Processing device for managing physical entity component to be attached to component carrier
By designing a processing device including peeling, cutting and detection devices, the problem of poor attachment of component carriers caused by failure of peeling of membrane components is solved, and the appropriate management of component carriers is realized, which reduces production costs and improves product quality.
Patent Information
- Application Number
- CN202420628759.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-03-27
AI Technical Summary
During the manufacturing process of component carriers, failure of the peeling of the membrane assembly causes the membrane assembly that has not been completely peeled to adhere to the surface of the component carrier, causing production defects and reducing production yields.
A processing device is designed, including a peeling device, a cutting device and a detection device. The peeling device is used to peel the second physical entity from the first physical entity, the cutting device is used to cut the first physical entity, and re-peeling is used to re-peel when the peeling fails. The detection device is used to detect whether the second physical entity after peeling is completely removed, and if it is not removed, an alarm will be triggered.
It effectively prevents poor attachment of component carriers due to unsuccessful peeling of membrane components, avoids waste and scrapping of component carriers, reduces production costs and material losses, and improves production efficiency and product quality.
Smart Images
Figure CN222653917U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of semiconductor device manufacturing. In particular, the present application relates to a processing device for managing physical entity components to be attached to a component carrier. Background Art
[0002] This section provides background information related to the present application but this information does not necessarily constitute prior art.
[0003] Against the background of increasing product functionality of component carriers, such as printed circuit boards, equipped with one or more electronic components and the increasing number of electronic components to be mounted on the component carriers, there is a need to use increasingly powerful array-like components or packages with a plurality of electronic components, which have a plurality of contacts or connections and increasingly smaller spacings between these contacts or connections. During operation, the removal of the heat generated by such electronic components and the component carrier itself is becoming an increasingly serious problem. At the same time, the component carrier should be mechanically stable and electrically reliable in order to be able to operate even under harsh conditions.
[0004] Due to the above characteristics of the product, equipment that can accurately control the product and production materials and is easy to operate is required during the manufacturing process. Before attaching the membrane assembly to the component carrier, the membrane assembly needs to be partially peeled off. In the related art, there are problems caused by peeling failure, such as the membrane assembly that is not completely peeled off is attached to the surface of the component carrier in an undesirable manner, resulting in defects in the component carrier in the subsequent production process, thereby reducing the production yield. Utility Model Content
[0005] This section provides a general summary of the application, and is not a comprehensive disclosure of its full scope or all of its features.
[0006] Some embodiments of the present application provide a processing device for managing a physical entity component to be attached to a component carrier, wherein the physical entity component includes at least a first physical entity to be attached to the component carrier and a second physical entity covering a first main surface of the first physical entity, and the processing device includes: a peeling device, the peeling device is configured to peel the second physical entity from the first physical entity to expose the first main surface of the first physical entity to be attached to the component carrier; a cutting device, the cutting device includes a cutting member and a re-peeling member, the cutting member is configured to cut the first physical entity that has undergone a peeling operation, and the re-peeling member is configured to re-peel the second physical entity that has not been successfully peeled off when the peeling device does not successfully peel the second physical entity off the first physical entity; and at least one first detection device, the first detection device detects the presence of the peeled second physical entity, and the first detection device triggers an alarm when the presence of the peeled second physical entity is not detected, so that the processing device stops operating.
[0007] The processing device according to the exemplary embodiment of the present application is capable of re-peeling the second physical entity that has not been successfully peeled off from the first physical entity when the peeling device has not successfully peeled off the second physical entity, so that the cutting member always only cuts the first physical entity, thereby effectively preventing the following undesirable situation from occurring, that is, because the second physical entity has not been successfully peeled off from the first physical entity, the cutting member acts on the first physical entity and the second physical entity at the same time, thereby causing the cut first physical entity to still be at least partially attached with the second physical entity that should have been peeled off. In addition, the first detection device included in the processing device of the exemplary embodiment of the present application is capable of detecting the existence of the peeled second physical entity. When the first detection device fails to detect the existence of the peeled second physical entity due to the re-peeling operation of the re-peeling member, the first detection device will issue an alarm signal to stop the processing device from operating. In this way, the processing equipment provided by the exemplary embodiment of the present application can achieve proper management of the physical entity components to be attached to the component carrier, and such proper management can not only avoid the waste of the component carrier and the physical entity components, especially the first physical entity, but also effectively prevent the component carrier from being scrapped due to poor attachment to the first physical entity (because the second physical entity has not been peeled off), thereby significantly reducing production costs and material losses, and improving production efficiency and product quality as a whole. In addition, the above configuration of the processing equipment makes the peeling and re-peeling of the physical entity easy to operate, which is more conducive to the precise control of the product.
[0008] In some optional embodiments, when the processing equipment is in an operating state, the physical entity component is fed along a predetermined feed path, wherein the peeling device is arranged along the feed path upstream of an attachment position where the first main surface of the first physical entity is attached to the component carrier; and wherein the cutting device is arranged along the feed path upstream of the attachment position where the first main surface of the first physical entity is attached to the component carrier, and the cutting device is arranged along the feed path downstream of the peeling device.
[0009] In this way, the peeling device and the cutting device are appropriately positioned along the feeding path of the component carrier, so that when the upstream peeling device has successfully peeled off the second physical entity, only the cutting member in the downstream cutting device then acts on the first physical entity that has been peeled off to cut out the first physical entity of a predetermined size suitable for attachment to the component carrier; and when the upstream peeling device has not successfully peeled off the second physical entity, the re-peeling member in the downstream cutting device acts on the unsuccessfully peeled second physical entity to peel it off through a re-peeling operation, and then or almost simultaneously, the cutting member in the cutting device acts on the first physical entity that has been re-peeled to cut out the first physical entity of a predetermined size suitable for attachment to the component carrier. Such a setting can prevent the second physical entity from being attached to the surface of the first physical entity in an undesirable manner to the greatest extent during the operation of the device, and improve the processing efficiency.
[0010] In some optional embodiments, the cutting device is configured to reciprocate in a direction transverse to / perpendicular to the feeding direction of the physical entity component when the processing device is in operation. Such an arrangement can make the movement trajectory of the cutting device when cutting the physical entity component relatively short, especially the shortest, thereby improving the cutting efficiency and the positioning accuracy of the cutting position.
[0011] In some optional embodiments, the re-stripping member is configured as an elongated extension member. The elongated extension member can be adjusted in length, direction and / or height to adapt to the layout of various devices in the processing equipment, thereby further improving the efficiency of re-stripping and ensuring that the second physical entity does not adhere to the surface of the first physical entity in an undesirable manner.
[0012] In some optional embodiments, the re-stripping member is constructed as one of the following: a rod-shaped member installed on the main body of the cutting device, a gripping member installed on the main body of the cutting device, and a protrusion protruding from the main body of the cutting device.
[0013] In some optional embodiments, the re-peeling member is configured to be connected to the cutting member in a manner that it can move relative to the cutting member. In this way, the relative position between the re-peeling member and the cutting member is adjustable, which promotes the flexibility of the device in operation and can also be applied to component carriers with different thicknesses.
[0014] In some optional embodiments, the re-peeling member is configured to be releasably and / or adjustably mounted upstream of the cutting member along the predetermined feeding path of the component carrier, in particular, the re-peeling member is configured to be releasably and / or adjustably mounted below the bottom of the cutting member. The re-peeling member is appropriately positioned upstream of the cutting member in a releasable and / or adjustably manner, so that before the cutting member performs the cutting operation, the second physical entity that has not been successfully peeled off by the peeling device can be successfully peeled off by the action of the re-peeling member.
[0015] In some optional embodiments, when the processing device is in an operating state, the cutting member is arranged along the feeding direction of the physical entity component downstream of the peeling point where the peeling device separates the first physical entity from the second physical entity; and the re-peeling member is arranged along the feeding direction of the physical entity component upstream or downstream of the peeling point when the processing device is in an operating state.
[0016] In some optional embodiments, when the processing device is in operation, the re-peeling member is arranged to be oriented perpendicular to the physical entity component or inclined at a first predetermined angle relative to the physical entity component at a peeling point where the peeling device separates the first physical entity from the second physical entity. The re-peeling member is oriented perpendicular to the physical entity component or inclined at a first predetermined angle relative to the physical entity component at the peeling point, which can facilitate the effective execution of the re-peeling operation to a certain extent.
[0017] In some optional embodiments, the re-peeling member is arranged upstream or downstream of the peeling point where the peeling device separates the first physical entity from the second physical entity along the feeding direction of the physical entity assembly when the processing device is in an operating state, and the re-peeling member is oriented to be perpendicular to the peeled second physical entity or inclined at a second predetermined angle relative to the peeled second physical entity. Such positioning of the re-peeling member can facilitate the effective execution of the re-peeling operation.
[0018] In some optional embodiments, the re-peeling member includes a mounting seat and an elongated member to be acted on the second physical entity that has not been successfully peeled off by the peeling device, and the mounting seat is movably mounted on the main body of the cutting device, and the mounting seat is provided with a connecting portion, and the elongated member is connected to the mounting seat via the connecting portion.
[0019] In some optional embodiments, the elongated member is movably coupled to the mounting seat, which promotes operational flexibility and universal applicability of the re-stripping member.
[0020] In some optional embodiments, the coupling portion includes a mounting hole extending between two main surfaces of the mounting seat, and the elongated member is coupled to the mounting seat by being inserted into the mounting hole. In this way, the elongated member can be mechanically simply coupled to the mounting seat.
[0021] In some optional embodiments, the re-peeling member further comprises a fixing member acting on the elongated member, the fixing member being configured to fix the elongated member to the mounting seat in an adjustably manner and to position the elongated member to extend an appropriate length toward the second physical entity being peeled near the peeling point where the peeling device separates the first physical entity from the second physical entity. In this way, the orientation of the elongated member relative to the second physical entity and the length extending toward the second physical entity are both adjustable, further promoting the operational flexibility and universal applicability of the re-peeling member.
[0022] In some optional embodiments, the processing device further comprises a conveying device, the conveying device comprising: a feed roller, the feed roller feeds the physical entity assembly along the feed path; and a collection roller, the collection roller is configured to collect the peeled second physical entity, wherein the peeled second physical entity extends from the peeling point where the first physical entity is separated from the second physical entity to the collection roller. The use of the feed roller and the collection roller allows the physical entity assembly and the peeled second physical entity to be stored in a roll form, thereby saving space.
[0023] In some optional embodiments, the first detection device is a proximity sensor.
[0024] In some optional embodiments, the first detection device includes at least one of the following: a photoelectric sensor; a capacitive sensor; an ultrasonic sensor; an infrared sensor; or a magnetic sensor. Such a first detection device can flexibly and accurately detect whether the peeled second physical entity exists.
[0025] In some optional embodiments, the processing device includes at least two first detection devices, and when the processing device is in operation, at least one of the at least two first detection devices is arranged above the first lateral edge region of the peeled second physical entity, and at least one of the other at least two first detection devices is arranged above the second lateral edge region of the peeled second physical entity. In this way, providing at least two first detection devices enables the peeled state of the second physical entity to be quickly detected when the re-peeling member re-peels the second physical entity that has not been successfully peeled off by the peeling device from either side, thereby improving the sensitivity / accuracy of detecting the existence of the peeled second physical entity as a whole.
[0026] In some optional embodiments, the processing device includes a supporting device, and at least two of the first detection devices are movably arranged on the supporting device.
[0027] In some optional embodiments, the processing device further comprises at least one second detection device, and when the processing device is in an operating state, the at least one second detection device is arranged above the central area of the second physical entity being peeled off. In some embodiments, the second detection device can be movably arranged on the supporting device together with the first detection device. In other embodiments, the second detection device can be separately arranged on another, particularly movable, support or mounting structure. By arranging at least one second detection device above the central area of the second physical entity being peeled off, it is possible to detect whether the first physical entity is at least partially improperly adhered to the second physical entity being peeled off, thereby controlling the peeling quality.
[0028] In some optional embodiments, the processing device is connected to an electronic relay to stop the processing device from operating if the alarm is triggered.
[0029] In some optional embodiments, the cutting member includes an annular blade and a housing for accommodating the annular blade, wherein a portion of the annular blade is exposed outside the housing for cutting the first physical entity after the stripping operation. In this way, the cutting member has lower cutting resistance and higher mechanical wear resistance.
[0030] In some optional embodiments, the physical entity assembly is a film assembly, wherein the film assembly comprises at least a first film to be attached to the component carrier and a second film covering the first main surface of the first film. In particular, the film assembly further comprises a third film covering the second main surface (relative to the first main surface) of the first film.
[0031] In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components on and / or in the component carrier to provide mechanical support and / or electrical and / or thermal connection. In other words, the component carrier may be configured as a mechanical carrier and / or electronic carrier and / or thermal carrier for the components. In particular, the component carrier may be one of a printed circuit board, an organic interposer and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board, which combines different types of component carriers of the above-mentioned types of component carriers.
[0032] In an embodiment, the component carrier comprises a stack having at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate of one or more electrically insulating layer structures and one or more electrically conductive layer structures as mentioned, formed in particular by applying mechanical pressure and / or thermal energy. The mentioned stack can provide a plate-like component carrier that can provide a large mounting surface for further components and is still very thin and compact.
[0033] In an embodiment, the component carrier is configured as one of a printed circuit board, a substrate (in particular an IC substrate) and an interposer.
[0034] In the context of the present application, the term "printed circuit board" may particularly denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and / or by supplying thermal energy. As a preferred material for printed circuit board technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may include resin and / or glass fiber, so-called prepreg, or FR4 material. The various electrically conductive layer structures may be connected to each other in a desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and by partially or completely filling these holes with electrically conductive material (in particular copper) to form vias or any other through-hole connections. The filled holes connect the entire stack (i.e., the through-hole connections extend through multiple layers or the entire stack), or the filled holes connect at least two electrically conductive layers, i.e., so-called vias. Similarly, optical interconnects may be formed through the various layers of the stack to accommodate an electro-optical circuit board. Printed circuit boards are typically configured to accommodate one or more components on one surface or two opposite surfaces of a plate-like printed circuit board. The one or more components may be connected to the respective major surfaces by soldering.The dielectric portion of the printed circuit board may include a resin with reinforcing fibers, such as glass fibers.
[0035] In the context of the present application, the term "substrate" may particularly refer to a small component carrier. Relative to a printed circuit board, a substrate may be a relatively small component carrier on which one or more components may be mounted and which may be used as a connection medium between one or more chips and another printed circuit board. For example, a substrate may have substantially the same size as a component (especially an electronic component) to be mounted on the substrate (for example, in the case of a chip-scale package (CSP)). More specifically, a substrate may be understood as a carrier for electrical connectors or power grids, and a component carrier for connectors that are arranged laterally and / or vertically, which are comparable to printed circuit boards but have a relatively high density. Lateral connectors are, for example, conductive paths, while vertical connectors may be, for example, drilled holes. These lateral connectors and / or vertical connectors are arranged in the substrate and may be used to provide electrical, thermal and / or mechanical connections between accommodated components or unaccommodated components (for example, bare wafers), in particular IC chips and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes an "IC substrate". The dielectric portion of the substrate may include a resin with reinforcement particles, such as reinforcement spheres, particularly glass spheres.
[0036] The interposer may include or be composed of at least one layer of: glass; silicon and / or a photosensitive or dry-etchable organic material, such as an epoxy-based laminate material (e.g., an epoxy-based laminate film); or a polymer compound (the polymer compound may or may not include photosensitive and / or heat-sensitive molecules).
[0037] The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] The features and advantages of the embodiments of the present application will become more easily understood through the following description with reference to the accompanying drawings, which are not drawn to scale and some features are enlarged or reduced to show details of specific components. In the accompanying drawings:
[0039] Figure 1 to Figure 2 The following schematically illustrates a layout diagram of a processing device according to an exemplary embodiment of the present application, wherein: Figure 1 The processing equipment shown in is in normal operation. Figure 2 The processing device shown in is in an abnormal operating state.
[0040] Figure 3a to Figure 3b The operation diagram of the cutting device and the detection device according to the exemplary embodiment of the present application is schematically illustrated.
[0041] Figure 4A structural diagram of a processing device according to an exemplary embodiment of the present application and an enlarged diagram of a local part thereof are schematically illustrated.
[0042] Figure 5 A perspective structural diagram of a re-peeling member according to an exemplary embodiment of the present application is schematically illustrated. DETAILED DESCRIPTION
[0043] The present application will be described in detail below with reference to the accompanying drawings by means of exemplary embodiments of the present application. It should be noted that the following detailed description of the present application is for illustrative purposes only and is not intended to limit the present application. In addition, the same reference numerals are used in the various drawings to represent the same components.
[0044] It should also be pointed out that, for the sake of clarity, not all features of an actual specific implementation are described and shown in the specification and drawings. In addition, in order to avoid unnecessary details that obscure the technical solutions that the present application focuses on, only the layout structures that are closely related to the technical content of the present application are described and shown in the specification and drawings, while other details that are not closely related to the technical content of the present application and are known to those skilled in the art are omitted.
[0045] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, each embodiment of the present application will be described in detail below in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in each embodiment of the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can also be implemented. The division of the following embodiments is for the convenience of description and should not constitute any limitation on the specific implementation of the present application. The various embodiments can be combined with each other and referenced to each other without contradiction.
[0046] It should be noted that the terms "first", "second", etc. involved in the specification and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0047] In this application document, the terms "upper", "lower", "outer", "inner", "front", and "rear" are used only for the purpose of convenience of description and should not be considered as limiting. In addition, although the present application has been described with reference to exemplary embodiments, it should be understood that the present application is not limited to the specific embodiments described and shown in detail herein. Those skilled in the art may make various changes to the exemplary embodiments without departing from the scope defined by the claims of the present application.
[0048] Before describing exemplary embodiments in more detail with reference to the accompanying drawings, basic considerations upon which exemplary embodiments of the present application were developed will be summarized.
[0049] The process of manufacturing component carriers (such as printed circuit boards, especially high-density interconnect (HDI) printed circuit boards; IC substrates) usually involves the process of attaching physical components to the functional surface of the component carrier. For example, in the process of manufacturing printed circuit boards and IC substrates, it is often necessary to attach Ajinomoto Build-up Film (ABF film) to their functional surfaces so that the Ajinomoto Build-up Film can be used as a dielectric layer to provide precise electrical isolation and support the formation of electrical conduction paths in subsequent manufacturing processes. The use of Ajinomoto Build-up Film allows more circuit layers and more complex circuit designs to be realized within the limited space of the component carrier, thereby meeting the needs of modern electronic devices for miniaturization and high performance.
[0050] Generally speaking, an oriented polypropylene film (OPP film) is attached to the surface of the Ajinomoto laminated film for the purpose of protection and support, etc. Before attaching the Ajinomoto laminated film to the component carrier, the oriented polypropylene film needs to be peeled off from the Ajinomoto laminated film to expose the surface of the Ajinomoto laminated film to be attached to the component carrier.
[0051] However, in the related art, in the process of peeling the oriented polypropylene film from the Ajinomoto laminated film, the peeling failure problem is often encountered. Such undesirable peeling failure may cause the Ajinomoto laminated film to be damaged or incomplete, thereby affecting its attachment quality on the component carrier and possibly causing the component carrier to be scrapped, ultimately resulting in an increase in production costs and material loss, as well as a decrease in overall production efficiency and product quality.
[0052] The reasons for peeling failure may be various. For example, peeling failure may be caused by excessive or uneven adhesion between the oriented polypropylene film and the Ajinomoto laminated film. For another example, peeling failure may be caused by inaccurate control of the strength of the peeling device and / or the angle at which the peeling force is applied, resulting in the oriented polypropylene film breaking during the peeling process or remaining on the Ajinomoto laminated film. In addition, improper speed control during the peeling process or changes in environmental conditions (such as temperature and humidity) may also lead to peeling failure. For this reason, in the related art, the solutions proposed to solve the problem of peeling failure often focus on how to improve the peeling device itself.
[0053] However, different from the inventive concept of the related art, the present application provides a new technical solution to solve the problem of peeling failure.
[0054] Next, a processing apparatus according to an exemplary embodiment of the present application will be described in detail with reference to the accompanying drawings.
[0055] In the context of the present application, the "physical entity component" to be managed may specifically indicate any physical component that needs to be stripped of the object to be attached (e.g., the second physical entity) covered on the object to be attached (e.g., the first physical entity) before the object to be attached in the physical component is attached to the component carrier during the manufacture and / or use of the component carrier. Generally, the physical entity component to be managed is in the form of a film. For example, in some embodiments, the physical entity component to be managed may include an Ajinomoto laminated film as the object to be attached and an oriented polypropylene film as the object to be stripped covering one main surface of the Ajinomoto laminated film. For example, in some embodiments, the physical entity component to be managed may include a resin-coated copper material (RCC) as the object to be attached and a release film as the object to be stripped covering one main surface of the resin-coated copper material. For another example, in some embodiments, the physical entity component to be managed may include an adhesive thermally conductive film as the object to be attached and a protective film as the object to be stripped covering at least one adhesive main surface of the thermally conductive film. For another example, in some embodiments, the physical entity component to be managed may include an electromagnetic interference shielding member such as an electrical tape and a protective layer covering the sticky surface of the electromagnetic interference shielding member as an object to be attached. It can be understood that the above-mentioned examples of "physical entity components" are merely illustrative and not restrictive.
[0056] In the context of the present application, the "main surface" of the first physical entity may particularly refer to the two largest opposite surfaces of the first physical entity or the outermost surfaces of opposite sides of the first physical entity. The main surfaces or the outermost surfaces may be connected by a circumferential sidewall. The thickness of the first physical entity, such as a single piece or a stack of pieces, may be defined by the distance between the two opposite main surfaces.
[0057] In the context of the present application, a processing device being in an "operating state" may specifically refer to a situation where the processing device is in the process of managing a physical entity component. Further, a processing device being in a "normal operating state" may specifically refer to a situation where the processing device is properly managing a physical entity component without a peeling failure (for example, the peeling device does not peel off the second physical entity that should have been peeled off from the first physical entity). A processing device being in an "abnormal operating state" may specifically refer to a situation where the processing device does not fully implement proper management of a physical entity component, resulting in a peeling failure (for example, the peeling device does not peel off the second physical entity that should have been peeled off from the first physical entity).
[0058] In the context of the present application, the "feed path" of a physical entity component may specifically refer to the path followed by the physical entity component from an initial position via a conveying mechanism to move along a predetermined travel route to a destination, i.e., the location of a component carrier, so as to attach the first physical entity to the component carrier. The feed path may be linear or non-linear to suit the layout or processing requirements of the equipment.
[0059] In the context of the present application, the "feed direction" of a physical entity component may specifically refer to the direction along which the physical entity component moves when moving along the feed path. It is understood that the "feed direction" may change once or more times during the feeding process of the physical entity component, for example, from a first feeding direction (such as a horizontal direction) to a second feeding direction (such as a vertical direction or another direction at a certain angle to the horizontal direction). Thus, in the context of the present application, when referring to the positioning or movement mode of a device or component relative to the feeding direction, it generally refers to the relative relationship between the device or component and the feeding direction of the physical entity component located near (e.g., the closest) to the device or component.
[0060] Please refer to Figure 1 . Figure 1 The arrangement of a processing device 100 for managing a physical entity assembly 200 to be attached to a component carrier 300 according to some embodiments of the present application is schematically illustrated, wherein the processing device 100 is in a normal operating state.
[0061] like Figure 1 As shown, in an embodiment of the present application, the physical entity assembly 200 to be managed includes at least a first physical entity 210 and a second physical entity 220. The first physical entity 210 is to be attached to a surface of a component carrier, such as a functional surface, in a subsequent process. The second physical entity 220 covers the first main surface 2102 of the first physical entity 210 to play a role of protection and / or support.
[0062] In some embodiments, a third physical entity 240 may be further disposed on a second main surface of the first physical entity 210 opposite to the first main surface 2102 (see Figure 1 or Figure 2 ). Taking the Ajinomoto laminated film as an example, an oriented polypropylene film may be provided on its first main surface, and a polyethylene terephthalate film (PET film) may be provided on the second main surface opposite to the first main surface. In the attachment process of the Ajinomoto laminated film, the PET film may not be removed.
[0063] Continue to refer to Figure 1, the processing equipment 100 according to the exemplary embodiment of the present application may include a stripping device 110 , a cutting device 120 , and at least one first detection device 130 .
[0064] In some embodiments, when the processing device 100 is in operation, the physical entity assembly 200 can be fed along a predetermined feeding path. The peeling device 110 can be arranged upstream of the attachment position where the first physical entity 210 is attached to the component carrier 300 along the feeding path. The cutting device 120 can be arranged upstream of the attachment position where the first physical entity 210 is attached to the component carrier 300 along the feeding path, and the cutting device 120 is arranged downstream of the peeling device 110 along the feeding path. However, it can be understood that the above-mentioned positioning manner of the peeling device 110 and the cutting device 120 is only exemplary, and does not exclude that in some possible embodiments, the cutting device 120 and the peeling device 110 can be arranged at substantially the same position along the feeding path of the physical entity assembly. Even in some other possible embodiments, the cutting device 120 can be arranged upstream of the stripping device 110 along the feed path of the physical entity component. For example, in this arrangement, the installation site of the cutting device 120 can be upstream of the stripping device 110, and the operating site of the cutting device 120 (such as the position where the cutting action is performed) can be downstream of the stripping device 110.
[0065] When the physical entity assembly 200 is fed to the peeling device 110 along the feeding path, the peeling device 110 peels the second physical entity 220 from the first physical entity 210 to expose the first main surface 2102 of the first physical entity 210 to be attached to the component carrier 300 .
[0066] In the embodiment of the present application, the peeling device 110 can be any device known in the art suitable for appropriately peeling the second physical entity 220 from the first physical entity 210. As a non-limiting example, the peeling device 110 can be any one of a mechanical peeling device, a vacuum adsorption peeling device, and a pneumatic peeling device.
[0067] In an embodiment of the present application, the cutting device 120 may include a cutting member 1202 and a re-peeling member 1204. When the first physical entity 210 that has undergone a successful peeling operation (i.e., the first main surface 2102 has been successfully and properly exposed) travels along the feeding path to the cutting device 120, the cutting member 1202 cuts the first physical entity 210. The cut first physical entity 210 having a predetermined size, for example, matching the functional surface of the component carrier 300, will be attached to the first physical entity 210 by an attachment device (such as a Figure 1) is attached to the component carrier 300 with its exposed first main surface 2102. In other embodiments, when the third physical entity 240 may also be provided on the second main surface of the first physical entity 210 opposite to the first main surface 2102, when the first physical entity 210 that has undergone a successful peeling operation (i.e., the first main surface 2102 has been successfully and properly exposed) travels to the cutting device 120 along the feeding path, the cutting member 1202 cuts the first physical entity 210 and the corresponding third physical entity 240 on its second main surface.
[0068] In some embodiments, the cutting device 120 is configured to reciprocate in a direction transverse to the feeding direction of the physical entity assembly 200 when the processing device 100 is in an operating state. In some embodiments, along the direction transverse to the feeding direction, the cutting device 120 moves from one side to the other side of the fed first physical entity 210 at a predetermined interval, and the first physical entity 210 that has undergone the peeling operation is fed along the feeding path by a predetermined length within the predetermined time interval, so that the first physical entity 210 cut out in each cutting operation has a predetermined size that matches the surface to be attached of the component carrier 300. In other embodiments, the cutting device 120 can cut along a non-linear cutting path so that the cut first physical entity 210 has a desired predetermined shape.
[0069] In some embodiments, the cutting member 1202 may include an annular blade and a housing for accommodating the annular blade. Part of the annular blade is exposed outside the housing for cutting the first physical entity 210 after the stripping operation. It is understood that the cutting member 2102 may also be any other member known in the art suitable for cutting the first physical entity 210, which will not be described in detail herein.
[0070] Next, we will mainly refer to Figure 2 , Figure 3a and Figure 3b The operation process of the cutting device 120 , the first detection device 130 , and the optional second detection device 130 ′ in the processing device 100 according to the embodiment of the present application is explained. Figure 2 The arrangement diagram of a processing device 100 according to some embodiments of the present application is schematically illustrated, wherein the processing device 100 is in an abnormal operation state. Figure 3a to Figure 3b The operating diagram of the cutting device 120 and the detection device according to some embodiments of the present application is schematically illustrated.
[0071] In the embodiment of the present application, the re-peeling member 1204 may be configured to re-peel the unsuccessfully peeled second physical entity 220 when the peeling device 110 fails to successfully peel the second physical entity 220 from the first physical entity 210. In other words, when the second physical entity 220 and the first physical entity 210 are successfully peeled, the re-peeling member 1204 may not perform any action.
[0072] like Figure 2 As shown, in the case where the stripping device 110 fails to successfully strip the second physical entity 220 from the first physical entity 210, the second physical entity 220 that should be stripped will move to the cutting device 120 together with the first physical entity 210. At this time, the second physical entity 220 that should be stripped will come into contact with the re-stripping member 1204, prompting the re-stripping member 1204 to re-strip the second physical entity 220 that was not successfully stripped by the stripping device 110, so that before the cutting member 120 performs the cutting operation or almost simultaneously with the cutting operation, the second physical entity 220 is successfully stripped from the first physical entity 210 through the re-stripping operation of the re-stripping member 1204, so that the cutting member 120 will always only cut the first physical entity 210.
[0073] In the embodiment of the present application, the first detection device 130 included in the processing device 100 can detect the existence of the peeled second physical entity 220. When the existence of the peeled second physical entity 220 is not detected, the first detection device 130 will issue an alarm signal indicating that the peeling operation of the peeling device 110 is abnormal, so as to stop the processing device 100 from operating.
[0074] In some embodiments, the processing device 100 may be connected to an electronic relay to stop the processing device 100 from operating if an alarm is triggered.
[0075] In some embodiments, the first detection device 130 may be a proximity sensor. In some embodiments, the first detection device 130 may be, for example, a photoelectric sensor, a capacitive sensor, an ultrasonic sensor, an infrared sensor, or a magnetic sensor. The specific type of the first detection device 130 may be selected according to actual needs, and is not limited here. In addition, the arrangement of the first detection device 130, such as the location of the arrangement, may be selected according to the layout of the processing equipment (such as the feed path of the physical entity component 200 and the recovery path of the stripped second physical entity 220, etc.). It can be understood that the arrangement of the first detection device 130 is flexible and diverse, as long as it satisfies the requirement that the existence of the stripped second physical entity can be detected. For example, in some embodiments, the processing equipment 100 may include a supporting device (not shown), such as a crossbar, and the first detection device 130 may be movably arranged on the supporting device, so that the displacement range of the first detection device 130 may cover the entire width range of the second physical entity 220 (for example, the first detection device 130 may be flexibly positioned relative to the second physical entity along the width direction of the second physical entity, thereby covering the entire width extension range of the second physical entity 220).
[0076] In some embodiments, the processing device 100 may include at least two first detection devices 130. When the processing device 100 is in operation, at least one of the at least two first detection devices 130 may be disposed above a first lateral edge region of the peeled second physical entity 220, and at least one of the other at least two first detection devices 130 may be disposed above a second lateral edge region of the peeled second physical entity 220.
[0077] In the context of the present application, the “lateral edge region” of the second physical entity 220 may specifically refer to a region of the second physical entity 220 adjacent to the lateral edge of the physical entity 220 in a direction transverse to the length extension of the second physical entity 220 .
[0078] As an example, Figure 3a or Figure 3bAs shown, the processing device 100 may include a first detection device 130 disposed above the left edge region of the peeled second physical entity 220 and another first detection device 130 disposed above the right edge region of the peeled second physical entity 220. In some embodiments, each first detection device 130 may be a detection module, which may include a signal generator 131 and a signal receiver 132 disposed substantially perpendicular to the second physical entity 220, for example, a signal generator 131 disposed above the left edge region of the peeled second physical entity 220 and a signal receiver 132 disposed below the left edge region of the peeled second physical entity 220.
[0079] Still refer to Figure 3b In the process of the second physical entity 220 being successfully peeled off from the first physical entity 210 by the re-peeling operation, for example, the second physical entity 220 is lifted from one side (shown as the left side in the figure) by the re-peeling member 1204 to be peeled off from the first physical entity 210, the first detection device 130 located above the lateral edge area of the side (shown as the left side in the figure) will immediately detect the "non-existence" of the second physical entity 220, thereby triggering an alarm, so that the processing device 100 stops operating. It can be understood that when the movement direction of the cutting device 120 is opposite, that is, from Figure 3b When the second physical entity 220 moves from the right side to the left side as shown in the figure, the peeling member 1204 will lift the second physical entity 220 from the right side to peel it off from the first physical entity 210. Accordingly, the first detection device 130 located above the lateral edge area on the right side will immediately detect the "absence" of the second physical entity 220 and trigger an alarm, thereby stopping the operation of the processing device 100.
[0080] In some embodiments, the processing device 100 may further include at least one second detection device 130'. When the processing device 100 is in operation, the at least one second detection device 130' is located above the central area of the peeled second physical entity 220. In some embodiments, the second detection device 130' may be, for example, a photoelectric sensor or a near-infrared sensor. Similar to the first detection device 130, the second detection device 130' may also be a detection module, which may include, for example, a signal generator located above the central area of the peeled second physical entity and a signal receiver located below the central area of the peeled second physical entity (see also Figure 3a and Figure 3b ). It can be understood that the specific type of the second detection device 130' can also be selected according to actual needs and is not limited here.
[0081] like Figure 3a or Figure 3bAs shown, a second detection device 130' is provided above the central area of the second physical entity 220 to be peeled off. The second detection device 130' located above the central area of the second physical entity 220 to be peeled off can be used to detect the peeling quality. Specifically, when peeling off the second physical entity 220 (for example, an OPP film), the first physical entity 210 (for example, an ABF film) may be partially inappropriately taken away by the second physical entity 220 (for example, part of the ABF film adheres to the peeled OPP film), resulting in a partial loss of the first physical entity 210 to be attached to the component carrier 300. The second detection device 130' located above the central area can be configured to detect whether the first physical entity 210 is partially inappropriately taken away by the second physical entity 220, thereby ensuring qualified peeling quality while the second physical entity is successfully peeled off. For example, OPP is a light-transmitting film, while ABF film is an opaque film, so the second detection device 130' can determine whether the ABF film is partially adhered to the peeled OPP film by detecting the light transmittance of the peeled OPP film. When the peeled object is detected to be an opaque object, it means that the peeled object is the second physical entity 220 carrying part of the first physical entity 210, and the second detection device 130' located above the central area issues an alarm accordingly to stop the operation of the device 100.
[0082] In some embodiments, two or more second detection devices 130 ′ are disposed above the central region of the peeled second physical entity 220 , and the two or more second detection devices 130 ′ may be arranged at intervals within the width extension range of the peeled second physical entity 220 .
[0083] Next, we will refer to Figure 4 as well as Figure 5 The cutting device 120 according to some embodiments of the present application, especially the re-stripping member 1204 therein, is described in further detail.
[0084] In some embodiments, the re-stripping member 1204 can be constructed as an elongated extension. In some embodiments, the re-stripping member 1204 can be a rod-shaped member installed on the main body of the cutting device 120. In other embodiments, the re-stripping member 1204 can be a gripping member, such as a claw-shaped member, installed on the main body of the cutting device 120. In some other embodiments, the re-stripping member 1204 can be a protrusion protruding from the main body of the self-cutting device 120. It can be understood that the configuration of the re-stripping member 1204 is diverse and can be changed or adjusted accordingly according to the layout and processing requirements of the equipment. The above examples cited in this article are merely illustrative and non-restrictive. In addition, it can also be understood that the extension length, orientation and / or height of the elongated extension can be adjusted to adapt to specific stripping requirements and the layout of each device in the processing equipment.
[0085] In some embodiments, the re-stripping member 1204 can be configured to be releasably and / or adjustably mounted upstream of the cutting member 1202 along the feeding path of the physical entity assembly 200. For example, the re-stripping member 1204 is detachably mounted upstream of the cutting member. For another example, the re-stripping member 1204 is adjustable in terms of its position, orientation, and the length extending toward the second physical entity after being mounted in place.
[0086] In some embodiments, the re-stripping member 1204 can be configured to be connected to the cutting member 1202 in a manner that allows it to move relative to the cutting member 1202.
[0087] In some embodiments, the cutting member 1202 is disposed downstream of the peeling point 230 where the peeling device 110 separates the first physical entity 210 from the second physical entity 220 along the feeding direction of the physical entity assembly 200, and the re-peeling member 1204 can be disposed upstream or downstream of the peeling point 230. It can be understood that the specific arrangement positions of the cutting member 1202 and the re-peeling member 1204 can be changed accordingly according to the layout of the equipment and application requirements. Generally speaking, the specific setting positions of the cutting member 1202 and the re-peeling member 1204 must meet the following conditions: when the second physical entity is successfully peeled off, the re-peeling member 1204 does not contact the successfully peeled off second physical entity 220; when the second physical entity 220 is not successfully peeled off, after the unsuccessfully peeled off second physical entity 220 is fed to a point beyond the peeling point of the peeling device and before or when it reaches the point in the feed path where the cutting member 1202 is about to act, the re-peeling member 1204 can act on the side of the unsuccessfully peeled off second physical entity 220, and with the help of the displacement of the cutting device 120, the unsuccessfully peeled off second physical entity 220 can be re-peeled.
[0088] In some embodiments, the re-peeling member 1204 may be disposed to be oriented perpendicular to the second physical entity 220 or tilted at a first predetermined angle relative to the second physical entity 220 at the peeling point 230 where the peeling device 110 separates the first physical entity 210 from the second physical entity 220. In other embodiments, the re-peeling member 1204 may be disposed upstream or downstream of the peeling point 230 where the peeling device 110 separates the first physical entity 210 from the second physical entity 220 along the feeding direction of the physical entity assembly 200, and the re-peeling member 1204 is oriented perpendicular to the peeled second physical entity 220 or tilted at a second predetermined angle relative to the peeled second physical entity 220 accordingly.
[0089] The first predetermined angle of inclination may be, for example, in the range of 30° to 45°. The second predetermined angle of inclination may be, for example, in the range of 30° to 45°.
[0090] like Figure 5 As shown, in some embodiments, the re-stripping member 1204 may include a mounting seat 1206 and an elongated member 1208 to be acted on the second physical entity 220 that is not successfully stripped by the stripping device 110. The mounting seat 1206 may be movably mounted on the main body of the cutting device 120. The mounting seat 1206 may be provided with a coupling portion 1210. The elongated member 1208 may be movably coupled to the mounting seat 1206 via the coupling portion 1210.
[0091] In some embodiments, the coupling portion 1210 may include a mounting hole extending between two main surfaces of the mounting seat 1206, and the elongated member 1208 may be coupled to the mounting seat 1206 in a manner of being inserted into the mounting hole. The mounting hole may be a blind hole or a through hole.
[0092] In some embodiments, the re-peeling member 1204 may further include a fixing member (not shown) acting on the elongated member 1208. The fixing member may be configured to adjustably fix the elongated member 1208 to the mounting seat and position the elongated member 1208 to extend an appropriate length toward the peeled second physical entity 220 near the peeling point 230 where the peeling device 110 separates the first physical entity 210 from the second physical entity 220.
[0093] Next, return to the reference Figure 1 and Figure 2In some embodiments, the processing device 100 according to the embodiment of the present application may further include a conveying device. The conveying device may include a feed roller 140 and a collection roller 160. The feed roller 140 feeds the physical entity component 200 along the feed path. The collection roller 160 is configured to collect the peeled second physical entity 220, wherein the peeled second physical entity 220 extends from the peeling point 230 where the first physical entity 210 is separated from the second physical entity 220 to the collection roller 160. In other embodiments, the conveying device may further include at least one auxiliary conveying roller 150. At least one auxiliary conveying roller 150 for assisting the conveyance of the physical entity component 200 may be provided downstream of the feed roller 140 along the feed path. At least one auxiliary conveying roller 150 may be located at at least one waypoint on the feed path. In some embodiments, an auxiliary conveying roller 150 used as a steering roller or a guide roller may be included on the feed path to change the feeding direction of the physical entity component so as to achieve an angle change or bypass obstacles during the feeding process. For example, the physical entity component may first be conveyed in a horizontal direction and then guided to a vertical direction or another oblique direction by a steering roller to adapt to the position of the component carrier or the layout of the processing station. In addition, the feeding direction of the physical entity component can be distinguished from the extension / recovery path of the second physical entity 220 after being peeled off to the collection roller 160. During the entire feeding process, the feeding direction and feeding path of the physical entity component can be precisely controlled to ensure that the physical entity component has the correct orientation and position alignment when it reaches the area to be attached of the component carrier, thereby achieving a high-precision attachment operation. In addition, by adjusting the rotation rate and position of the feed roller 140, the collection roller 160 and the auxiliary conveying roller 150, it can be ensured that the physical entity component 200 always maintains a certain tension during the feeding process, thereby improving the peeling efficiency / success rate.
[0094] According to the exemplary embodiment of the present application, the processing equipment 100 can re-peel off the second physical entity 220 that was not successfully peeled off from the first physical entity 210 when the peeling device 110 failed to successfully peel off the second physical entity 220, so that the cutting member 1202 always only cuts the first physical entity 210, thereby effectively preventing the following undesirable situation from occurring - because the second physical entity 220 was not successfully peeled off from the first physical entity 210, the cutting member 1202 acts on the first physical entity 210 and the second physical entity 220 at the same time, thereby causing the cut first physical entity 210 to still have at least partially attached to it.
[0095] In addition, the first detection device 130 included in the processing equipment 100 according to the exemplary embodiment of the present application is capable of detecting the existence of the peeled second physical entity 220. When the first detection device 130 fails to detect the existence of the peeled second physical entity 220 due to the re-peeling operation of the re-peeling component 1204, the first detection device 130 will immediately issue an alarm signal to stop the operation of the processing equipment 100.
[0096] The processing device 100 provided by the exemplary embodiment of the present application can realize the proper management of the physical entity assembly 200 to be attached to the component carrier 300. Such proper management can not only avoid the waste of the component carrier 300 and the physical entity assembly 200, especially the first physical entity 210, but also effectively prevent the component carrier 300 from being scrapped due to poor attachment to the first physical entity 210 (because the second physical entity 220 is not peeled off), thereby significantly reducing production costs and material losses, and improving production efficiency and product quality as a whole.
[0097] Some embodiments of the present application also provide a processing station. In the processing station, two processing devices 100 may be arranged in a mirror image relative to the attachment site where the component carrier 300 to be attached is located. In the processing station, the two processing devices 100 arranged in a mirror image can simultaneously perform attachment operations on two opposite functional surfaces of the component carrier 300 to improve production efficiency.
[0098] Although the present application has been described with reference to exemplary embodiments, it should be understood that the present application is not limited to the specific embodiments described and shown in detail herein. Various changes may be made to the exemplary embodiments by those skilled in the art without departing from the scope defined by the claims of the present application.
[0099] The features mentioned and / or shown in the above description of the exemplary embodiments of the present application may be combined in the same or similar manner into one or more other embodiments, combined with the features in other embodiments or substituted for the corresponding features in other embodiments. The technical solutions obtained by these combinations or substitutions shall also be deemed to be included in the protection scope of the present application.
Claims
1. A processing device (100) for managing a physical entity component (200) to be attached to a component carrier (300), wherein: The physical entity assembly (200) comprises at least a first physical entity (210) to be attached to the component carrier (300) and a second physical entity (220) covering a first main surface (2102) of the first physical entity (210), wherein the processing device (100) comprises: a peeling device (110) configured to peel the second physical entity (220) from the first physical entity (210) so as to expose the first main surface (2102) of the first physical entity (210) to be attached to the component carrier (300); a cutting device (120), the cutting device (120) comprising a cutting member (1202) and a re-peeling member (1204), the cutting member (1202) being configured to cut the first physical entity (210) that has been subjected to a peeling operation, and the re-peeling member (1204) being configured to re-peel the second physical entity (220) that has not been successfully peeled off from the first physical entity (210) when the peeling device (110) fails to peel off the second physical entity (220) successfully; and At least one first detection device (130), the first detection device (130) detects the existence of the peeled second physical entity (220), and the first detection device (130) triggers an alarm when the existence of the peeled second physical entity (220) is not detected, so as to stop the operation of the processing equipment (100).
2. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1, characterized in that When the processing device (100) is in an operating state, the physical entity component (200) is fed along a predetermined feeding path, wherein the stripping device (110) is arranged along the feed path upstream of an attachment location where the first main surface (2102) of the first physical entity (210) is attached to the component carrier (300); and The cutting device (120) is arranged upstream of the attachment position where the first main surface (2102) of the first physical entity (210) is attached to the component carrier (300) along the feed path, and the cutting device (120) is arranged downstream of the stripping device (110) along the feed path.
3. A handling device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1 or 2, characterized in that The cutting device (120) is configured to reciprocate in a direction transverse to a feeding direction of the physical entity component (200) when the processing apparatus (100) is in an operating state.
4. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1, characterized in that The re-peeling member (1204) is constructed as an elongated extension.
5. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1, characterized in that The re-peeling member (1204) is constructed as one of the following: a rod-shaped member installed on the main body of the cutting device (120), a gripping member installed on the main body of the cutting device (120), and a protrusion protruding from the main body of the cutting device (120).
6. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1, characterized in that The re-peeling member (1204) is configured to be connected to the cutting member (1202) in a manner that allows it to be moved relative to the cutting member (1202).
7. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1, characterized in that The re-stripping member (1204) is configured to be releasably and / or adjustably mounted upstream of the cutting member (1202) along a predetermined feeding path of the physical entity assembly (200).
8. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 7, characterized in that The cutting member (1202) is arranged downstream of a stripping point (230) at which the stripping device (110) separates the first physical entity (210) from the second physical entity (220) along the feeding direction of the physical entity assembly (200) when the processing device (100) is in operation; and The re-stripping member (1204) is arranged upstream or downstream of the stripping point (230) along the feeding direction of the physical entity component (200) when the processing device (100) is in an operating state.
9. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1 or 2, characterized in that The re-peeling member (1204) is configured to be oriented perpendicular to the physical entity component (200) or inclined at a first predetermined angle relative to the physical entity component (200) at a peeling point (230) where the peeling device (110) separates the first physical entity (210) from the second physical entity (220) when the processing equipment (100) is in an operating state.
10. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1 or 2, characterized in that The re-peeling member (1204) is arranged upstream or downstream of the peeling point (230) where the peeling device (110) separates the first physical entity (210) from the second physical entity (220) along the feeding direction of the physical entity component (200) when the processing equipment (100) is in an operating state, and the re-peeling member (1204) is correspondingly oriented to be perpendicular to the second physical entity (220) being peeled or inclined at a second predetermined angle relative to the second physical entity (220) being peeled.
11. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1 or 2, characterized in that The re-peeling member (1204) includes a mounting seat (1206) and an elongated member (1208) to be acted on the second physical entity (220) that has not been successfully peeled off by the peeling device (110), wherein the mounting seat (1206) is movably mounted on the main body of the cutting device (120), and the mounting seat (1206) is provided with a connecting portion (1210), and the elongated member (1208) is connected to the mounting seat (1206) via the connecting portion (1210).
12. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 11, characterized in that The elongated member (1208) is movably coupled to the mounting seat (1206).
13. The processing device (100) according to claim 11, characterized in that The coupling portion (1210) includes a mounting hole extending between two main surfaces of the mounting seat (1206), and the elongated member (1208) is coupled to the mounting seat (1206) in a manner of being inserted into the mounting hole.
14. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 11, characterized in that The re-peeling member (1204) also includes a fixing member acting on the elongated member (1208), wherein the fixing member is configured to fix the elongated member (1208) to the mounting seat in an adjustably manner and to position the elongated member (1208) to extend an appropriate length toward the second physical entity (220) to be peeled near the peeling point (230) where the peeling device (110) separates the first physical entity (210) from the second physical entity (220).
15. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1 or 2, characterized in that The processing device (100) further comprises a conveying device, wherein the conveying device comprises: a feed roller (140) that feeds the physical entity assembly (200) along a feed path; and A collecting roller (160) configured to collect the peeled second physical entity (220), wherein the peeled second physical entity (220) extends from a peeling point (230) where the first physical entity (210) is separated from the second physical entity (220) to the collecting roller (160).
16. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1, characterized in that The first detection device (130) is a proximity sensor.
17. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 16, characterized in that The first detection device (130) comprises at least one of the following: a photoelectric sensor; a capacitive sensor; Ultrasonic sensor; infrared sensor; magnetic sensor.
18. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1, characterized in that The processing device (100) includes at least two first detection devices (130). When the processing device (100) is in an operating state, at least one of the at least two first detection devices (130) is arranged above a first lateral edge region of the peeled second physical entity (220), and at least one of the other at least two first detection devices (130) is arranged above a second lateral edge region of the peeled second physical entity (220).
19. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 18, characterized in that The processing device (100) comprises a supporting device, and at least two of the first detection devices (130) are movably arranged on the supporting device.
20. The processing device (100) according to claim 18, characterized in that The processing device (100) further comprises at least one second detection device (130'). When the processing device (100) is in operation, the at least one second detection device (130') is arranged above the central area of the peeled second physical entity (220).
21. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1, characterized in that The processing device (100) is connected to an electronic relay to stop the processing device (100) from operating if the alarm is triggered.
22. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1, characterized in that The cutting member (1202) includes an annular blade and a shell for accommodating the annular blade, wherein a portion of the annular blade is exposed outside the shell for cutting the first physical entity (210) that has undergone a stripping operation.
23. A processing device (100) for managing physical entity components (200) to be attached to a component carrier (300) according to claim 1, characterized in that The physical entity assembly (200) is a film assembly, wherein the film assembly comprises at least a first film to be attached to the component carrier (300) and a second film covering the first major surface (2102) of the first film.