Transverse moving material distributing assembly

Abstract

The utility model discloses a transverse moving material distributing assembly, which relates to the technical field of silicon wafer processing and comprises a base, two carrying tables arranged on the base side by side and a driving assembly used for driving the two carrying tables to move synchronously. The top end of the carrying table is provided with a moving assembly used for carrying the silicon wafer onto the carrying table or moving the silicon wafer out of the carrying table. Through the design of the two carrying tables, when one carrying table is used for distributing materials, the other carrying table is used for loading materials, the two carrying tables alternately move, incoming materials are sequentially conveyed to a plurality of material removing runways, efficient material distribution of silicon wafers is completed, and the processing efficiency of the silicon wafers is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a transverse material distribution component. Background Art

[0002] Silicon is refined from quartz sand. Silicon wafers are purified silicon elements. Then the pure silicon is made into silicon crystal rods, which become the material of quartz semiconductors for manufacturing integrated circuits. With the development of large-scale integrated circuits, silicon wafers are widely used as the main substrate material for semiconductors and other electronic products.

[0003] During the silicon wafer processing process, the silicon wafers drawn out of the flower basket need to be moved to different tracks. The silicon wafer dividing assembly in the prior art moves horizontally through a silicon wafer carrier to distribute the silicon wafers from the flower basket to the parallel downstream tracks in sequence. Since there is only one silicon wafer carrier, the dividing efficiency is low, which affects the processing efficiency of the silicon wafers.

[0004] In view of this, a transverse material distribution component is urgently needed. Summary of the invention

[0005] In view of the problems existing in the prior art, the utility model solves the problems with the following technical structure.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A transverse material distribution assembly comprises: a base, on which two carriers are arranged in parallel and a driving assembly for driving the two carriers to move synchronously;

[0008] The top of the carrier is provided with a moving component for receiving the silicon wafer onto the carrier or moving the silicon wafer out of the carrier.

[0009] A further feature is that

[0010] The bottoms of the two carriers are provided with movable plates, and the movable plates are slidably arranged on the base.

[0011] The driving assembly includes a motor, a gear and a rack. The motor is arranged on the moving plate, the gear is arranged at the output end of the motor, the rack is arranged on the base, and the gear is meshed with the rack.

[0012] Two slide rails are arranged in parallel on the base, and the movable plate is slidably arranged on the two slide rails.

[0013] Buffers are arranged on both sides of the top surface of the base.

[0014] The moving assembly comprises two conveyor belts arranged in parallel on both sides of the top surface of the platform and a power assembly for driving the two conveyor belts to move synchronously.

[0015] The top of the carrier is provided with a plurality of adsorption holes.

[0016] A slot-type optical coupler is arranged on the base, and a photoelectric baffle adapted to the slot-type optical coupler is arranged on the movable plate.

[0017] The carrier is fixed on the moving plate by bolts.

[0018] A plurality of mounting holes are arranged on the base.

[0019] The above structure of the utility model can achieve the following beneficial effects:

[0020] Through the design of two carriers, one carrier is dividing materials while the other carrier is loading materials. The two carriers move alternately to transport the incoming materials to multiple material removal tracks in sequence, completing the efficient dividing of silicon wafers and further improving the efficiency of silicon wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of this embodiment;

[0022] Figure 2 This is a schematic diagram of the structure of the bottom of the movable plate in this embodiment;

[0023] Figure 3 for Figure 2 Structural diagram of the structure from another perspective.

[0024] In the figure: 1. base; 11. slide rail; 12. buffer; 13. slotted optical coupler; 14. mounting hole; 2. carrier; 21. adsorption hole; 3. moving component; 31. conveyor belt; 32. power component; 4. moving plate; 41. photoelectric baffle; 5. motor; 6. gear; 7. rack. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0026] It should be noted that the terms "including" and "having" and any variations of them in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, product or equipment that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0027] The following is combined with Figure 1-3 This application is described in further detail.

[0028] The best usage scenario of the present application is: to be set between an incoming material runway and three parallel material removal runways (the three material removal runways are the first runway, the second runway and the third runway), to achieve the purpose of "one to three" material separation. In combination with this scenario, a usage scenario of the present application is described in detail below.

[0029] refer to Figure 1 The lateral shifting material distribution component shown in the figure comprises: a base 1, on which two carriers 2 (the two carriers 2 are respectively the first carrier and the second carrier) are arranged side by side, and a driving component for driving the two carriers 2 to move synchronously; the top of the carrier 2 is provided with a moving component 3 for receiving the silicon wafer onto the carrier 2 or moving the silicon wafer out of the carrier 2, so that when in use, the device is placed at the discharge end of the incoming material runway, when the first carrier carrying the silicon wafer moves to align with the first runway, the second carrier is aligned with the second runway and the incoming material runway, and during the process of transporting the silicon wafer carried by the first carrier to the first runway, the second carrier is aligned with the second runway and the incoming material runway. The carrier transports the first silicon wafer from the incoming material runway directly to the second runway, and then leaves the second silicon wafer on the second carrier. Then the driving component drives the two carriers 2 to move synchronously to one side of the third runway. When the second carrier is aligned with the third runway, the first carrier is aligned with the second runway and the incoming material runway. When the second carrier transports the carried silicon wafer to the third runway, the incoming material runway transports the silicon wafer to the first carrier, and so on and so forth, continuously transporting the silicon wafers from the incoming material runway to the three unloading runways, completing the efficient material separation of the silicon wafers, and further improving the efficiency of silicon wafer processing.

[0030] refer to Figure 1-3 As shown, in order to ensure the synchronization of the movement of the two platforms 2, a movable plate 4 is provided at the bottom of the two platforms 2, and the movable plate 4 is slidably set on the base 1. In this way, the synchronous movement of the two platforms 2 can be completed by only driving the movable plate 4 to ensure the accuracy of material distribution, and in order to guide the movement of the movable plate 4, two slide rails 11 are arranged in parallel on the base 1, and the movable plate 4 is slidably set on the two slide rails 11. The platform 2 can be fixed to the movable plate 4 by bolts, which is convenient for disassembling the platform 2.

[0031] refer to Figure 1-3 As shown, one of the specific structures of the driving component is: it includes a motor 5, a gear 6 and a rack 7, the motor 5 is arranged on the moving plate 4, the gear 6 is arranged at the output end of the motor 5, the rack 7 is arranged on the base 1 (the extension direction of the rack 7 is consistent with the arrangement direction of the two platforms 2), and the gear 6 is meshed with the rack 7. In this way, the motor 5 drives the gear 6 to rotate, so that the gear 6 moves in the extension direction of the rack 7, so as to drive the movement of the moving plate 4.

[0032] Further optimization is to refer to Figure 1 As shown, in order to limit the movement of the movable plate 4, buffers 12 are provided on both sides of the top surface of the base 1. Thus, when the movable plate 4 moves to one side and hits the buffer 12 on that side, it reaches the designated position, thereby ensuring the accuracy of the displacement of the movable plate 4. The specific structure of the buffer 12 can be composed of a mounting plate arranged on the base 1 and a plurality of rubber pins arranged on the mounting plate.

[0033] refer to Figure 1 As shown, the moving component 3 includes two conveyor belts 31 arranged in parallel on both sides of the top surface of the carrier 2 and a power component 32 for driving the two conveyor belts 31 to move synchronously (the power component 32 can be composed of a motor and a synchronous shaft, so that the two conveyor belts 31 can move synchronously). In this way, the two conveyor belts 31 are driven to move synchronously by the power component 32, so that the silicon wafers from the incoming runway or the silicon wafers on the carrier 2 are transported to the unloading runway.

[0034] Further optimization is to refer to Figure 1 As shown, in order to prevent the silicon wafer from slipping off the carrier 2 when the moving plate 4 moves at a fast speed, a plurality of adsorption holes 21 are provided on the top of the carrier 2. Thus, when the moving plate 4 moves, the silicon wafer is placed on the carrier 2 and fixed by the plurality of adsorption holes 21 on the carrier 2 to prevent the silicon wafer from shifting on the carrier 2.

[0035] Further optimization is to refer to Figure 1-3 As shown, in order to facilitate the detection of the position of the movable plate 4, a slot-type optical coupler 13 is provided on the base 1, and a photoelectric baffle 41 adapted to the slot-type optical coupler 13 is provided on the movable plate 4. When the slot-type optical coupler 13 detects the photoelectric baffle 41 (the photoelectric baffle 41 moves into the slot of the slot-type optical coupler 13), the movable plate 4 reaches the specified position.

[0036] A further optimization is that, in order to facilitate fixing the present application on the process route, a plurality of mounting holes 14 are provided on the base 1 to facilitate fixing the position of the present application.

[0037] In summary, through the design of the two carriers 2, when one carrier 2 is dividing the materials, the other carrier 2 is loading the materials. The two carriers 2 move alternately, and the incoming materials are transported to multiple material removal tracks in sequence, completing the efficient dividing of silicon wafers and further improving the efficiency of silicon wafer processing.

[0038] The above are only preferred embodiments of the present application, and the present invention is not limited to the above embodiments. It is understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the protection scope of the present invention.

Claims

1. A transverse material distribution component, characterized in that: include: A base (1), wherein two carriers (2) and a driving component for driving the two carriers (2) to move synchronously are arranged in parallel on the base (1); The top of the carrier (2) is provided with a moving component (3) for receiving a silicon wafer onto the carrier (2) or moving the silicon wafer out of the carrier (2).

2. A transverse material distribution assembly according to claim 1, characterized in that: A movable plate (4) is arranged at the bottom of the two carriers (2), and the movable plate (4) is slidably arranged on the base (1).

3. A transverse material distribution assembly according to claim 2, characterized in that: The driving assembly comprises a motor (5), a gear (6) and a rack (7); the motor (5) is arranged on the moving plate (4); the gear (6) is arranged at the output end of the motor (5); the rack (7) is arranged on the base (1); and the gear (6) is meshed with the rack (7).

4. A transverse material distribution assembly according to claim 2, characterized in that: Two slide rails (11) are arranged in parallel on the base (1), and the movable plate (4) is slidably arranged on the two slide rails (11).

5. A transverse material distribution assembly according to claim 2, characterized in that: Buffers (12) are provided on both sides of the top surface of the base (1).

6. A transverse material distribution assembly according to claim 1, characterized in that: The moving assembly (3) comprises two conveyor belts (31) arranged in parallel on both sides of the top surface of the carrier (2) and a power assembly (32) used for driving the two conveyor belts (31) to move synchronously.

7. The transverse material distribution assembly according to claim 1, characterized in that: A plurality of adsorption holes (21) are arranged on the top of the carrier (2).

8. The transverse material distribution assembly according to claim 2, characterized in that: A slot-type optical coupler (13) is provided on the base (1), and a photoelectric baffle (41) adapted to the slot-type optical coupler (13) is provided on the movable plate (4).

9. A transverse material distribution assembly according to claim 2, characterized in that: The carrier (2) is fixed on the moving plate (4) by means of bolts.

10. The transverse material distribution assembly according to claim 1, characterized in that: The base (1) is provided with a plurality of mounting holes (14).

Images