Silicon wafer cleaning structure for silicon wafer cleaning machine

Abstract

The utility model relates to the technical field of silicon wafer cleaning, and discloses a silicon wafer cleaning structure for a silicon wafer cleaning machine, which comprises a cleaning tank, a lifting tank is arranged in the cleaning tank, and a discharge hopper is fixedly mounted at the bottom of the cleaning tank; the placing assembly is arranged in the cleaning tank; wherein the placing assembly comprises a placing part and a clamping part; the cleaning assembly is fixedly mounted in the cleaning tank; wherein the cleaning assembly comprises an air pump part and a stirring part. According to the silicon wafer cleaning device, the cleaning assembly is arranged, the air pump is started, the air pump conveys air into the cleaning tank through the bent pipe, bubbles are generated in a cleaning agent, the bubbles are broken near the surface of a silicon wafer, the surface of the silicon wafer fluctuates, the motor is started, and the connecting plate rotates to drive the stirring column to rotate to stir the cleaning agent in the cleaning tank; therefore, the washing frequency of the cleaning agent and the surface of the silicon wafer is increased, and the effect of cleaning the surface of the silicon wafer more completely is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning structure for a silicon wafer cleaning machine. Background Art

[0002] Wafer cleaning machine is an indispensable equipment in the semiconductor manufacturing process. It is mainly used to remove stains, dust and residues on the surface of silicon wafers to ensure the cleanliness of silicon wafers. Its working principle is mainly to remove impurities on the surface of silicon wafers through various cleaning methods (such as chemical cleaning, physical cleaning, etc.). Wafer cleaning machine plays a very important role in the semiconductor manufacturing process. It can ensure the cleanliness of silicon wafers and improve the performance and reliability of semiconductors.

[0003] At present, in the actual application process of the silicon wafer cleaning structure used in the silicon wafer cleaning machine, the silicon wafer is generally placed inside a cleaning basket, and then placed inside a cleaning tank, a cleaning agent is added into the cleaning tank, and the silicon wafer is cleaned using a cleaning mechanism. The cleaning process mostly causes the silicon wafer to shake inside the cleaning tank, thereby causing the surface of the silicon wafer to collide with the cleaning agent to achieve the purpose of cleaning. However, the silicon wafer will collide with the inner wall of the cleaning basket during the shaking process, and this cleaning method has limited effect. Utility Model Content

[0004] The utility model aims to provide a silicon wafer cleaning structure for a silicon wafer cleaning machine, so as to achieve the purpose of solving the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the utility model provides the following technical solutions: a silicon wafer cleaning structure for a silicon wafer cleaning machine, comprising a cleaning tank, a lifting tank is provided inside the cleaning tank, and a discharge hopper is fixedly installed at the bottom of the cleaning tank;

[0006] A placement component, wherein the placement component is arranged inside the cleaning tank;

[0007] Wherein, the placement component includes a placement portion and a clamping portion;

[0008] A cleaning component, wherein the cleaning component is fixedly installed inside the cleaning tank;

[0009] Wherein, the cleaning component includes an air pump part and a stirring part.

[0010] Preferably, the placement location includes a frame, a side net is fixedly installed inside the frame, a connecting frame is fixedly installed in the middle of the frame, a bottom net is fixedly installed at the bottom of the frame, the frame is arranged inside the cleaning tank, and the side net is in contact with the connecting frame.

[0011] Preferably, the clamping part includes a positioning column, a mounting block is fixedly installed inside the cleaning tank, a square block is clamped and installed inside the mounting block, a square groove is opened inside the mounting block, a telescopic rod is fixedly installed inside the cleaning tank, and a controller is fixedly installed in the middle of the cleaning tank.

[0012] Preferably, the positioning column is fixedly installed inside the cleaning tank, a positioning hole is opened inside the mounting block, the positioning column and the positioning hole are adapted to each other, the positioning column and the positioning hole are clamped and installed, the mounting block and the connecting frame are fixedly installed, the square block and the square groove are adapted to each other, the telescopic end of the telescopic rod is fixedly installed on the square block, and the telescopic rod and the controller are electrically connected.

[0013] Preferably, the air pump portion includes a mounting plate, the air pump is fixedly mounted on the top of the mounting plate, a bent pipe is fixedly mounted on the output end of the air pump, and a fixing seat is fixedly mounted in the middle of the bent pipe.

[0014] Preferably, the mounting plate is fixedly mounted on the cleaning tank, the air pump is electrically connected to the controller, one end of the bent pipe passes through the cleaning tank and the fixed seat in sequence, and one end of the bent pipe extends to the bottom of the fixed seat, and the fixed seat is fixedly mounted on the inner wall of the cleaning tank.

[0015] Preferably, the stirring part includes a connecting plate, a sealing cover is provided at the bottom of the connecting plate, stirring columns are fixedly installed at equal intervals on the top circumference of the connecting plate, and a motor is fixedly installed at the bottom of the connecting plate.

[0016] Preferably, the connecting plate is arranged at the bottom of the frame, the connecting plate is movably installed between the sealing cover, the sealing cover is fixedly installed inside the cleaning tank, the motor is fixedly installed inside the cleaning tank, the output end of the motor is movably installed between the sealing cover, and the motor is electrically connected to the controller.

[0017] The utility model provides a silicon wafer cleaning structure for a silicon wafer cleaning machine. It has the following beneficial effects:

[0018] (1) The utility model provides a clamping part, wherein the frame is fixedly installed on the connecting frame, and the connecting frame is fixedly installed on the mounting block. The frame is movably installed inside the cleaning tank by clamping the positioning column and the positioning hole, and the mounting block is fixedly installed inside the cleaning tank by clamping the square block and the square groove. When the telescopic rod is activated by the controller, the square block is no longer clamped on the square groove, so the frame can be taken out from the cleaning tank, thereby achieving the effect of facilitating cleaning and maintenance of the inside of the cleaning tank.

[0019] (2) The utility model provides a cleaning component and starts the air pump through a controller. The air pump supplies air to the inside of the cleaning tank through a curved pipe, and bubbles are generated inside the cleaning agent. The bubbles burst near the surface of the silicon wafer, causing the surface of the silicon wafer to fluctuate, thereby enhancing the cleaning effect on the surface of the silicon wafer. The motor is started through the controller, and the connecting plate rotates to drive the stirring column to rotate, stirring the cleaning agent inside the cleaning tank. As a result, the frequency of flushing the cleaning agent with the surface of the silicon wafer is increased, thereby achieving a more complete cleaning effect on the surface of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 It is the right view of the utility model;

[0022] Figure 3 This is a view of the internal structure of the utility model;

[0023] Figure 4 For this utility model Figure 2 A partial enlarged view of center A.

[0024] In the figure: 1 cleaning tank, 2 lifting tank, 3 placing component, 31 placing position, 311 frame, 312 side net, 313 connecting frame, 314 bottom net, 32 clamping position, 321 positioning column, 322 mounting block, 323 square block, 324 square tank, 325 telescopic rod, 326 controller, 4 cleaning component, 41 air pump position, 411 mounting plate, 412 air pump, 413 elbow, 414 fixing seat, 42 stirring position, 421 connecting plate, 422 sealing cover, 423 stirring column, 424 motor. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention. Embodiment 1

[0027] The preferred embodiment of the silicon wafer cleaning structure for a silicon wafer cleaning machine provided by the utility model is as follows Figure 1-4As shown: a silicon wafer cleaning structure for a silicon wafer cleaning machine, comprising a cleaning tank 1, a lifting tank 2 is provided inside the cleaning tank 1, and a discharge hopper 5 is fixedly installed at the bottom of the cleaning tank 1;

[0028] A placement component 3 is disposed inside the cleaning tank 1;

[0029] The placement component 3 includes a placement portion 31 and a clamping portion 32;

[0030] The placement part 31 includes a frame 311, a side net 312 is fixedly installed inside the frame 311, a connecting frame 313 is fixedly installed in the middle of the frame 311, and a bottom net 314 is fixedly installed at the bottom of the frame 311. The frame 311 is arranged inside the cleaning tank 1, and the side net 312 is in contact with the connecting frame 313. The silicon wafer is placed inside the frame 311, and a cleaning agent is added into the cleaning tank 1 or liquid is discharged through the discharge hopper 5;

[0031] The clamping part 32 includes a positioning column 321, a mounting block 322 is fixedly installed inside the cleaning tank 1, a square block 323 is clamped and installed inside the mounting block 322, a square groove 324 is opened inside the mounting block 322, a telescopic rod 325 is fixedly installed inside the cleaning tank 1, a controller 326 is fixedly installed in the middle of the cleaning tank 1, the positioning column 321 is fixedly installed inside the cleaning tank 1, a positioning hole is opened inside the mounting block 322, the positioning column 321 is adapted to the positioning hole, the positioning column 321 and the positioning hole are clamped and installed, the mounting block 322 is fixedly installed with the connecting frame 313, and the square block 323 is fixed with the square The slots 324 are adapted to each other, the telescopic end of the telescopic rod 325 is fixedly installed with the square block 323, and the telescopic rod 325 is electrically connected to the controller 326; the frame 311 is fixedly installed with the connecting frame 313, and the connecting frame is fixedly installed with the mounting block 322. The frame 311 is movably installed inside the cleaning tank 1 through the snap connection between the positioning column 321 and the positioning hole, and the mounting block 322 is fixedly installed inside the cleaning tank 1 through the snap connection between the square block 323 and the square slot 324. The telescopic rod 325 is started by the controller 326, and the square block 323 is no longer snap-connected with the square slot 324, so the frame 311 can be taken out from the inside of the cleaning tank 1. Embodiment 2

[0032] On the basis of Example 1, a preferred embodiment of a silicon wafer cleaning structure for a silicon wafer cleaning machine provided by the utility model is as follows: Figure 1-4 As shown: a cleaning component 4, the cleaning component 4 is fixedly installed inside the cleaning tank 1;

[0033] The cleaning component 4 includes an air pump portion 41 and an agitation portion 42;

[0034] The air pump part 41 includes a mounting plate 411, an air pump 412 is fixedly mounted on the top of the mounting plate 411, a curved pipe 413 is fixedly mounted on the output end of the air pump 412, a fixed seat 414 is fixedly mounted in the middle of the curved pipe 413, the mounting plate 411 is fixedly mounted on the cleaning tank 1, the air pump 412 is electrically connected to the controller 326, one end of the curved pipe 413 passes through the cleaning tank 1 and the fixed seat 414 in sequence, and one end of the curved pipe 413 extends to the bottom of the fixed seat 414, and the fixed seat 414 is fixedly mounted on the inner wall of the cleaning tank 1; after the cleaning tank 1 is filled with cleaning agent, the air pump 412 is started by the controller 326, and the air pump 412 transmits air to the cleaning tank 1 through the curved pipe 413, bubbles are generated in the cleaning agent, the bubbles burst near the surface of the silicon wafer, and the surface of the silicon wafer is fluctuated, which can enhance the cleaning effect of the silicon wafer surface;

[0035] The stirring part 42 includes a connecting plate 421, a sealing cover 422 is provided at the bottom of the connecting plate 421, stirring columns 423 are fixedly installed at equal intervals on the top circumference of the connecting plate 421, a motor 424 is fixedly installed at the bottom of the connecting plate 421, the connecting plate 421 is arranged at the bottom of the frame 311, the connecting plate 421 and the sealing cover 422 are movably installed, the sealing cover 422 is fixedly installed inside the cleaning tank 1, the motor 424 is fixedly installed inside the cleaning tank 1, the output end of the motor 424 is movably installed between the sealing cover 422, and the motor 424 is electrically connected to the controller 326; the motor 424 is started by the controller 326, the connecting plate 421 rotates to drive the stirring columns 423 to rotate, and the cleaning agent inside the cleaning tank 1 is stirred, so that the frequency of the cleaning agent flushing with the silicon wafer surface is increased, and the silicon wafer surface is cleaned more completely.

[0036] When in use, the silicon wafer is placed inside the frame 311, and cleaning agent is added or liquid is discharged into the cleaning tank 1 through the discharge hopper 5. The frame 311 is fixedly installed with the connecting frame 313, and the connecting frame is fixedly installed with the mounting block 322. The frame 311 is movably installed inside the cleaning tank 1 by the clamping connection between the positioning column 321 and the positioning hole, and the mounting block 322 is fixedly installed inside the cleaning tank 1 by the clamping connection between the square block 323 and the square groove 324. The telescopic rod 325 is started by the controller 326, and the square block 323 is no longer clamped with the square groove 324, so the frame 311 can be The rack 311 is taken out from the cleaning tank 1. After the cleaning tank 1 is filled with cleaning agent, the air pump 412 is started through the controller 326. The air pump 412 supplies air to the cleaning tank 1 through the curved pipe 413. Bubbles are generated inside the cleaning agent. The bubbles burst near the surface of the silicon wafer, causing fluctuations on the surface of the silicon wafer, which can enhance the cleaning effect on the surface of the silicon wafer. The motor 424 is started through the controller 326, and the connecting plate 421 rotates to drive the stirring column 423 to rotate, stirring the cleaning agent inside the cleaning tank 1. Therefore, the frequency of flushing between the cleaning agent and the surface of the silicon wafer is increased, and the surface of the silicon wafer is cleaned more completely.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A silicon wafer cleaning structure for a silicon wafer cleaning machine, characterized in that: It comprises a cleaning tank (1), a lifting tank (2) is provided inside the cleaning tank (1), and a discharge hopper (5) is fixedly installed at the bottom of the cleaning tank (1); A placement component (3), wherein the placement component (3) is arranged inside the cleaning tank (1); Wherein, the placement component (3) comprises a placement portion (31) and a clamping portion (32); A cleaning component (4), wherein the cleaning component (4) is fixedly installed inside the cleaning tank (1); Wherein, the cleaning component (4) comprises an air pump portion (41) and a stirring portion (42).

2. The silicon wafer cleaning structure for a silicon wafer cleaning machine according to claim 1, characterized in that: The placement portion (31) comprises a frame (311), a side net (312) is fixedly installed inside the frame (311), a connecting frame (313) is fixedly installed in the middle of the frame (311), and a bottom net (314) is fixedly installed at the bottom of the frame (311); the frame (311) is arranged inside the cleaning tank (1), and the side net (312) is in contact with the connecting frame (313).

3. The silicon wafer cleaning structure for a silicon wafer cleaning machine according to claim 1, characterized in that: The clamping portion (32) comprises a positioning column (321), a mounting block (322) is fixedly mounted inside the cleaning tank (1), a square block (323) is clamped and mounted inside the mounting block (322), a square groove (324) is provided inside the mounting block (322), a telescopic rod (325) is fixedly mounted inside the cleaning tank (1), and a controller (326) is fixedly mounted in the middle of the cleaning tank (1).

4. The silicon wafer cleaning structure for a silicon wafer cleaning machine according to claim 3, characterized in that: The positioning column (321) is fixedly mounted inside the cleaning tank (1); a positioning hole is provided inside the mounting block (322); the positioning column (321) and the positioning hole are matched with each other; the positioning column (321) and the positioning hole are mounted by snapping; the mounting block (322) and the connecting frame (313) are fixedly mounted; the square block (323) and the square groove (324) are matched with each other; the telescopic end of the telescopic rod (325) and the square block (323) are fixedly mounted; and the telescopic rod (325) and the controller (326) are electrically connected.

5. The silicon wafer cleaning structure for a silicon wafer cleaning machine according to claim 1, characterized in that: The air pump portion (41) comprises a mounting plate (411), an air pump (412) is fixedly mounted on the top of the mounting plate (411), a curved pipe (413) is fixedly mounted on the output end of the air pump (412), and a fixing seat (414) is fixedly mounted in the middle of the curved pipe (413).

6. The silicon wafer cleaning structure for a silicon wafer cleaning machine according to claim 5, characterized in that: The mounting plate (411) is fixedly mounted on the cleaning tank (1), the air pump (412) is electrically connected to the controller (326), one end of the curved pipe (413) passes through the cleaning tank (1) and the fixed seat (414) in sequence, and one end of the curved pipe (413) extends to the bottom of the fixed seat (414), and the fixed seat (414) is fixedly mounted on the inner wall of the cleaning tank (1).

7. The silicon wafer cleaning structure for a silicon wafer cleaning machine according to claim 1, characterized in that: The stirring portion (42) comprises a connecting plate (421), a sealing cover (422) is provided at the bottom of the connecting plate (421), stirring columns (423) are fixedly mounted at equal intervals on the top of the connecting plate (421), and a motor (424) is fixedly mounted at the bottom of the connecting plate (421).

8. The silicon wafer cleaning structure for a silicon wafer cleaning machine according to claim 7, characterized in that: The connecting plate (421) is arranged at the bottom of the frame (311), the connecting plate (421) is movably mounted between the sealing cover (422), the sealing cover (422) is fixedly mounted inside the cleaning tank (1), the motor (424) is fixedly mounted inside the cleaning tank (1), the output end of the motor (424) is movably mounted between the sealing cover (422), and the motor (424) is electrically connected to the controller (326).

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