, the applicability of this technology is low. At the same time, due to power supply limitations, the continuous working time and reliability of thermal sensing fire alarms are also affected to a certain extent.
[0005] Therefore, how to improve the reliability of fire alarms is a problem that those skilled in the art currently need to solve. Utility Model Content
[0006] The purpose of the present application is to provide a fire alarm and a fire alarm system, aiming to solve the problem of low reliability of fire alarms in traditional technologies.
[0007] A first aspect of an embodiment of the present application provides a fire alarm, comprising:
[0008] A temperature sensor, used to detect the ambient temperature of the scene where the fire alarm is located and send a temperature detection signal;
[0009] A signal processor, used to receive the temperature detection signal and output a processing signal according to the temperature detection signal, wherein the processing signal is used to characterize the temperature data of the scene where the fire alarm is located;
[0010] The temperature sensor is a passive thermoelectric sheet, and the passive thermoelectric sheet is configured to send the temperature detection signal when the ambient temperature on one side of the passive thermoelectric sheet is different from the ambient temperature on the other side of the passive thermoelectric sheet.
[0011] In some embodiments of the present application, a semiconductor electric couple arm is provided in the thermoelectric sheet, and the semiconductor electric couple arm is used to output the temperature detection signal according to the temperature at both sides of the semiconductor electric couple arm.
[0012] In some embodiments of the present application, the semiconductor electric couple arm includes a plurality of semiconductor guide plates, and the plurality of semiconductor guide plates are arranged in series.
[0013] In some embodiments of the present application, the signal processor includes a signal amplifying unit, the signal amplifying unit includes a first chip and a charging capacitor, the first chip has an input pin and an output pin, the input pin is connected to the temperature sensor and is used to receive the temperature detection signal; both ends of the charging capacitor are connected to the output pin;
[0014] Among them, an amplified signal output terminal is arranged between one end of the charging capacitor and the output pin, and the amplified signal output terminal is configured to output an amplified temperature detection signal according to the level signal of the output pin when the input pin receives the temperature detection signal.
[0015] In some embodiments of the present application, the signal amplification unit also includes a first resistor and a second resistor, the resistance value of the first resistor is greater than the resistance value of the second resistor, the output pin is connected between the first resistor and the second resistor, the other end of the first resistor is connected to the amplified signal output end, and the other end of the second resistor is connected to the other end of the charging capacitor that is not connected to the amplified signal output end.
[0016] In some embodiments of the present application, the charging capacitor includes a first capacitor and a second capacitor connected in parallel with each other, and the capacitance value of the first capacitor is greater than the capacitance value of the second capacitor.
[0017] In some embodiments of the present application, the signal processor also includes a voltage stabilizing unit, which includes a second chip and a voltage stabilizing capacitor, one end of the second chip is used to receive the amplified temperature detection signal, and the other end is connected to the voltage stabilizing capacitor, the other end of the voltage stabilizing capacitor is grounded, and a voltage stabilizing signal output end is provided at the connection between the voltage stabilizing capacitor and the second chip, and the voltage stabilizing signal output end is used to output a voltage stabilizing signal, and the voltage value of the voltage stabilizing signal is less than the voltage value of the amplified temperature detection signal.
[0018] In some embodiments of the present application, the signal processor also includes a single-chip microcomputer and a wireless signal sending unit, the single-chip microcomputer is used to receive and output a communication signal based on the voltage stabilization signal, the wireless signal sending unit is used to receive and output the processed signal based on the communication signal, and the processed signal is a wireless communication signal.
[0019] In a second aspect, the present application also provides a fire alarm system, comprising a signal receiver and the above-mentioned fire alarm, wherein the signal receiver is used to receive the processed signal and display the temperature data of the scene where the fire alarm is located according to the processed signal.
[0020] In some embodiments of the present application, there are multiple fire alarms, the multiple fire alarms are arranged in different areas, and the signal receiver receives processed signals sent by different fire alarms through different serial ports.
[0021] Compared with the prior art, the embodiments of the utility model have the following beneficial effects: the above-mentioned fire alarm and fire alarm system, the fire alarm includes a temperature sensor and a signal processor, the temperature sensor is used to detect the ambient temperature of the scene where the fire alarm is located, and sends out a temperature detection signal; the signal processor is used to receive the temperature detection signal, and output a processing signal according to the temperature detection signal, and the processing signal is used to characterize the temperature data of the scene where the fire alarm is located; on the one hand, the present application detects fire by detecting temperature, and a detection signal can be sent out as long as the ambient temperature rises, which is conducive to improving the timeliness of detection, and thus is conducive to improving the reliability of the fire alarm; on the other hand, the present application sets the temperature sensor as a passive thermoelectric sheet, and the passive thermoelectric sheet is configured to send out a temperature detection signal when the ambient temperature on one side of the passive thermoelectric sheet is different from the ambient temperature on the other side of the passive thermoelectric sheet, and the passive thermoelectric sheet does not need to be driven by a power supply, but when the ambient temperature is high, it spontaneously generates an electrical signal as a temperature detection signal, which is conducive to improving the reliability of the fire alarm in some scenes without power supply. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 A schematic diagram of the framework structure of a fire alarm provided in one embodiment of the present application;
[0023] Figure 2 A schematic diagram of the framework structure of a fire alarm provided in another embodiment of the present application;
[0024] Figure 3 A schematic diagram of the circuit structure of a fire alarm provided in one embodiment of the present application;
[0025] Figure 4 A schematic diagram of the circuit structure of a fire alarm provided in another embodiment of the present application;
[0026] Figure 5 A schematic diagram of the framework structure of a fire alarm provided in yet another embodiment of the present application;
[0027] Figure 6 A schematic diagram of the framework structure of a fire alarm system provided in yet another embodiment of the present application;
[0028] Figure 7 A schematic diagram of the framework structure of a fire alarm system provided in yet another embodiment of the present application.
[0029] Explanation of specific element symbols: 100-temperature sensor, 200-signal processor, 210-signal amplification unit, 220-voltage stabilization unit, 230-single-chip microcomputer, 240-wireless signal sending unit, 300-signal receiver, 400-fire alarm, L1-first inductor, R1-first resistor, R2-second resistor, R3-third resistor, C1-first capacitor, C2-second capacitor, C3-third capacitor, C4-fourth capacitor, C5-fifth capacitor, C6-sixth capacitor, C7-seventh capacitor, C8-eighth capacitor, U1-first chip, U2-second chip. DETAILED DESCRIPTION
[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0031] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0032] It should be understood that the terms "length", "width", "up", "down", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0034] It is important to know that with the development of modern society, the continuous improvement of the living standards of the whole people and the widespread popularity of electrical appliances, the risk of electrical fires has become increasingly significant. This risk is not only due to the failure of the electrical appliances themselves, but is also often exacerbated by factors such as improper use and untimely maintenance. In recent years, residential fires have been relatively frequent, but it should be noted that abnormal climate and continued high temperatures in recent years have also provided conditions for the frequent occurrence of fires. Especially in forest areas, these unfavorable climatic conditions have greatly increased the risk of forest fires. The increase in fires has undoubtedly put forward higher requirements for fire prevention and emergency rescue work, and the demand for fire sensors has continued to grow. As an important device for preventing fires, the accuracy and reliability of fire alarms play a vital role in protecting people's lives and property.
[0035] At present, fire alarms mainly use photoelectric sensing technology, thermal sensing technology and gas sensing technology to achieve early warning of fire. Photoelectric sensing technology determines the occurrence of fire by detecting the scattering or blocking of light by smoke. Photoelectric sensing technology realizes smoke detection by sending and receiving light signals. It usually consists of two main components: a light source and a light receiver. The light source is usually a light emitting diode (LED) or a laser diode, which is used to emit a light beam. The light receiver is usually a photoresistor or a photodiode, which is used to receive the light beam. When there is no smoke, the light intensity received by the light receiver is higher; when smoke enters, the scattering of light by smoke particles weakens the light intensity received by the light receiver. By monitoring the changes in the received light intensity, the system can determine whether there is smoke and issue a corresponding alarm.
[0036] Gas sensing technology determines the possibility of fire by detecting smoke or harmful gas components in the air. Gas sensing technology detects the concentration of specific gases in the environment based on the changes in electrical properties caused by the interaction between gas and sensor sensitive elements. Gas sensors are usually composed of an oxide sensitive element, such as zinc oxide, tin oxide, etc. The electrical properties (such as resistance and conductivity) of these oxides will change under different gas environments. When the target gas comes into contact with the sensitive element, the gas molecules will adsorb on the surface of the sensitive element, changing the electrical properties of the sensitive element, such as changes in resistance value. At the same time, different gases have different effects on sensitive elements, so different gases can be distinguished by the way they affect the sensitive elements. By measuring the influence of the electrical properties of the sensitive element of the gas, the gas concentration of a specific gas, such as gases that are easily produced by fire, such as smoke, carbon monoxide and carbon dioxide, can be inferred, so as to determine whether a fire has occurred.
[0037] However, photoelectric sensing technology and gas sensing technology mainly rely on the generation and diffusion of smoke or harmful gases for detection, so there is a lag. In some cases, when a fire has occurred but the smoke or harmful gases have not yet spread to the vicinity of the detector, these two technologies may not be able to issue early warning signals in time, resulting in the timeliness of fire warnings being affected. In addition, photoelectric sensing technology and gas sensing technology also have the problem of excessive sensitivity. Such sensors may produce false alarms for cooking steam, dust, etc. And they cannot accurately detect hidden fires, such as fires hidden inside walls or ceilings.
[0038] Therefore, thermal sensing technology is often used for fire warning. Thermal sensing technology detects the presence of fire by monitoring changes in ambient temperature. In a fire alarm using thermal sensing technology, one or more temperature sensors can be provided. A temperature sensor is a device that can detect temperature changes, such as a thermistor, a thermocouple, or an infrared sensor. Thermistor sensors are usually made of a temperature-sensitive semiconductor material, such as iron oxide, zinc oxide, etc. The resistance values of these materials vary at different temperatures. When the temperature rises, the free electron activity in the material increases and the resistance decreases; when the temperature decreases, the electron activity decreases and the resistance increases. Based on this principle, the thermistor sensor can indirectly measure the temperature of the environment by measuring its resistance value.
[0039] Usually thermistor sensors are connected to a circuit, which provides a stable current or voltage, and the temperature change is inferred by measuring the change in voltage or current. Thermocouple sensors are usually composed of two wires of different metal conductors, and the junction of the two conductors is called a thermocouple point. According to the Seebeck principle, when the thermocouple point of the thermocouple is in contact with the environment of the measured temperature, the two metal conductors are at different temperatures, and the resulting temperature difference potential will form a voltage signal at both ends of the thermocouple. There is a certain relationship between this voltage signal and the thermoelectric properties of the thermocouple and the measured temperature, and it can be used to monitor the temperature change of the environment. The principle of infrared sensors is based on infrared radiation emitted or reflected by objects. Infrared sensors usually include infrared transmitters and infrared receivers. The transmitter emits infrared radiation, and the receiver is used to receive infrared radiation emitted or reflected by the object. When infrared rays are irradiated on the receiver, it generates a corresponding electrical signal. When the temperature of the object changes, the infrared radiation emitted or reflected by it will also change. The amount of infrared radiation received by the sensor also changes accordingly, thereby generating a corresponding change in the electrical signal. By processing and analyzing the received electrical signals, the temperature information of the object can be determined, and when the temperature is higher than the alarm setting value, a fire alarm can be issued.
[0040] However, although the current thermal sensing technology can detect the occurrence of fire by detecting temperature changes, the current thermal sensing fire alarm requires power to power the temperature sensor to achieve temperature detection. In some scenarios where it is inconvenient to provide power, such as remote areas, outdoor environments or temporary buildings, the applicability of this technology is low. At the same time, due to power supply limitations, the continuous working time and reliability of thermal sensing fire alarms are also affected to a certain extent.
[0041] Therefore, the present application improves the relevant fire alarm and fire alarm system based on this.
[0042] See also Figure 1 , Figure 1 The schematic diagram of the framework structure of the fire alarm 400 provided in the present embodiment is shown. A fire alarm 400 of the present embodiment includes a temperature sensor 100 and a signal processor 200. The temperature sensor 100 is used to detect the ambient temperature of the scene where the fire alarm 400 is located and send a temperature detection signal; the signal processor 200 is used to receive the temperature detection signal and output a processing signal according to the temperature detection signal, and the processing signal is used to characterize the temperature data of the scene where the fire alarm 400 is located; the temperature sensor 100 is a passive thermoelectric sheet, and the passive thermoelectric sheet is configured to send a temperature detection signal when the ambient temperature on one side of the passive thermoelectric sheet is different from the ambient temperature on the other side of the passive thermoelectric sheet.
[0043] It should be explained that the fire alarm 400 in this embodiment uses thermal sensing technology to warn of fire. The temperature sensor 100 can detect temperature changes, and the signal processor 200 can process the signal of the temperature sensor 100 and send it out. The passive thermoelectric chip is a semiconductor thermoelectric chip. Through the Seebeck effect, when the temperature rises without an external power supply, the semiconductor thermoelectric chip will spontaneously output a voltage to drive the single-chip computer 230 to operate.
[0044] The current fire alarm 400 mostly uses gas-sensitive and light-sensitive sensors, which can only detect smoke, etc., and has the problems of low timeliness and low reliability. For the fire alarm 400 that uses a metal thermocouple as the temperature sensor 100, it needs to rely on an external power supply to realize the temperature detection work. However, on the one hand, the present application detects fire by detecting temperature, and a detection signal can be issued as long as the ambient temperature rises, which is conducive to improving the timeliness of detection, and thus is conducive to improving the reliability of the fire alarm 400; on the other hand, the present application sets the temperature sensor 100 as a passive thermoelectric sheet, and the passive thermoelectric sheet is configured to send a temperature detection signal when the ambient temperature on one side of the passive thermoelectric sheet is different from the ambient temperature on the other side of the passive thermoelectric sheet. The passive thermoelectric sheet does not need to be driven by a power supply, but when the ambient temperature is high, it spontaneously generates an electrical signal as a temperature detection signal, which is conducive to improving the reliability of the fire alarm 400 in some scenarios without power supply.
[0045] In some embodiments of the present application, a semiconductor couple arm is provided in the thermoelectric sheet, and the semiconductor couple arm is used to output a temperature detection signal according to the temperature on both sides of the semiconductor couple arm. It should be explained that the thermoelectric sheet (also called a thermocouple or a thermopile) is a temperature measurement device based on the thermoelectric effect (also called the Seebeck effect). It is usually composed of two different semiconductor materials (such as copper and constantan), which are connected together to form a couple arm (or thermocouple). When there is a temperature difference between the two junctions of the thermocouple (usually called the hot end and the cold end), it will generate a potential difference between the couple arms, and this potential difference can be measured and converted into a temperature value.
[0046] In some embodiments of the present application, the semiconductor electric couple arm includes a plurality of semiconductor guide plates, and the plurality of semiconductor guide plates are arranged in series.
[0047] In some embodiments of this application, please refer to Figure 2 and Figure 3 , Figure 2 The frame structure diagram of the fire alarm 400 provided in this embodiment is as follows: Figure 3 The circuit structure diagram of the fire alarm 400 provided in this embodiment is shown. The signal processor 200 of this embodiment includes a signal amplifying unit 210, which includes a first chip U1 and a charging capacitor. The first chip U1 has an input pin and an output pin. The input pin is connected to the temperature sensor 100 and is used to receive the temperature detection signal; the two ends of the charging capacitor are connected to the output pin; wherein an amplified signal output terminal is provided between one end of the charging capacitor and the output pin, and the amplified signal output terminal is configured to output an amplified temperature detection signal according to the level signal of the output pin when the input pin receives the temperature detection signal.
[0048] It should be explained that the model of the first chip U1 can be SX1308, and the charging capacitor is a farad capacitor. In some embodiments, the temperature detection signal output by the thermoelectric chip is 1.2V, and the amplified temperature detection signal output by the signal amplification unit 210 is 5V. The input pin can be the VIN pin of the first chip U1, and the output pin can be the FB pin of the first chip U1.
[0049] In some embodiments of this application, please continue to refer to Figure 3 The signal amplifying unit 210 of this embodiment further includes a first resistor R1 and a second resistor R2, the resistance value of the first resistor R1 is greater than the resistance value of the second resistor R2, the output pin is connected between the first resistor R1 and the second resistor R2, the other end of the first resistor R1 is connected to the amplified signal output end, and the other end of the second resistor R2 is connected to the other end of the charging capacitor that is not connected to the amplified signal output end.
[0050] In some embodiments, the resistance value of the first resistor R1 is 110KΩ, and the resistance value of the second resistor R2 is 15KΩ.
[0051] In some embodiments of this application, please continue to refer to Figure 3 The charging capacitor of this embodiment includes a first capacitor C1 and a second capacitor C2 connected in parallel with each other, and the capacitance value of the first capacitor C1 is greater than the capacitance value of the second capacitor C2.
[0052] In some embodiments, the capacitance value of the first capacitor C1 is 22 μF, and the capacitance value of the second capacitor C2 is 100 nF.
[0053] In some embodiments of the present application, the signal amplification unit 210 of the present embodiment further includes a third capacitor C3, one end of the third capacitor C3 is connected between the second resistor R2 and the ground point, and the other end is connected to the EN pin of the first chip U1. The signal amplification unit 210 further includes a third resistor R3 and a first inductor L1, the third resistor R3 and the first inductor L1 are connected in series, one end of the third resistor R3 away from the first inductor L1 is used to receive the temperature detection signal, the first inductor L1 is connected to the SW pin of the first chip U1, and the input pin of the first chip U1 is connected between the third resistor R3 and the first inductor L1.
[0054] In some embodiments of this application, please refer to Figure 2 and see Figure 4 , Figure 4A schematic diagram of the circuit structure of the fire alarm 400 provided in this embodiment is shown; this embodiment also includes a voltage stabilizing unit 220, the voltage stabilizing unit 220 includes a second chip U2 and a voltage stabilizing capacitor, one end of the second chip U2 is used to receive the amplified temperature detection signal, the other end is connected to the voltage stabilizing capacitor, the other end of the voltage stabilizing capacitor is grounded, and a voltage stabilizing signal output terminal is provided at the connection between the voltage stabilizing capacitor and the second chip U2, the voltage stabilizing signal output terminal is used to output a voltage stabilizing signal, and the voltage value of the voltage stabilizing signal is less than the voltage value of the amplified temperature detection signal.
[0055] It is understandable that during a fire, the temperature sensed by the thermoelectric element is not stable, and the temperature detection signal output by the thermoelectric element is also unstable. A relatively stable voltage stabilization signal can be output through the voltage stabilization signal for subsequent analysis and detection.
[0056] In some embodiments, the model of the second chip U2 is AIF117-3.3, and can output a stable voltage of 3.3V through the voltage stabilizing unit 220 .
[0057] In some embodiments, the voltage stabilizing capacitor includes a fourth capacitor C4, one end of which is connected to the pin of the second chip U2 for receiving the amplified temperature detection signal, and the other end is connected between the ground pin and the ground point of the second chip U2. The voltage stabilizing capacitor also includes a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7 and an eighth capacitor C8, one end of the fifth capacitor C5 is connected to the pin of the second chip U2 for outputting the voltage stabilizing signal, and the other end is connected between the ground pin and the ground point of the second chip U2; the sixth capacitor C6 is connected in parallel with the fifth capacitor C5, the seventh capacitor C7 is connected in parallel with the fifth capacitor C5, and the eighth capacitor C8 is connected in parallel with the fifth capacitor C5.
[0058] In some embodiments of this application, please refer to Figure 5 , Figure 5 A schematic diagram of the framework structure of the fire alarm 400 provided in this embodiment is shown; the signal processor 200 of this embodiment also includes a single-chip microcomputer 230 and a wireless signal sending unit 240, the single-chip microcomputer 230 is used to receive and output a communication signal according to the voltage-stabilized signal, and the wireless signal sending unit 240 is used to receive and output a processed signal according to the communication signal, and the processed signal is a wireless communication signal.
[0059] In some embodiments, the wireless signal sending unit 240 is a test rack.
[0060] In some embodiments, the model of the single chip microcomputer 230 may be STM32F030F4P6TR. The single chip microcomputer 230 may output the input voltage regulated signal from the RX and TX ports as a signal, which is then input from the RX and TX ports of the wireless signal transmitting unit 240 and then output from the antenna end as a wireless signal.
[0061] In some embodiments, the signal processor 200 further includes a burning unit, a reset unit, a passive crystal oscillator unit, and an indication unit. The passive crystal oscillator unit is connected to the OSC_IN and OSC_OUT ports of the single-chip microcomputer 230 as a clock reference source. The reset unit enables the single-chip microcomputer 230 to work again after sending a signal again. The burning unit is responsible for writing the pre-written program into the non-volatile memory inside the chip. The indication unit indicates the sending of the signal by lighting up the LED light.
[0062] Further, in order to better implement the fire alarm 400 in any of the above embodiments, on the basis of the fire alarm 400, please refer to Figure 6 , Figure 6 A schematic diagram of the framework structure of the fire alarm system provided in this embodiment is shown; the present application also provides a fire alarm system, including a signal receiver 300 and the above-mentioned fire alarm 400, the signal receiver 300 is used to receive the processed signal and display the temperature data of the scene where the fire alarm 400 is located according to the processed signal.
[0063] In some embodiments, the working distance of the signal receiver 300 is 3 km, and the sensing range is 28.27 square kilometers. The signal receiver 300 can be composed of an HC-14 module and an HC-T test stand. The signal sent by the signal processor 200 is received by the antenna of the test stand, output by its RX and TX ports, and accepted by the HC-14 module. The indicator light turns from red to green, the signal is input into the computer program, and the logo of the corresponding serial port turns from green to red, indicating an abnormality, indicating that the temperature of the area where the sensor corresponding to the serial port is located is abnormal, and a fire may occur.
[0064] In some embodiments, the signal receiver 300 includes a lora communication module (the main control chip is sx1278), and sends and receives information through the lora communication module. Fire monitoring can be achieved in a relatively wide range. In addition, the thermoelectric fire sensor has a simple structure, which makes it easy to move and install, and has a wide range of application scenarios. It can be used in industrial scenes, outdoor scenes, and can also meet personal needs. In addition, compared with metal thermocouples, the thermoelectric sheet in the above embodiment is composed of a ceramic insulating layer, a metal conductor, and N&P type doped bismuth telluride, which has stronger antioxidant ability and lower requirements on conditions such as humidity and air oxygen content, further expanding the applicable scenarios of thermoelectric sheet fire sensors.
[0065] In some embodiments of this application, please refer to Figure 7 , Figure 7The schematic diagram of the framework structure of the fire alarm system provided in this embodiment is shown; there are multiple fire alarms 400, and the multiple fire alarms 400 are arranged in different areas, and the signal receiver 300 receives the processed signals sent by different fire alarms 400 through different serial ports. By setting different serial port values in the program, multiple transmissions and one reception can be achieved to monitor the fire conditions in multiple locations.
[0066] It is understandable that the fire alarm 400 in the above embodiment can be installed in outdoor scenes such as forests. Since forest fires may occur in a wide area and at random times, it is difficult to replace the power supply of forest fire sensors. The characteristic of thermoelectric sheets that can spontaneously generate electrical signals solves the dependence of the sensor on power supply and greatly facilitates the fire monitoring of forest fires.
[0067] In some embodiments, the model of the thermoelectric sheet is TEG1-127-2.0-6. Under the conditions of 30°C on the cold side, 200°C on the hot side, and a temperature difference of 170°C, the open circuit voltage is 7.5V, the matching load voltage is 4V, the matching load current is 1.0A, and the matching power is 4W. The voltage required for the normal operation of the single-chip microcomputer 230 is 2V, and the thermoelectric sheet can output a voltage of 4V at a temperature difference of 170°C. Therefore, the temperature difference (150-300°C) at the initial stage of a forest fire matches the operating temperature difference of the fire alarm 400. In addition, if the initial temperature difference reaches the operating voltage of the single-chip microcomputer 230, the fire sensor can alarm without maintaining the temperature difference between the cold and hot surfaces, ensuring that the fire alarm 400 can work normally and autonomously.
[0068] The advantage of the present application is that the present application uses a semiconductor thermal energy thermoelectric power generation sheet as a temperature sensor. When a fire occurs, the temperature difference causes the charge carriers in the semiconductor thermocouple to move in a directional manner, forming a current and outputting an electrical signal without loading an external current. At the same time, semiconductor thermocouples are more sensitive than metal conductor thermocouples, and are more conducive to detecting fires in the early stages. In addition, the integrated circuit converts the output electrical signal of the thermoelectric sheet into a wireless signal, realizing long-distance signal transmission and reception. The receiving program receives and distinguishes multiple sensor signals by setting different serial port values, achieving the function of detecting multiple fires at the same time. By changing the selection of the thermoelectric sheet, the sensitivity and detection range of the fire sensor can be easily controlled. It is expected that the fire sensor can be used in a wide range of scenarios, such as factories and residential buildings. In various special scenarios, especially in forests and other scenarios where there are high requirements for the monitoring range and self-sufficient power supply of the sensor, the thermoelectric fire sensor has more advantages than the traditional fire sensor.
[0069] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0070] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.
[0071] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.
[0072] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more utility model embodiments, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, drawing or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.
[0073] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.
Claims
1. A fire alarm, characterized in that: include: A temperature sensor, used to detect the ambient temperature of the scene where the fire alarm is located and send a temperature detection signal; A signal processor, used for receiving the temperature detection signal and outputting a processing signal according to the temperature detection signal, wherein the processing signal is used for representing the temperature data of the scene where the fire alarm is located; Wherein, the temperature sensor is a passive thermoelectric sheet, and the passive thermoelectric sheet is configured to send the temperature detection signal when the ambient temperature on one side of the passive thermoelectric sheet is different from the ambient temperature on the other side of the passive thermoelectric sheet; The thermoelectric sheet is provided with a semiconductor electric couple arm, and the semiconductor electric couple arm is used to output the temperature detection signal according to the temperature on both sides of the semiconductor electric couple arm; The signal processor includes a signal amplifying unit, the signal amplifying unit includes a first chip and a charging capacitor, the first chip has an input pin and an output pin, the input pin is connected to the temperature sensor and is used to receive the temperature detection signal; the two ends of the charging capacitor are connected to the output pin; Among them, an amplified signal output terminal is arranged between one end of the charging capacitor and the output pin, and the amplified signal output terminal is configured to output an amplified temperature detection signal according to the level signal of the output pin when the input pin receives the temperature detection signal.
2. The fire alarm according to claim 1, characterized in that: The semiconductor electric couple arm comprises a plurality of semiconductor guide plates, and the plurality of semiconductor guide plates are arranged in series.
3. The fire alarm according to claim 1, characterized in that: The signal amplifying unit also includes a first resistor and a second resistor, the resistance value of the first resistor is greater than the resistance value of the second resistor, the output pin is connected between the first resistor and the second resistor, the other end of the first resistor is connected to the amplified signal output end, and the other end of the second resistor is connected to the other end of the charging capacitor that is not connected to the amplified signal output end.
4. The fire alarm according to claim 1 or 3, characterized in that: The charging capacitor includes a first capacitor and a second capacitor connected in parallel with each other, and the capacitance value of the first capacitor is greater than the capacitance value of the second capacitor.
5. The fire alarm according to claim 1, characterized in that: The signal processor also includes a voltage stabilizing unit, which includes a second chip and a voltage stabilizing capacitor. One end of the second chip is used to receive the amplified temperature detection signal, and the other end is connected to the voltage stabilizing capacitor. The other end of the voltage stabilizing capacitor is grounded. A voltage stabilizing signal output end is provided at the connection between the voltage stabilizing capacitor and the second chip. The voltage stabilizing signal output end is used to output a voltage stabilizing signal. The voltage value of the voltage stabilizing signal is less than the voltage value of the amplified temperature detection signal.
6. The fire alarm according to claim 5, characterized in that: The signal processor also includes a single-chip microcomputer and a wireless signal sending unit. The single-chip microcomputer is used to receive and output a communication signal according to the voltage stabilization signal. The wireless signal sending unit is used to receive and output the processed signal according to the communication signal. The processed signal is a wireless communication signal.
7. A fire alarm system, characterized in that: It comprises a signal receiver and the fire alarm according to any one of claims 1 to 6, wherein the signal receiver is used to receive the processed signal and display the temperature data of the scene where the fire alarm is located according to the processed signal.
8. The fire alarm system according to claim 7, characterized in that: There are multiple fire alarms, which are arranged in different areas, and the signal receiver receives processing signals sent by different fire alarms through different serial ports.