High-precision pressure sensor

Abstract

The utility model discloses a high-precision pressure sensor, which comprises a shell, a gland plate, a sensor chip, a buffer pressure pad and a connector, the sensor chip is provided with a conductive interface, the bottom of the connector is provided with a positioning column protruding and extending downwards, the positioning column is sequentially provided with a first step surface and a second step surface from bottom to top, the end face of the first step surface is provided with a conductive terminal, the gland plate is provided with an annular clamping groove, and the buffer pressure pad is arranged in the annular clamping groove. And the buffer pressure pad is used for hermetically abutting against the bottom of the connector. According to the utility model, the first step surface and the second step surface can provide supporting structures with different heights for the conductive terminal, so that the conductive terminal is ensured to be connected with the conductive interface at a proper position, and the connector is prevented from loosening in the use process; through the arrangement of the buffer pressure pad, reliable sealing can be formed between the sensor chip and the connector, moisture, moisture, dust and the like in an external environment are prevented from entering the pressure sensor, and thus internal electronic components are protected.

Description

Technical Field

[0001] The utility model relates to the field of pressure sensors, in particular to a high-precision pressure sensor. Background Art

[0002] A pressure sensor is a device or apparatus that can sense pressure signals and convert them into usable output electrical signals according to certain rules. A pressure sensor is usually composed of a pressure sensitive element and a signal processing unit. According to different test pressure types, pressure sensors can be divided into gauge pressure sensors, differential pressure sensors and absolute pressure sensors, and pressure sensors are the most commonly used sensors in industrial practice.

[0003] In the prior art, when the pressure sensor is installed in a humid environment for use, moisture and water droplets in the air can easily penetrate into the interior of the pressure sensor, which will not only cause damage to the electronic components inside the pressure sensor, but also cause faults such as short circuits and corrosion, seriously affecting the measurement accuracy and service life of the pressure sensor; in addition, when the pressure sensor is installed in a vibrating or frequently moving environment, the connection between the pressure sensor and the connector can easily become loose, resulting in poor contact and causing interruption of signal transmission or inaccurate measurement data, affecting the detection accuracy of the pressure sensor.

[0004] Therefore, the prior art has defects and needs to be improved. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a high-precision pressure sensor with good waterproof effect, stable connection and effective improvement of measurement accuracy.

[0006] To achieve this purpose, the utility model adopts the following technical solutions: a high-precision pressure sensor, including a housing, a pressure cover plate, a sensor chip, a buffer pressure pad and a connector;

[0007] The housing has a receiving space for receiving the sensor chip, and the cover plate is connected to the housing by snapping to close the receiving space;

[0008] The sensor chip is provided with a conductive interface, the cover plate located above the conductive interface is provided with a boss portion, and the boss portion is provided with an avoidance hole for exposing the conductive interface;

[0009] A positioning column protruding and extending downward is provided at the bottom of the connector, and the positioning column is provided with a first step surface and a second step surface in sequence from bottom to top, a limiting ring is provided in the upper area of ​​the second step surface, and a conductive terminal is provided on the end surface of the first step surface, and the conductive terminal passes through the avoidance hole and is electrically connected to the conductive interface;

[0010] The bottom of the avoidance hole is provided with a limiting ring groove for fitting and engaging with the limiting ring, and the avoidance hole is provided with a plurality of inclined surface structures along the circumferential direction, and the inclined surface structures are used to guide the limiting ring to slide into the limiting ring groove;

[0011] An annular groove is provided on the outer side of the avoidance hole, the buffer pressure pad is arranged in the annular groove, the height of the buffer pressure pad is greater than the depth of the annular groove, and the buffer pressure pad is used for sealing and abutting against the bottom of the connector.

[0012] By adopting the above-mentioned technical solutions, in the high-precision pressure sensor, a positioning base is provided on the gland plate located at the bottom of the avoidance hole;

[0013] The positioning base is provided with a first positioning groove and a second positioning groove, the first positioning groove is used for limiting abutment with the first step surface, and the second positioning groove is used for limiting abutment with the second step surface.

[0014] By adopting the above-mentioned technical solutions, the high-precision pressure sensor further includes a sealing pressure pad, which is arranged on the positioning base and is used to abut against the positioning column when the conductive terminal is in a connected state.

[0015] By adopting the above-mentioned technical solutions, in the high-precision pressure sensor, a threaded rod for easy installation is provided at the bottom of the shell, and a rubber sealing pad is sleeved on the top of the threaded rod.

[0016] By adopting the above-mentioned technical solutions, in the high-precision pressure sensor, a plurality of support and positioning seats are provided in the accommodating space, and the support and positioning seats are used to position and support the sensor chip;

[0017] The supporting and positioning seat is provided with an internal threaded hole, and the sensor chip is threadedly connected to the internal threaded hole via a locking screw.

[0018] By adopting the above-mentioned technical solutions, in the high-precision pressure sensor, at least one of the supporting and positioning seats is provided with a first fool-proofing protrusion, and the sensor chip is provided with a first fool-proofing groove adapted to be snap-connected with the first fool-proofing protrusion.

[0019] By adopting the above-mentioned technical solutions, in the high-precision pressure sensor, the boss portion is provided with a second fool-proofing protrusion, and the connector is provided with a second fool-proofing groove adapted to be engaged with the second fool-proofing protrusion.

[0020] By adopting the above-mentioned technical solutions, in the high-precision pressure sensor, the sensor chip includes a circuit board and a pressure sensing sheet arranged on the top of the circuit board, and the circuit board and the pressure sensing sheet are bonded by conductive adhesive.

[0021] Compared with the prior art, the utility model has the following beneficial effects:

[0022] The sensor chip of the utility model can sense the pressure changes applied thereon, and convert the mechanical pressure into an electrical signal to realize the measurement of the pressure; the positioning column can realize the precise positioning of the connector during the installation process, so that the conductive terminal can be accurately aligned and pass through the avoidance hole, and be electrically connected to the conductive interface of the sensor chip; the first step surface and the second step surface can provide support structures of different heights for the conductive terminal, ensuring that the conductive terminal is connected to the conductive interface at a suitable position to prevent the connector from loosening during use; when the limit ring is engaged with the limit ring groove, the displacement of the connector due to external force after the docking is completed can be avoided, thereby improving the stability of the electrical connection; the setting of the buffer pressure pad enables a reliable seal to be formed between the sensor chip and the connector, preventing moisture, water, dust, etc. in the external environment from entering the interior of the pressure sensor, thereby realizing the protection of the internal electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0025] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0026] Figure 2 This is a schematic diagram of the top structure of the gland plate of the utility model;

[0027] Figure 3 This is a schematic diagram of the connector structure of the utility model;

[0028] Figure 4 This is a schematic diagram of the sensor chip installation structure of the utility model;

[0029] Figure 5It is a schematic diagram of the installation structure between the gland plate and the positioning base of the utility model;

[0030] Figure 6 It is a schematic diagram of the bottom structure of the shell of the present utility model. DETAILED DESCRIPTION

[0031] In order to make the utility model's purpose, features, and advantages more obvious and easy to understand, the following will be combined with the drawings in the utility model embodiments to clearly and completely describe the technical solutions in the utility model embodiments. Obviously, the embodiments described below are only part of the utility model embodiments, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0033] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0034] like Figures 1 to 6 As shown, the embodiment of the utility model provides a high-precision pressure sensor, including a housing 1, a pressure cover plate 2, a sensor chip 3, a buffer pressure pad 4 and a connector 5;

[0035] The shell 1 has a containing space 10 for accommodating the sensor chip 3. The pressure cover plate 2 is connected to the shell 1 by snapping to close the containing space 10. The sensor chip 3 can sense the pressure changes applied thereto and convert the mechanical pressure into an electrical signal to measure the pressure. The sensor chip 3 is arranged in the containing space 10 to protect the sensor chip 3 from being damaged by moisture, dust and other pollutants in the external environment.

[0036] The sensor chip 3 is provided with a conductive interface 30, and the pressure cover plate 2 located above the conductive interface 30 is provided with a boss portion 21, and the boss portion 21 is provided with an avoidance hole 210 for exposing the conductive interface 30; the conductive interface 30 can be connected to an external circuit system to transmit the pressure signal sensed inside the sensor chip 3 to an external signal processing unit, control system or display device through the conductive interface 30, so as to realize further processing, monitoring and control of the data.

[0037] The connector 5 is provided with a positioning column 51 protruding downward at the bottom, and the positioning column 51 is provided with a first step surface 511 and a second step surface 512 in sequence from bottom to top, and a limiting ring 513 is provided in the upper area of ​​the second step surface 512, and a conductive terminal 510 is provided on the end surface of the first step surface 511, and the conductive terminal 510 passes through the avoidance hole 210 and is electrically connected to the conductive interface 30; a limiting ring groove 211 for adapting and snapping with the limiting ring 513 is provided at the bottom of the avoidance hole 210, and the avoidance hole 210 is provided with a plurality of inclined surface structures 212 along the circumferential direction, and the inclined surface structure 212 is used to guide the limiting ring 513 to slide into the limiting ring groove 211; the positioning column 51 can be used to adjust the connector 5 during installation During the process, precise positioning is achieved, so that the conductive terminal 510 can be accurately aligned and pass through the avoidance hole 210, and electrically connected to the conductive interface 30 of the sensor chip 3; the first step surface 511 and the second step surface 512 can provide support structures of different heights for the conductive terminal 510, ensuring that the conductive terminal 510 is connected to the conductive interface 30 at a suitable position to prevent the connector 5 from loosening during use; when the limiting ring 513 is engaged with the limiting ring groove 211, the connector 5 can be prevented from being displaced due to external force after the docking is completed, thereby improving the stability of the electrical connection; the setting of the inclined surface structure 212 makes it smoother for the limiting ring 513 to slide into the limiting ring groove 211, effectively reducing the friction and resistance during the connection and installation.

[0038] An annular groove 213 is provided on the outer side of the avoidance hole 210, and the buffer pressure pad 4 is arranged in the annular groove 213. The height of the buffer pressure pad 4 is greater than the depth of the annular groove 213, and the buffer pressure pad 4 is used to seal and abut against the bottom of the connector 5. Such a configuration enables a reliable seal to be formed between the sensor chip 3 and the connector 5 to prevent moisture, water, dust, etc. in the external environment from entering the interior of the pressure sensor, thereby protecting the internal electronic components; and, since the buffer pressure pad 4 has a certain elasticity, it can absorb and buffer external vibrations and impacts, thereby reducing the stress and damage to the internal components of the pressure sensor due to vibration, thereby extending the service life of the pressure sensor.

[0039] like Figures 4 to 6As shown, further, a positioning base 6 is provided on the pressure cover plate 2 located at the bottom of the avoidance hole 210, and a first positioning groove 61 and a second positioning groove 62 are provided on the positioning base 6. The first positioning groove 61 is used to limit the abutment with the first step surface 511, and the second positioning groove 62 is used to limit the abutment with the second step surface 512. Such an arrangement enables the first positioning groove 61 and the first step surface 511, and the second positioning groove 62 and the second step surface 512 to be precisely matched, ensuring that the connector 5 can be accurately positioned during the insertion process to prevent excessive insertion or displacement, thereby maintaining the stability of the electrical connection.

[0040] like Figure 5 As shown, further, a sealing pressure pad 63 is included, and the sealing pressure pad 63 is arranged on the positioning base 6. The sealing pressure pad 63 is used to abut against the positioning column 51 when the conductive terminal 510 is in a connected state. Such a configuration can not only effectively improve the sealing performance of the connection part, but also improve the stability of the connector 5 when the conductive terminal 510 is in a connected state with the conductive interface 30.

[0041] like Figure 6 As shown, further, a threaded rod 11 is provided at the bottom of the housing 1 for easy installation, and a rubber sealing pad 12 is sleeved on the top of the threaded rod 11. The arrangement of the threaded rod 11 enables the pressure sensor to be installed on various devices or pipelines by threaded connection, which is convenient for installation; the rubber sealing pad 12 has good resilience and can form a tight seal when the threaded rod 11 is tightened, thereby improving the sealing performance.

[0042] like Figure 4 As shown, further, a plurality of supporting and positioning seats 13 are provided in the accommodating space 10, and the supporting and positioning seats 13 are used to position and support the sensor chip 3. An internal threaded hole 130 is provided on the supporting and positioning seat 13, and the sensor chip 3 is threadedly connected to the internal threaded hole 130 through a locking screw. Such a setting can improve the installation convenience of the sensor chip 3, and at the same time, the connection effect is stable, which can effectively prevent the sensor chip 3 from loosening or shifting due to vibration or external force during operation.

[0043] like Figure 4 As shown, further, at least one of the supporting and positioning seats 13 is provided with a first anti-foolproofing protrusion 131, and the sensor chip 3 is provided with a first anti-foolproofing groove 300 which is adapted to be snap-connected with the first anti-foolproofing protrusion 131. Such a configuration can ensure the correct docking of the conductive terminal 510 and the conductive interface 30, avoiding electrical connection problems caused by incorrect installation direction.

[0044] like Figure 1As shown, further, the boss portion 21 is provided with a second fool-proofing protrusion 214 , and the connector 5 is provided with a second fool-proofing groove 50 adapted to be engaged with the second fool-proofing protrusion 214 .

[0045] like Figure 4 As shown, further, the sensor chip 3 includes a circuit board 31 and a pressure sensing sheet 32 ​​arranged on the top of the circuit board 31, and the circuit board 31 and the pressure sensing sheet 32 ​​are bonded by conductive adhesive. The conductive adhesive can form a uniform contact surface between the circuit board 31 and the pressure sensing sheet 32, avoiding the poor contact problem that is easy to occur in traditional welding or mechanical connection, and improving the reliability of signal transmission; at the same time, the conductive adhesive also has a certain elasticity, which can absorb and buffer mechanical stress between the circuit board 31 and the pressure sensing sheet 32, reduce stress concentration, and avoid damage to the sensor chip 3 caused by mechanical stress.

[0046] As described above, the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A high-precision pressure sensor, characterized in that: It includes a housing, a pressure cover plate, a sensor chip, a buffer pressure pad and a connector; The housing has a receiving space for receiving the sensor chip, and the cover plate is connected to the housing by snapping to close the receiving space; The sensor chip is provided with a conductive interface, the cover plate located above the conductive interface is provided with a boss portion, and the boss portion is provided with an avoidance hole for exposing the conductive interface; A positioning column protruding and extending downward is provided at the bottom of the connector, and the positioning column is provided with a first step surface and a second step surface in sequence from bottom to top, a limiting ring is provided in the upper area of ​​the second step surface, and a conductive terminal is provided on the end surface of the first step surface, and the conductive terminal passes through the avoidance hole and is electrically connected to the conductive interface; The bottom of the avoidance hole is provided with a limiting ring groove for fitting and engaging with the limiting ring, and the avoidance hole is provided with a plurality of inclined surface structures along the circumferential direction, and the inclined surface structures are used to guide the limiting ring to slide into the limiting ring groove; An annular groove is provided on the outer side of the avoidance hole, the buffer pressure pad is arranged in the annular groove, the height of the buffer pressure pad is greater than the depth of the annular groove, and the buffer pressure pad is used for sealing and abutting against the bottom of the connector.

2. The high-precision pressure sensor according to claim 1, characterized in that: A positioning base is provided on the gland plate located at the bottom of the avoidance hole; The positioning base is provided with a first positioning groove and a second positioning groove, the first positioning groove is used for limiting abutment with the first step surface, and the second positioning groove is used for limiting abutment with the second step surface.

3. The high-precision pressure sensor according to claim 2, characterized in that: A sealing pressure pad is also included. The sealing pressure pad is arranged on the positioning base and is used to abut against the positioning column when the conductive terminal is in a connected state.

4. The high-precision pressure sensor according to claim 1, characterized in that: A threaded rod is provided at the bottom of the shell body for easy installation, and a rubber sealing pad is sleeved on the top of the threaded rod.

5. The high-precision pressure sensor according to claim 1, characterized in that: A plurality of support and positioning seats are arranged in the accommodating space, and the support and positioning seats are used to position and support the sensor chip; The supporting and positioning seat is provided with an internal threaded hole, and the sensor chip is threadedly connected to the internal threaded hole via a locking screw.

6. The high-precision pressure sensor according to claim 5, characterized in that: At least one of the supporting and positioning seats is provided with a first fool-proofing protrusion, and the sensor chip is provided with a first fool-proofing groove adapted to be engaged with the first fool-proofing protrusion.

7. The high-precision pressure sensor according to claim 1, characterized in that: The boss portion is provided with a second fool-proofing protrusion, and the connector is provided with a second fool-proofing groove adapted to be engaged with the second fool-proofing protrusion.

8. The high-precision pressure sensor according to any one of claims 1 to 7, characterized in that: The sensor chip includes a circuit board and a pressure sensing sheet arranged on the top of the circuit board, and the circuit board and the pressure sensing sheet are bonded by conductive adhesive.

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