Thermal diffusion device and electronic apparatus

Abstract

The utility model relates to a thermal diffusion device and electronic equipment. A heat diffusion device (1A) is provided with: a housing (10) having a first inner surface (10a) and a second inner surface (10b) which face each other in the thickness direction (T), and provided with an internal space; a working medium (20) sealed in the internal space of the housing (10); and a core body (30) provided in the internal space of the frame body (10), the core body (30) being provided with a first through-hole (41), the core body (30) being provided with a first protrusion (51) located on the periphery of the first through-hole (41), the first protrusion (51) being close to a first inner surface (10a) of the frame body (10) in the thickness direction (T), the core body (30) being provided with: a first through-hole arrangement region (61) in which the first through-hole (41) is provided when viewed from the thickness direction (T); and a first through-hole non-arrangement region (71) that traverses the first through-hole arrangement region (61) and that does not have the first through-hole (41).

Description

Technical Field

[0001] The utility model relates to a heat diffusion device and an electronic device. Background Art

[0002] In recent years, the heat generation has increased due to the high integration and high performance of components. In addition, the heat density has increased due to the miniaturization of products. This situation is particularly prominent in the field of mobile terminals such as smartphones and tablets. In view of this situation, it has become important to take heat dissipation measures.

[0003] As a component for heat dissipation countermeasures, graphite sheets and the like are often used, but the amount of heat transported by these sheets is insufficient, and therefore the use of various heat diffusion devices capable of diffusing heat has been studied.

[0004] Patent document 1 discloses a heat spreader, which comprises: a frame, including an upper frame sheet and a lower frame sheet that are opposed to each other and are joined at the outer edge, and have an internal space; a working fluid that is sealed in the above-mentioned internal space; a microchannel that is arranged in the above-mentioned internal space in the above-mentioned lower frame sheet and constitutes a flow path for the above-mentioned working fluid; and a sheet-shaped core that is arranged in the above-mentioned internal space of the above-mentioned frame and is arranged to contact the above-mentioned microchannel, and the contact area between the above-mentioned core and the above-mentioned microchannel is 5% to 40% relative to the area of ​​the above-mentioned internal space when viewed from above.

[0005] Patent Document 1: International Publication No. 2021 / 229961

[0006] In the heat spreader described in Patent Document 1, the delivery of the working fluid (also called the working medium) is controlled by the capillary force exerted by the core body against the working fluid (also called the working medium) and the liquid flow path of the working fluid is formed by the microchannel. However, in the heat spreader described in Patent Document 1, since the delivery of the working fluid is controlled by two components, the core body and the microchannel, a positional offset occurs between the two components, resulting in a problem that it is difficult to locally control the delivery of the working fluid.

[0007] In addition, in the heat spreader described in Patent Document 1, in order to increase the maximum heat transfer amount, it is necessary to make the core body and the microchannel close contact. Figure 4 As shown, at the portion where the holes of the core overlap with the microchannels, the core and the microchannels are not in close contact, so there is a problem that the maximum heat transport amount cannot be increased.

[0008] The above problem is not limited to the vapor chamber, but is a common problem for heat spreaders that can diffuse heat using the same structure as the vapor chamber. Utility Model Content

[0009] The utility model is completed to solve the above problems, and its purpose is to provide a heat diffusion device that can easily control the delivery of liquid working medium locally and can increase the maximum heat delivery amount. In addition, the utility model aims to provide an electronic device having the above heat diffusion device.

[0010] The heat diffusion device of the utility model is characterized in that it comprises: a frame body having a first inner surface and a second inner surface opposite to each other in a thickness direction and provided with an internal space; a working medium sealed in the internal space of the frame body; and a core body arranged in the internal space of the frame body, wherein a first through hole is arranged in the core body, a first convex portion close to the first inner surface of the frame body in the thickness direction is located at the periphery of the first through hole, and when observed from the thickness direction, the core body comprises: a first through hole arrangement region in which the first through hole is arranged; and a first through hole non-arrangement region in which the first through hole is not arranged and which crosses the first through hole arrangement region.

[0011] The electronic device of the present invention is characterized by comprising the heat diffusion device of the present invention.

[0012] According to the present invention, it is possible to provide a heat diffusion device that can easily control the transport of a liquid phase working medium locally and can increase the maximum heat transport amount. In addition, according to the present invention, it is possible to provide an electronic device having the heat diffusion device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective schematic diagram showing an example of the heat diffusion device according to the first embodiment of the present invention.

[0014] Figure 2 This is a schematic plan view showing an example of the internal structure of the heat diffusion device according to the first embodiment of the present invention.

[0015] Figure 3 Yes means Figure 2 The cross-sectional schematic diagram of an example of the cross-section of the heat spreading device along the line segment a1 - a2 is shown.

[0016] Figure 4 Yes means Figure 2 The cross-sectional schematic diagram of an example of the cross-section of the heat spreading device along the line b1 - b2 is shown.

[0017] Figure 5 This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Modification 1 of Embodiment 1 of the present invention.

[0018] Figure 6This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Modification 2 of Embodiment 1 of the present invention.

[0019] Figure 7 This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Modification 3 of Embodiment 1 of the present invention.

[0020] Figure 8 This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Embodiment 2 of the present invention.

[0021] Fig. 9 This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Modification 1 of Embodiment 2 of the present invention.

[0022] Fig.10 This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Embodiment 3 of the present invention.

[0023] Fig.11 It is a perspective schematic diagram showing an example of a heat diffusion device according to a fourth embodiment of the present invention.

[0024] Fig.12 It is a perspective schematic diagram showing an example of the internal structure of the heat diffusion device according to the fourth embodiment of the present invention.

[0025] Fig.13 It is a perspective schematic diagram showing an example of the electronic device of the present invention.

[0026] Description of Reference Numerals

[0027] 1A, 1A', 1B, 1C, 1D, 2A, 2B, 3A...heat spreader (heat diffusion device); 10...frame; 10a...first inner surface; 10b...second inner surface; 11...first sheet; 12...second sheet; 20...working medium; 30...core; 41...first through hole; 42...second through hole; 51...first convex portion; 52...second convex portion; 61...first through hole configuration area; 62...second through hole configuration area; 71...first through hole non-configuration area; 72...second through hole non-configuration area; 100...electronic device; 110...electronic component; 120...device frame; EP...evaporation portion; HS...heat source; L...length direction; T...thickness direction; W...width direction. DETAILED DESCRIPTION

[0028] The following is a description of the heat diffusion device of the present invention and the electronic device of the present invention. In addition, the present invention is not limited to the following structure, and can also be appropriately changed within the scope of the main purpose of the present invention. In addition, the present invention also includes a structure in which multiple preferred structures described below are combined.

[0029] The embodiments shown below are examples, and it is of course possible to partially replace or combine the structures shown in different embodiments. After Embodiment 2, the description of matters common to Embodiment 1 is omitted, and the differences are mainly described. In particular, the same effects brought about by the same structure are not mentioned in sequence in each embodiment.

[0030] In the following description, when each embodiment is not particularly distinguished, it is simply referred to as "the heat diffusion device of the present invention" and "the electronic device of the present invention".

[0031] In the following embodiments, a heat spreader is shown as an example of the heat spreading device of the present invention. The heat spreading device of the present invention can also be applied to heat spreading devices such as heat pipes.

[0032] The drawings shown below are schematic diagrams, and their dimensions, aspect ratios, and other aspects may differ from those of actual products.

[0033] In this specification, terms indicating the relationship between elements (for example, "parallel", "perpendicular", etc.) and terms indicating the shape of an element refer not only to strict forms as described literally, but also to substantially equivalent ranges, such as a range containing a difference of approximately several percent.

[0034] [Heat diffusion device]

[0035] The heat diffusion device of the utility model is characterized in that it comprises: a frame body having a first inner surface and a second inner surface opposite to each other in a thickness direction and provided with an internal space; a working medium sealed in the internal space of the frame body; and a core body arranged in the internal space of the frame body, wherein a first through hole is arranged in the core body, a first convex portion close to the first inner surface of the frame body in the thickness direction is located at the periphery of the first through hole, and when observed from the thickness direction, the core body comprises: a first through hole arrangement region in which the first through hole is arranged; and a first through hole non-arrangement region in which the first through hole is not arranged and which crosses the first through hole arrangement region.

[0036] <Implementation method 1>

[0037] In the heat diffusion device according to the first embodiment of the present invention, the first through-hole non-arrangement region extends in a direction perpendicular to the longitudinal direction of the frame body when viewed from the thickness direction.

[0038] Figure 1 It is a perspective schematic diagram showing an example of the heat diffusion device according to the first embodiment of the present invention.

[0039] Figure 1 The illustrated heat spreader (heat spreading device) 1A has a frame 10 .

[0040] The frame body 10 is sealed in an airtight state and has a hollow structure.

[0041] A heat source HS as a heating element is provided on the outer surface of the housing 10 .

[0042] As the heat source HS, for example, electronic components etc. can be mentioned.

[0043] In this manual, if Figure 1 As shown in FIG. 1 , the length direction, thickness direction, and width direction are respectively set to directions determined by L, T, and W. The length direction L, the thickness direction T, and the width direction W are in a mutually perpendicular relationship. In addition, the direction perpendicular to the thickness direction T and including the length direction L and the width direction W is set as the plane direction.

[0044] The heat spreader 1A is preferably in a planar shape as a whole. That is, the frame 10 is preferably in a planar shape as a whole.

[0045] In this specification, planar refers to a shape including a plate-like and a sheet-like shape, and a shape in which the dimensions in the length direction and the dimensions in the width direction are relatively large relative to the dimension in the thickness direction, for example, a shape in which the dimensions in the length direction and the dimensions in the width direction are more than 10 times the dimensions in the thickness direction, preferably more than 100 times.

[0046] The size of the heat spreader 1A is not particularly limited.

[0047] The dimensions of the heat spreader 1A in the longitudinal direction L and the width direction W are preferably 5 mm or more and 500 mm or less, more preferably 20 mm or more and 300 mm or less, and further preferably 50 mm or more and 200 mm or less.

[0048] The dimension in the longitudinal direction L and the dimension in the width direction W of the uniform heat plate 1A may be the same as or different from each other.

[0049] The dimension of the heat spreader 1A in the thickness direction T is preferably 50 μm or more and 500 μm or less.

[0050] The dimension of the heat spreader 1A in the length direction L, the thickness direction T, and the width direction W are determined as the maximum dimensions in the length direction L, the thickness direction T, and the width direction W, respectively.

[0051] The frame 10 is preferably composed of a first sheet 11 and a second sheet 12 whose outer edges are joined to each other. In this case, the first sheet 11 and the second sheet 12 may be overlapped so that their ends are aligned with each other or may be overlapped so that their ends are offset from each other.

[0052] Examples of methods for joining the outer edges of the first sheet 11 and the second sheet 12 include laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inert gas welding), ultrasonic bonding, and resin sealing. Among them, laser welding, resistance welding, or brazing is preferred.

[0053] The constituent materials of the first sheet 11 and the second sheet 12 are not particularly limited as long as they have properties suitable for a heat spreader, such as thermal conductivity, strength, softness, flexibility, etc. The constituent materials of the first sheet 11 and the second sheet 12 are preferably metals, such as copper, nickel, aluminum, magnesium, titanium, iron, and alloys containing at least one of these metals as a main component, and copper or aluminum is particularly preferred.

[0054] The constituent materials of the first sheet 11 and the second sheet 12 may be the same as or different from each other.

[0055] When the first sheet 11 and the second sheet 12 are made of different materials, different functions can be exerted by the first sheet 11 and the second sheet 12. Such functions are not particularly limited, and examples thereof include a heat conduction function and an electromagnetic wave shielding function.

[0056] The shapes of the first sheet 11 and the second sheet 12 are not particularly limited. For example, the first sheet 11 may be a flat plate with a constant dimension in the thickness direction T, and the second sheet 12 may be a shape in which the dimension in the thickness direction T of the outer edge is larger than the portion outside the outer edge. Alternatively, the first sheet 11 may be a flat plate with a constant dimension in the thickness direction T, and the second sheet 12 may be a shape in which the dimension in the thickness direction T is constant, and the portion outside the outer edge is convex outward relative to the outer edge. In this case, a depression is provided in the outer edge of the frame 10. Such a depression in the outer edge of the frame 10 can be utilized when the heat spreader 1A is mounted. In addition, other components can be arranged in the depression in the outer edge of the frame 10.

[0057] The dimensions of the first sheet 11 and the second sheet 12 in the thickness direction T are preferably 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, and further preferably 40 μm or more and 60 μm or less.

[0058] The dimensions in the thickness direction T of the first sheet 11 and the second sheet 12 may be the same as or different from each other.

[0059] The dimensions of the first sheet 11 and the second sheet 12 in the thickness direction T may be the same as the entirety or may be partially different from each other.

[0060] The dimensions of the first sheet material 11 and the second sheet material 12 in the thickness direction T are determined to be the maximum dimensions in the thickness direction T, respectively.

[0061] As the plane shape of the frame 10 when viewed from the thickness direction T, for example, a triangle, a polygon such as a rectangle, a circle, an ellipse, a shape formed by combining these, etc. can be listed. In addition, the plane shape of the frame 10 can also be an L-shape, a C-shape (U-shape), a step-shape, etc. In addition, a through-hole can also be provided in the thickness direction T in the frame 10. The plane shape of the frame 10 can also be a shape corresponding to the purpose of the heat spreader 1A, a shape corresponding to the mounting position of the heat spreader 1A, or a shape corresponding to other components existing nearby.

[0062] The size of the frame 10 is not particularly limited.

[0063] The dimensions of the frame body 10 in the length direction L and the width direction W are preferably 5 mm or more and 500 mm or less, more preferably 20 mm or more and 300 mm or less, and further preferably 50 mm or more and 200 mm or less.

[0064] The dimension of the frame body 10 in the length direction L and the dimension of the width direction W may be the same as or different from each other.

[0065] The dimension of the frame body 10 in the thickness direction T is preferably not less than 50 μm and not more than 500 μm.

[0066] The dimensions of the frame body 10 in the length direction L, the thickness direction T, and the width direction W are determined as the maximum dimensions in the length direction L, the thickness direction T, and the width direction W, respectively.

[0067] exist Figure 1 In the embodiment, the frame body 10 is constituted by two sheets, the first sheet 11 and the second sheet 12 , but the frame body 10 may be constituted by one sheet or may be constituted by three or more sheets.

[0068] Figure 2 This is a schematic plan view showing an example of the internal structure of the heat diffusion device according to the first embodiment of the present invention. Figure 3 Yes means Figure 2 The cross-sectional schematic diagram of an example of the cross-section of the heat spreading device along the line segment a1 - a2 is shown. Figure 4 Yes means Figure 2 The cross-sectional schematic diagram of an example of the cross-section of the heat spreading device along the line b1 - b2 is shown.

[0069] Figure 2 , Figure 3 as well as Figure 4 The illustrated vapor chamber 1A includes a frame 10 , a working medium 20 , and a core 30 .

[0070] like Figure 3 and Figure 4 As shown, the frame body 10 has a first inner surface 10 a and a second inner surface 10 b which are opposite to each other in the thickness direction T.

[0071] exist Figure 3 and Figure 4 In the example shown, the frame 10 is composed of a first sheet 11 and a second sheet 12 . The inner surface of the first sheet 11 corresponds to a first inner surface 10 a of the frame 10 , and the inner surface of the second sheet 12 corresponds to a second inner surface 10 b of the frame 10 .

[0072] An internal space is provided in the frame body 10. More specifically, an internal space surrounded by a first inner surface 10a and a second inner surface 10b is provided in the frame body 10.

[0073] like Figure 2 As shown, the frame 10 preferably has an evaporation portion EP in the internal space.

[0074] The evaporation portion EP is a portion that evaporates a liquid phase working medium 20 described later and changes the working medium 20 into a gas phase. More specifically, the evaporation portion EP corresponds to the inner space of the housing 10. Figure 1 The portion near the heat source HS shown is a portion heated by the heat source HS.

[0075] The number of evaporation parts EP corresponds to the number of heat sources HS, such as Figure 2 That is, only one heat source HS may be provided on the outer surface of the frame 10, or a plurality of heat sources HS may be provided.

[0076] The heat source HS can be set on the outer surface of the frame 10 opposite to the first inner surface 10a, here the outer surface of the first sheet 11, or can be set on the outer surface of the frame 10 opposite to the second inner surface 10b, here the outer surface of the second sheet 12.

[0077] like Figure 2 , Figure 3 as well as Figure 4 As shown, the working medium 20 is sealed in the internal space of the frame 10 .

[0078] The working medium 20 is not particularly limited as long as it can undergo a gas-liquid phase transition under the environment in the housing 10. Examples of the working medium 20 include water, alcohols, and freon substitutes. The working medium 20 is preferably an aqueous compound, and water is particularly preferred.

[0079] like Figure 2 , Figure 3 as well as Figure 4 As shown, the core 30 is disposed in the inner space of the frame 10 .

[0080] The core 30 has a capillary structure capable of moving the liquid-phase working medium 20 by utilizing capillary force.

[0081] The capillary structure of the core 30 may be a known structure used in an existing heat diffusion device (heat spreader, etc.). Such a capillary structure may include a fine structure having unevenness such as pores, grooves, and protrusions, such as a porous structure, a fiber structure, a groove structure, a mesh structure, and the like.

[0082] The core 30 functions as a liquid transport portion that sucks up and transports the liquid-phase working medium 20 by capillary force.

[0083] The core 30 is preferably provided continuously in the internal space of the frame 10 when viewed from the thickness direction T. For example, when viewed from the thickness direction T, the core 30 may be provided in the entire internal space of the frame 10 or in a portion of the internal space of the frame 10 .

[0084] The core body 30 is preferably composed of a porous body.

[0085] Examples of the porous body include a sintered body, a nonwoven fabric, a mesh, an etched porous plate, and a fiber bundle.

[0086] Examples of the sintered body include a porous metal sintered body, a porous ceramic sintered body, etc. Among them, a porous metal sintered body is preferred, and a porous sintered body of copper or nickel is more preferred.

[0087] Examples of the nonwoven fabric include metal nonwoven fabrics, etc. When the core body 30 is made of nonwoven fabric, it can be manufactured at low cost.

[0088] Examples of the mesh include metal meshes, resin meshes, and meshes with surface coatings. Among them, copper meshes, stainless steel (SUS) meshes, and polyester meshes are preferred. When the core 30 is made of a mesh, it can be manufactured at low cost.

[0089] The etched porous plate is produced by, for example, etching a flat metal plate. When the core 30 is composed of the etched porous plate produced in this way, the core 30 has excellent flatness.

[0090] The fiber bundle is produced by, for example, bundling a plurality of fibers into a linear shape. The fiber bundle functions as a liquid holding portion that sucks up and holds the liquid working medium 20 by capillary force, and also functions as a liquid transport portion that transports the sucked-up liquid working medium 20.

[0091] When the core 30 is composed of a fiber bundle, it is preferably composed of a braided fiber bundle. In a braided fiber bundle formed by weaving a plurality of fibers, it is easy to have unevenness on the surface, so when the core 30 is composed of a braided fiber bundle, it is easy to transport the liquid working medium 20.

[0092] As the fibers constituting the fiber bundle, for example, metal wires such as copper, aluminum, and stainless steel, non-metal wires such as carbon fiber and glass fiber, etc. can be cited. Among them, metal wires are preferred due to their high thermal conductivity. For example, a fiber bundle can be formed by bundling about 200 copper wires with a diameter of about 0.03 mm.

[0093] The dimension of the core 30 in the thickness direction T is preferably 2 μm or more and 200 μm or less, more preferably 5 μm or more and 100 μm or less, and further preferably 10 μm or more and 40 μm or less.

[0094] The dimension of the core body 30 in the thickness direction T may be the same as a whole or may be partially different.

[0095] like Figure 2 and Figure 3 As shown, the core body 30 is provided with a first through hole 41 .

[0096] The first through hole 41 exerts a capillary force on the working medium 20 . That is, the working medium 20 moves inside the first through hole 41 by the capillary force.

[0097] like Figure 2 and Figure 3 As shown, the first protrusion 51 close to the first inner surface 10 a of the frame body 10 in the thickness direction T is located at the periphery of the first through hole 41 .

[0098] The area between the core 30 and the first inner surface 10 a of the frame 10 , more specifically, the area between the first protrusion 51 located at the periphery of the first through hole 41 and the first inner surface 10 a of the frame 10 , constitutes a liquid flow path mainly containing the working medium 20 in liquid phase.

[0099] The liquid flow path may include the working medium 20 in a gas phase as long as it is a region where the working medium 20 in a liquid phase mainly exists.

[0100] As described above, in the heat spreader 1A, the core 30 exerts a capillary force on the liquid working medium 20 and forms a liquid flow path for the liquid working medium 20 , thereby controlling the transport of the liquid working medium 20 .

[0101] In a structure that uses two components to control the delivery of a liquid-phase working medium, such as the heat spreader described in Patent Document 1, it is difficult to locally control the delivery of the liquid-phase working medium due to positional offset between the two components. In contrast, in the heat spreader 1A, the delivery of the liquid-phase working medium 20 can be controlled using only one component, the core 30, so it is easy to locally control the delivery of the liquid-phase working medium 20.

[0102] The cross-sectional shape of the first through hole 41 when viewed in a cross section perpendicular to the thickness direction T is not particularly limited, and examples thereof include a triangle, a polygon such as a rectangle, a circle, an ellipse, and a combination thereof.

[0103] exist Figure 2 and Figure 3 In the example shown, a plurality of first through holes 41 are provided, but when observing a cross section perpendicular to the thickness direction T, the cross-sectional shapes of the plurality of first through holes 41 may be the same as, different from, or partially different from each other.

[0104] The cross-sectional shape of the first through hole 41 when observing the cross section along the thickness direction T is not particularly limited, for example, Figure 3 As shown, the diameter of the first through hole 41 (in Figure 3 The first through hole 41 may be shaped such that the diameter of the first through hole 41 is reduced. Alternatively, the first through hole 41 may be shaped such that the diameter of the first through hole 41 is increased. In addition, the cross-sectional shape of the first through hole 41 when observing the cross section along the thickness direction T may be a shape such that the diameter of the first through hole 41 is constant toward the first inner surface 10a of the frame body 10.

[0105] exist Figure 2 and Figure 3 In the example shown, a plurality of first through holes 41 are provided, but when observing a cross section along the thickness direction T, the cross-sectional shapes of the plurality of first through holes 41 may be the same as, different from, or partially different from each other.

[0106] The size of the first through hole 41 is not particularly limited. For example, the surface direction of the first through hole 41 (for example, in Figure 2 The dimension in the length direction L or the width direction W) is not particularly limited.

[0107] exist Figure 2 and Figure 3In the example shown, a plurality of first through holes 41 are provided, but the sizes of the plurality of first through holes 41 may be the same, different, or partially different. Figure 2 The dimensions in the length direction L or the width direction W) may be the same as each other, different from each other, or partially different.

[0108] The size, shape, number, and arrangement of the first through holes 41 may also vary in actual products. Figure 2 and Figure 3 The examples shown are different.

[0109] The first through hole 41 is formed, for example, by aligning the core 30 from one main surface to the other main surface. Figure 3 In the illustrated example, the frame body 10 is formed by punching out from the principal surface on the second inner surface 10 b side toward the principal surface on the first inner surface 10 a side of the frame body 10 by press working.

[0110] like Figure 2 As shown, the first protrusion 51 is preferably located on the entire periphery of the first through hole 41 .

[0111] The first protrusion 51 may be located at a portion of the periphery of the first through hole 41 .

[0112] exist Figure 2 and Figure 3 In the example shown, a plurality of first through holes 41 are provided, and a plurality of first protrusions 51 are present therewith, but it is preferred that all of the plurality of first protrusions 51 are located on the entire periphery of the first through hole 41. Alternatively, a portion of the plurality of first protrusions 51 may be located on the entire periphery of the first through hole 41. In this way, at least a portion of the plurality of first protrusions 51 may be located on the entire periphery of the first through hole 41.

[0113] like Figure 3 As shown, the first protrusion 51 is preferably in contact with the first inner surface 10a of the frame 10 in the thickness direction T. In this case, the first protrusion 51 may be fixed or not fixed relative to the first inner surface 10a of the frame 10. For example, the first protrusion 51 may be bonded to the first inner surface 10a of the frame 10 or not. As a bonding method for the first protrusion 51 and the first inner surface 10a of the frame 10, for example, diffusion bonding, ultrasonic bonding, spot welding, etc. can be listed.

[0114] The first protrusion 51 may not be in contact with the first inner surface 10 a of the frame body 10 in the thickness direction T. That is, the first protrusion 51 may be separated from the first inner surface 10 a of the frame body 10 in the thickness direction T.

[0115] exist Figure 2 and Figure 3 In the example shown, there are a plurality of first protrusions 51, but preferably all of the plurality of first protrusions 51 are in contact with the first inner surface 10a of the frame body 10 in the thickness direction T. Alternatively, a portion of the plurality of first protrusions 51 may be in contact with the first inner surface 10a of the frame body 10 in the thickness direction T. In this way, at least one of the plurality of first protrusions 51 may be in contact with the first inner surface 10a of the frame body 10 in the thickness direction T.

[0116] In the case where the plurality of first protrusions 51 are in contact with the first inner surface 10a of the frame body 10 in the thickness direction T, at least one of the plurality of first protrusions 51 may be fixed to the first inner surface 10a of the frame body 10. For example, at least one of the plurality of first protrusions 51 may be engaged with the first inner surface 10a of the frame body 10. More specifically, all of the plurality of first protrusions 51 may be engaged with the first inner surface 10a of the frame body 10, or a portion of the first protrusions 51 may be engaged with the first inner surface 10a of the frame body 10.

[0117] The cross-sectional shape of the first convex portion 51 when observing the cross section along the thickness direction T is not particularly limited. Figure 3 As shown, the distance between the inner walls of the first protrusion 51 (in Figure 3 The shape in which the distance between the inner walls of the first convex portion 51 is increased may be a shape in which the distance between the inner walls of the first convex portion 51 is constant toward the first inner surface 10a of the frame 10.

[0118] The first protrusion 51 may be bent toward the first through hole 41 (inward) or toward the opposite side (outward) to the first through hole 41 at the end portion on the first inner surface 10 a side of the frame body 10 .

[0119] exist Figure 2 and Figure 3 In the example shown, there are a plurality of first protrusions 51 , but when the cross section along the thickness direction T is observed, the cross-sectional shapes of the plurality of first protrusions 51 may be the same as, different from, or partially different from each other.

[0120] The size of the first protrusion 51 is not particularly limited. For example, the dimension of the first protrusion 51 in the thickness direction T may be larger than the dimension of the first through hole 41 in the surface direction (for example, Figure 2 The dimension in the length direction L or the width direction W) may be smaller than the dimension in the surface direction of the first through hole 41 or may be the same as the dimension in the surface direction of the first through hole 41.

[0121] exist Figure 2 and Figure 3 In the example shown, there are a plurality of first protrusions 51, but the sizes of the plurality of first protrusions 51 may be the same, different, or partially different. For example, the sizes of the plurality of first protrusions 51 in the thickness direction T may be the same, different, or partially different.

[0122] The size, shape, and configuration of the first protrusion 51 may also be different from those in the actual product. Figure 2 and Figure 3 The examples shown are different.

[0123] The first protrusion 51 is similar to the first through hole 41, for example, by directing the core 30 from one main surface to the other main surface. Figure 3 In the example shown, the first convex portion 51 is formed by punching from the main surface on the second inner surface 10b side of the frame body 10 toward the main surface on the first inner surface 10a side of the frame body 10 by punching. The first convex portion 51 may be formed at the same time as the first through hole 41, or may be formed at a different time from the first through hole 41. When punching by punching, the shape of the first convex portion 51 may be adjusted by adjusting the depth of the punching, etc. In addition, the depth of the punching refers to, for example, the amount of pressure of the punch in the punching direction when the punch is punched.

[0124] like Figure 2 As shown, when viewed from the thickness direction T, the core 30 includes a first through-hole arrangement region 61 where the first through-holes 41 are provided, and a first through-hole non-arrangement region 71 where the first through-holes 41 are not provided.

[0125] like Figure 2 As shown in FIG. 1 , when viewed from the thickness direction T, the first through-hole non-arrangement region 71 crosses the first through-hole arrangement region 61 . Figure 2 In the illustrated example, when viewed from the thickness direction T, the first through-hole non-arrangement region 71 crosses the center portion of the first through-hole arrangement region 61 .

[0126] In this specification, the first through hole non-arrangement area refers to an area where no first through holes are provided, and the short side direction (in Figure 2 In the example shown, the minimum dimension in the longitudinal direction (L) is greater than twice the minimum value of the center-to-center distance (pitch) of the first through-holes provided in the first through-hole arrangement region.

[0127] In the heat spreader 1A, in the core 30, the first through-hole non-configuration region 71 is provided to cross the first through-hole configuration region 61, thereby reducing the overall fluid resistance of the core 30 with respect to the liquid-phase working medium 20 by the amount of the fluid resistance of the first through-hole non-configuration region 71 with respect to the liquid-phase working medium 20, compared with a structure in which the first through-hole non-configuration region 71 is not provided. Therefore, in the heat spreader 1A, when the liquid-phase working medium 20 is transported, the pressure loss of the liquid-phase working medium 20 is reduced, resulting in an increase in the maximum heat transport amount.

[0128] In a structure that uses two components to control the transport of a liquid-phase working medium, as in the heat spreader described in Patent Document 1, in order to increase the maximum heat transport amount, the two components need to be in close contact. In contrast, in the heat spreader 1A, since the transport of the liquid-phase working medium 20 can be controlled by a single component, the core 30, the maximum heat transport amount can be increased without causing the problem of close contact between the above-mentioned components.

[0129] As described above, according to the vapor chamber 1A, it is possible to realize a heat spreading device that can easily control the transport of the liquid-phase working medium 20 locally and can increase the maximum heat transport amount.

[0130] In the internal space of the frame 10 , the region other than the liquid flow path, more specifically, the region between the core 30 and the second inner surface 10 b of the frame 10 constitutes a vapor flow path mainly containing the working medium 20 in a gas phase.

[0131] The steam flow path may include the working medium 20 in a liquid phase as long as it is a region where the working medium 20 in a gas phase mainly exists.

[0132] The heat spreader 1A operates as follows.

[0133] In the heat spreader 1A, the liquid-phase working medium 20 evaporates by absorbing heat from the heat source HS in the core 30 and the liquid flow path in the area near the evaporation section EP, and changes into the gas-phase working medium 20. Then, the gas-phase working medium 20 generated in the evaporation section EP moves through the steam flow path to an area away from the evaporation section EP, such as the periphery of the end on the opposite side of the evaporation section EP in the length direction L of the steam flow path, and is cooled around the end to change into the liquid-phase working medium 20. Hereinafter, the part where the gas-phase working medium 20 condenses and changes into the liquid-phase working medium 20 is referred to as the condensation section. The condensation section is easily located in an area away from the evaporation section EP, such as the periphery of the end on the opposite side of the evaporation section EP in the length direction L of the internal space of the frame 10. Then, the liquid-phase working medium 20 generated in the condensation section is transported to the evaporation section EP after being recovered to the core 30 and the liquid flow path.

[0134] In the heat spreader 1A, by repeating the above process, the working medium 20 undergoes a gas-liquid phase change and circulates. At this time, the heat from the heat source HS is absorbed in the evaporation section EP as the latent heat of evaporation of the working medium 20 in the liquid phase into the working medium 20 in the gas phase, and then released in the condensation section (for example, a region away from the evaporation section EP in the length direction L) as the latent heat of condensation of the working medium 20 in the gas phase into the working medium 20 in the liquid phase. In this way, the heat spreader 1A works independently without the need for external power, and further, by utilizing the latent heat of evaporation and condensation of the working medium 20, the heat from the heat source HS can be diffused two-dimensionally and at high speed.

[0135] like Figure 2 As shown in FIG. 1 , when viewed from the thickness direction T, the first through hole non-arrangement region 71 extends in a direction perpendicular to the longitudinal direction of the frame body 10 . Figure 2 In the illustrated example, when viewed from the thickness direction T, the first through-hole non-arrangement region 71 extends in the width direction W perpendicular to the longitudinal direction L.

[0136] When the heat plate 1A is working, Figure 2 In the example shown, the liquid working medium 20 generated in the condensation section, here the liquid working medium 20 generated in the area away from the evaporation section EP in the length direction L, is transported to the evaporation section EP by the capillary force acting in the long side direction of the frame 10, here the capillary force acting in the length direction L, after being recovered to the core 30 and the liquid flow path. At this time, when the first through hole non-configuration area 71 extends in a direction perpendicular to the long side direction of the frame 10, here the width direction W when viewed from the thickness direction T, the overall fluid resistance of the core 30 is easily reduced relative to the liquid working medium 20 transported in the length direction L by the capillary force. Therefore, in the heat spreader 1A, when the liquid working medium 20 is transported, the pressure loss of the liquid working medium 20 is easily reduced, and as a result, the maximum heat transport amount is easily increased.

[0137] In this specification, the long side direction refers to the direction of the length direction perpendicular to the thickness direction and the width direction, which is the longer dimension when viewed from the thickness direction. In addition, the short side direction refers to the direction of the length direction perpendicular to the thickness direction and the width direction, which is the shorter dimension when viewed from the thickness direction. In addition, when the dimensions in the length direction and the width direction are the same, one of the length direction and the width direction is the long side direction, and the other of the length direction and the width direction is the short side direction.

[0138] like Figure 2 As shown, when viewed from the thickness direction T, the first through hole non-arrangement region 71 may extend from one end of the first through hole arrangement region 61 to the other end in a direction perpendicular to the long side direction of the frame body 10. Figure 2In the example shown, the first through-hole non-arrangement region 71 extends from one end of the first through-hole arrangement region 61 to the other end in the width direction W when viewed from the thickness direction T. Thus, when viewed from the thickness direction T, the first through-hole non-arrangement region 71 divides the first through-hole arrangement region 61 into two regions arranged along the length direction L.

[0139] When viewed from the thickness direction T, the first through-hole non-arrangement region 71 may not cross from one end to the other end of the first through-hole arrangement region 61 in the direction perpendicular to the long side direction of the frame body 10. For example, when viewed from the thickness direction T, the first through-hole non-arrangement region 71 may cross in the direction perpendicular to the long side direction of the frame body 10 in a manner of reaching one end of the first through-hole arrangement region 61 but not reaching the other end of the first through-hole arrangement region 61, or may cross in a manner of not reaching one end of the first through-hole arrangement region 61 but reaching the other end of the first through-hole arrangement region 61, or may cross in a manner of not reaching both one end and the other end of the first through-hole arrangement region 61.

[0140] like Figure 2 As shown in FIG. 1 , when viewed from the thickness direction T, the area of ​​the first through-hole non-arrangement region 71 is preferably smaller than the area of ​​the first through-hole arrangement region 61. Figure 2 In the example shown, the first through hole arrangement region 61 is divided into two regions, but the area of ​​the first through hole arrangement region 61 in this case is the total area of ​​the two divided regions. The same is true when the first through hole arrangement region 61 is divided into three or more regions.

[0141] If the area of ​​the first through hole non-configuration region 71 is equal to or greater than the area of ​​the first through hole configuration region 61 when viewed from the thickness direction T, the first through hole configuration region 61 where capillary force acts on the liquid working medium 20 is relatively reduced, and therefore the liquid transport capacity related to the transport of the liquid working medium 20 is difficult to improve.

[0142] From the viewpoint of reducing the pressure loss of the liquid working medium 20 when the liquid working medium 20 is transported from the condensation section to the evaporation section EP during operation of the heat spreader 1A, the first through-hole non-configuration area 71 is preferably provided in the middle of the path from the condensation section to the evaporation section EP. In addition, from the same viewpoint, the first through-hole non-configuration area 71 preferably overlaps with the condensation section of the condensation section and the evaporation section EP, and preferably does not overlap with the evaporation section EP. In this way, the first through-hole non-configuration area 71 preferably overlaps with the condensation section of the condensation section and the evaporation section EP, rather than the evaporation section EP.

[0143] exist Figure 2 and Figure 3In the example shown, a plurality of first through holes 41 are provided, but the plurality of first through holes 41 are preferably provided evenly in the first through hole arrangement region 61 so that the center-to-center distance (pitch) of the first through holes 41 is constant.

[0144] The plurality of first through holes 41 may be provided in the first through hole arrangement region 61 so that the distance (pitch) between the centers of the first through holes 41 is not constant.

[0145] The plurality of first through holes 41 in the first through hole arrangement region 61 may be arranged as follows: Figure 2 The grid arrangement shown can also be Figure 2 Different configurations, such as a staggered arrangement.

[0146] like Figure 2 and Figure 4 As shown, the core body 30 is preferably further provided with a second through hole 42 .

[0147] The second through hole 42 exerts a capillary force on the working medium 20 similarly to the first through hole 41. That is, the working medium 20 moves inside the second through hole 42 by the capillary force.

[0148] like Figure 2 and Figure 4 As shown, the second protrusion 52 close to the second inner surface 10 b of the frame body 10 in the thickness direction T is preferably located at the periphery of the second through hole 42 .

[0149] The area between the core body 30 and the first inner surface 10a of the frame body 10, more specifically, the area between the second protrusion 52 located at the periphery of the second through hole 42 and the first inner surface 10a of the frame body 10, is the same as the area between the first protrusion 51 and the first inner surface 10a of the frame body 10, constituting a liquid flow path mainly including the working medium 20 in liquid phase.

[0150] The cross-sectional shape of the second through hole 42 when viewed in a cross section perpendicular to the thickness direction T is not particularly limited, and examples thereof include a triangle, a polygon such as a rectangle, a circle, an ellipse, and a combination thereof.

[0151] exist Figure 2 and Figure 4 In the example shown, a plurality of second through holes 42 are provided, but when observing a cross section perpendicular to the thickness direction T, the cross-sectional shapes of the plurality of second through holes 42 may be the same as, different from, or partially different from each other.

[0152] When the cross section perpendicular to the thickness direction T is viewed, the cross-sectional shape of the second through hole 42 may be the same as or different from the cross-sectional shape of the first through hole 41 .

[0153] The cross-sectional shape of the second through hole 42 when observing the cross section along the thickness direction T is not particularly limited, for example, Figure 4 As shown, the diameter of the second through hole 42 (at Figure 4 The second through hole 42 may be shaped such that the diameter of the second through hole 42 is reduced. Alternatively, the second through hole 42 may be shaped such that the diameter of the second through hole 42 is increased. In addition, the cross-sectional shape of the second through hole 42 when observing the cross section along the thickness direction T may be a shape such that the diameter of the second through hole 42 is constant toward the second inner surface 10b of the frame body 10.

[0154] exist Figure 2 and Figure 4 In the example shown, a plurality of second through holes 42 are provided, but when the cross section along the thickness direction T is observed, the cross-sectional shapes of the plurality of second through holes 42 may be the same as each other, may be different from each other, or may be partially different.

[0155] When the cross section along the thickness direction T is viewed, the cross-sectional shape of the second through hole 42 may be the same as or different from the cross-sectional shape of the first through hole 41 .

[0156] The size of the second through hole 42 is not particularly limited. For example, the surface direction of the second through hole 42 (for example, in Figure 2 The dimension in the length direction L or the width direction W) is not particularly limited.

[0157] exist Figure 2 and Figure 4 In the example shown, a plurality of second through holes 42 are provided, but the sizes of the plurality of second through holes 42 may be the same, different, or partially different. Figure 2 The dimensions in the length direction L or the width direction W) may be the same as each other, different from each other, or partially different.

[0158] The size of the second through hole 42 may be the same as or different from the size of the first through hole 41. For example, the surface direction of the second through hole 42 (for example, Figure 2 The dimension in the length direction L or the width direction W) may be the same as or different from the dimension in the surface direction of the first through hole 41 .

[0159] The size, shape, number, and arrangement of the second through holes 42 may also vary in actual products. Figure 2 and Figure 4 The examples shown are different.

[0160] The second through hole 42 is formed by, for example, directing the core 30 from one main surface to the other main surface. Figure 4 In the illustrated example, the frame body 10 is formed by punching out from the main surface on the first inner surface 10 a side toward the main surface on the second inner surface 10 b side of the frame body 10 by press working.

[0161] like Figure 2 As shown, the second protrusion 52 is preferably located on the entire periphery of the second through hole 42 .

[0162] The second protrusion 52 may be located at a portion of the periphery of the second through hole 42 .

[0163] exist Figure 2 and Figure 4 In the example shown, a plurality of second through holes 42 are provided, and a plurality of second protrusions 52 are provided therewith, but it is preferred that all of the plurality of second protrusions 52 are located on the entire periphery of the second through hole 42. Alternatively, a portion of the plurality of second protrusions 52 may be located on the entire periphery of the second through hole 42. In this way, at least a portion of the plurality of second protrusions 52 may be located on the entire periphery of the second through hole 42.

[0164] The cross-sectional shape of the second protrusion 52 when observing the cross section along the thickness direction T is not particularly limited. Figure 4 As shown, the distance between the inner walls of the second protrusion 52 (in Figure 4 The shape in which the distance between the inner walls of the second convex portion 52 is increased may be a shape in which the distance between the inner walls of the second convex portion 52 is increased. In addition, the cross-sectional shape of the second convex portion 52 may be a shape in which the distance between the inner walls of the second convex portion 52 is constant toward the second inner surface 10b of the frame body 10.

[0165] The second convex portion 52 may be bent toward the second through hole 42 (inward) or toward the opposite side of the second through hole 42 (outward) at the end portion on the second inner surface 10 b side of the frame body 10 .

[0166] exist Figure 2 and Figure 4 In the example shown, there are a plurality of second protrusions 52 , but when the cross section along the thickness direction T is observed, the cross-sectional shapes of the plurality of second protrusions 52 may be the same as, different from, or partially different from each other.

[0167] The size of the second protrusion 52 is not particularly limited. For example, the size of the second protrusion 52 in the thickness direction T may be larger than the size of the second through hole 42 in the surface direction (for example, Figure 2The dimension in the length direction L or the width direction W) may be smaller than the dimension in the surface direction of the second through hole 42, or may be the same as the dimension in the surface direction of the second through hole 42.

[0168] exist Figure 2 and Figure 4 In the example shown, there are a plurality of second protrusions 52, but the sizes of the plurality of second protrusions 52 may be the same, different, or partially different. For example, the sizes of the plurality of second protrusions 52 in the thickness direction T may be the same, different, or partially different.

[0169] The size of the second convex portion 52 may be the same as or different from that of the first convex portion 51. For example, the size of the second convex portion 52 in the thickness direction T may be the same as or different from that of the first convex portion 51.

[0170] The size, shape, and configuration of the second protrusion 52 may also be different from those in the actual product. Figure 2 and Figure 4 The examples shown are different.

[0171] The second protrusion 52 is similar to the second through hole 42, for example, by directing the core 30 from one main surface to the other main surface. Figure 4 In the example shown, the second convex portion 52 is formed by punching from the main surface on the first inner surface 10a side of the frame body 10 toward the main surface on the second inner surface 10b side of the frame body 10. The second convex portion 52 may be formed at the same time as the second through hole 42, or may be formed at a different time from the second through hole 42. When punching by punching, the shape of the second convex portion 52 can be adjusted by adjusting the depth of punching, etc.

[0172] The second through hole 42 and the second convex portion 52 located at the periphery thereof may be formed at the same time as the first through hole 41 and the first convex portion 51 located at the periphery thereof, or may be formed at a different time from the first through hole 41 and the first convex portion 51 located at the periphery thereof.

[0173] like Figure 2 As shown, when viewed from the thickness direction T, the core body 30 preferably further includes a second through-hole arrangement region 62 where the second through-holes 42 are provided, and a second through-hole non-arrangement region 72 where the second through-holes 42 are not provided.

[0174] like Figure 2 As shown in FIG. 1 , when viewed from the thickness direction T, the second through-hole non-arrangement region 72 preferably crosses the second through-hole arrangement region 62. Figure 2In the illustrated example, when viewed from the thickness direction T, the second through-hole non-arrangement region 72 crosses the center portion of the second through-hole arrangement region 62 .

[0175] In this specification, the second through hole non-arrangement area refers to an area where no second through holes are provided, and the short side direction (in Figure 2 In the example shown, the minimum dimension in the longitudinal direction (L) is greater than twice the minimum value of the center-to-center distance (pitch) of the second through-holes provided in the second through-hole arrangement region.

[0176] In the heat spreader 1A, in the core 30, the second through hole non-configuration area 72 is set to cross the second through hole configuration area 62, thereby expanding the steam flow path between the core 30 and the second inner surface 10b of the frame 10 compared to the structure without the second through hole non-configuration area 72, thereby improving the thermal diffusion and resulting in an increase in the maximum heat transfer amount.

[0177] like Figure 2 As shown in FIG. 1 , when viewed from the thickness direction T, the second through hole non-arrangement region 72 may extend in a direction perpendicular to the long side direction of the frame body 10 . Figure 2 In the illustrated example, when viewed from the thickness direction T, the second through-hole non-arrangement region 72 extends in the width direction W perpendicular to the longitudinal direction L.

[0178] like Figure 2 As shown, when viewed from the thickness direction T, the second through hole non-arrangement region 72 may extend from one end of the second through hole arrangement region 62 to the other end in a direction perpendicular to the long side direction of the frame body 10. Figure 2 In the example shown, the second through-hole non-arrangement region 72 extends from one end of the second through-hole arrangement region 62 to the other end in the width direction W when viewed from the thickness direction T. Thus, when viewed from the thickness direction T, the second through-hole non-arrangement region 72 divides the second through-hole arrangement region 62 into two regions arranged along the length direction L.

[0179] When viewed from the thickness direction T, the second through-hole non-arrangement region 72 may not cross from one end to the other end of the second through-hole arrangement region 62 in the direction perpendicular to the long side direction of the frame body 10. For example, when viewed from the thickness direction T, the second through-hole non-arrangement region 72 may cross in the direction perpendicular to the long side direction of the frame body 10 in a manner of reaching one end of the second through-hole arrangement region 62 but not reaching the other end of the second through-hole arrangement region 62, or may cross in a manner of not reaching one end of the second through-hole arrangement region 62 but reaching the other end of the second through-hole arrangement region 62, or may cross in a manner of not reaching both one and the other ends of the second through-hole arrangement region 62.

[0180] like Figure 2 As shown in FIG. 1 , when viewed from the thickness direction T, the area of ​​the second through-hole non-arrangement region 72 is preferably smaller than the area of ​​the second through-hole arrangement region 62. Figure 2 In the example shown, the second through hole arrangement region 62 is divided into two regions, but the area of ​​the second through hole arrangement region 62 in this case is the total area of ​​the two divided regions. The same is true when the second through hole arrangement region 62 is divided into three or more regions.

[0181] When viewed in the thickness direction T, the area of ​​the second through-hole arrangement region 62 may be the same as or different from the area of ​​the first through-hole arrangement region 61 .

[0182] When viewed in the thickness direction T, the area of ​​the second through-hole non-arrangement region 72 may be the same as or different from the area of ​​the first through-hole non-arrangement region 71 .

[0183] The second through hole non-arrangement region 72 is preferably provided in the middle of the path from the condensation portion to the evaporation portion EP. In addition, the second through hole non-arrangement region 72 may overlap with the condensation portion or the evaporation portion EP.

[0184] exist Figure 2 and Figure 4 In the example shown, a plurality of second through holes 42 are provided, but the plurality of second through holes 42 are preferably provided evenly in the second through hole arrangement region 62 so that the center-to-center distance (pitch) of the second through holes 42 is constant.

[0185] The plurality of second through holes 42 may be provided in the second through hole arrangement region 62 so that the center-to-center distance (pitch) of the second through holes 42 is not constant.

[0186] The plurality of second through holes 42 in the second through hole arrangement region 62 may be arranged as follows: Figure 2 The grid arrangement shown can also be Figure 2 Different configurations, such as a staggered arrangement.

[0187] The first through holes 41 and the second through holes 42 can be as follows: Figure 2 As shown, they are arranged in a staggered manner, and can also be arranged in a staggered manner. Figure 2 Different configurations, such as a grid arrangement.

[0188] like Figure 2 As shown, when viewed from the thickness direction T, the first through-hole non-arrangement region 71 and the second through-hole non-arrangement region 72 preferably overlap.

[0189] When viewed in the thickness direction T, the first through hole non-arrangement region 71 and the second through hole non-arrangement region 72 may entirely overlap each other, one entirely overlaps with a portion of the other, or both regions may partially overlap each other.

[0190] The core body 30 may not be provided with the second through hole 42 and the second protrusion 52 located at the peripheral edge thereof.

[0191] The core body 30 may also be provided with through holes other than the first through hole 41 and the second through hole 42. For example, in addition to the first through hole 41 in which the first protrusion 51 is located at the periphery and the second through hole 42 in which the second protrusion 52 is located at the periphery, the core body 30 may also be provided with a through hole in which the protrusion is not located at the periphery.

[0192] In the heat diffusion device according to the first embodiment of the present invention, the position of the first through hole non-arrangement region when viewed in the thickness direction is not limited to Figure 2 The position of the first through hole arrangement region in the direction perpendicular to the long side direction of the frame body may also be Figure 2 Different locations.

[0193] <Variation 1 of Embodiment 1>

[0194] Figure 5 This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Modification 1 of Embodiment 1 of the present invention.

[0195] exist Figure 5 In the heat spreader 1B shown, when viewed from the thickness direction T, the first through hole non-configuration area 71 is in a direction perpendicular to the long side direction of the frame 10, here in the width direction W, and is located on the opposite side of the evaporation portion EP from the center of the first through hole configuration area 61.

[0196] like Figure 5 As shown, when viewed from the thickness direction T, the second through hole non-configuration area 72 may be in a direction perpendicular to the long side direction of the frame body 10, here in the width direction W, crossing the center of the second through hole configuration area 62 and closer to the opposite side of the evaporation portion EP.

[0197] <Variation 2 of Embodiment 1>

[0198] Figure 6 This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Modification 2 of Embodiment 1 of the present invention.

[0199] exist Figure 6In the heat spreader 1C shown, when viewed from the thickness direction T, the first through hole non-configuration area 71 is perpendicular to the long side direction of the frame 10, here in the width direction W, and crosses the center of the first through hole configuration area 61 to the evaporation portion EP side.

[0200] like Figure 6 As shown, when viewed from the thickness direction T, the second through hole non-configuration area 72 may be in a direction perpendicular to the long side direction of the frame body 10, here in the width direction W, crossing a position closer to the evaporation portion EP than the center of the second through hole configuration area 62.

[0201] In the heat diffusion device according to the first embodiment of the present invention, the number of the first through hole non-arrangement regions is not limited to Figure 2 The one shown may also be multiple.

[0202] <Variation 3 of Embodiment 1>

[0203] Figure 7 This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Modification 3 of Embodiment 1 of the present invention.

[0204] exist Figure 7 In the heat spreader 1D shown in FIG. 1 , when viewed from the thickness direction T, the first through hole non-arrangement region 71 crosses the first through hole arrangement region 61 at two locations. Figure 7 As shown, the core 30 includes two first through hole non-arrangement areas 71 .

[0205] The core body 30 may include three or more first through-hole non-arrangement regions 71 .

[0206] like Figure 7 As shown in FIG. 1 , when viewed from the thickness direction T, the second through hole non-arrangement region 72 may cross the second through hole arrangement region 62 at two locations. Figure 7 As shown, the core 30 may also include two second through hole non-arrangement areas 72 .

[0207] The core body 30 may include three or more second through-hole non-arrangement regions 72 .

[0208] <Implementation method 2>

[0209] In the heat diffusion device according to the second embodiment of the present invention, the first through hole non-arrangement region extends in a direction parallel to the longitudinal direction of the frame when viewed in the thickness direction. The heat diffusion device according to the second embodiment of the present invention is the same as the heat diffusion device according to the first embodiment of the present invention except for the above point.

[0210] Figure 8This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Embodiment 2 of the present invention.

[0211] exist Figure 8 In the heat spreader 2A shown in FIG. 1 , when viewed from the thickness direction T, the first through hole non-arrangement region 71 extends in a direction parallel to the longitudinal direction of the frame body 10 . Figure 8 In the illustrated example, when viewed from the thickness direction T, the first through-hole non-arrangement region 71 extends along the longitudinal direction L.

[0212] When the heat plate 2A is working, Figure 8 In the example shown, the liquid working medium 20 generated in the condensation portion, here the liquid working medium 20 generated in the region away from the evaporation portion EP in the length direction L, is transported to the evaporation portion EP by the capillary force acting in the long side direction of the frame 10, here the capillary force acting in the length direction L, after being recovered to the core 30 and the liquid flow path. At this time, when the first through hole non-configuration area 71 extends in a direction parallel to the long side direction of the frame 10, here the length direction L, in the first through hole configuration area 61 divided by the first through hole non-configuration area 71, the area with a larger maximum dimension in the direction perpendicular to the long side direction of the frame 10, here the area with a larger maximum dimension in the width direction W (in Figure 8 In the area on the right side of the first through hole non-configuration area 71), the fluid resistance to the liquid-phase working medium 20 becomes small. Therefore, in the heat spreader 2A, in the area with a larger maximum dimension in the direction perpendicular to the long side direction of the frame 10 in the first through hole configuration area 61, here, in the area with a larger maximum dimension in the width direction W, the liquid-phase working medium 20 is easily recovered. Therefore, in the heat spreader 2A, the liquid transport capacity related to the transport of the liquid-phase working medium 20 is easily improved, and as a result, the maximum heat transport amount is easily improved.

[0213] like Figure 8 As shown, when viewed from the thickness direction T, the first through hole non-arrangement region 71 may extend from one end of the first through hole arrangement region 61 to the other end in a direction parallel to the long side direction of the frame body 10. Figure 8 In the example shown, the first through-hole non-arrangement region 71 extends from one end of the first through-hole arrangement region 61 to the other end in the length direction L when viewed from the thickness direction T. Thus, when viewed from the thickness direction T, the first through-hole non-arrangement region 71 divides the first through-hole arrangement region 61 into two regions arranged in the width direction W.

[0214] When viewed from the thickness direction T, the first through-hole non-arrangement region 71 may not cross from one end to the other end of the first through-hole arrangement region 61 in a direction parallel to the long side direction of the frame body 10. For example, when viewed from the thickness direction T, the first through-hole non-arrangement region 71 may cross in a direction parallel to the long side direction of the frame body 10 in a manner of reaching one end of the first through-hole arrangement region 61 but not reaching the other end of the first through-hole arrangement region 61, or may cross in a manner of not reaching one end of the first through-hole arrangement region 61 but reaching the other end of the first through-hole arrangement region 61, or may cross in a manner of not reaching both one end and the other end of the first through-hole arrangement region 61.

[0215] From the viewpoint of improving the recovery efficiency of the liquid working medium 20 when the heat spreader 2A is working, it is preferred that an area with a larger maximum dimension in the direction perpendicular to the long side direction of the frame 10 in the first through hole configuration area 61, here is an area with a larger maximum dimension in the width direction W, overlaps with the condensation portion, here is an area away from the evaporation portion EP in the length direction L.

[0216] like Figure 8 As shown, when viewed from the thickness direction T, the first through hole non-configuration area 71 may be in a direction parallel to the long side direction of the frame body 10, here, a position on the side of one end in the direction perpendicular to the long side direction of the frame body 10 that crosses the central portion of the first through hole configuration area 61 in the length direction L, here, a position on the side of one end in the width direction W (at Figure 8 : The position on the left side in the width direction W).

[0217] When viewed from the thickness direction T, the first through hole non-configuration area 71 may also be in a direction parallel to the long side direction of the frame 10, here, in the longitudinal direction L, across the central portion of the first through hole configuration area 61 and closer to the other end side in the direction perpendicular to the long side direction of the frame 10, here, in the width direction W. Figure 8 centered is the position on the right side in the width direction W).

[0218] When viewed from the thickness direction T, the first through hole non-configuration area 71 may also be in a direction parallel to the long side direction of the frame body 10, here, the central portion of the first through hole configuration area 61 in the length direction L. In this case, the first through hole configuration area 61 is divided by the first through hole non-configuration area 71 into areas having the same maximum dimension in a direction perpendicular to the long side direction of the frame body 10, here, the maximum dimension in the width direction W, so the recovery efficiency of the liquid-phase working medium 20 is equal in each area.

[0219] like Figure 8As shown in FIG. 1 , when viewed from the thickness direction T, the second through hole non-arrangement region 72 may extend in a direction parallel to the long side direction of the frame body 10 . Figure 8 In the illustrated example, the second through-hole non-arrangement region 72 extends along the longitudinal direction L when viewed from the thickness direction T.

[0220] like Figure 8 As shown, when viewed from the thickness direction T, the second through hole non-arrangement region 72 may also extend from one end of the second through hole arrangement region 62 to the other end in a direction parallel to the long side direction of the frame body 10. Figure 8 In the example shown, the second through-hole non-arrangement region 72 extends from one end to the other end of the second through-hole arrangement region 62 in the length direction L when viewed from the thickness direction T. Thus, when viewed from the thickness direction T, the second through-hole non-arrangement region 72 divides the second through-hole arrangement region 62 into two regions arranged in the width direction W.

[0221] When viewed from the thickness direction T, the second through-hole non-arrangement region 72 may not cross from one end to the other end of the second through-hole arrangement region 62 in a direction parallel to the long side direction of the frame body 10. For example, when viewed from the thickness direction T, the second through-hole non-arrangement region 72 may cross in a direction parallel to the long side direction of the frame body 10 in a manner of reaching one end of the second through-hole arrangement region 62 but not reaching the other end of the second through-hole arrangement region 62, or may cross in a manner of not reaching one end of the second through-hole arrangement region 62 but reaching the other end of the second through-hole arrangement region 62, or may cross in a manner of not reaching both one and the other ends of the second through-hole arrangement region 62.

[0222] like Figure 8 As shown, when viewed from the thickness direction T, the second through hole non-configuration area 72 may be in a direction parallel to the long side direction of the frame body 10, here, in the length direction L, crossing the central portion of the second through hole configuration area 62 and closer to one end side in the direction perpendicular to the long side direction of the frame body 10, here, in the width direction W (at Figure 8 : The position on the left side in the width direction W).

[0223] When viewed from the thickness direction T, the second through hole non-configuration area 72 may also be in a direction parallel to the long side direction of the frame 10, here, in the longitudinal direction L, across the central portion of the second through hole configuration area 62 and closer to the other end side in the direction perpendicular to the long side direction of the frame 10, here, in the width direction W. Figure 8 centered is the position on the right side in the width direction W).

[0224] When viewed from the thickness direction T, the second through hole non-arrangement region 72 may be in a direction parallel to the longitudinal direction of the frame body 10 , and may be across the center of the second through hole arrangement region 62 in the longitudinal direction L here.

[0225] In the heat diffusion device according to the second embodiment of the present invention, the planar shape of the frame body 10 when viewed from the thickness direction T is not limited to Figure 8 The rectangle shown can also be Figure 8 Different shapes.

[0226] <Variation 1 of Embodiment 2>

[0227] Fig. 9 This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Modification 1 of Embodiment 2 of the present invention.

[0228] exist Fig. 9 In the illustrated heat spreader 2B, the planar shape of the frame body 10 when viewed from the thickness direction T is L-shaped.

[0229] In the heat spreader 2B, in the first through hole arrangement area 61 divided by the first through hole non-arrangement area 71, the area with a larger maximum dimension in the direction perpendicular to the long side direction of the frame 10, here, the area with a larger maximum dimension in the width direction W (in Fig. 9 In the region (the region on the right side of the first through hole non-configuration region 71), the fluid resistance to the liquid working medium 20 is reduced, so that the liquid working medium 20 is easily recovered. In contrast, in the heat spreader 2B, in the internal space of the frame 10, in the region around the corner farthest from the evaporation portion EP (in Fig. 9 The area around the lower right corner in the middle is easy to accumulate the condensed liquid working medium 20, but because the area with a larger maximum dimension in the direction perpendicular to the long side direction of the frame 10 in the first through hole configuration area 61, here is the area with a larger maximum dimension in the width direction W, is located in the area where the liquid working medium 20 is easy to accumulate, the recovery efficiency of the liquid working medium 20 is easy to improve.

[0230] exist Fig. 9 In the illustrated example, the first through-hole non-arrangement region 71 overlaps with the evaporation portion EP, but it is preferable that the first through-hole non-arrangement region 71 does not overlap with the evaporation portion EP.

[0231] Furthermore, in the heat diffusion device according to other embodiments of the present invention, the planar shape of the frame body when viewed from the thickness direction is not limited to a rectangle, and may be a shape other than a rectangle, such as an L-shape.

[0232] <Implementation method 3>

[0233] In the heat diffusion device of the third embodiment of the present invention, when viewed from the thickness direction, the first through hole non-configuration area has an intersection. In addition, in the heat diffusion device of the third embodiment of the present invention, when viewed from the thickness direction, the first through hole non-configuration area extends in two directions, a direction perpendicular to the long side direction of the frame and a direction parallel to the long side direction of the frame. The heat diffusion device of the third embodiment of the present invention is the same as the heat diffusion device of the first embodiment of the present invention except for the above point.

[0234] Fig.10 This is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Embodiment 3 of the present invention.

[0235] exist Fig.10 In the illustrated heat spreader 3A, when viewed from the thickness direction T, the first through-hole non-arrangement region 71 has an intersection portion.

[0236] like Fig.10 As shown, when viewed from the thickness direction T, the first through hole non-arrangement region 71 extends in two directions: a direction perpendicular to the long side direction of the frame body 10 and a direction parallel to the long side direction of the frame body 10. Fig.10 In the illustrated example, when viewed from the thickness direction T, the first through-hole non-arrangement region 71 extends in both the width direction W and the length direction L.

[0237] In the heat spreader 3A, in the core 30, the first through hole non-arrangement area 71 extends in two directions, namely, the width direction W and the length direction L, perpendicular to the long side direction of the frame 10 and parallel to the long side direction of the frame 10, so as to have an intersection, thereby obtaining the heat spreader 1A (refer to Figure 2 ) and heat plate 2A (refer to Figure 8 ) is combined. That is, in the heat spreader 3A, when the liquid working medium 20 is transported, the pressure loss of the liquid working medium 20 is easily reduced, and further, the liquid working medium 20 is easily recovered. As a result, in the heat spreader 3A, the maximum heat transport amount is easily increased.

[0238] like Fig.10 As shown, when viewed from the thickness direction T, the second through-hole non-arrangement region 72 may have an intersection portion.

[0239] like Fig.10 As shown, when viewed from the thickness direction T, the second through hole non-arrangement region 72 may extend in two directions: a direction perpendicular to the long side direction of the frame body 10 and a direction parallel to the long side direction of the frame body 10. Fig.10In the illustrated example, when viewed from the thickness direction T, the second through-hole non-arrangement region 72 extends in both the width direction W and the length direction L.

[0240] In the heat diffusion device according to the third embodiment of the present invention, when viewed from the thickness direction, the first through hole non-arrangement region may be arranged along the same direction as the first through hole non-arrangement region. Fig.10 In addition, in the heat diffusion device of the third embodiment of the present invention, the second through hole non-configuration area may also extend in a direction similar to the Fig.10 The different multiple directions extend so as to have an intersection.

[0241] <Implementation method 4>

[0242] The heat diffusion device according to the fourth embodiment of the present invention is bent at the first through hole non-arrangement region. The heat diffusion device according to the fourth embodiment of the present invention is the same as the heat diffusion device according to the first embodiment of the present invention except for the above point.

[0243] Hereinafter, as an example of a heat diffusion device according to Embodiment 4 of the present invention, the heat diffusion device according to Embodiment 1 of the present invention is bent at the first through hole non-arrangement region. The heat diffusion devices according to other embodiments of the present invention are also bent at the first through hole non-arrangement region.

[0244] Fig.11 It is a perspective schematic diagram showing an example of a heat diffusion device according to a fourth embodiment of the present invention. Fig.12 It is a perspective schematic diagram showing an example of the internal structure of the heat diffusion device according to the fourth embodiment of the present invention.

[0245] Fig.11 and Fig.12 The heat spreader 1A' shown in FIG. 1 is bent at the first through hole non-arrangement region 71. More specifically, the heat spreader 1A' is a heat spreader 1A (see FIG. 1A). Figure 1 and Figure 2 ) is bent at the first through hole non-configuration area 71.

[0246] Since the first through hole non-arrangement region 71 where the heat spreader 1A' is bent does not have the first through hole 41 and the first protrusion 51, stress caused by bending is less likely to be generated in the core 30. Therefore, in the heat spreader 1A', the core 30 is less likely to be damaged when being bent.

[0247] like Fig.12 As shown, the heat spreader 1A′ may be bent at the second through-hole non-arrangement region 72 .

[0248] like Fig.12As shown, when the first through hole non-arrangement region 71 and the second through hole non-arrangement region 72 overlap, the heat spreader 1A can be easily bent at the first through hole non-arrangement region 71 and the second through hole non-arrangement region 72 when obtaining the heat spreader 1A′.

[0249] In the heat diffusion device according to the fourth embodiment of the present invention, the bending angle is not limited to Fig.11 and Fig.12 The approximately 90° shown can also be Fig.11 and Fig.12 Different angles.

[0250] In the heat diffusion device of the present invention, when viewed from the thickness direction, the evaporation portion can be as follows: Figure 2 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 as well as Fig.12 Thus, in the heat diffusion device of the utility model, when viewed from the thickness direction, the evaporation portion can be arranged at the inner edge or its periphery of the frame, or at the central part or its periphery of the frame.

[0251] [Electronic equipment]

[0252] The electronic device of the present invention is characterized by comprising the heat diffusion device of the present invention.

[0253] Hereinafter, as an example of the electronic device of the present invention, an electronic device including the heat diffusion device according to the first embodiment of the present invention will be described. The same is true for electronic devices including the heat diffusion devices according to other embodiments of the present invention.

[0254] Fig.13 It is a perspective schematic diagram showing an example of the electronic device of the present invention.

[0255] Fig.13 The electronic device 100 shown has a vapor chamber 1A.

[0256] like Fig.13 As shown, the electronic device 100 preferably also has an electronic component 110 .

[0257] like Fig.13 As shown in FIG. 1 , the electronic component 110 is preferably disposed on the outer surface of the frame 10 of the heat spreader 1A. In this case, the electronic component 110 is Figure 1 As the heat source HS shown, the heat spreader 1A can function.

[0258] The electronic component 110 is relative to Figure 3 and Figure 4 The frame 10 of the heat spreader 1A shown can be set on the outer surface of the frame 10 opposite to the first inner surface 10a, which is the outer surface of the first sheet 11, or can be set on the outer surface of the frame 10 opposite to the second inner surface 10b, which is the outer surface of the second sheet 12.

[0259] The electronic component 110 may be directly provided on the outer surface of the housing 10 , or may be provided via other components such as an adhesive, a sheet, or a tape having high thermal conductivity.

[0260] When the electronic component 110 is provided on the outer surface of the housing 10 , it is preferred that the electronic component 110 overlaps with the evaporation portion EP when viewed in the thickness direction T.

[0261] Examples of the electronic component 110 include heat generating elements such as a central processing unit (CPU), a light emitting diode (LED), and a power semiconductor.

[0262] like Fig.13 As shown, the electronic device 100 preferably further includes a device housing 120 .

[0263] exist Fig.13 In the illustrated example, the heat spreader 1A and the electronic component 110 are disposed in the internal space of the device housing 120 .

[0264] The housing 10 and the device housing 120 are preferably joined via a joining member. More specifically, the outer surface of the housing 10 and the inner surface of the device housing 120 are preferably joined via a joining member. In this case, the adhesion between the housing 10 and the device housing 120 is improved.

[0265] The joining member joining the housing 10 and the device housing 120 is preferably a thermally conductive member. In this case, the heat from the heat source HS, here the heat from the electronic component 110, is easily conducted from the housing 10 to the device housing 120. That is, the heat from the heat source HS, here the heat from the electronic component 110, is also easily diffused through the path from the housing 10 to the device housing 120.

[0266] Examples of the thermally conductive member include a thermally conductive tape and a thermally conductive adhesive.

[0267] As described above, the heat spreader 1A works independently without external power, and further, by utilizing the latent heat of evaporation and condensation of the working medium 20, it is possible to diffuse heat from the heat source HS, which is the heat from the electronic component 110, in two dimensions and at high speed. As described above, the electronic device 100 having the heat spreader 1A can effectively achieve heat dissipation in a limited space inside the electronic device 100.

[0268] In this specification, the following contents are disclosed.

[0269] <1> A heat diffusion device, characterized by comprising:

[0270] The frame has a first inner surface and a second inner surface that are opposite to each other in the thickness direction and is provided with an internal space;

[0271] A working medium is sealed in the internal space of the frame; and

[0272] The core is arranged in the inner space of the frame.

[0273] The core body is provided with a first through hole, and a first convex portion close to the first inner surface of the frame body in the thickness direction is located at a periphery of the first through hole.

[0274] When viewed in the thickness direction, the core body includes: a first through hole arrangement region in which the first through holes are arranged; and a first through hole non-arrangement region in which the first through holes are not arranged and which crosses the first through hole arrangement region.

[0275] <2> According to the heat spreader described in <1>,

[0276] The first through hole non-arrangement region extends in a direction perpendicular to the longitudinal direction of the frame body when viewed in the thickness direction.

[0277] <3> According to the heat diffusion device described in <1>,

[0278] The first through-hole non-arrangement region extends in a direction parallel to the longitudinal direction of the frame body when viewed in the thickness direction.

[0279] <4> According to the heat diffusion device described in <1>,

[0280] The first through-hole non-arrangement region has an intersection portion when viewed from the thickness direction.

[0281] <5> According to the heat diffusion device described in <4>,

[0282] When viewed in the thickness direction, the first through-hole non-arrangement region extends in two directions: a direction perpendicular to the longitudinal direction of the frame body and a direction parallel to the longitudinal direction of the frame body.

[0283] <6> The heat spreader according to any one of <1> to <5>,

[0284] The heat diffusion element is bent in the first through hole non-arrangement region.

[0285] <7> The heat spreader according to any one of <1> to <6>,

[0286] The core body is further provided with a second through hole, and a second protrusion close to the second inner surface of the frame body in the thickness direction is located at a periphery of the second through hole.

[0287] <8> According to the heat diffusion device described in <7>,

[0288] When viewed from the thickness direction, the core body further includes: a second through hole configuration region in which the second through holes are provided; and a second through hole non-configuration region in which the second through holes are not provided and which crosses the second through hole configuration region.

[0289] <9> According to the heat diffusion device described in <8>,

[0290] When viewed from the thickness direction, the first through-hole non-arrangement region and the second through-hole non-arrangement region overlap.

[0291] <10> An electronic device, characterized in that:

[0292] A heat diffusion device according to any one of <1> to <9> is provided.

[0293] [Industrial Applicability]

[0294] The heat diffusion device of the utility model can be used for a wide range of purposes in the fields of portable information terminals, etc. The heat diffusion device of the utility model can be used, for example, to reduce the temperature of heat sources such as central processing units, extend the use time of electronic devices, and can be used in electronic devices such as smart phones, tablet terminals, laptops, gaming devices, and wearable devices.

Claims

1. A heat diffusion device, characterized in that: have: The frame has a first inner surface and a second inner surface that are opposite to each other in the thickness direction and is provided with an internal space; A working medium is sealed in the internal space of the frame; as well as A core body is arranged in the inner space of the frame body, The core body is provided with a first through hole, and a first convex portion close to the first inner surface of the frame body in the thickness direction is located at a periphery of the first through hole. When viewed from the thickness direction, the core body includes: a first through hole configuration area, in which the first through holes are provided; and a first through-hole non-arrangement region in which the first through-holes are not provided and which crosses the first through-hole arrangement region.

2. The heat diffusion device according to claim 1, characterized in that: The first through-hole non-arrangement region extends in a direction perpendicular to the longitudinal direction of the frame body when viewed in the thickness direction.

3. The heat diffusion device according to claim 1, characterized in that: The first through-hole non-arrangement region extends in a direction parallel to the longitudinal direction of the frame body when viewed in the thickness direction.

4. The heat diffusion device according to claim 1, characterized in that: The first through-hole non-arrangement region has an intersection portion when viewed from the thickness direction.

5. The heat diffusion device according to claim 4, characterized in that: When viewed in the thickness direction, the first through-hole non-arrangement region extends in two directions: a direction perpendicular to the longitudinal direction of the frame body and a direction parallel to the longitudinal direction of the frame body.

6. The heat diffusion device according to claim 1, characterized in that The heat spreading element is bent at a region where the first through hole is not arranged.

7. The heat diffusion device according to claim 1, characterized in that The core body is further provided with a second through hole, and a second protrusion close to the second inner surface of the frame body in the thickness direction is located at a periphery of the second through hole.

8. The heat diffusion device according to claim 7, characterized in that When viewed from the thickness direction, the core body further includes: a second through hole arrangement region in which the second through holes are arranged; and a second through hole non-arrangement region in which the second through holes are not arranged and which crosses the second through hole arrangement region.

9. The heat diffusion device according to claim 8, characterized in that The first through-hole non-arrangement region and the second through-hole non-arrangement region overlap each other when viewed in the thickness direction.

10. An electronic device, characterized in that: The electronic device comprises the heat diffusion device according to any one of claims 1 to 9.

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