Heat dissipation module and heat dissipation device
By designing a heat dissipation module with multiple phase change cooling chambers, the problem of insufficient liquid reflux of solid-liquid phase change radiator is solved, and a more efficient and uniform heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202420631027.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-28
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-03-28
AI Technical Summary
When existing solid-liquid phase change radiators cool the upper part of the heat source, the liquid reflux is insufficient, resulting in low heat dissipation efficiency.
A heat dissipation module is designed, including a plate body and a plurality of fins, with a second cavity inside the fin, and the second cavity of the plurality of fins is in communication with the first cavity to form a phase change cooling cavity. By adjusting the arrangement of the fins and the number and shape of the second cavity, the liquid is ensured to be sufficiently refluxed, and the phase change cooling chamber is connected through the communication pipe to improve heat dissipation efficiency.
It improves the uniformity and efficiency of heat dissipation, ensures that different heating zones of the heating parts can be cooled uniformly, and improves the heat dissipation ability.
Smart Images
Figure CN222638921U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of heat dissipation devices, and in particular to a heat dissipation module and a heat dissipation device. Background Art
[0002] With the continuous development of electronic technology and communication technology, the power of outdoor communication base stations continues to increase, and the requirements for the heat dissipation efficiency of radiators are getting higher and higher.
[0003] Solid-liquid phase change heat sinks have good constant temperature and large phase change latent heat, which can effectively solve the heat dissipation problem of high-power electronic devices that work in short periods of time and periodically. However, since the liquid reflux inside the phase change heat sink completely relies on gravity, the liquid inside the phase change heat sink is mainly concentrated in the lower part of the blown plate fins. For the heat source in the upper part of the phase change heat sink, there is no good liquid reflux, resulting in low heat dissipation efficiency and failure to achieve the expected effect. Utility Model Content
[0004] In view of this, the present application is dedicated to providing a heat dissipation module to solve the problem of poor heat dissipation effect. The present application also provides a heat dissipation device including the above heat dissipation module.
[0005] In order to achieve the above objectives, this application provides the following technical solutions:
[0006] A heat dissipation module, comprising:
[0007] The plate body is provided with a first cavity;
[0008] A fin having a second cavity inside, wherein a plurality of fins are provided, and the second cavities in the plurality of fins are all connected to the first cavity to form a phase change cooling cavity;
[0009] There are multiple first cavities, and the second cavity in any fin is arranged one-to-one with the first cavity to form a plurality of independent phase change cooling cavities, and the number and / or shape of the second cavities in at least two fins are different.
[0010] Optionally, in the arrangement direction of the fins, a distribution area of the second cavity in the fin located in the middle is greater than a distribution area of the second cavity in the fin located at the end.
[0011] Optionally, in the arrangement direction of the fins, the number of the second cavities in the fins located in the middle is greater than the number of the second cavities in the fins located at the ends.
[0012] Optionally, a connecting pipe is further included, wherein the connecting pipe connects the second cavities in at least two of the fins that are connected to the same first cavity.
[0013] Optionally, when the heat dissipation module is in a vertical working state, the connecting pipe is located in a top area of the second cavity.
[0014] Optional,
[0015] The end of the fin close to the plate body is a first end, and the end away from the plate body is a second end;
[0016] The second cavity comprises a gas-liquid circulation channel for circulating the phase-change working medium, and the region in the gas-liquid circulation channel where the gaseous phase-change working medium is converted into a liquid phase-change working medium is the phase-change region;
[0017] When the heat dissipation module is in a vertical working state, the channel on the side of the gas-liquid circulation channel away from the phase change zone is a bottom channel, and the height of the bottom channel close to the second end is higher than that close to the first end.
[0018] Optionally, each of the fins is provided with a plurality of mutually independent second cavities, and an isolation portion is provided between adjacent second cavities on the same fin, the width of the isolation portion is uniform, and when the heat dissipation module is in a vertical working state, the height of the isolation portion close to the second end is higher than the height close to the first end.
[0019] Optionally, the second cavity includes a plurality of gas-liquid flow channel units distributed in an array and / or staggered manner, and the gas-liquid flow channel units are hexagonal and / or circular.
[0020] Optionally, at least two of the fins are arranged in non-parallel directions.
[0021] A heat dissipation device comprises the heat dissipation module described in any one of the above items.
[0022] It can be seen from the above technical scheme that during the use of the heat dissipation module provided by the present application, the heat generated by the heating element is transferred to the phase change medium in the first cavity through the plate body, and the entire contact surface between the heating element and the plate body is a heat exchange surface, and the heat exchange efficiency of each area is consistent, thereby effectively improving the uniformity of heat dissipation; in addition, the multiple phase change cooling cavities in the heat dissipation module are independent of each other, and different phase change cooling cavities cool different heating areas (or different heating elements) of the heating element respectively, so that the heat generated by different heating areas (or different heating elements) of the heating element is simultaneously transferred toward one side of the plate body and conducted to the phase change medium in the phase change cooling cavity. On the one hand, this can improve the uniformity of heat dissipation, and on the other hand, this can reduce the transfer of heat in the heating element inside the heating element (or between different heating elements), thereby improving the heat dissipation efficiency. Moreover, the number and / or shape of the second cavity in at least two fins are different, thereby adjusting the number and position of the independent phase change cooling cavities, so that the heat dissipation module accurately dissipates heat to the heating area and improves the heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 Shown is an exploded view of a heat dissipation device provided in an embodiment of the present application;
[0024] Figure 2 Shown is an exploded view of the heat dissipation module with the main body omitted;
[0025] Figure 3 Shown is a three-dimensional diagram of the heat dissipation module with the main body omitted;
[0026] Figure 4 Shown is a front view of the lower fin of the first embodiment;
[0027] Figure 5 Shown is a front view of the lower fin of the second embodiment;
[0028] Figure 6 Shown is a front view of the lower fin of the third embodiment;
[0029] Figure 7 Shown is a front view of the lower fin of the fourth embodiment;
[0030] Figure 8 Shown is a perspective view of a heat sink.
[0031] exist Figure 1-Figure 8 middle:
[0032] 1- plate body, 2- fins, 3- connecting pipe;
[0033] 11-first cavity, 12-body, 13-cover plate, 21-second cavity, 22-first end, 23-second end, 24-isolating portion;
[0034] 211 - gas-liquid circulation channel, 212 - phase change zone, 213 - bottom channel. DETAILED DESCRIPTION
[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0036] First of all, it should be noted that the heat dissipation module in the present application is suitable for scenarios where heat-generating components need to be cooled. The above-mentioned heat-generating components can be electronic devices (for example: computers, servers and televisions, etc.), power system equipment (transformers, rectifiers and inverters, etc.) and outdoor communication base stations, etc.
[0037] like Figure 1-Figure 8 As shown, the heat dissipation module in the embodiment of the present application includes a plate body 1 and fins 2, wherein the plate body 1 is provided with a first cavity 11, and the fins 2 have a second cavity 21 inside, and the fins 2 are provided with multiple fins, and the second cavities 21 in the multiple fins 2 are all connected to the first cavity 11 to form a phase change cooling cavity; that is, the phase change cooling cavity includes a first cavity 11 and multiple second cavities 21, and the multiple second cavities 21 here are all second cavities 21 in different fins 2. In addition, based on the above structure, the plate body 1 in this embodiment is provided with multiple first cavities 11, and the second cavity 21 in any fin 2 is arranged one-to-one with the first cavity 11, that is, the first cavity 11 in any fin 2 is only connected to one first cavity 11, so that the multiple fins 2 and the plate body 1 cooperate to form multiple independent phase change cooling cavities.
[0038] When the above-mentioned heat dissipation module is used for heat dissipation, the areas corresponding to different first cavities 11 on the plate body 1 are respectively connected to different heating areas of the same heating element (or different heating elements) for heat transfer. In this way, the heat generated by the heating element is transferred to the phase change medium in the first cavity 11 through the plate body 1. After absorbing the heat, the phase change medium in the first cavity 11 undergoes a phase change from liquid to gas, and diffuses into the second cavity 21, and re-condenses in the second cavity 21 to release heat. The condensed phase change medium returns to the first cavity 11 under the action of gravity and the side wall of the second cavity 21 to participate in the next cycle.
[0039] Moreover, the number and / or shape of the second cavities 21 in at least two fins 2 are different. Exemplarily, the number of the second cavities 21 in at least two fins 2 is different; the shape of the second cavities 21 in at least two fins 2 is different; the number and shape of the second cavities 21 in at least two fins 2 are different. It should be noted that the number of fins 2 with different numbers and / or shapes of the second cavities 21 is not limited here, and the number of fins 2 can be two or more.
[0040] During the above-mentioned heat dissipation process, the heat generated by the heating element is transferred to the phase change medium in the first cavity 11 through the plate body 1. The entire contact surface between the heating element and the plate body 1 is a heat exchange surface, and the heat exchange efficiency of each area is consistent, thereby effectively improving the uniformity of heat dissipation. In addition, the multiple phase change cooling cavities in the heat dissipation module are independent of each other, and different phase change cooling cavities cool different heating areas of the heating element (or different heating elements) respectively. In this way, the heat generated by different heating areas of the heating element (or different heating elements) is simultaneously transferred toward one side of the plate body 1 and conducted to the phase change medium in the phase change cooling cavity. On the one hand, this can improve the uniformity of heat dissipation. On the other hand, this can reduce the transfer of heat in the heating element inside the heating element (or between different heating elements), thereby improving the heat dissipation efficiency.
[0041] Moreover, the number and / or shape of the second cavities 21 in at least two fins 2 are different, so that different second cavities 21 can be set according to different heating zones of the same heating element, and the number and position of the second cavities 21 can be adjusted on the corresponding fins 2, and then the number and position of independent phase change cooling cavities can be adjusted, so that the heat dissipation module can accurately dissipate heat from the heating zone and improve the heat dissipation capacity.
[0042] It should be noted that if Figure 1 As shown, the plate body 1 includes a main body 12 and a cover plate 13, wherein a plurality of grooves are provided on one side of the main body 12, and the cover plate 13 covers the above grooves to form a plurality of first cavities 11 on the plate body 1, and at the same time, a plurality of openings are provided on the cover plate 13 at a position corresponding to each first cavity 11, so that the first cavity 11 in the plate body 1 can be connected with the second cavity 21 in the fin 2 to form a plurality of phase change cooling cavities.
[0043] Furthermore, in order to further improve the heat dissipation capacity of the heat dissipation module, in some embodiments, laser engraving is performed in the groove of the body 12 (for example, laser engraving is performed in the groove to form multiple protrusions) to increase the contact area between the side wall of the first cavity 11 and the phase change medium, thereby improving the heat dissipation efficiency. In other embodiments, a material with better thermal conductivity, such as graphene, is applied to the surface of the body 12 so that the heat emitted by the heating element can be transferred to the phase change medium more quickly, thereby improving the heat dissipation efficiency of the heat dissipation module.
[0044] In addition, regarding the connection method between the body 12 and the cover plate 13, in some preferred embodiments, the body 12 and the cover plate 13 are welded and connected by brazing. To ensure the airtightness of the connection position between the body 12 and the cover plate 13, and to avoid leakage of the phase change working fluid in the phase change cooling cavity. Of course, in the specific implementation, other connection methods that can achieve a sealed connection, such as adhesive connection, can also be used. Further, in some preferred embodiments, in order to facilitate the connection between the body 12 and the cover plate 13, a positioning structure is provided between the body 12 and the cover plate 13 to ensure the relative position of the two during the connection process is accurate, thereby ensuring the airtightness of the phase change cooling cavity of the heat dissipation module after assembly. Exemplarily, in a specific embodiment, the positioning structure is a positioning column and a positioning hole, wherein the positioning column is provided on one of the body 12 and the cover plate 13, and the positioning hole is provided on the other of the body 12 and the cover plate 13 (for example, the positioning column is provided on the body 12, and the positioning hole is provided on the cover plate 13). In another specific embodiment, the positioning structure is a positioning groove, which is arranged on the main body 12, and the shape and size of the positioning groove match the outer contour of the cover plate 13, so that during the assembly process, the cover plate 13 can be placed in the positioning groove, thereby realizing the positioning connection between the main body 12 and the cover plate 13.
[0045] Of course, the above is only an exemplary description of a method of forming the plate body 1, but the present application is not limited to this. For example, if processing conditions permit, the plate body 1 can also be set as an integral structural member; or, the plate body 1 can also be composed of a main body 12 and a plurality of cover plates 13 that can cover different grooves.
[0046] In some embodiments, when the heat generated by the heating element is transferred to the middle area of the plate body 1, the fins 2 on both sides of the middle fin 2 are provided with the second cavity 21, and the fin 2 in the middle will be disturbed by the fins 2 on both sides, resulting in poor heat dissipation effect in the middle area of the plate body 1. Therefore, an optional embodiment is provided here, in the arrangement direction of the fins 2, the distribution area of the second cavity 21 in the fin 2 in the middle is larger than the distribution area of the second cavity 21 in the fin 2 at the end, so that the heat dissipation effect in the middle area of the plate body 2 can be improved.
[0047] It should be noted that the arrangement direction of the fins 2 is Figure 2 The direction is indicated by the double-headed arrow A.
[0048] In this embodiment, another implementation is provided. In the arrangement direction of the fins 2, the number of the second cavities 21 in the fins 2 located in the middle is greater than the number of the second cavities 21 in the fins 2 located at the ends. Here, the number of the second cavities 21 located in the middle is increased to increase the distribution area of the second cavities 21 in the fins 2 located in the middle, so as to improve the heat dissipation effect of the middle area of the plate body 2.
[0049] Of course, in the arrangement direction of the fins 2, it is also possible to ensure that the distribution area of the second cavities 21 in the fins 2 located in the middle is greater than the distribution area of the second cavities 21 in the fins 2 located at the ends, and further ensure that the number of the second cavities 21 in the fins 2 located in the middle is greater than the number of the second cavities 21 in the fins 2 located at the ends. This arrangement further improves the heat dissipation effect of the middle area of the plate body 2.
[0050] In some embodiments, the heat dissipation module further includes a connecting pipe 3, which connects the second cavities 21 in at least two fins 2 that are connected to the same first cavity 11. From the above content, it can be seen that the same first cavity 11 is connected to the second cavities 21 in multiple fins 2. On this basis, further, a connecting pipe 3 is provided to connect multiple second cavities 21 connected to the same first cavity 11. The first cavity 11 and the connecting pipe 3 located on the plate body 1 are both connecting channels connecting the second cavities 21 in the above multiple fins 2. With such arrangement, after the heat generated by the heating element is transferred to the first cavity 11 through the plate body 1, the phase change medium in the first cavity 11 in the area and the second cavity 21 connected to the first cavity 11 undergoes a phase change after absorbing the heat, changing from liquid to gas, and diffuses into the second cavity 21. Since the second cavity 21 is connected through the connecting pipe 3, the gaseous phase change medium can diffuse through the connecting pipe 3 to the second cavity 21 in other fins 2 where no phase change has occurred. Then, the phase change medium in the second cavity 21 where no phase change has occurred can also achieve cooling of the area by undergoing a phase change. This increases the volume of the phase change medium participating in heat dissipation in the phase change cooling cavity during heat dissipation, thereby improving the heat dissipation efficiency of the heat dissipation module.
[0051] Furthermore, the connecting pipe 3 connects the second cavities 21 in all the fins 2 that are connected to the same first cavity 11, thereby further improving the heat dissipation efficiency of the heat dissipation module.
[0052] In this embodiment, further, in the vertical working state of the heat dissipation module (the vertical working state refers to the fins being in Figure 4-Figure 7 The posture shown is the working state of the heat dissipation module), and the connecting pipe 3 is located in the top area of the second cavity 21. Since the heat dissipation module is in the vertical working state, when the heat generated by the heating element is transferred to the board body 1, the phase change medium in the first cavity 11 and the second cavity 21 of the board body 1 will change from liquid to gas, and the gaseous medium will rise to the top of the second cavity 21 when the heat dissipation module is in the vertical working state; here, by arranging the connecting pipe 3 in the top area of the second cavity 21, it is convenient for the gaseous phase change medium in the second cavity 21 corresponding to the heat rising area to diffuse into the second cavity 21 in other areas, further improving the diffusion speed of the phase change medium in the phase change cooling cavity, and further improving the heat dissipation efficiency of the heat dissipation module.
[0053] It should be noted that the vertical working state refers to the heat dissipation module with Figure 2 The direction indicated by the double-headed arrow B is set on the ground. Of course, the vertical working state can also be inclined at a certain angle to the double-headed arrow B. Accordingly, the top of the second cavity 21 refers to the end of the heat dissipation module away from the ground in the vertical working state. That is, the top area is also the phase change zone 212 described below.
[0054] In some embodiments, Figure 1 and Figure 4 As shown, in this embodiment, the end of the fin 2 close to the plate body 1 is the first end 22, and the end away from the plate body 1 is the second end 23. The second cavity 21 includes a gas-liquid circulation channel 211 for circulating the phase-change medium, and the area in the gas-liquid circulation channel 211 that converts the gaseous phase-change medium into the liquid phase-change medium is the phase-change zone 212; in the vertical working state of the heat dissipation module (i.e., the working state of the heat dissipation module when the plate body 1 is vertical or inclined at a certain angle), the flow channel on the side away from the phase-change zone 212 in the gas-liquid circulation channel 211 is the bottom flow channel 213, and the height of the bottom flow channel 213 close to the second end 23 is higher than the height close to the first end 22. In this way, under the guidance of the bottom flow channel 213, the condensed and liquefied phase-change medium will flow into the first cavity 11 more easily to participate in the cooling cycle.
[0055] Further, in some preferred embodiments, Figure 4 As shown, each fin 2 is provided with a plurality of mutually independent second cavities 21, and an isolation portion 24 is provided between adjacent second cavities 21 on the same fin 2, the width of the isolation portion 24 is uniform, and in the vertical working state of the heat dissipation module, the height of the isolation portion 24 close to the second end 23 is higher than the height close to the first end 22; in this way, on the basis of ensuring that different second cavities 21 on the fin 2 are effectively isolated, the heat exchange area for heat exchange between the gaseous phase change medium and the outside world can be increased. In addition, this arrangement allows the gaseous phase change medium entering the second cavity 21 from the first cavity 11 to have sufficient rising space, thereby improving the fluidity of the gaseous phase change medium in the phase change cooling cavity, which is beneficial to the gas-liquid conversion of the phase change medium inside the phase change cooling cavity, thereby improving the heat dissipation efficiency of the heat dissipation module.
[0056] It should be noted that the width of the isolation portion 24 refers to the width of the isolation portion 24. Figure 4 Dimensions in the direction indicated by the double-headed arrow D.
[0057] like Figure 1 or Figure 4As shown, the second cavity 21 includes a gas-liquid flow channel unit, and adjacent gas-liquid flow channel units have a common part to form a gas-liquid circulation flow channel 211; in this way, under the segmentation effect of the gas-liquid flow channel unit, the uniformity of the distribution of the gaseous phase change medium in the second cavity 21 can be improved. In addition, the heat exchange area between the fins 2 and the gaseous phase change medium can also be increased, thereby improving the heat dissipation efficiency.
[0058] In some embodiments, the gas-liquid flow channel unit is set to a hexagon. Under this setting, the size of the flow channels in the gas-liquid flow channel unit is more uniform, which is more conducive to improving the structural strength of the gas-liquid circulation flow channel 211 (it should be noted that during the operation of the heat dissipation module, the phase change medium in the phase change cooling chamber changes from liquid to gas, which will cause the pressure of the phase change cooling chamber to increase. Based on this, if there is a large local flow channel in the gas-liquid circulation flow channel 211, the heat dissipation surface constituting the local flow channel has poor deformation resistance, which makes it easy for this position to deform or even be damaged). At the same time, it is also beneficial for the condensed and liquefied phase change medium to return to the first cavity 11, thereby ensuring the heat dissipation efficiency.
[0059] Furthermore, regarding the distribution mode of the gas-liquid flow channel units, in specific implementation, an adaptive design can be performed as needed. For example, in some embodiments, multiple gas-liquid flow channel units are distributed in an array. In other embodiments, multiple gas-liquid flow channel units are distributed in a staggered manner. In addition, in some other embodiments, some gas-liquid flow channel units are distributed in an array, and some gas-liquid flow channel units are distributed in a staggered manner.
[0060] In addition, during the specific implementation process, the shape of the gas-liquid flow channel unit can be adaptively designed as needed, for example:
[0061] In some embodiments, the gas-liquid flow channel unit is set to a hexagon. Under this setting, the size of the flow channels in the gas-liquid flow channel unit is more uniform, which is more conducive to improving the structural strength of the gas-liquid circulation flow channel 211 (it should be noted that during the operation of the heat dissipation module, the phase change medium in the phase change cooling chamber changes from liquid to gas, which will cause the pressure of the phase change cooling chamber to increase. Based on this, if there is a large local flow channel in the gas-liquid circulation flow channel 211, the heat dissipation surface constituting the local flow channel has poor deformation resistance, which makes it easy for this position to deform or even be damaged). At the same time, it is also beneficial for the condensed and liquefied phase change medium to return to the first cavity 11, thereby ensuring the heat dissipation efficiency.
[0062] In other embodiments, the gas-liquid flow channel unit is set to a circular shape. Under this setting, the heat dissipation area of the gas-liquid circulation channel 211 is larger, which is more conducive to improving the heat dissipation efficiency of the heat dissipation module; at the same time, it is also beneficial for the condensed and liquefied phase change medium to return to the first cavity 11, thereby ensuring the heat dissipation efficiency.
[0063] Of course, the above is only an exemplary description of the shape of the gas-liquid flow channel unit, but the present application is not limited thereto. For example, the gas-liquid flow channel unit can also be set to other shapes such as a rectangle or a diamond.
[0064] In some embodiments, at least two fins 2 are arranged in non-parallel directions (not shown in the figure). Generally, in order to improve the stability of the connection between the fins 2 and the plate body 1, the fins 2 are usually arranged perpendicular to the plate body 1 ( Figure 2 The fins 2 are arranged in parallel to ensure that there is a certain gap between adjacent fins 2. Here, the arrangement directions of at least two fins are not parallel, that is, the arrangement direction of at least one fin is parallel to the direction of the fins. Figure 2 There is an acute angle in the direction indicated by the double-headed arrow C, which can increase the setting area of the fins 2 and correspondingly increase the setting area of the second cavity 21, thereby increasing the heat dissipation efficiency of the heat dissipation module.
[0065] Furthermore, in order to increase the fluidity of the gas between adjacent fins 2, in the arrangement direction of the fins 2, the plurality of fins 2 are arranged in a wave shape, and gaps exist between adjacent fins 2, thereby further improving the heat dissipation effect of the heat dissipation device.
[0066] In addition, the present invention also provides a heat dissipation device (see Figure 1 and Figure 8 ), including the above-mentioned heat dissipation module. It should be noted that, since the heat dissipation device in this embodiment includes the above-mentioned heat dissipation module, the beneficial effects of the heat dissipation device brought by the heat dissipation module are detailed in the above discussion and will not be repeated here.
[0067] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details are not limited to the present application must be implemented by using the above specific details.
[0068] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.
[0069] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.
[0070] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.
[0071] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.
Claims
1. A heat dissipation module, characterized in that: include: The plate body is provided with a first cavity; A fin having a second cavity inside, wherein a plurality of fins are provided, and the second cavities in the plurality of fins are all connected to the first cavity to form a phase change cooling cavity; There are multiple first cavities, and the second cavity in any fin is arranged one-to-one with the first cavity to form a plurality of independent phase change cooling cavities, and the number and / or shape of the second cavities in at least two fins are different.
2. The heat dissipation module according to claim 1, characterized in that: In the arrangement direction of the fins, the distribution area of the second cavity in the fin located in the middle is greater than the distribution area of the second cavity in the fin located at the end.
3. The heat dissipation module according to claim 1 or 2, characterized in that: In the arrangement direction of the fins, the number of the second cavities in the fins located in the middle is greater than the number of the second cavities in the fins located at the ends.
4. The heat dissipation module according to claim 1, characterized in that: It also includes a connecting pipe, which connects the second cavities in at least two of the fins that are connected to the same first cavity.
5. The heat dissipation module according to claim 4, characterized in that: When the heat dissipation module is in a vertical working state, the connecting pipe is located in the top area of the second cavity.
6. The heat dissipation module according to claim 1, characterized in that: The end of the fin close to the plate body is a first end, and the end away from the plate body is a second end; The second cavity comprises a gas-liquid circulation channel for circulating the phase-change working medium, and the region in the gas-liquid circulation channel where the gaseous phase-change working medium is converted into a liquid phase-change working medium is the phase-change region; When the heat dissipation module is in a vertical working state, the channel on the side of the gas-liquid circulation channel away from the phase change zone is a bottom channel, and the height of the bottom channel close to the second end is higher than that close to the first end.
7. The heat dissipation module according to claim 6, characterized in that: A plurality of mutually independent second cavities are provided on each of the fins, and an isolation portion is provided between adjacent second cavities on the same fin, the width of the isolation portion is uniform, and when the heat dissipation module is in a vertical working state, the height of the isolation portion close to the second end is higher than the height close to the first end.
8. The heat dissipation module according to claim 7, characterized in that: The second cavity includes a plurality of gas-liquid flow channel units distributed in an array and / or staggered manner, and the gas-liquid flow channel units are hexagonal and / or circular.
9. The heat dissipation module according to claim 1, characterized in that: The arrangement directions of at least two of the fins are not parallel.
10. A heat dissipation device, characterized in that: Comprising the heat dissipation module as described in any one of claims 1-9.